Apple A22 Pro May Adopt 1.4nm in 2028; TSMC Remains Primary Supplier, Intel Reportedly Considered

Release time：2026-06-18
author：AMEYA360
source：TrendForce
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Apple A22 Pro May Adopt 1.4nm in 2028; TSMC Remains Primary Supplier, Intel Reportedly Considered

　　Apple is expected to use TSMC’s 2nm for its A20 and A20 Pro chips, but industry discussions are already shifting to the A22 Pro and a potential move to 1.4nm. According to Bloomberg, Apple is expected to adopt a 1.4nm process for the A22 Pro, which is slated for high-end iPhone models in 2028. While TSMC is expected to remain Apple’s primary manufacturing partner, the report notes that the company is also evaluating Intel as a potential secondary production source.

　　Based on the reported timeline, the A21 Pro is expected to remain on TSMC’s 2nm, potentially transitioning to the enhanced N2P variant, which offers incremental improvements over N2, according to Wccftech.

　　Wccftech also notes that costs could rise significantly, with TSMC’s 1.4nm wafers estimated to cost around US$45,000 each. As a result, the report suggests that only the A22 Pro, rather than the standard A22, will be manufactured on the 1.4nm node.

　　As noted by MacRumors, current rumors suggest Intel could manufacture lower-end chips for products such as the iPad and Mac. At the same time, Intel CEO Lip-Bu Tan is seeking to revive the company’s foundry business by focusing on leading-edge nodes. According to TechPowerUp, Intel expects its 14A node to enter risk production in 2028, followed by high-volume manufacturing in 2029.

　　Beyond the possibility of Apple adopting TSMC’s 1.4nm node for its A22 chips, the company is reportedly preparing three major product launches for late 2027. According to 9to5Mac, citing Bloomberg, these include a 20th-anniversary iPhone featuring a nearly edge-to-edge display and curved glass that wraps around the sides, a second-generation foldable iPhone, and AirPods equipped with built-in cameras.

　　TSMC’s A14 Roadmap Takes Shape

　　TSMC has been accelerating construction of its 1.4nm fab at the Central Taiwan Science Park. According to Economic Daily News, foundation piling for the first phase has largely been completed, with progress reportedly ahead of schedule. Trial production could begin as early as 3Q27, with mass production targeted for the second half of 2028.

　　Compared with N2, A14 is expected to deliver a 10–15% performance improvement at the same power level, or reduce power consumption by 25–30% at the same performance level, while increasing logic density by more than 20%, according to TSMC.


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Apple May Debut M5 Ultra-Powered Mac Studio at WWDC, Boosting Demand for TSMC N3P and SoIC-mH
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Apple May Debut M5 Ultra-Powered Mac Studio at WWDC, Boosting Demand for TSMC N3P and SoIC-mH

　　Apple’s annual Worldwide Developers Conference (WWDC) is set to kick off on June 9. According to Commercial Times, beyond updates to Apple Intelligence, Siri, and macOS 27, market attention is focused on whether a next-generation Mac Studio powered by Apple’s M5 Ultra chip will also make an appearance.　　The M5 Ultra is expected to retain Apple’s UltraFusion dual-die architecture, combining two M5 Max dies and delivering interconnect bandwidth of more than 1,000GB/s. Specifications are rumored to include a 36-core CPU, an 84-core GPU, and up to 512GB of unified memory, the report adds.　　Notably, as the report highlights, TSMC’s N3P is expected to serve as the key manufacturing foundation for the M5 Ultra, potentially adding to demand for already tight 3nm capacity.　　TSMC’s SoIC-mH Emerges as Potential M5 Ultra Enabler　　TSMC’s advanced packaging is also expected to play a key role in boosting the performance of the M5 Ultra. According to institutional investors cited by Commercial Times, SoIC-mH could emerge as a core technology platform if Apple adopts a higher-density heterogeneous integration approach alongside its UltraFusion high-speed interconnect architecture.　　As TechNews notes, SoIC-mH uses a molded horizontal packaging architecture and integrates multiple chips directly at the wafer level through no-bump hybrid bonding technology. The approach can increase packaging density, improve signal transmission efficiency, and enhance thermal performance.　　In addition, TechPowerUp notes that TSMC’s SoIC-mH allows Apple to separate the CPU and NPU from the GPU. This enables Apple to scale CPU clusters and GPU dies independently, adding more cores as needed. The approach also gives Apple greater flexibility to expand its product lineup without pushing die sizes close to the 830 mm² reticle limit. According to the report, this can improve yields and reduce defects associated with larger silicon dies.　　Despite these potential advantages, the launch timing of the next-generation Mac Studio remains uncertain. According to Macworld, citing Bloomberg, supply-chain constraints are affecting production of Apple’s next-generation professional Macs and could delay the debut of the M5 Ultra-powered system until October 2026.　　Touchscreen MacBooks Could Create New Opportunities for TSMC　　Meanwhile, macOS 27 is another key focus of this year’s WWDC. Commercial Times notes that Apple is expected to strengthen touch support features, laying the groundwork for future touchscreen MacBooks through the early adoption of on-cell touch panel integration.　　Institutional investors cited by the report say that the shift toward OLED displays and touch-enabled MacBooks is expected to drive demand for upgraded display driver ICs, TDDI chips, and touch controllers, while also benefiting TSMC’s specialty process. The report adds that TSMC has completed reliability certification for its 16nm high-voltage process platform and is set to enter the yield-validation stage in 2026, potentially helping customers develop more competitive OLED display driver ICs.
2026-06-09 13:50 reading：414
Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals
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Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals

