2020年Q2全球封测厂商排名出炉！

Release time：2020-08-18
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source：国际电子商情网
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根据TrendForce集邦咨询旗下拓墣产业研究院表示，2020年第一季受到新冠肺炎疫情冲击，因各国边境管制与封城措施使整体供应链出现断链情况，不论是客户及渠道库存均偏低。第二季随着供应链逐步恢复供给，加上各国持续推出救市措施与宅经济发酵，使得下游客户回补库存的力道加大，推升全球封测产值接续增长，预估2020年第二季全球前十大封测业者营收为63.25亿美元，年增26.6%。

拓墣产业研究院分析师王尊民表示，虽然下游客户回补库存需求涌现，然近期中美关系降到冰点，加上疫情在美国、南美洲、印度及东南亚等地持续升温，恐将压抑下半年终端需求。

中美关系与疫情发展态势将成为2020下半年全球封测营收盈亏关键

中国台湾和大陆地区几家封测龙头在2020年第二季均有不俗成长。

其中，日月光(ASE)第二季营收为13.79亿美元，年增18.9%，虽成长幅度较第一季稍微收敛，但因5G通讯与消费性电子的封测需求上升，成长趋势依然稳健。至于矽品(SPIL)、力成(PTI)及京元电(KYEC)，还有美商安靠(Amkor) 同样受惠于终端消费产品、存储器及5G芯片等封测产能提升，年成长率皆突破三成；并且因疫情所获转单效应，以及美系设备商将于9月15日后终止对华为产品的制造服务，已趋使封测业者于第二季加速出货进程。

大陆地区的封测三雄江苏长电(JCET)、天水华天(Hua Tian)、通富微电(TFME)，因国内境内疫情获得有效控制，进而拉升各类手机、AI芯片及穿戴设备的封测需求，预估三家企业第二季年成长率约近三成。

另一方面，第二季下旬大尺寸面板市场需求与终端销售表现逐渐回温，大尺寸面板驱动IC (LDDI)和触控面板感测芯片(TDDI)稼动率维持在高档，南茂(ChipMOS)、颀邦(Chipbond)第二季营收分别有16.6%与4.8%的年增表现。

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