Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band <span style='color:red'>Wireless</span> Modules
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Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless Modules

　　Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi® 6 Dual Band 2.4GHz to 5GHz and BLUETOOTH® 5.4® Modules are wireless radio modules with integrated Bluetooth BDR/EDR/Low Energy (LE). These modules are designed for highly integrated and cost-effective applications requiring high data rates and low power consumption. The PAN9019/PAN9019A features integrated power management, a dual-core CPU, 802.11i security standard support, and high-speed data interfaces. The modules provide a combination of Wi-Fi, Bluetooth, and 802.15.4 wireless connectivity, allowing for high throughput applications and enhanced flexibility. Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi 6 Dual Band 2.4GHz to 5GHz and Bluetooth 5.4 Modules are available in an M.2 form factor for use with host processors as an evaluation tool using an M.2 Key E socket.FEATURES　　Dual-band 2.4GHz to 5GHz 802.11a/b/g/n/ac/ax Wi-Fi, Bluetooth, and 802.15.41 combo module　　Supports WPA3 security　　Secured boot and firmware　　802.11e quality of service supported for multimedia application　　IEEE 802.11ax, 1x1 spatial stream with up to 600Mbps data rate　　OFDMA (UL/DL) and MU-MIMO (UL/DL)　　Bluetooth 5.4 (LE and long range)　　WCI-2- and 5-wire PTA coexistence interfaces　　SDIO 3.0, high-speed UART, and SPI2 for host processor connection general interfaces　　OS driver support for RTOS, Linux, and Android　　Available in M.2 form for evaluation with host processor using an M.2 Key E socket　　SPECIFICATIONS　　PAN9019　　NXP IW611 WLAN 2.4GHz and 5GHz, Bluetooth single-chip solution inside　　PAN9019A　　NXP IW612 WLAN 2.4GHz and 5GHz, Bluetooth and 802.15.4 single-chip solution inside　　15.3mm x 12mm x 2.5mm SMT package size　　-98dBm Rx sensitivity at IEEE 802.11b　　IEEE 802.11ax 20MHz, 40MHz, 80MHz channel bandwidth　　1.8V to 3.3V power supply range　　-40°C to +85°C operating temperature range　　BLOCK DIAGRAM　　PRODUCT OVERVIEW
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Release time：2024-07-15 14:05 reading：952 Continue reading>>
Murata’s Latest Partnership Aids IoT Development, Enabling M.2 <span style='color:red'>Wireless</span> Module Integration for STM32 Nucleo Boards
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Murata’s Latest Partnership Aids IoT Development, Enabling M.2 Wireless Module Integration for STM32 Nucleo Boards

　　Murata, a leading electronics manufacturer, in collaboration with Infineon are pleased to announce a new IoT development solution. This comprehensive innovation allows Murata’s Infineon-based Wi-Fi® and Bluetooth® modules to seamlessly integrate with a wide range of STM32 Nucleo-144 boards, helping to reduce the time-to-market for many wireless-enabled applications.　　The joint project is built on the collaboration with Infineon and Murata. / By combining each company’s extensive expertise, the collaboration has engineered a complete hardware and software solution that addresses a number of IoT development requirements. At its core, the platform solution allows STM32 microcontroller to connect Murata M.2 wireless modules featuring Infineon chipsets. Providing the hardware connection is Murata’s new Nucleo-144 to M.2 adapted board, while software integration is enabled through Infineon AIROC™ STM32 Expansion Pack. Whether you are evaluating low-power implementations, such as wearables and battery-powered devices, or high-performance deployments, such as industrial equipment and smart homes, this exciting solution creates a more efficient evaluation process.　　Murata Nucleo-144 to M.2 Adapter board　　Providing physical M.2 support for STMicroelectronics STM32 Nucleo board for microcontrollers, including the popular STM32U5 and STM32H5 series, is the Murata Nucleo-144 to M.2 adapter board. This innovative PCB-based adapter effortlessly mounts to the STM32 and features a convenient top-mounted M.2 socket. The M.2 dock grants effortless physical integration and swapping of Embedded Artists Murata M.2 modules which use Infineon chipsets. This allows the STM32 to accept a wide range of Wi-FiWi-Fi® and Bluetooth® combination units, including Wi-Fi 4, Wi-Fi 5 and industrial grade modules.　　AIROC™ STM32 Expansion Pack　　Produced by Infineon, a leading global semiconductor manufacturer, Infineon AIROC™ STM32 Expansion Pack provides the framework required to facilitate the Murata hardware. Using the Common Microcontroller Software Interface Standard (CMSIS), the AIROC™ STM32 Expansion Pack enables the integration of Infineon based Wi-Fi® and Bluetooth® module with STM32 STM32Cube ecosystem, including STM32CubeMX tool. Within the semiconductor industry, CMSIS establishes a consistent approach for software components, hardware parameters and code, helping to increase development productivity. Documentation, libraries and example projects are also available on Infineon’s dedicated Expansion Pack GitHub page,helping to support the quick deployment of your hardware environment.　　Innovation Through Collaboration　　Through the Infineon AIROC™ STM32 Expansion Pack, engineers can leverage an effective design environment to evaluate a range of Murata M.2 wireless modules (featuring Infineon chipsets) with STM32 Nucleo boards. With full support from dependable hardware, extensive documentation and example libraries, this comprehensive solution is the perfect tool for accelerating IoT development across an extensive variety of applications.　　Comment from Infineon　　Neil Chen, Director, Wi-Fi Product Line Marketing, IoT Compute and Wireless Business Unit at Infineon said “To reduce the barrier to entry for first-time IoT developers, semiconductor and module companies must come together to offer simple, easy-to-use and ease-to-productize solutions to market. Our collaboration with Murata does just that by leveraging our industry-leading AIROC™ Wi-Fi and Bluetooth portfolio to simplify the development of next-generation IoT products for a variety of applications.”　　Comment from Murata　　Masatomo Hashimoto, Director, Connectivity Module Division, Communication and Sensor Business Division, Murata Manufacturing Co. Ltd., said “We are excited to collaborate with Infineon, a global leader in semiconductors in the IoT and power systems to deliver this innovation. Customers face many barriers when bringing connectivity products to market, but this partnership provides a solution for a variety of development challenges and reduces time-to-market for a wide range of applications.”
