UMC Expects A Ito Grow to $3 Billion Business

发布时间:2018-01-25 00:00
作者:Ameya360
来源:Alan Patterson
阅读量:1743

  United Microelectronics Corp. (UMC) expects artificial intelligence (AI) to contribute $3 billion to company revenue by 2021 as demand for edge computing and automotive devices takes off.

  AI is forecast to be one of the fastest growing markets during the next few years as more companies adopt machine learning in everything from autonomous vehicles to cryptocurrency mining. The global AI market for semiconductors is projected to grow at a compound annual rate of 63 percent between 2016 and 2022, reaching $16 billion by 2022, according to research firm MarketsandMarkets.

  UMC sees the driving forces behind the foundry business shifting from smartphones to AI and autonomous vehicles. While UMC declined to quantify how much its AI business is currently worth, the company said it is already doing AI-related work for edge computing devices and cars.

  “In recent months, we’ve seen a lot of customers coming to us to talk about the automobile segment,” said UMC Senior Vice President of Marketing Steven Liu in an interview with EE Times. “Not just Europe. We also see a lot of requests from Japan and the U.S.” That demand is coming from both IDMs and fabless companies, he said.

  In the automotive segment, UMC silicon goes into the power train, infotainment systems, ADAS and safety systems. UMC currently builds MCUs for infotainment and ADAS.

  More business is coming to UMC through fabless companies such as Faraday Technology Corp., a company that’s part of the UMC ecosystem.

  “Business for the design houses has been much stronger than I anticipated,” according to Liu. “The customer portfolio is different from before. A lot of the demand is from medium and small AI-related companies. We do see the momentum continuing.”

  UMC’s revenue contribution from the automotive segment doubled between 2016 and 2017. Due to the stringent safety and quality requirements of the industry, UMC is taking a long-term view toward development work, much of which probably will not pan out until 2020 or even 2030, according to Liu. Power and ADAS are two areas where UMC sees strong demand.

  Automobiles will soon play a different role, and quality, safety and the ability to communicate will become very important. UMC aims to focus on its automotive business by providing better quality and reliability. MCUs and ALRs are devices the company will aim for.

  UMC expects power-related devices to show huge potential over the next 10years. “We have an advantage today, and we will definitely enhance our technology leadership,” according to Liu. UMC will announce partnerships with customers this year, he said.

  Beyond the automotive business, UMC is aiming to provide devices for data sensing in edge computing such as MEMS sensors, audio codecs, control MCUs for robots and application processors for parallel computing.

  UMC is also evaluating emerging memories such as MRAM.

  “There is a chance we can be a leader here,” according to Liu. “At this moment, we are evaluating more than seven kinds of memories. Performance, cost and partnerships are among the factors UMC is considering.”

  Moving in a New Direction

  The company sees opportunity in AI as it moves in a new direction.

  “Rather than chasing advanced nodes and following the giants, at this moment, we need to slow down before we pursue the advanced nodes,” Liu said. UMC’s focus will be on edge computing and end devices. The company sees potential in neuromorphic chips. They don’t necessarily need the most advanced process technology, according to Liu.

  “UMC will have very good technology in sensors, which will be key elements for systems to retrieve data,” Liu said. Also microcontrollers. “MCUs will play a critical role for devices in IoT. That’s one reason why we will aim for strategic MCUs and SIM cards. Those are some of the key things that we see for AI.”

  UMC offers a variety of microcontrollers and some of the most competitive bank card solutions, according to Liu.

  UMC says its ecosystem is starting to change as demand for AI-related ASICs heats up. A lot of OEMs have their own design teams for software, algorithms and hardware. What’s different today is that the hardware also involves chip design. That has created a lot of demand, both direct and through design-service companies.

  “Starting from the second half of 2016 through 2017, the design-service companies, especially in Taiwan, have seen their business go crazy,” Liu says.

