台积电：3nm或将在2022量产

Release time：2020-11-26
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source：eefocus
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据媒体报道，台积电 3nm 芯片将于 2022 年下半年量产，月产量为 5.5 万片，在 2023 年，将达到 10.5 万片。据了解，台积电此前已在研发 3nm、4nm 制程工艺。

 

3nm 工艺是 5nm 工艺的自然迭代，相较于 5nm 工艺，3nm 工艺可以减少 25%~30%功耗、提升 10%~15%性能。目前台积电 3nm 芯片研发进展顺利，计划在 2021 年试产，2022 年下半年大规模量产。台积电在台南科学园的雇员数目前为 1.5 万人，到 3nm 芯片量产时，将达到约 2 万人。

 

台积电是全球第一家专业积体电路制造服务（晶圆代工）企业，在芯片制造工艺方面全球领先。截至今年 7 月，台积电已经生产超 10 亿颗 7nm 芯片，包括苹果、华为在内的全球几十家公司都是台积电的客户。同时，台积电 5nm、6nm 芯片已在量产中，并且 5nm 工艺会在明年推出 N5P 增强版。

 

董事长刘德音表示，台积电今年营收持续创新高，在 3nm 领先布局，于南科的累计投资将超过 2 万亿元新台币（下同），目标是 3nm 量产时， 12 英寸晶圆月产能超过 60 万片。台积电规划，3nm 于 2022 年量产。

 

值得一提的是，此前有消息称，台积电在 2nm 工艺上取得一项重大突破，据此推断，台积电 2nm 工艺有望在 2023 年下半年进行风险性试产，在 2024 年进入量产阶段。


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