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Release time：2024-03-08 14:47 reading：831 Continue reading>>
Fibocom：How PoC Ensures Boundary-Free <span style='color:red'>Wireless</span> Communication for Industries?
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Fibocom：How PoC Ensures Boundary-Free Wireless Communication for Industries?

　　What is PoC and What are the differences between PTT (Push-to-Talk)　　PoC, shortened for Push-to-talk over cellular, is commonly seen among citizens and vertical industries users, and the way it operates for group users is as easy as the saying, push a button then voice speaks out loud. Developed through the 2G generation to 5G nowadays, the global Push-to-Talk over Cellular market size was valued at USD 4003.0 million in 2021 and is expected to expand at a CAGR of 11.99% during the forecast period, reaching USD 7898.26 million by 2027, according to the 360 Market Updates.　　Several factors are driving the popularity of PoC, but firstly we are going to understand the differences between Push-to-Talk over Cellular (PoC) and Push-to-Talk (PTT) from the perspective of range, coverage, and data transmission.　　· Traditionally, PTT was associated with two-way radio systems that operate on dedicated radio frequencies. It allows a group of people to make instant communication through a handheld device in a certain range, which has greatly improved communication efficiency and reduced the billing of long-distance calls. However, PoC is built-in with cellular technology like 4G, and 5G, and relies on telecom operators’ public networks to transmit the data, which allows cross-border data roaming in mobile scenarios, taking logistics vehicles for example, the vehicle loaded with cargo is departing from France to Belgium, and the driver can still communicate with his fellow workers through the PoC device in real-time.　　· The infrastructure of the traditional PTT systems is based on the dedicated spectrum, such as private radio networks (Tetra, DMR, PDT), which is crucial for specific scenarios that require instant, interruption-free and emergency situation. While PoC relies on the coverage of cellular carriers’ networks.　　· In the aspect of data transmission, PoC leverages the 4G/5G cellular technologies to extend digital capabilities for multimedia applications such as data, voice, and video transmission. But traditional PTT mainly supports voice and a few data applications.　　How does 5G IoT extend the capability of PoC to meet the versatile market demands?　　Stemming from the “Walkie Talkie”, the PoC has evolved with a bundle of functionalities beyond voice, similar to a rugged smartphone with multimedia features and operating systems, most importantly, it has irreplaceable value for the vertical industries.　　Logistics and Fleet Management　　Teams in logistics and fleet management are dispersed across various locations, cross-country commutes are necessary in daily operation. Deploying the PoC devices is an effective approach to streamline the communication protocol and ensure smooth coordination among employees as it is equipped with 4G/5G cellular capability and supports global roaming.　　Real-time communication: business operators can smartly dispatch, and instruct essential updates to drivers on the road in real-time. This facilitates the coordination of route changes, traffic conditions, cargo delivery status, etc.　　Documentation for future optimization, this can be useful for the documentation of the communication records, and offer better solutions for route planning.　　Merging with GNSS function to trace the position in real-time.　　Manufacturing and Warehousing　　Manufacturing sites often require coordination with several departments, the instant communication enabled by the PoC device is crucial in synchronizing the messages across multiple departments, contributing to the decision-making process and reducing downtime.　　Warehouse operations rely on intelligent inventory management systems and well-organized employees to realize efficient inventory management. Benefiting from 5G’s capacity, PoC devices pre-installed with the warehouse management operating system enable the real-time communication of inventory levels, restocking needs, and location updates, improving accuracy and reducing errors.　　Construction and Mining　　Site Coordination: Construction and mining sites often cover vast areas and reach deep undergrounds where the public network is out of range. Business owners can gain dedicated network resources through authorization from local authorities, thus enabling interference-free group communications between various teams spread across these sites via the PoC devices, allowing quick coordination between supervisors, equipment operators, engineers, and safety personnel.　　Safety and Emergency Response: Safety is paramount in these industries. Benefiting from 5G’s millisecond latency and bandwidth, PoC facilitates instant communication in emergencies, allowing remote operators to view real-time status through video transmission, enabling swift response times and ensuring that safety protocols are promptly followed.　　The infusion of 5G renovates the PoC industry with an extension of new capabilities　　Leveraging the high bandwidth and capacity of 5G technology, the PoC will experience minimum delays, high qualify multimedia communications, and enhanced scalabilities.　　The PoC can develop more customized industry applications thanks to the support of the Android system, allowing functionalities such as ID verification through fingerprints/ID card scanning. Limited by the bandwidth of 4G, LTE PoC can not well support real time or smooth HD video applications, while 5G empowers the PoC with rich multimedia functions such as uploading the HD video to the management center in real-time without comprising the resolution, which is a crucial feature for emergencies. In the latest 3GPP Release 17, NTN (Non-terrestrial Networks) was introduced to provide an uninterrupted connection to the IoT applications on land, high-altitude space, and ocean, especially important for keeping track of remote operations at a global scale.　　Fibocom’s industry know-how for the highly integrated 4G/5G PoC device　　As mentioned above, “PoC is similar to a rugged smartphone with multimedia features and operating systems”, and the complexity of integrating the cellular capability, multimedia functions, communication protocols, operating systems, and GNSS into one smart device at a compact size is obvious a big challenge for the device manufacturer.　　Fibocom offers a highly integrated PCBA (Printed Circuit Board Assembly) solution customized for the PoC industry. Based on Fibocom’s 4G/5G smart module portfolio, which adopts high-performance CPU and GPU backed by the features from the chipset platform, the module allows the edge computing process to be conducted on the edge device. In addition to the support of a rich extension of interfaces such as MIPI/ USB/ UART/ SPI/ I2C, etc, along with Android OS, the smart module structures the foundation of the PoC device. Furthermore, the assembly know-how stems from Fibocom’s accumulation in the PoC industry evolving since the 2G era, by integrating the smart module, PCB assembly, and hardware ID & MD evaluation into the offering as the reference design for customer’ PoC devices, will significantly simplify the manufacturing process, optimize the cost-ratio, improve the efficiency and product quality, helping customers to reduce the time to market.