(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
UMC Announces First Delivery of Mass-Produced Silicon Photonics Wafers from Singapore 12-Inch Fab
  Taiwan’s foundry UMC and Singapore-based silicon photonics chip designer SILITH announced on July 14 the first delivery of mass-produced silicon photonics wafers from UMC’s 12-inch fab in Singapore. The milestone marks the transition of silicon photonics from development to high-volume production and will support 1.6T solutions for AI and hyperscale data centers. The platform has achieved production-grade performance with high yield and has been qualified by a leading cloud infrastructure customer for volume deployment, according to UMC’s press release.  According to Nikkei, SILITH will be UMC’s first major customer for its new 12-inch silicon photonics production. The report adds that SILITH’s customers include leading optical transceiver makers such as Innolight and Coherent, both key suppliers to NVIDIA and Google.  In addition to the successful commercialization of the first silicon photonics product for a customer, UMC is making its own 12-inch silicon photonics platform available for customer product development in 2027, its press release notes.  Expanding the Silicon Photonics Roadmap  Building on the successful commercialization of SILITH’s 200G/lane silicon photonics products, UMC and SILITH are extending their silicon photonics roadmap to support next-generation 400G-per-lane optical interconnects.  Looking further ahead, UMC senior vice president G.C. Hung, as cited by Nikkei, said the company aims to debut an open silicon photonics platform by 2028 to help customers develop a broader range of optical chips and silicon photonics technologies.  UMC also plans to begin offering advanced packaging services in 2027, enabling photonic chips to be connected to an interposer that shortens electrical paths to processors and improves connectivity speed, according to Nikkei. The press release also notes that UMC is collaborating with ecosystem partners to develop thin-film lithium niobate (TFLN)-based solutions for future ultra-high-bandwidth optical interconnects.  TrendForce forecasts that the CPO/NPO market will surpass US$39 billion by 2030, with growth accelerating sharply between 2028 and 2029 as scale-up architectures begin incorporating optical interconnect technologies.
2026-07-15 16:07 阅读量:357
UMC May Net Profit Surges 203% YoY as Utilization Strength Drives Earnings Upside
  Ahead of its planned second-half price increases, UMC is already riding a profit upswing fueled by robust utilization rates. The foundry posted May revenue of NT$22.94 billion, up 17.8% year-over-year, while net profit soared 203% to NT$8.45 billion, translating into EPS of NT$0.68, according to its latest unaudited earnings disclosure.  Notably, May EPS alone nearly matched the NT$0.71 generated in the whole second quarter of last year, and accounted for roughly 53% of the NT$1.29 earned in the first quarter of 2026, according to the Economic Daily News and MoneyDJ.  The strong momentum in May aligns with UMC’s Q2 guidance. According to Central News Agency, wafer shipments are expected to rise 7%–9% QoQ, with utilization reaching 81%–83%. ASPs are projected to increase 1%–3%, supporting gross margin close to 30%.  Industry sources cited by the Economic Daily News further indicate UMC’s overall capacity utilization averaged around 85% in the second quarter of 2026. The company’s 12-inch fab in Tainan has yet to reach full utilization, while its Singapore facility remains fully loaded and its Xiamen fab is operating near full capacity, the report suggests.  Meanwhile, demand for specialty 8-inch process technologies continues to strengthen, with product lines including PMICs maintaining stable order intake, as noted by the report.  UMC has further cemented its position in the mature-node foundry segment, with 22/28nm accounting for 34% of wafer revenue, followed by 40nm at 18%, according to its latest quarterly earnings. Geographically, Asia Pacific remained the largest market at 65% of sales, while North America contributed 21%.  Intel Collaboration Rumors  While market speculation around a potential UMC–Intel partnership on 3nm technologies has intensified, UMC said it does not comment on rumors or market speculation, as noted by TechNews.  More concretely, the 12nm collaboration between UMC and Intel is progressing smoothly. According to the report, the jointly developed 12nm FinFET platform is on track for mass production in 2027. The program is being advanced in close collaboration, with process validation expected to complete in 2026 before production is transferred to Intel’s Ocotillo fab in Arizona, the report adds.  Additionally, the Economic Daily News also notes that UMC is focusing on silicon photonics and advanced packaging. The company has secured silicon photonics process licensing and is leveraging its proprietary SOI process and 8-inch volume production experience to advance a 12-inch silicon photonics platform. Meanwhile, embedded deep trench capacitor products have entered mass production and begun shipment, and have been designed into international customers’ supply chains, according to the report.
2026-06-25 10:38 阅读量:472
Ameya360:UMC and Cadence Partner on 3D-IC Hybrid Bonding Reference Flow
