英飞凌宣布将为小米汽车提供先进功率芯片

Release time:2024-05-08
author:AMEYA360
source:英飞凌
reading:896

  德国芯片制造商英飞凌据称已与电动汽车制造商小米达成协议,将向小米汽车供应先进的功率芯片,直至2027年。

英飞凌宣布将为小米汽车提供先进功率芯片

  英飞凌方面称,其为小米 SU7 Max 供应两颗 1200 V HybridPACK Drive G2 CoolSiC 模块,还为小米汽车供应满足不同需求的其它广泛产品,例如不同应用中的 EiceDRIVER™栅极驱动器和 10 款以上的微控制器。同时,两家公司还同意在碳化硅汽车应用领域开展进一步合作。

  据介绍,其 CoolSiC 功率模块可适应更高的工作温度,从而实现一流的性能、驾驶动力和寿命,基于该技术的牵引逆变器可进一步增加电动汽车续航里程。英飞凌宣称其为全球最大汽车半导体供应商,去年在汽车微控制器领域也占据领先地位。

  小米汽车副总裁兼供应链部总经理黄振宇表示:“英飞凌是重要的合作伙伴,在功率半导体领域拥有领先的技术和弹性制造能力,以及高度可扩展的微控制器产品组合。两家公司的合作不仅有利于稳定小米汽车的SiC供应,也有利于我们为客户打造高性能、安全可靠、功能领先的豪华汽车。”

  英飞凌汽车事业部总裁 Peter Schiefer 表示:“我们非常高兴与小米汽车等充满活力的企业合作,为他们提供SiC产品,旨在进一步提高电动汽车的性能。作为汽车行业的领先合作伙伴,我们凭借广泛的产品组合、系统理解和多站点制造基地,在塑造未来移动出行方面处于有利地位。”

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