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Release time：2024-01-05 16:07 reading：2085 Continue reading>>
New Murata Power Solutions Product Designed to Meet the Latest Demands of <span style='color:red'>Wireless</span> Infrastructure Equipment Including RFPAs, 5G Base Stations, and <span style='color:red'>Wireless</span> Repeaters
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New Murata Power Solutions Product Designed to Meet the Latest Demands of Wireless Infrastructure Equipment Including RFPAs, 5G Base Stations, and Wireless Repeaters

　　Murata Power Solutions today announced a new product for growing telecommunications and networking equipment needs. The MPQ600 was designed to enable hardware engineers the flexibility to meet demanding RFPA (Radio Frequency Power Amplifier) system design goals. The solution features a Vin range of 36-75Vdc, a Vout range of 14V to 35V, and offers 96.5 percent efficiency. It was developed specifically for powering wireless infrastructure equipment such as RFPA, 5G base stations, wireless repeaters, distributed antenna systems, industrial (robotics, transportation, digital signage, communications), infrastructure point-to-point radios, networking equipment, public safety wireless equipment, and test and measurement equipment.　　Additional features include remote on/off control, remote sense and trim functions, input under voltage, over-current, over temperature, and short circuit protection. Additionally, the MPQ600 module features a PMBusTM interface that can be used to monitor input and output voltages, output current, and device temperature. The PMBusTM also allows users to configure many operational parameters including output voltage, current limit, Vout ramp rate, Vout delay, soft start/stop and optimization of the modules for stable operation under a wide range of conditions.　　The solution was designed, tested, and qualified according to the industry standard IPC9592 design for reliability requirements. Electrical performance is state-of-the-art with an efficiency rating of 96.5+ percent typical at full load, Pre-Bias protection under all conditions, and tight line and load regulation. The MPQ600 has low output ripple and noise and fast load transient response all packaged in an industry standard quarter brick package measuring just 58.4 x 36.8 x 14.4mm (2.3 x 1.45 x 0.57 in). All I/O isolated MPS modules are designed and comply with IEC/EN/UL 62368-1 safety standards.　　“Murata Power Solutions is proud to offer the MPQ600-28V21-D48NBMC modules to power systems architects around the world. We employ a highly rigorous reliability design and manufacturing process, advanced digital control platform with Murata’s proprietary firmware, providing the power system designer the tools for the next generation, high performance systems,” said Bill Smith, Sr. Product Manager, Murata Power Solutions.
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Release time：2023-10-11 13:40 reading：1787 Continue reading>>
ROHM：New Compact VCSEL Proximity Sensor Contributes to Greater Miniaturization and Battery Capacity in <span style='color:red'>Wireless</span> Earbuds and other Wearable Devices
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ROHM：New Compact VCSEL Proximity Sensor Contributes to Greater Miniaturization and Battery Capacity in Wireless Earbuds and other Wearable Devices

　　ROHM has developed a compact 2.0mm × 1.0mm proximity sensor, the RPR-0720, optimized for applications requiring attachment/detachment and proximity detection.　　As the use of IoT continues to grow, sensor devices that play a critical role are requiring greater miniaturization and functionality. ROHM offers a lineup of proximity sensors that combine light emitting and receiving elements in a single package, providing unmatched versatility that has led to widespread adoption in a range of applications, from mobile devices to industrial equipment. Particularly for wearable devices, in response to the growing demand for small proximity sensors that can support improved designs and an increase in the number of parts resulting from higher functionality, ROHM developed a compact proximity sensor that integrates a VCSEL and sensor IC.　　The RPR-0720 is an optical sensor module that adopts a VCSEL featuring higher directivity than LEDs as the light emitting element and a sensor IC for the light receiving element. Compact size is achieved by optimizing the module structure using in-house chips, reducing area by approximately 78% compared to conventional products. At the same time, the wide input voltage range (2.7V to 4.5V) of the built-in VCSEL eliminates the need for a peripheral voltage booster circuit (i.e. consisting of a power supply IC, three capacitors, and one inductor) when using a Li-ion battery, contributing to greater space savings that leads to smaller applications and increased battery capacity. This makes it suitable not only for sensing attachment/detachment, but also for detecting various conditions in a wide range of applications.　　Going forward, ROHM will continue to develop sensing products that meet customer needs by combining original light receiving and emitting elements to further improve energy savings and convenience.　　Product Lineup　　Application ExamplesSuitable for a wide range of applications that use light reflection to detect conditions.　　◆ Attachment/detachment detection of wireless ear buds, smart watches, gaming console controllers, VR headsets, and the like　　◆ Paper detection in printers, copiers, shredders, and other office automation devices　　◆ E-cigarette cartridge/liquid detection　　◆ Detecting various conditions in smartphones and laptops　　TerminologyVCSEL　　Short for Vertical Cavity Surface Emitting Laser, a type of laser diode that can emit light directly from the surface. Although conventionally used for communication, it is increasingly being adopted in recent years as a light source for the optical block in sensing systems.
