英飞凌推出带有集成温度传感器的全新 CoolMOS S7T

Release time:2023-12-21
author:AMEYA360
source:英飞凌
reading:2549

  为提高结温传感的精度,英飞凌科技股份公司推出带有集成温度传感器的全新CoolMOS™ S7T产品系列。通过在系统中集成该系列半导体产品,可提升许多电子应用的耐用性、安全性和效率。CoolMOS™ S7T具有出色的导通电阻和高精度嵌入式传感器,最适合用于提高固态继电器(SSR)应用的性能和可靠性。

英飞凌推出带有集成温度传感器的全新 CoolMOS S7T

  SSR是各种电子设备的基本配置,如果能够将传感器和超结 MOSFET集成到同一封装中,客户便可以获得多方面的好处。英飞凌的创新方案提高了继电器的性能,使继电器即使在过载条件下也能可靠运行。与位于漏极的标准独立板载传感器相比,集成温度传感器的精度提高了多达40%,响应时间加快了10倍,而且由于可在多设备系统内单独执行监测流程,因此具有更高的可靠性。

  CoolMOS™ S7T能够优化功率晶体管的使用,进而提高输出级的性能并实现精准的控制。其总功率耗散的降幅高达机电继电器的两倍,效率比目前的固态三端双向可控硅解决方案高出5倍以上。效率的提升以及应对更高负载的能力有助于降低功耗和能源成本。

  独一无二的输出级性能加上显著的过流阈值可提高继电器的可靠性,最大程度地降低故障和停机风险。这一坚固耐用的开关解决方案还能提高运行的安全性。凭借更高的稳健性,MOSFET能够延长继电器的使用寿命,减少更换频率。所有这些优点最终都将转化为更低的维护成本。

("Note: The information presented in this article is gathered from the internet and is provided as a reference for educational purposes. It does not signify the endorsement or standpoint of our website. If you find any content that violates copyright or intellectual property rights, please inform us for prompt removal.")

Online messageinquiry

reading
英飞凌EconoDUAL™ 3 CoolSiC™ SiC MOSFET 1200V模块
英飞凌:用于CoolSiC™ MOSFET FF6MR20W2M1H_B70的双脉冲测试评估板
英飞凌:EasyDUAL™ 1B和2B,1200V共发射极IGBT模块
英飞凌:储能用1200V 500A NPC2 三电平IGBT EasyPACK™ 3B模块
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 weixin Service Account AMEYA360 weixin Service Account
AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code