　　While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire in-house 5G modem orders with TSMC, leveraging its 2nm process technology.　　The report suggests that Apple’s self-developed 5G modem chips are expected to power future iPhone, iPad, and Apple Watch devices, replacing modems from Qualcomm. The volume used across its product lineup is projected to reach hundreds of millions of units, the report adds.　　Notably, Apple’s iPhone 17 lineup is expected to be the last to ship with Qualcomm Incorporated’s 5G modems, as the company moves toward a full transition to its in-house C2 baseband chip across all iPhone 18 models, according to Wccftech.　　The C2 development builds on Apple’s earlier in-house modem effort. Apple’s C1, first introduced in early 2025 with the iPhone 16e, marked its most complex chip system to date, integrating a 4nm baseband modem and a 7nm transceiver, according to earlier reporting from Reuters. The Economic Daily News further reports that Apple Inc.’s in-house C2 5G modem is expected to add full mmWave support—addressing the Sub-6 GHz limitation of its predecessor—while also incorporating satellite connectivity.　　Supply chain sources cited in the Economic Daily News report say TSMC has already secured foundry orders for Apple’s modem chips. Its back-end testing partner is also reportedly preparing for higher demand, with around 600 test systems being procured, as capacity is set to ramp from 2027.　　Apple’s Chip Tug-of-War: TSMC vs Intel　　Though claims of an Apple order shift to Intel remain unconfirmed, and any such move would not signal a departure from TSMC, cooperation between Apple and Intel appears to be warming. According to The Wall Street Journal, the two companies have reportedly reached a preliminary agreement for Intel to manufacture some of the chips powering Apple devices.　　The two sides have been engaged in intensive talks for more than a year, with a formal deal said to have been hammered out in recent months, the report adds.　　In parallel, Commercial Times reported earlier that Apple is evaluating Intel’s 18A-P process for its M-series chips. Looking further ahead, The New 7 reports that the first Intel-manufactured low-end M-series chips could emerge as early as mid-2027 under contract production, likely targeting entry-level Macs or iPads.　　As highlighted by The Wall Street Journal, Apple’s reported outreach to Intel may reflect growing supply chain pressures, as the Cupertino firm—long TSMC’s top customer—faces tightening access to advanced manufacturing capacity amid surging demand from NVIDIA and other AI chip designers.　　Intel previously played a central role in powering Apple’s Mac lineup, before Apple transitioned in 2020 to its own Arm-based custom chips, the report points out.
2026-05-11 11:12 reading：746
Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification
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Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification

　　Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially providing a second sourcing option alongside its longstanding supplier, TSMC.　　Sources say the company has held early-stage discussions with Intel about leveraging its foundry services, while Apple executives have also visited a Samsung facility under construction in Texas that is expected to produce advanced chips.　　That said, the report notes that neither effort has led to any orders so far. Engagements with both suppliers remain at a preliminary stage, as Apple continues to have reservations about adopting non-TSMC manufacturing technologies.　　One of the key drivers behind Apple’s potential shift is supply constraints at TSMC, according to Bloomberg. As the report notes, Apple executives addressed the issue during the company’s quarterly earnings call last week, indicating that limited chip availability for iPhone and Mac devices is currently weighing on growth.　　In early 2026, Tim Cook identified access to advanced-node manufacturing as the main bottleneck for Apple’s iPhone output, according to CNBC. He noted that production is constrained by limited capacity for the company’s A-series and M-series system-on-chip (SoC) chips, which are fabricated on TSMC’s 3nm process.　　In addition, it also aims to maintain at least two suppliers for key components, allowing Apple to strengthen its negotiating leverage on pricing while reducing the risk of supply disruptions, Bloomberg adds.　　Apple’s Reported Supplier Talks May Open Door for Intel Comeback, Samsung Gains　　Apple’s talks with both companies reportedly began before the most recent supply constraints emerged. As Bloomberg notes, collaborating with Intel could offer an added advantage, potentially strengthening Apple’s ties with the Donald Trump administration. As for Samsung, the report indicates that it has already been working on supplying more peripheral components for Apple’s devices, including power management parts.　　In an August 2025 press release, Apple also announced a partnership with Samsung to co-develop a new chip manufacturing technology at Samsung’s Austin fab. Citing industry sources, Business Korea adds that the chip Samsung is expected to produce will likely be used as an image sensor in future iPhones and other Apple products.　　Separately, industry momentum appears to be building around Intel’s foundry push. According to Commercial Times, major tech firms including Google and Apple are weighing a shift to Intel’s foundry. The report adds that Apple’s M-series chips are evaluating Intel’s 18A-P node.　　Apple’s potential shift could provide a boost to both Samsung and Intel. As the report notes, securing external customers for its foundry business is central to Intel’s turnaround strategy under CEO Lip-Bu Tan. Winning Apple as a client would mark a major milestone for Tan and could help draw in additional business. Samsung, meanwhile, would also stand to gain significantly from an endorsement by Apple.
2026-05-06 14:44 reading：599
Apple Reveals Qualcomm Patent Fees
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Apple Reveals Qualcomm Patent Fees