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Release time：2023-10-10 10:19 reading：2101 Continue reading>>
Murata Electronics 2EG BLUETOOTH® 5.2 <span style='color:red'>Wireless</span> Module
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Murata Electronics 2EG BLUETOOTH® 5.2 Wireless Module

　　Murata Electronics 2EG BLUETOOTH® 5.2 Wireless Module is ultra-small and designed for connected IoT edge devices in industrial and medical applications. This module offers ultra-low power consumption, a rich peripheral interface, an integrated IoT cybersecurity platform, and a power MCU core for user applications. The 2EG wireless module provides a 7mm x 7.4mm x 1mm LGA package, 48MHz Arm® Cortex® M33, onboard antenna and external antenna options, and various I/O interfaces such as UART, QSPI, SPI, GPIO, ADC, DAC, PWM, and I2C. Murata Electronics 2EG Bluetooth 5.2 Wireless Module has an operating temperature range -40°C to +85°C and an input supply range of 1.2V to 3.6V.       FEATURES　　*Powerful MCU core for user applications　　*Ultra-low power consumption　　*Integrated IoT cybersecurity platform　　*Rich peripheral interface　　*Ultra-small size　　*Both onboard and external antenna options　　APPLICATIONS　　*IoT Edge Devices　　*Industrial　　*Medical　　SPECIFICATIONS　　*Bluetooth 5.2　　*Long range　　*2Mbps transmit rate　　*Proximity AoA and AoD　　*Up to 10 simultaneous connections　　*7mm x 7.4mm x 1mm LGA package　　*48MHz Arm Cortex M33　　*80kB RAM, 512kB flash　　*Arm CryptoCell 312　　*-95dBm receive sensitivity at 1Mbps　　*Ultra-Low Power　　*TX at 0dBm 4.3mA　　*RX at 1Mbps 2.7mA　　*40nA sleep mode at 3V VBAT　　*1.2V to 3.6V input supply　　*Shielded resin　　*-40°C to +85°C operating temperature range　　*FCC/ISED, ETSI, and TELEC regulatory certificates　　*UART, QSPI, SPI, GPIO, ADC, DAC, PWM, and I2C interfaces
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Release time：2023-09-14 15:09 reading：2536 Continue reading>>
Murata’s Latest <span style='color:red'>Wireless</span> Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations
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Murata’s Latest Wireless Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations

　　Murata, an industry leading electronics manufacturer, has further expanded its range of state-of-the-art wireless communication modules. The new LBEE5XV2EA (Type 2EA) module utilises Infineon’s CYW55573 system-on-chip (SoC), providing Bluetooth® 5.3 and triband Wi-FiTM operation – which includes both 2.4GHz and 5GHz bands as well as 6GHz band, Wi-Fi 6E, support.　　With many areas of the RF spectrum becoming increasingly overcrowded, Wi-Fi communication speeds can often suffer. The latest Wi-Fi 6E standard allows the same 9.6Gbps data rate as 5GHz Wi-Fi 6, but overall performance is more consistent thanks to less congestion and interference at 6GHz frequencies. Furthermore, Wi-Fi 6E provides additional (and wider) broadcast radio channels, which helps to increase data throughput in high-traffic areas.　　The module supports Wi-Fi 6’s target wake time (TWT) feature. This ensures that the device spends more time in standby mode, only communicating when necessary to reduce overall energy consumption and optimise network efficiency.　　The Type 2EA is equipped with on-board Bluetooth 5.3 functionality, including Bluetooth LE (low energy) Audio. This standard employs a new audio codec known as low complexity communications codec (LC3), which provides enhanced high-quality audio at a lower power requirement than Bluetooth Classic.　　20/40/80MHz channels are all incorporated into the module, with 1024-QAM modulation and a 2x2 MIMO antenna arrangement, helping to achieve heightened levels of data throughput. The Type 2EA’s wireless specification meets the latest IoT demands, making it ideal for low-latency communication applications such as video streaming, conference systems, virtual reality (VR) and augmented reality (AR) equipment, surveillance camaras, high resolution digital still camara, and alarm systems.　　Compared to other Wi-Fi 6E solutions available on the market, the Type 2EA has a better optimised design, thanks to utilising Murata’s high-performance components and miniaturisation expertise. With its surface mount device (SMD) design and compact size of just 12.5mm x 9.4mm x 1.2mm, the wireless module allows for easy system integration.　　While FCC certification is in preparation, the availability of ISED and MIC certification, along with conductive tests for CE, also helps to simplify any compliance process. This means that fewer engineering resources need to be committed, delivering both time and cost savings.
