Share of TDDI In-Cell Solutions for Smartphones Will Double Since the <span style='color:red'>Tight</span> Supply is Gradually Eased
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Share of TDDI In-Cell Solutions for Smartphones Will Double Since the Tight Supply is Gradually Eased

The share of In-Cell solutions in the global smartphone market is estimated to reach 27.1% in 2018, marginal up from 26.2% of last year, according to the latest research on touch display solutions by WitsView, a division of TrendForce. This is due to the rapid adoption by Android smartphones, despite the fact that the new iPhones this year will not adopt In-Cell solutions. Particularly, the share of TDDI (Touch with Display Driver Integration) In-Cell solutions is likely to grow significantly to 17.3%, although the IC products for TDDI In-Cell products experience a tight supply.“Branded smartphone vendors are now more willing to adopt TDDI In-Cell solutions, thanks to the maturation of IC products for TDDI and more IC suppliers’ entrance into the market”, says Boyce Fan, research director of WitsView. Despite the tight supply of wafer in the first half of 2018, smartphone vendors have actively searched for alternatives from second-tier IC manufacturers or foundries, or switched to Out-Cell design, so the overall supply and demand of TDDI IC has returned to a rational level in the second half of the year. Although the new iPhone models this year will adopt Out-Cell solutions, the share of TDDI In-Cell solutions is likely to grow significantly to 17.3%, up from 8.9% of last year driven by the promotion of IC manufacturers and panel makers.“Right now, smartphones makers have been constantly optimizing the design of full-screen models, while pursuing narrower borders, which will jointly drive the development of TDDI IC products,” says Fan. For example, the adoption of Dual Gate in HD+ products and MUX6 in FHD+ products is aimed to narrow the border at the side of IC Bonding. Moreover, in order to cope with the tight supply, IC design houses have been exploring new capacity of wafer supply and may also consider the transition into more advanced processes, smaller IC sizes and new specs.WitsView notes that the demand remains strong, and the tight supply of TDDI IC will be gradually eased with the new capacity. Therefore, the share of TDDI In-Cell solutions in the global smartphone market would continue to grow to 24.3% in 2019.
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Release time：2018-09-07 00:00 reading：1121 Continue reading>>
Production Costs of Large-Size Panels to Drop by Only 1~1.5% QoQ in 3Q18 Due to <span style='color:red'>Tight</span> Supply of Components
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Production Costs of Large-Size Panels to Drop by Only 1~1.5% QoQ in 3Q18 Due to Tight Supply of Components

According to the Large Size Panel Cost Breakdown, the latest report by WitsView, a division of TrendForce, the overall production costs of large-size panels are estimated to drop by 1~1.5% QoQ in 3Q18, less than 2~2.5% in 2Q. This is because the components of panels have a relatively limited price drop influenced by the tight supply. Moreover, the panel makers still face the amortization of equipment capital expenditure for new technologies including narrow-bezel, Mini LED and inkjet printing OLED.Components like driver ICs and polarizers are in tight supply during the peak season“As the new capacity of Chinese panel makers increases the demand for glass substrates, the glass manufacturers do not have enough capacity of cutting glass sheets for Gen 6 or more advanced fabs,” says Julian Lee, the assistant research manager of WitsView. The polarizers see a tight supply in 3Q18, as Nitto’s fab in Japan experienced discontinued production and transportation for several days due to the continual rain in July. Meanwhile, other polarizer manufacturers have been unable to increase the supply, since their production lines have already been operated with a full availability during the peak season. However, the tight supply of glass substrates and polarizers is expected to be eased in the fourth quarter.The supply of driver ICs has also been insufficient in 1H18 due to the foundries’ adjustment in wafer starts. The undersupply has become more severe in the traditional peak season, and is expected to continue to the fourth quarter. Meanwhile, the capacity for testing and packaging, as well as Film (COF) also faces an undersupply, as TDDI solutions for smartphones see higher demand and the production of new iPhones is scheduled in the short term.In addition, it is difficult for panel makers to bargain with backlight module suppliers, because the prices of backlight module components, such as optical coatings and LEDs, have reached almost the lowest level.Rebounding panel prices may improve the profitability of panel makersThe TV panel prices have already rebounded since July, although the cost reduction of panels is lower than expected. IT panel prices have shown a flat trend or even a slight increase, which may improve the profitability of panel makers. For example, the cash cost of 32-inch TV panel is about US$43~44/piece, but the quote for it has rebounded higher than that in the third quarter. Similarly, the cash cost of 65-inch panel is about US$210~ 220/piece, of which the quote is at least US$230~240/piece in the third quarter. Overall, the profitability of most panel makers in 3Q18 is expected to be better than in 2Q.
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Release time：2018-08-24 00:00 reading：916 Continue reading>>
Server DRAM Supply Expected to Remain <span style='color:red'>Tight</span>
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Server DRAM Supply Expected to Remain Tight

　　Server DRAM revenue among the top three DRAM vendors — Samsung Electronics, SK Hynix and Micron Technology — rose by 30 percent sequentially in the second quarter as the tight supply of DRAM chips continued to lift average selling prices, according to market watcher DRAMeXchange. The firm expects server DRAM supply to remain tight throughout the remainder of 2017.　　Despite product mix adjustments, suppliers had trouble meeting the various growing demands of the DRAM market, said DRAMeXchange, a unit of market research firm TrendForce that tracks memory chip pricing.　　"Thanks to the increase in the average memory density of server systems, as evidenced by the adoption of high-density 32GB RDIMMs and 64GB LRDIMMs in this year’s first half, the profit margin of server DRAM surged,” said Mark Liu, a DRAMeXchange analyst, in a press statement.　　DRAMeXchange said it expects the penetration rate of DDR4 2666MHz modules to rise in the second half of this year due to the introduction of servers based on Intel's Purley platform.　　South Korea's Samsung, the leading memory supplier and the leader in server DRAM market share, saw its second quarter server DRAM revenue rise by 36.5 percent sequentially to reach nearly $2 billion, DRAMeXchange said. Samsung continues to benefit from a commanding lead in the overall DRAM market and an overall lead in manufacturing technology, according to the firm.
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Release time：2017-08-15 00:00 reading：1069 Continue reading>>
<span style='color:red'>Tight</span> Memory Supply Drives Micron's Record Sales
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Tight Memory Supply Drives Micron's Record Sales

