Ameya360:Tackling RF Design Challenges in 5G Rollout

发布时间:2023-01-19 13:27
作者:Ameya360
来源:网络
阅读量:2928

  As 5G technology continues to roll out and offer improved network capacity, design challenges and other hurdles are emerging in the analog front-end space. One significant challenge is a densely-packed radio with multiple transmitters and receivers. Other issues to troubleshoot include operating over wider bandwidths and over several different frequencies. Improved digital twins and RF models also play important roles.

Ameya360:Tackling RF Design Challenges in 5G Rollout

  While the challenges may evoke memories of the 4G commercial rollout in 2009, this latest generation poses even more issues to overcome.

  “The initial rollout of 5G looks and feels very similar to the current 4G LTE design space, with typical challenges of multiple frequency bands and lots of tough filtering and power requirements,” said Joe Civello, director of RFMW product management and PathWave software solutions at Keysight Technologies. “While this is challenging by itself, it is just the tip of the iceberg for what is coming in 5G. As the higher frequency bands roll out, along with small cell deployments in dense areas, the challenges will increase dramatically. Analog front ends need to operate over wider bandwidths and at several different frequencies, sometimes simultaneously in the case of non-contiguous channel bonding.”

  The improvements and the challenges often come in the same package.

  “Beamforming [in which a wireless signal is directed to a specific receiving device] is at the core of network capacity improvements offered in 5G, but it presents radio designers with significant challenges,” Peadar Forbes, director of radio platform development at Analog Devices, said. “First, you have a densely packed radio with multiple transmitters and receivers, up to 64 in the case of sub-6 GHz or up to 256 in the case of mmWave radios. The dense packing of transceivers, power amplifiers, LNAs and filters causes significant thermal RF isolation and coupling challenges for radio designers. Secondly, there are a lot of digital circuitries operating at awkward frequencies with the potential to interfere with the radio.”

  Along with beamforming, other new 5G technologies including multiple input, multiple output (MIMO) and antenna arrays, will reshape and improve the analog front-end and bring more challenges, Forbes said. The antenna arrays must be calibrated to fine degrees of accuracy, for example, to enable accurate beams—but that adds complexity, he said.

  One big unknown is the impact of artificial intelligence/machine learning optimization of the air interface, Civello explained.

  “Researchers in academia and industry are looking at the benefits, which can be realized for channel estimation, beam management and positioning accuracy,” he said. “It’s certainly conceivable that this research will drive not only new signal processing technology, but also impact the RF and antenna architectures in a secondary, but significant, way. Exactly what this means is to be discovered.”

  Additionally, increasingly broadband over-the-air systems are more prone to the effects of interference from a packed spectrum, and careful system analysis is needed to mitigate this for all potential scenarios, Civello said.

  The designer also must manage internal interference from reference sources and oscillators within the overall system in the context of a broad channel, Civello added. System analysis must also include all the power amplifiers’ load pull characteristics as the array scans, interacting with the array active impedance, he said.

  The major burden for managing this risk falls across three tiers of the ecosystem: system-on-a-chip (SoC) design houses, RF system integrators and network infrastructure companies, according to Civello. The requirements will flow down from the network companies to the system providers, and then to the RFIC designers, he said.

  Achieving a successful 5G rollout

  The best way for companies to succeed with the complexity of 5G and future 6G systems, Civello noted, is to build a robust design flow—not just for their own products, but for their customers’ products, as well.

  “The more product data can be shared beyond just datasheets and plots, the better these complex SoCs can be integrated into the end products,” he said. “If the SoC suppliers take a design-for-context approach and design and validate their products in the way their customers will use them, the higher the chances are for successful system integration.”

  The parallel transmit and receive paths required for these new technologies will compound the challenges of existing 5G front-end architectures, according to Forbes. While these techniques offer significantly improved data rates, they require multiple front-end chipsets to deliver multiple signals.

  In turn, this creates challenges of space and power for handset manufacturers. Base station implementations have less constraints on size and power, but for deployment in dense urban and indoor areas, the size and power constraints will present a similar challenge, he said.

  Highly directive phased arrays handling multiple users simultaneously can easily scale up to thousands of elements, each requiring an analog front-end to drive the antenna, Forbes added. Then the challenges shift to the system-level architecture and the need for good modeling for 5G designs.

  “Accurate RF modeling is necessary to predict the overall system performance. Without this high-fidelity system model, it’s impossible to analyze all the possible design architecture trade-offs to find the optimal solution for a given application,” he said. “Designing for these applications requires simulation using the real modulated waveforms rather than just CW stimulus. Without these waveforms, performance can’t be predicted until lab testing, which is then often followed by troubleshooting and possibly re-design. One way of addressing this is by creating accurate nonlinear models of analog front-end behavior, which can be used in higher-level system simulation tools to exercise the RF portion with not only real waveforms, but also in actual deployment scenarios.”

