Ameya360：PCB connector 1757022

发布时间：2023-01-17 14:39
作者：Ameya360
来源：网络
阅读量：2238

　　PCB connector, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Tin, type of contact: Female connector, number of potentials: 3, number of rows: 1, number of positions: 3, number of connections: 3, product range: MSTB 2,5/..-ST, pitch: 5.08 mm, connection method: Screw connection with tension sleeve, screw head form: L Slotted, conductor/PCB connection direction: 0 °, locking clip: - Locking clip, plug-in system: COMBICON MSTB 2,5, locking: without, mounting: without, type of packaging: packed in cardboard.

Ameya360：PCB connector 1757022

　　Advantages:

　　Well-known connection principle allows worldwide use

　　Low temperature rise, thanks to maximum contact force

　　Allows connection of two conductors


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Shielding EffectThe metal layer or shielding cover on the PCB may shield signals, affecting the transmission range and quality of signals.　　Measures to Reduce Shielding Effect:　　Design PCB layout reasonably: Try to avoid overlap or proximity between signal lines and shielding areas to minimize the impact of shielding effect.　　Choose appropriate shielding materials: Select suitable metal layers or shielding cover materials in PCB design to have good shielding performance while minimizing the impact on signal transmission.　　Design suitable grounding structure: A good grounding structure can help reduce the shielding effect of signals and improve signal transmission quality.　　Pay attention to signal adjustment: For signals that need to pass through shielding areas, signal adjustment techniques can be employed to minimize the impact of shielding effect, such as increasing signal power or adjusting signal transmission methods.　　9. Thermal Expansion EffectTemperature changes may cause thermal expansion or contraction of PCB materials, affecting the dimensional stability of circuit boards and the connection status of components.　　Measures to Reduce Thermal Expansion Effect:　　Choose appropriate PCB materials: Selecting PCB materials with smaller coefficients of thermal expansion can reduce the impact of thermal expansion on circuits.　　Design PCB layout reasonably: During PCB design, try to avoid direct connection between materials with high coefficients of thermal expansion and those with low coefficients to reduce the impact of thermal expansion.　　Control soldering temperature: Control soldering temperature and time during the soldering process to avoid excessive temperature leading to solder joint failure or component displacement.　　Use support structures: Adding appropriate support structures in PCB design can reduce PCB bending deformation, improving the stability and reliability of the PCB.　　10. Ground Hole EffectThere are many ground holes on the PCB. 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Filling EffectThe filling material on the PCB may affect signal transmission. For example, differences in the dielectric constant of the filling material may cause changes in signal transmission speed or signal attenuation.　　Measures to Reduce Filling Effect:　　Choose filling material reasonably: Select filling materials with a dielectric constant close to that of the PCB material to reduce the impact of dielectric constant differences on signal transmission.　　Control the thickness of filling material: Properly control the thickness of filling material to avoid excessive thickness, which could lengthen the signal transmission path and increase attenuation.　　Optimize PCB layout: During PCB design, minimize the impact on signal transmission paths, plan filling areas reasonably, and avoid interference from filling materials on signal transmission paths.　　Use low-loss filling materials: Choose filling materials with low resistance and dielectric loss to minimize attenuation and distortion during signal transmission.　　12. Temperature Drift EffectTemperature changes on the PCB may cause thermal expansion or contraction of circuit board materials, thereby affecting the dimensional stability of the circuit board and the connection status of components.　　Measures to Reduce Temperature Drift Effect:　　Choose PCB materials reasonably: Select PCB materials with good thermal stability and dimensional stability to reduce the impact of temperature changes on the PCB.　　Control soldering temperature: During the soldering process, control soldering temperature and time properly to avoid excessive soldering temperature leading to damage or breakage of components and solder joints.　　Optimize PCB layout: Plan PCB layout reasonably to reduce differences in thermal expansion coefficients between components and avoid changes in the connection status of components due to temperature changes.　　Temperature environment control: Control temperature changes in the PCB usage environment to avoid significant temperature shocks to the PCB, thereby reducing the impact of temperature changes on PCB circuits.　　13. Crystal EffectDevices such as transistors in PCB routing may be influenced by the surrounding environment, causing changes in device parameters and affecting circuit performance.　　Measures to Reduce Crystal Effect:　　Rational Layout: Properly plan PCB layout to avoid external interference affecting devices such as transistors and minimize electromagnetic field interference with devices.　　Temperature Control: Take measures to control the operating temperature of the PCB board during design and manufacturing to reduce the influence of temperature changes on device parameters and improve circuit stability.　　Choose Appropriate Devices: Select transistors and other devices with good anti-interference and stability to reduce the impact of crystal effect on the circuit.　　Design Compensation Circuits: In PCB design, compensation circuits can be used to correct drift in device parameters, improving circuit performance and stability.　　14. Restricted EffectThere are some restricted areas on the PCB, such as edges, power supply areas, etc., which may impose certain limitations or impacts on signal transmission or routing.　　Measures to Reduce Restricted Effect:　　Rational Planning of Layout: During PCB design, plan the layout reasonably to avoid placing sensitive signal lines or components near restricted areas, reducing the impact of restrictions.　　Electromagnetic Shielding: For areas prone to electromagnetic interference in restricted areas, electromagnetic shielding measures can be adopted, such as placing metal shielding covers around sensitive areas to reduce the impact of external electromagnetic interference on the circuit.　　Optimization of Power Supply Design: For possible power supply instability or noise issues in power supply areas, measures such as optimizing power supply design, adding filtering circuits, and reducing power supply noise can be taken to improve power supply stability and circuit performance.　　Fine Routing: When routing in restricted areas, adopt fine routing methods as much as possible to reduce restrictions or elongation of signal transmission paths, improving signal transmission rate and stability.　　15. Landmine EffectHidden problems or faults on PCB boards may suddenly appear during subsequent testing or use, causing unexpected impacts or damage to the circuit board.　　Measures to Reduce Landmine Effect:　　Strict Quality Control: During PCB production, strictly control the quality of each process to ensure that each component and circuit connection meets specifications, reducing hidden dangers.　　Perfect Testing Procedures: Establish comprehensive testing and inspection procedures to conduct comprehensive testing and inspection of PCB circuits, promptly identify and repair potential problems.　　Use Reliable Components: Choose components and materials with high reliability and stable quality to reduce the probability of failure and minimize the occurrence of landmine effects.　　Strengthen Maintenance: Regularly maintain and upkeep produced PCB circuits, promptly identify and repair potential problems, improving circuit reliability and stability.
2024-04-30 10:11 阅读量：779
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