英飞凌、恩智浦和博世获德国批准入股台积电芯片厂

Release time:2023-11-10
author:AMEYA360
source:网络
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  近日,德国反垄断机构声明表示,批准博世 (BOSCH)、英飞凌 (Infineon) 和恩智浦 (NXP) 入股台积电的德国德勒斯登12英寸芯片厂。

英飞凌、恩智浦和博世获德国批准入股台积电芯片厂

  德国企业联合管理局表示,三家公司将分别收购台积电成立的半导体公司European Semiconductor Manufacturing Company(ESMC)10%的股份。

  德国企业联合管理局负责人Andreas Mundt在一份声明中表示:“最近动荡的地缘政治表明,确保半导体供应是多么重要,尤其是对德国工业而言。”Mundt还补充说,欧盟和德国都致力于将更多的半导体生产带来欧洲和德国。

  台积电是全球最大的芯片代工制造商,自2021年以来,该公司一直商谈在德国东部萨克森州建立制造工厂(或称“晶圆厂”)的事宜。

  该工厂将是台积电在欧洲的第一座工厂,对于德国政府推动国内芯片业发展的雄心壮志而言,台积电的这座工厂将发挥至关重要的作用。新工厂计划于2027年投入运营,预计每月可生产4万块300毫米晶圆。

  此前在8月8日,台积电声明称,已批准一项在德国半导体工厂的计划,将与博世、英飞凌和恩智浦共同成立合资公司ESMC,批准向ESMC不超过34.9993亿欧元,用于在德国提供代工服务。合资公司将由台积电持有70%的股份,博世、英飞凌和恩智浦各持有10%的股权。预计将超过100亿欧元,该工厂将由台积电运营。

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