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Release time：2023-09-12 10:20 reading：2495 Continue reading>>
Ameya360:How to Select <span style='color:red'>Wireless</span> SoCs for Your IoT Designs
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Ameya360:How to Select Wireless SoCs for Your IoT Designs

　　Selecting a wireless system-on-chip (SoC) for your design isn’t easy. It requires careful consideration around several factors, including power consumption, size and cost. The SoC also needs to support the right wireless protocols for the IoT application and network, which then entails factors like range, latency and throughput.　　Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors.　　One way to ensure that your IoT design is optimized for the application is by carefully considering your choice of wireless SoCs. It also requires a careful evaluation of the key requirements of your design—including battery life, compute and memory resources, and footprint—because there will be performance tradeoffs, depending on the application.　　Designers have many factors to consider when selecting wireless SoCs for their products, said Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors. “There is no right answer in terms of what device or architecture to choose, as this depends on the series of engineering tradeoffs that the product designer is willing to make to satisfy the needs of their end customer.”　　There is also industry agreement that a strong development ecosystem with comprehensive support tools and service is paramount. These product and prototyping tools and services can help designers reduce their time to market and cost.　　So let’s address some of the top-of-mind design issues that engineers should consider when selecting wireless SoCs for their IoT designs, as well as some of the biggest challenges and tradeoffs.　　Use cases dictate design　　Most wireless SoC manufacturers agree that the application requirements determine the selection of the wireless SoC and help narrow down the options for the IoT design. One of the most critical factors is power consumption, they said, followed by a host of other considerations, such as wireless protocols, performance, cost, size, tool support and ease of integration.　　While power consumption is tapped as one of the most critical factors in selecting wireless SoCs, choice of the wireless protocol is governed by the application.　　The end application determines the priorities, said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated.　　He cited a few application examples in which design priorities define the selection of the wireless SoC.　　“For example, if it’s a battery-powered device, such as a wearable with a single Bluetooth connection, they may choose our SYN20703P [single-chip Bluetooth transceiver and baseband processor],” Bae explained. “If it’s a drone, they may need our SYN43400 Wi-Fi SoC, as power consumption and size—and weight—are very important and developers have to make the decision based on their go-to-market strategy.　　“A drone may also need both Wi-Fi and Bluetooth,” he added. “At that point, the number of wireless interfaces required for the application becomes important, and an integrated SoC with both is typically the best approach. Our SYN43756 [single-chip IEEE 802.11ax 2 × 2 MAC/baseband/radio with integrated Bluetooth 5.2] is a good solution for that.”　　Bae also noted that “application dependency can be extrapolated to include aggregation points or gateways for the IoT where multiple heterogeneous wireless networks come together.” This would benefit from a higher level of integration, with Bluetooth, Wi-Fi and Zigbee/Thread (IEEE 802.15.4 PHY), such as that provided by the Triple Combo SYN4381 wireless SoC, he said.　　Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs, agreed: “Every wireless protocol is playing a different role, and the end-application use cases are the most important in deciding one or more of these protocols for an IoT device.”　　Sogani said there are several key factors in selecting a wireless SoC for an IoT device, which vary by the application. His top five considerations, which are important for all kinds of IoT devices, include wireless protocols; security; battery life; hardware and software support, including peripherals, GPIOs, IDE support, cloud support and networking/wireless stack integration; and compute and memory resources available for the application after the OS, networking stacks and the wireless stacks have been integrated into the wireless SoC.　　For wireless protocols, requirements include application throughput, latency, number of network nodes and range, he said. “IoT devices are becoming more complicated every day as more functionality is getting integrated into the devices. Adding wireless to the IoT devices increases the complexity manifold. There are many wireless protocols being used in IoT devices, including Wi-Fi, BT, BLE, Zigbee, Thread, Z-Wave and cellular. The choice of wireless communication protocols for a particular device depends upon the application, size, cost, power and several other factors.”　　Sogani cited several examples in which the application, together with the performance requirements, are key to the decision-making.　　“BLE is a good protocol to use for a home-temperature sensor, as it consumes low power, it is lower in cost than some other protocols and it provides the necessary range in a typical home environment,” he said. “NFC provides the lowest throughput and the shortest range, making it ideal for contactless-payment–like applications. Wi-Fi provides higher application throughput needed for several applications, such as security cameras.”　　Design challenges　　Most chipmakers agree that wireless SoCs can simplify designs by integrating the different wireless protocols and handling the coexistence challenges between multiple protocols. They also deliver space savings, a key concern in many IoT designs. However, there are use cases where discrete solutions could offer the best value in terms of both performance and cost.　　“The benefits of a wireless SoC are many and include the assurance of a proven design, shorter time to market, smaller overall footprint, lower bill of materials [BOM] and lower inventory management costs,” said Synaptics’ Bae. “These advantages apply to mostly all end applications, but there may be instances where a discrete solution may work better if the customer has specific requirements and has the RF design skills and resources to implement in that direction.”　　NXP’s Palumbo said that when determining how to architect an end product that includes wireless connectivity, “one of the first decisions a product designer must make is whether they will use a single, integrated wireless SoC or separate the wireless from the processor. An equally important decision that needs to be made is which operating system will be used. The decision of the operating system will quickly shift designers either to lower-cost, RTOS-based microcontrollers or toward larger, more scalable, Linux-based processors.”　　Integrated wireless SoCs are physically smaller and may be lower-cost due to the integration, enabling the end-product designer to deliver a smaller product or a more innovative form factor, said Palumbo.　　“However, the challenge with an integrated wireless SoC is that the designer lacks flexibility to optimize the compute performance or the wireless performance independently and the capabilities of the wireless SoC itself are invariant, so there is not as much ability to optimize individual components of the product,” he said.　　