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- 绍兴 600 亿元 IC 项目奠基，将建设 8 英寸和 12 英寸晶圆
绍兴 600 亿元 IC 项目奠基，将建设 8 英寸和 12 英寸晶圆
Release time：2019-11-18
author：
source：与非网
reading：1728
近日，绍兴市两岸集成电路创新产业园项目奠基：总投资不低于 600 亿元人民币，将建设 8 英寸和 12 英寸晶圆制造基地。
据悉，绍兴两岸集成电路创新产业园项目由上海中天传祺基业有限公司牵头组织实施，计划总投资不低于 600 亿元人民币，将建设 8 英寸和 12 英寸晶圆制造基地，同时导入 200 家上下游集成电路相关企业和台湾科学园区管理团队。
来源：绍兴网
据了解，首批入园的龙头项目为 8 英寸晶圆制造厂及汽车电子暨物联网芯片产业园区，计划总投资 100 亿元，未来将打造研发设计、电子研究院、交易中心、智造平台、众创空间、企业孵化、人才培育七大功能平台。
近年来，绍兴市大力发展集成电路产业，中芯绍兴、长电科技等一批晶圆制造、封装、测试头部企业相继落户，集成电路产业平台入选首批省级“万亩千亿”新产业平台培育名单，“绍兴集成电路产业创新中心”成功纳入《长三角区域一体化发展规划纲要》。
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