  Power amplifiers, RF transceivers, and antenna tuning for multiple antennas pose additional front-end design challenges, Civello said.

  “Power amplifier design in 5G has some of the traditional challenges related to size, cost, power and performance, but there are even more challenges associated with linearity, efficiency, high bandwidth, high temperatures and increased integration,” he said. “It also brings new challenges with frequencies increasing or latency decreasing.”

  Traditional flows around sub-GHz, for example, were using laterally diffused metal oxide semiconductor (LDMOS) or gallium arsenide (GaAs) technologies. To cope with the frequency/power dilemma, the use of gallium nitride (GaN) keeps increasing, Civello said.

  Designing GaN is not a minor change of technology, however, and brings new technological challenges, such as stronger memory effects or a more precise thermal management for ICs as well as assembly.

  “Just trying to solve the thermal challenges in 5G power amplifier design requires new design techniques and access to integrated electrical and thermal simulations because they are interdependent,” Civello said. “When you look at the sum of these requirements, it adds more and more complexity for the designer and solving these requires much more upfront design and simulations.”

  Keysight’s answer to multi-vendor tool challenges

  One ongoing challenge that Keysight is working to solve, Civello noted, is multi-vendor tools each optimized for one technology, such as silicon ASICs or GaN MMICs, or board-level design that becomes awkward when trying to accommodate multiple technologies with technology stacks and PDKs from dissimilar domains.

  “Where Keysight is making progress is in making it possible to glue difficult domains like RF/mmW onto mainstream flows, and still be able to run 3DEM packaging and nonlinear RF and thermal simulations across a whole ensemble,” he said. “Keysight has taken an open approach to these multi-technology flows, allowing best-in-class tools and processes, adding new domains like millimeter wave and high-power phased arrays, but still working through open standards and APIs that preserve choices.”

  These challenges must be addressed immediately, Civello warned.

  “The time is now,” he said. “The technologies under consideration are groundbreaking and the technical challenges must be researched, otherwise the commercial risks to the roll out of 5G enhancements and later 6G are unacceptable.”