Whether using an integrated or discrete solution, power consumption is still a key factor that is influenced by the system architecture and use cases. “This means in some cases, multi-chip solutions involving separate radio and processor chips may be easier to optimize,” said Palumbo. “In other cases, wireless processors may provide all the necessary flexibility needed for specific applications and use cases.”　　Palumbo provided some key examples in which power consumption plays a critical role. “For example, simple end applications like a sensor or actuator that have a low communications duty cycle and do not perform any ancillary networking functionality, such as routing, designers will see the lowest power consumption when using an integrated wireless SoC.” This type of application can be addressed with devices like NXP’s K32W148 wireless microcontroller.　　“However, for more complex devices—a thermostat, for example—where packet routing is an important feature for the overall user experience of the end device and the target ecosystem, a discrete solution may be lower power,” he said. “If a network co-processor [NCP] is included alongside the primary compute SoC, then this allows the networking stacks to be offloaded so that only the co-processor itself is required to wake up to route packets.”　　In this example, an NXP i.MX microprocessor like the i.MX 8M Mini can be used as the compute SoC, the NXP RW612 wireless MCU can be used as an NCP and the IW612 tri-radio solution can be used as a radio co-processor. “This can help reduce the power consumption of the system significantly—especially when an NCP is used with a Linux-based microprocessor as the primary compute platform,” said Palumbo.　　The product designer has to analyze these tradeoffs and select the architecture that makes the most sense for the value they are trying to bring to their customers, he added.　　Design tradeoffs　　Wireless integration can be quite challenging especially as it relates to RF circuitry, according to manufacturers of wireless SoCs, and all tradeoffs are driven by the use cases.　　The challenge is often about the radio-integration part of the solution to deliver good-quality product performance and to meet regulatory and protocol certification requirements, said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Nathalie Vallespin, wireless product line marketing manager, STMicroelectronics.　　“A wireless SoC simplifies the integration phase, as most customers first moving to wireless solutions are not RF experts, so integration simplifies and accelerates their development and production,” she said. “Product sourcing for end customers is also simplified by an integrated solution [SoC] and can be even further simplified using a module, which includes the whole reference design.”　　In addition, Vallespin said that “an SoC also ensures more efficient power and performance levels of the radio protocol and application, while a multi-chip solution creates connection interface constraints and complexity for software management. A discrete/multi-chip approach can also potentially lead to overconsumption to keep both host and radio running to communicate properly.”　　Synaptics’ Bae said there are many challenges with RF, but “they can be addressed through careful consideration of board layout, grounding, relative positioning of other digital ICs in the design to avoid interference, and antenna placement and routing. Aside from layout, the designers or developers need to be cognizant of the impact on the SoC from power-source switching, other sources of electromagnetic interference and materials choice for enclosures.”　　Wireless SoC integration can become challenging, depending on the number of wireless protocols it supports and the use cases, said Silicon Labs’ Sogani.　　He cited several challenges, including hardware integration (antenna placement, RF design, etc.), software development (wireless stacks, networking stacks, cloud connectivity, application development), RF testing (including extreme conditions), interoperability testing (with other devices it is supposed to connect to), wireless coexistence (multiple protocols need to co-exist), production testing (minimizing the test time and yield), regulatory certifications (for countries to be supported), protocol compliance (for protocols integrated in the device), power optimization (based on the battery requirements), system security (to ensure device and data security) and solution cost (based on the target).　　Designers need to make a tradeoff at every step to optimize between various parameters, and all of these tradeoffs are eventually drive by the application use cases, said Sogani.　　“With IoT devices needing to support multiple protocols, wireless SoCs provide an integrated solution that simplifies designs by integrating these protocols and handling the coexistence challenges between multiple protocols on the same ISM band internally, as well as not having to worry about managing and worrying about RF design for multiple devices,” he added. “This helps in faster development cycles and more seamless functionality between the various protocols. End applications do play a role, as it may be possible to use discrete chips for simpler applications, but as applications become complicated, it makes more sense to use integrated solutions.”　　Vallespin said understanding and selecting the right technology that will be the best fit for the application and market demand is a key challenge. Another challenge is understanding the chosen radio protocols and picking the right hardware (antenna, routing, BOM selection) and matching software, which can be specific to each technology, she said.　　The key tradeoffs are balancing price versus features as well as choosing the architecture—a host + co-processor approach or a single application processor, Vallespin added.　　Support and availability　　In addition to performance concerns, development and design support along with supply-chain issues like continued availability are priorities for many IoT designers.　　Key concerns include how effectively the product and its development ecosystem can reduce their time to market and cost, the availability of the product and prototyping tools and the long-term availability of the product, said Vallespin.　　There are also several questions that designers need to ask, such as if there are guarantees that the SoC will be available as long as their product is in the market, what the roadmap of the SoC is and if it aligns with their product development plan, and if there is sufficient support availability, including for documentation, ecosystem and contact to ensure success, she added.　　NXP’s Palumbo believes longevity requirements are part of the tradeoff equation.　　“Once a product has shipped, the hardware itself is unchanging; however, there is an expectation from the end customer that the product will continue to be supported and receive updates for some time after their purchase,” said Palumbo. “Selecting a device—and a product architecture—that enables product designers to provide updates for the lifetime of the product is a criterion that is gaining importance.”　　The software architecture is also another critical consideration when selecting a wireless SoC, said Palumbo. “Regardless of the product architecture—be it integrated wireless SoC or discrete—the software tools and environment for these SoCs are equally important components to the hardware. Whether a device is Linux-based, Android-based, or RTOS-based—even without considering the wrinkle of which RTOS to use from the myriad of solutions available—makes a massive impact on the end product.”