　　Micron Technology continues to build on a momentum that started late last year with a strong fiscal third quarter, ended June 1.　　Revenues for the quarter were a record $5.57 billion. That’s 20 percent higher compared to the previous quarter and 92 percent higher compared to the third quarter of fiscal 2016. It’s also the first quarter for new Micron president and CEO Sanjay Mehrotra, who in a statement outlining the quarterly financials said the strong operational performance with free cash flow nearly double that of the previous quarter enabled the company to retire $1 billion in debt. The results reflect Micron’s execution of its cost reduction plans and ongoing favorable industry supply and demand dynamics, he added.　　Mehrotra joined Micron in May after a long career at SanDisk prior to its sale to Western Digital last year, serving as president and CEO from 2011 to 2016. In a live webcast, Mehrotra said the company saw record revenues across all business units, driven by its technology portfolio and broad customer reach, as well as a favorable pricing environment for both NAND and DRAM. He also cited artificial intelligence (AI), machine learning and autonomous driving as strong segments as memory and storage become an increasingly strategic element in these applications.　　Micron’s compute and networking business unit saw a significant increase demand, in part due to increased enterprise demand as analytics and in-memory data processing pushed up DRAM content, while revenue from cloud customers was four times higher year over year. Micron Senior Vice President and Chief Financial Officer Ernie Maddock said success in the cloud segment can be attributed not only to the higher DRAM content demand, but company’s focused efforts to increase market penetration by addressing its needs.　　On the mobile front, Micron plans to introduce nearly 20 new 1x designs in the next 12 months, and is developing MCP and discrete NAND to address a full range of smartphones. Mehrotra said demand is strong for both value devices and higher-end smartphones. The company is currently sampling its 32-layer 3D NAND MCP and discrete eUFS and eMMC devices. “Many mobile OEM customers prefer MCPs in their design implementation to address their memory and storage requirements as MCPs provide a single source for DRAM memory and NAND storage, simplifying their system design, validation, and supply chain considerations,” he said.　　While the mobile segment was solid performer, Micron’s embedded business unit experienced record quarterly revenue in automotive, consumer / connected home, and industrial applications; the unit’s revenue was up 44 percent year over year. Mehrotra frequently referenced potential for automotive throughout the webcast, particularly autonomous vehicles. The company is maintaining a market share leadership position in automotive, he said, driven by infotainment and instrumentation systems. Voice-activated assistants and set-top boxes were big contributors on the connected home front. In the meantime, the company is in the process of transitioning its non-automotive embedded DRAM portfolio to 20n designs.　　Finally, Micron’s storage business also saw record revenue driven by a 30 percent quarter over quarter growth in SSDS, with sales to cloud and enterprise customers exceeding client sales.　　Overall, Mehrotra said Micron sees a healthy demand environment into 2018. The company’s priorities are focusing on being competitive by introducing new technology quickly, while strengthening business fundamentals. It is ramping up 64-layer 3D NAND and 1x DRAM technologies, he said, and expects to achieve meaningful output by end of fiscal 2017. The company’s third generation 3D NAND will be based on its CMOS Under Array Architecture, which allows for a smaller die and lower cost.　　Mehrotra said Micron is making progress in the cloud and enterprise markets and sees greater opportunities ahead, but it has some work to do. The company is focusing on having a mix of system level solutions in the NAND portfolio, as well as stronger controller and firmware capabilities with a roadmap for both internal and external controllers.　　Micron is forecasting a DRAM industry bit supply growth of 15 to 20 percent in calendar 2017, while NAND industry bit supply growth will be in the 30 to low 40 percent range. And although the favorable pricing environment is expected to persist into 2018, Micron cautioned that in the first half of the year its bit growth will be lower than industry average for DRAM due to its 1x transition, followed by a stronger second half.　　Jim Handy, principal analyst with Objective Analysis, said the favorable pricing environment is a big contributor to Micron’s current success. “It's mostly about the environment," Handy said. "We're in a shortage."　　It means the company is “basically printing money now,” thanks to unusually high profit margins for both DRAM and flash, he added. “Prices for flash and DRAM have both gone up, which goes against what the semiconductor market usually does,” Handy said.　　But Handy said Micron is also doing a good job of executing and controlling costs. There’s a reason why there were 28 DRAM makers in 1990s and only three today. “The dropouts weren't able to lower their cost structures quick enough,” Handy said.　　He did agree there are opportunities for DRAM ahead, especially as autonomous driving is falling to into place faster thanks to Google’s backing, which could be a boon to Micron.　　In the bigger picture, any new president will have a change of focus in mind for the company, said Handy, and Mehrotra wants to be more customer-focused and concentrate on longer-term and higher margin opportunities. “The good pricing environment is a nice thing, but whether it’s a good pricing or a bad pricing environment, all of these things will make the company stronger,” he said.　　Micron is clearly bullish on its technologies, said Handy, and is in a strong position with its 1x DRAM and 3D NAND. The company has struggled in the past to launch them in a timely fashion. But while they were third to market with 3D NAND, Handy said, "once they got into 3D NAND they executed very well."
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Release time：2017-07-03 00:00 reading：1148 Continue reading>>

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