(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
Invitation | AMEYA360 to Exhibit at electronica 2026 in Munich — Join Us at Booth B5-540!
  From November 10 to 13, 2026, the global electronics industry will gather in Munich for electronica 2026, one of the world’s premier electronics trade fairs. AMEYA360 will be there as scheduled at Booth B5-540, and we look forward to meeting you.  Launched in 1964 and held every two years, electronica is a top-tier event in the electronic components field. This year’s theme is “Empowering the All Electric Society,” with a focus on AI, automotive electronics, semiconductors, energy efficiency, IoT, and other key areas. It is a core platform for global procurement teams and engineers to connect with the supply chain.  Exhibition Information  Dates:Nov. 10–12: 09:00–18:00 | Nov. 13: 09:00–15:00  Venue:New Munich Trade Fair Centre, Munich, Germany  AMEYA360 Booth:B5-540  AMEYA360 holds 80+ original manufacturer authorizations, covering brands such as ROHM, Panasonic, Taiyo Yuden, NOVOSENSE, Runic, and 3PEAK, and also distributes brands including TI, ADI, and ST. The platform brings together 3,500+ suppliers, with over 8 million orderable part numbers and 5 million+ in-stock parts, offering BOM kitting, sourcing for scarce materials, FAE technical support, and global supply chain support services.  During the exhibition, the AMEYA360 business and technical teams will be onsite at B5-540 to meet you face to face and discuss:  Resource and material supply assurance: sourcing for scarce part numbers, alternative component solutions, and alignment on inventory and lead times  BOM kitting and bulk purchasing: one-stop BOM kitting services covering everything from sample validation to mass production delivery  Original manufacturer authorization and solution support: selection consulting for franchised product lines and FAE technical support  Global supply chain collaboration: AMEYA360’s service network covers more than 50 locations across Shanghai, Shenzhen, Hong Kong, Taiwan, China, Malaysia, India, Mexico, the United States, and other regions, supporting global procurement and production cadence  We welcome new and existing partners to visit Booth B5-540 to explore supply chain solutions together and seize new industry opportunities.
2026-11-03 15:40 阅读量:288
AMEYA360 invites you to attend Electronica Munich, Germany!
  The 2024 Munich International Electronic Fair (Electronica) will be held from November 12 to 15 at the Munich Trade Fair Center.Our booth location : B5-520.  Germany Munich Electronics Fair (Electronica), since its inception in 1964, has developed into Europe and even the world's largest and far-reaching electronic components professional exhibition. Every year, the elites of the global electronics industry gather in Munich to review the brilliant achievements of the electronics industry in the past two years and look forward to the future development of the electronics market.  As an excellent stage for industry elites to understand the market news and catch the latest information, the Munich Electronics Fair in Germany brings together the latest innovations of the world's leading electronics companies. Many professional visitors were not only attracted by the release of new products and technologies, but also gained a lot from finding partners and signing cooperation agreements.  The 2022 electronica was an even bigger success, with 14 specialized halls and 2,140 companies from 51 countries and regions, more than 60% of which came from outside Germany. At the same time, 69,783 visitors from 102 countries and regions attended the fair, making it a great success.  AMEYA360, as the industry's leading global one-stop procurement platform for electronic components, will be participated this exhibition. We sincerely invite you to visit Booth 520 in Hall B5 to discuss the development of the industry and participate in the industry big event, and sincerely cooperate with all sectors of society to create a brilliant future blueprint and write a new chapter in development!  Exhibition Overview  Time: November 12 - November 15, 2024  industry: Electronic components  Organizer:Messe Munchen International, Germany  Location: Munich Trade Fair Center, Germany  Holding cycle: every two years  Hall plan:  Range of exhibits  Cars; Display; Electromechanical and system peripherals; Electronic Design (ED/EDA); Embedded system; Electronic Manufacturing Services (EMS); Semiconductor; PCB and other circuit carriers; Test and measurement; Micro-nano system; Passive component; Sensor technology; The service industry; Power supply; System components/assemblies and subsystems; The radio.  About AMEYA360  AMEYA360 Mall (www.ameya360.com)is a one-stop procurement platform for electronic components, independently developed and designed by Shanghai Huanghua Information Technology Co.Ltd. The platform has secured cooperation and authorization from numerous renowned domestic and international brand manufacturers. With diverse range of material categories abundant inventory, and a commitment to quality,AMEYA360 ensures a reliable source for electronic component procurement.  In addition to the online platform, AMEYA360 has also introduced the user-friendly [AMEYA Store] app, which combines various function such as searching, ordering, price quote, making payments, tracking logistics, accessing resources, finding component references, and exploring material replcements.  With its comprehensive features, AMEYA360 caters to the varied demands of the electronic information-related industries. These include small-scale component procurement, ordering for future needs, applying for product samples, and receiving technical support to meet the diverse needs of businesses in the electronics sector.  AMEYA360 will participated in the 2024 Munich Electronica,Germany, hope to discuss industry trends and future development with all business partners & customers in the industry, and explore a new model of innovative cooperation in the supply chain that currently facing many challenges.  AMEYA team is looking forward to see you in Munich this November!  If you are sourcing for any electronics components, you can scan the QR code below for inquiry. For more information, please email dukelee@ameya360.com or call +86 13916138705.
2024-09-02 17:17 阅读量:4906
AMEYA360:Novosense Optocoupler Compatible Single-channel Isolated Gate Driver
  NSi6801 is an isolated gate driver with single-channel optocoupler-compatible input, which can be used to drive IGBT, SiC and MOSFET. It can provide peak source/sink current of 5A/5A. It supports the minimum common mode transient immunity (CMTI) of 150kV/μs, which ensures the robustness of the system.      The maximum power supply voltage of the driver is 32V. It has performance advantages over optocoupler gate drivers, including better reliability and aging performance, higher operation temperature, shorter propagation delay and less pulse width distortion. Therefore, NSi6801 is more suitable than photoelectric isolation driver in switching power supply systems, , photovoltaic inverters and motor drive systems which requires high reliability, high power density and high efficiency.  Product Features:  P2P compatible with optocoupler drivers, but upgraded performance  Driver side power supply voltage: up to 32V, UVLO is available  Peak source/sink current: 5A/5A  High CMTI: 150kV / μs  Typical propagation delay: 75ns  Maximum pulse width distortion: 30ns  Operation ambient temperature: -40℃~125℃  RoHS compliant package:  SOW6  DUB8  Safety Certificate:  UL1577 certification:  SOW6: 5.7kVRMS for 1min.  DUB8: 5kVRMS for 1min.  DIN VDE V 0884-11:2017-01  CSA component notice 5A  CQC certification per GB4943.1-2011  Application:  PV inverter  Energy storage  Servo motor  Frequency converter
2023-05-17 10:51 阅读量:5703
AMEYA360:Experts Weigh Impact of Intel-Arm Collaboration
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
型号 品牌 抢购
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。

请输入下方图片中的验证码:

验证码