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Release time：2023-02-24 15:30 reading：1809 Continue reading>>
Ameya360:<span style='color:red'>Wireless</span> SoCs Solve Connectivity Challenges
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Ameya360:Wireless SoCs Solve Connectivity Challenges

　　Wireless systems-on-chip (SoCs) are favored by IoT system designers for their high functionality, low power consumption and space savings. These devices are comprised of a number of key components, including the processors, radios, power management, memory, interfaces and peripherals.　　One of the biggest drivers in wireless SoCs is the growing need for multi-protocol support to meet the requirements of different IoT devices. Chipmakers need to keep up with existing standards that continue to evolve as well as new wireless standards. These include Wi-Fi, Bluetooth LE, Bluetooth classic, 802.15.4, ZigBee, Thread, Z-Wave, Matter, cellular and other proprietary wireless protocols.　　Through this integration and multi-protocol support, wireless SoCs are solving some of the biggest technical challenges around wireless design while simplifying development by providing all of the necessary functionality, along with the connectivity and security in one device. But designers aren’t on their own; SoC makers also provide complete ecosystems and reference designs that can lower design risk and shorten the design cycle.　　“A wireless SoC typically comprises the radio itself—one or more, depending on the application—a MAC/PHY for the Wi-Fi and PHY for Bluetooth, along with a power management unit, memory, various I/O ports, a debug port, possibly an analog-to-digital converter and bus management IP,” said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated. “Interfaces for external power amplifier and low-noise amplifier options, with associated switches, are also good to have.”　　Brandon Bae, senior director, product marketing, wireless connectivity at Synaptics Incorporated.　　Depending on the protocols supported and the end applications, the components in a wireless SoC could be different, said Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs. “Power optimization, longer range, robust connectivity, higher processing power, more peripherals and higher memory will continue to be the driving trends in wireless SoCs, and we will see continuous improvement in these.”　　Wireless SoCs are also packed with security features, making them suited for a range of embedded IoT systems, such as smart homes, smart metering, building automation and fitness devices.　　“Security is increasingly a concern to protect personal data and to protect IP, and many SoCs are adding features to address security at multiple hardware and software levels,” said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Highly integrated wireless SoCs　　As demand grows for wireless SoCs, chipmakers continue to meet requirements for better security and greater interoperability and are adding advanced features for sensors, graphics, artificial intelligence and machine learning. There is also a drive toward multi-protocol connectivity support with options for Wi-Fi, Bluetooth, LoRa, Zigbee, Matter and other protocols.　　“There is always a requirement for a higher level of integration in the wireless SoCs to meet the application use cases, simplify IoT device development and reduce cost,” Sogani said.　　One of the key areas is a higher level of hardware and software integration, which includes the integrated applications processor, integrated networking stacks, cloud connectivity, digital and analog peripherals, additional GPIOs and higher memory, along with support for new protocols like Matter, Amazon Sidewalk and Wi-SUN, he added.　　“Integration of multiple protocols is becoming critical,” Sogani said. These include the combinations of Wi-Fi and BLE and 802.15.4 and BLE, as well as Wi-Fi, BLE, 802.15.4 and even sub-gigahertz integration.　　“Bluetooth classic integration is also needed to support legacy headsets,” he added. “These protocols need to operate concurrently, which needs significant hardware and software work.”　　Dhiraj Sogani, senior director, wireless product marketing, at Silicon Labs.　　In addition, “Matter over Thread and Matter over Wi-Fi is gaining significant momentum, as it enables interoperability of different ecosystems, such as Google, Amazon and Samsung,” Sogani said. “Wi-SUN is becoming more critical for smart-city deployments. Amazon Sidewalk shows significant promise to become a leading protocol for neighborhood connectivity.”　　Vallespin noted that the evolution in standards is also enabling new use cases: “In Bluetooth Low Energy, audio is creating many new use cases to manage new user experiences and is replacing the Bluetooth classic technology. Matter technology, just announced late last year, is a new standard for connected-home applications, and ultra-wideband is increasingly being used for car access control.”　　STMicroelectronics offers a wireless roadmap based on its popular STM32 family of microcontrollers and ecosystem. These include the STM32WB series for Bluetooth LE, Thread, Matter and Zigbee and the STM32WL for LoRa and other sub-gigahertz protocols. “STM32 wireless products add best-in-class IPs to smoothly migrate to wireless platforms,” Vallespin said.　　Sogani noted two other key trends, including the integration of machine learning for IoT edge devices for simple audio, vision and data applications like keyword spotting, motion detection and glass-break detection, as well as security integration at the hardware and software level for improving IoT device security.　　Synaptics’ Bae agreed that there is a higher degree of integration coming: “We’re looking at advancing to finer nodes to not only shrink the die size, but it also frees up space to integrate more memory for more features for a given package size. The drivers tend to be functionality, size, power and cost, so if we can provide greater functionality for a given footprint while also improving power consumption, our customers like that.　　“It’s not always good to move to a smaller package, even when that’s possible, as that requires board redesigns,” Bae said. “More functionality is often preferred.”　　Similarly, Vallespin said the process node is a key factor in delivering new degrees of integration. “Smaller geometries allow greater integration.”　　Latest advances　　Wireless SoC vendors agreed that new product development is driven by wireless standards and the need for higher functionality, more integration and lower power consumption.　　For example, Silicon Labs’ wireless SoC roadmap focuses on “intelligent wireless connectivity for IoT devices.” The company offers a wide range of wireless solutions, including Wi-Fi, Bluetooth, 802.15.4, ZigBee, Thread, Z-Wave and proprietary wireless.　　Silicon Labs’ latest advances include its 2.4-GHz wireless MG24 SoC for Bluetooth and multiple-protocol operations. The MG24 supports Matter over Thread as a single-chip solution—with a range of up to 200 meters indoors for OpenThread—while also enabling Bluetooth commissioning of new devices on the same chip, Sogani said. “The MG24, combined with the ultra-low–power Silicon Labs RS9116 or Silicon Labs WF200 Wi-Fi products, enables development of Matter over Wi-Fi 4.”　　Silicon Labs also offers the FG25, the company’s new flagship SoC for Wi-SUN, which is one of the world’s first open protocols for smart-city and smart-utility applications. “The EFF01 is the FG25’s corresponding amplifier that boosts signal range by 2× when used together,” Sogani said.　　He said the FG25 “will be the world’s most secure smart-city solution, with long range, the largest memory capacity of any SoC in the Silicon Labs portfolio and the ability to operate for up to 10 years on a coin-cell battery.”　　