Qualcomm charges a 5% royalty, or about $12 to $20, per smartphone plus a large “CDMA tax,” Apple’s chief operating officer testified in an antitrust case here. The testimony put on the record some details of Qualcomm’s licensing practices that have long drawn industry complaints.Apple struck a deal with Qualcomm in 2007 to set royalties on iPhones at $7.50 per handset. In 2011, the two struck a deal to keep royalties at the same level while giving Qualcomm “short-term” exclusivity as the iPhone’s cellular baseband supplier.The “7.50 [royalty] may not sound like a lot, but it [amounted to] billions of dollars a year,” said Jeff Williams, who led the first iPhone team and is now Apple’s COO. “It is not FRAND, in our view, compared to everyone else … Qualcomm charged more than everyone else together.”“The alternative was that it defaults to the contract manufacturer’s rate of $17 to $18 [per phone, and] if we pursued them legally, we wouldn’t have access to chips … [and] risk getting our brand-new iPhone enjoined,” said Williams, adding, “Qualcomm represented [$7.50] as the average price paid.”Although patent licensing at the handset level has become widely used, Apple found it unfair.“We led the charge to add a lot of NAND memory” in handsets, but “if we put an extra $100 in NAND, they would get $5 of that even though they didn’t have anything to do with it,” he said. Apple spends “an extra $60 in stainless steel enclosures, and Qualcomm would collect an extra $3 — that didn’t make sense to us, and it still doesn’t today,” he added.The original $7.50 royalty “didn’t apply to CDMA phones or iPads,” said Williams, later calling licensing terms for the cellular protocol that Qualcomm developed “roughly a $250 million CDMA tax.”Apple initially proposed that it pay $1.50 per baseband chip used. Under the final deal, Apple’s contract manufacturers paid Qualcomm its usual 5% handset royalty under their existing patent licenses, Apple reimbursed them, and Qualcomm reimbursed Apple. Apple avoided striking a patent deal directly with Qualcomm under the arrangement.As part of the 2011 deal, Apple asked Qualcomm for a billion dollars to transition from using Infineon basebands.“They wanted exclusivity,” Williams said. “We proposed that we’d give them 100% sole-sourced for the short term, [but] in the long term, that wasn’t our plan.”However, “long-term [exclusivity] provisions wound up in the agreement … [and] made it prohibitively expensive to work with someone else,” he added. “For example, it cut off work with Intel” on a baseband for an iPad Mini in 2013 … overall, “our strategy is to dual-source.”Today, “Qualcomm continues to ship products on [Apple] design wins they have,” Williams said. “We have been unable to get them to support us on new design wins since [Apple sued Qualcomm in 2017]. This has been a challenge.”“Our strategy was to dual-source [basebands] in 2018,” he said. “We were working toward doing that with Qualcomm, but in the end, they would not support us and sell us chips.”As a result, “I went to [Intel CEO] Brian Krzanich and said that I was sorry, but instead of 50%, I need 100%” of iPhone basebands. “He had to scramble and go to his board to get almost a billion in capital to support us,” Williams said.Meanwhile, Qualcomm “is suing us in court all over the world on non-essential patents,” he said. “They are trying to get a hit in any one of those courts with an injunction to cause enough pain to make us pay tens of billions of dollars in their ransom … They said [that Apple is] an ideal target [because] unless [we] run the table, they will win.”In testimony Friday, Qualcomm’s CEO gave his own views on the deal and its efforts to continue working with Apple.Under cross-examination, a Qualcomm attorney noted that Apple gave the chip vendor a “moonshot challenge” to deliver a single chip baseband for LTE. The chip made it into the iPhone 5. In its launch, Apple founder Steve Jobs called the chip “one of the real breakthroughs” of the handset.
2019-01-15 00:00 reading：6392
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