  Cadence Design Systems Inc.’s 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for United Microelectronics Corp.’s (UMC) chip stacking technologies, thereby enabling faster time to market for customers.  UMC’s hybrid bonding solutions are now ready to support the integration across a broad range of technology nodes that are suitable for edge AI, image processing, and wireless communication applications. Using UMC’s 40nm low power (40LP) process as a wafer-on-wafer stacking demonstration, the two companies collaborated to validate key 3D-IC features in this design flow, including system planning and intelligent bump creation with Cadence’s Integrity 3D-IC platform, the industry’s first comprehensive solution that integrates system planning, chip and packaging implementation, and system analysis in a single platform.  “Interest in 3D-IC solutions has increased notably in the past year as our customers seek ways to boost design performance without sacrificing area or cost,” said Osbert Cheng, vice president of device technology development and design support at UMC. “Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.”  “With increasing design complexity for IoT, AI, and 5G applications, wafer-on-wafer technology automation is increasingly important for chip designers,” said Don Chan, vice president, R&D in the Digital & Signoff Group at Cadence. “The Cadence 3D-IC flow with the Integrity 3D-IC platform is optimized for use on UMC’s hybrid bonding technologies, providing customers with a comprehensive design, verification and implementation solution that enables them to create and verify innovative 3D-IC designs with confidence while accelerating time to market.”  The reference flow, featuring Cadence’s Integrity 3D-IC Platform, is built around a high-capacity, multi-technology hierarchical database. The platform offers design planning, implementation and analysis of full 3D designs within a single, unified cockpit. Multiple chiplets in a 3D stack can be designed and analyzed together through integrated early analysis for thermal, power and static timing analysis. The reference flow also enables system-level layout versus schematic (LVS) checking to connectivity accuracy, electric rule-checking (ERC) for coverage and alignment checking, and thermal analysis for heat distribution in a 3D stacked-die design structure.  In addition to the Integrity 3D-IC platform, the Cadence 3D-IC flow also includes the Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Signoff Solution, Pegasus Verification System, Voltus IC Power Integrity Solution and Celsius Thermal Solver for system analysis.
2023-02-22 15:54 阅读量:2587
UMC Halts R&D Project with China Chipmaker
Taiwan’s United Microelectronics Corp. (UMC) has shelved an R&D project with Chinese chipmaker Fujian Jinhua after the U.S. government ordered a ban on supplies of equipment to the company.The U.S. government on Monday cut off U.S. firms from supplying Fujian Jinhua following allegations that the Chinese fab stole intellectual property from U.S. semiconductor company Micron Technology. The move comes as the U.S. escalates a trade war with China that is increasingly focused on high-tech products.UMC and Jinhua started a project in May 2016 to develop technology for DRAM chips. Jinhua agreed to supply equipment and an unspecified amount of money to UMC for development of the technology at a UMC fab in Tainan, Taiwan. As part of the agreement, the partners would jointly own the technology. UMC planned to use the technology for its foundry customers and did not plan to enter DRAM production or invest in Jinhua.“We are just following the regulations set forth by the Taiwan government and the U.S. government,” UMC spokesman Richard Yu told EE Times regarding the suspended R&D project.  Taiwan’s Bureau of Foreign Trade issued a bulletin to domestic companies regarding business with Fujian Jinhua following the U.S. government ban.Yu was unable to elaborate on what technology, if any, UMC has transferred to Jinhua at this stage. He noted that the R&D project has been underway for more than two years.The U.S. Commerce Dept. said that Fujian Jinhua is nearing completion of its DRAM fab and that its technology likely originated in the U.S. The Chinese company, which has invested $5.7 billion in a 12-inch fab in Fujian Province’s Jinjiang City, is scheduled to start its first production this year.With the support of the Chinese government, several startups in the nation aim to make memory chips to reduce dependence on imports of semiconductors.UMC’s R&D work for Jinhua has been done at the 32nm node, which is several generations behind state-of-the-art technology for DRAM production. UMC developed its DRAM technology a number of years ago, Yu said.It is possible that Jinhua might eventually shrink the technology acquired from UMC, but UMC was not contracted to do further refinements, according to Yu.It is likely that Jinhua plans to use the technology to make commodity DRAM.UMC is part of a joint-venture investment with another Fujian chipmaker called United Semi in the city of Xiamen, but the Taiwan company has no equity relationship with Fujian Jinhua.
2018-11-02 00:00 阅读量:1955
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
型号 品牌 抢购
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。

请输入下方图片中的验证码:

验证码