In addition, Silicon Labs’ first Wi-Fi 6 and Bluetooth LE SoC, the fully integrated SiWx917, is designed to be the lowest-power Wi-Fi 6 and Bluetooth LE SoC in the industry, Sogani said. “The SiWx917 is a single-chip solution that is Matter-ready, includes an integrated applications processor and offers industry-leading energy efficiency, making it ideal for battery-powered or energy-efficient IoT devices with always-on cloud connectivity.”　　Synaptics is focusing on two major industry trends: connecting sensors that are gathering data to the AI systems or devices that are doing the analysis, and making wireless devices easier to use, Bae said.　　“First, we’re simplifying the integration of AI and wireless through KatanaConnect, which combines our Katana low-power edge AI SoC with our SYN430132 1 × 1 Wi-Fi/Bluetooth combo chip on a tiny module measuring 32 × 32 mm,” he said. “Second, our mix of Bluetooth, ULE, Wi-Fi, 802.15.4 and GNSS solutions is unique in the industry. They are proven solutions that simplify the cost-effective and rapid development of IoT connectivity devices. This has clear single-source benefits of both product and design expertise, so we know how to connect IoT devices.”　　However, Bae said there is more to it than having the silicon and track record. “We’re also either already Matter-compliant or are working on it across all our solution stacks so we can ensure users benefit from Matter’s promise of a seamless user experience across platforms and interfaces.”　　A good example of Synaptics’ Matter support and high integration is the SYN4381 Triple Combo SoC, which the company claims as the first to combine Wi-Fi 6/6E (802.11ax with extended 6-GHz operation), Bluetooth 5.2 (BT 5.2) with BLE audio and high-accuracy distance measurement, and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The SoC and its SynFi software simplify product development by providing secure and scalable connectivity between devices across heterogeneous IoT networks, regardless of platform, OEM or brand, the company said. For end users, they get a simplified setup and seamless control across their smart-home devices.　　Key differentiators for Synaptics include its robust connectivity and the ability to balance cost and performance, Bae said. “For example, while many offer Wi-Fi/Bluetooth combo solutions, they haven’t fully controlled the signaling, and that shows up as glitches in both audio and video.”　　To solve the problem, Synaptics has developed a proprietary mechanism, which it calls Smart Coexistence, in the 2.45-GHz band. It “carefully manages the Wi-Fi and Bluetooth transmission and reception to avoid lost packets and the inefficiencies of retransmissions,” Bae said.　　Bae added it is baked into all of its combo chips, including the SYN4381 Triple Combo, as well as the SYN43756 Bluetooth/Wi-Fi combo chip, an IEEE 802.11ax 2 × 2 MAC/baseband/radio IC with integrated Bluetooth 5.2 (with LE Audio).
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Release time：2023-02-23 15:59 reading：1920 Continue reading>>
Ameya360:What are the main types of wireless sensors
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Ameya360:What are the main types of wireless sensors

　　The component module of the wireless sensor is packaged in a shell, and it will be provided by the battery or the vibration generator when working, constituting the wireless sensor network node. It is widely used, and the wireless sensor is included in an electronic device everywhere in life. So wireless sensors are no stranger. In order to help you in-depth understanding, this article Ameya360 electronic components purchasing network will summarize the relevant knowledge of wireless sensors. If you're interested in what we're going to cover in this article, read on.　　First, what is wireless sensor Wireless sensors are devices that collect sensory information and detect changes in the local environment. Examples of wireless sensors include proximity sensors, motion sensors, temperature sensors, and liquid sensors. Wireless sensors do not perform heavy data processing locally, they consume so little power that a single battery can last for years with the best wireless technology. In addition, sensors are easy to support on slow networks because they transmit very light data loads.　　Wireless sensors can be grouped to monitor environmental conditions across an area. These wireless sensor networks consist of a number of spatially dispersed sensors that communicate through wireless connections. Sensors in a public network share data through nodes that consolidate information at the gateway or each sensor directly connected to the gateway, assuming it can reach the necessary range. Gateways act as Bridges connecting local sensors to the Internet, acting as both routers and wireless access points.　　Two, the main types of wireless sensors　　1. Vibration sensor　　The maximum sampling rate of each node can be set to 4KHz, and each channel is provided with anti-aliasing low-pass filter. The collected data can be transmitted wirelessly to the computer in real time or stored in the 2M data memory built in the node, ensuring the accuracy of the collected data. The effective outdoor communication distance is up to 300m, the node power consumption is only 30mA, and the built-in rechargeable battery can be used for continuous measurement for 18 hours. If you choose a node with a USB interface, you can not only charge the node through the USB interface, but also quickly download the data in the memory to the computer.　　2. Strain sensor　　The node is compact in structure and compact in size. It is composed of power module, acquisition and processing module and wireless transceiver module. It is encapsulated in PPS plastic shell. Each channel of the node has an independent high-precision 120-1000Ω bridge resistance and amplification and conditioning circuit, which can be easily switched automatically by the software to select 1/4 bridge, half bridge, full bridge measurement mode, compatible with various types of bridge sensors, such as strain, load, torque, displacement, acceleration, pressure, temperature, etc. The node supports both 2-wire and 3-wire input modes, and the bridge is automatically trimmed. It can also be stored in the built-in 2M data storage of the node. Effective outdoor communication distance up to 300 m. It can be measured continuously for more than ten hours.　　3. Torque sensor　　The node is compact in structure, compact in size and encapsulated in a resin shell. Each channel of the node is equipped with a high precision 120-1000Ω bridge resistor and an amplification and conditioning circuit. Automatic bridge trim. The in-air transmission rate of the node can reach 250K BPS, the effective real-time data transmission rate can reach 4K SPS, and the effective indoor communication distance can reach 100 meters. The node is designed with special power management software and hardware. In the case of real-time uninterrupted transmission, the power consumption of the node is only 25mA, and the ordinary 9V battery can be used for continuous measurement for dozens of hours. For long-term monitoring applications, torque values are sent at 5-minute intervals, and battery replacement is not required for several years, greatly improving the system's maintainability.　　In this article, Ameya360 can only give you a preliminary understanding of wireless sensors. I hope it will be of some help to you. At the same time, it needs to be summarized constantly so as to improve your professional skills.
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Release time：2023-02-22 15:34 reading：1539 Continue reading>>

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