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ROHM at PCIM Europe <span style='color:red'>2025</span>: Powerful Highlights for E-Mobility and Industrial Applications

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ROHM at PCIM Europe 2025: Powerful Highlights for E-Mobility and Industrial Applications

　　From May 6th to 8th ROHM will exhibit at the PCIM Expo & Conference, the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, taking place in Nuremberg. On its booth 304 in hall 9, ROHM will showcase reference projects with renowned partners and present the evolution of its package designs and evaluation boards.　　"PCIM 2025 in Nuremberg is the meeting place for innovation and progress in power electronics. This is where the brightest minds in the industry come together to shape the future of e-mobility and industrial applications. We will be presenting great customer applications to showcase the possibilities offered by our products in the best possible way. Whether in the PV industry or e-mobility sectors – we are involved and would like to talk to our customers on site about the key projects of the future," says Wolfram Harnack, President at ROHM Semiconductor Europe.　　Highlights of ROHM’s presence at PCIM 2025 include:　　For automotive applications, ROHM will exhibit an inverter unit utilizing the TRCDRIVE pack™ that consists of a 2-in-1 SiC Molded Module. Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchange to enhance the performance and efficiency of motor inverters, a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs).　　Power solutions for on-board chargers (OBCs), essential for e-mobility applications, will also be on the booth. ROHM will showcase the new EcoSiC™ molded power modules suitable for OBCs, along with OBC applications adopting ROHM’s power semiconductor devices.　　ROHM’s Power Eco Family products: ROHM has grouped the four product lines of power semiconductors under the brand concept “Power Eco Family” and is contributing to the development of a sustainable ecosystem through improved application performance. We will show featured solutions and case studies at the booth.　　In this context, one application example is the new GaN Lineup: ROHM’s EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switching performance, in Murata Power Solutions’ 5.5kW AI server power supply unit achieves greater efficiency and miniaturization.　　For more information, please refer to AMEYA360’s related news release.　　The details of the Power Eco Family are as follows.　　●　EcoSiC™ is a brand of devices leveraging silicon carbide which is attracting attention in the power device field for performance that surpasses silicon.　　●　EcoGaN™ comprises compact, energy-efficient devices that utilize the low ON resistance, high-speed switching characteristics of GaN to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.　　●　EcoIGBT™ is ROHM’s brand of IGBTs consisting of both devices and modules designed to meet the needs of high-voltage applications in the power device field.　　●　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　During the fair, ROHM’s power experts will participate in several panel discussions and conference presentations. Additionally, they will hold poster sessions at the PCIM Europe 2025 conference.　　More information regarding ROHM’s key highlights at PCIM 2025 is available here: www.rohm.com/pcim　　*EcoSiC™, EcoGaN™, EcoIGBT™, EcoMOS™ and TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.

Key word：

ROHM

Release time：2025-04-23 17:01 reading：193 Continue reading>>

MWC Barcelona <span style='color:red'>2025</span>: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.

Key word：

Fibocom

Release time：2025-03-20 13:55 reading：274 Continue reading>>

ROHM included in S&P Global's Sustainability Yearbook <span style='color:red'>2025</span> as Sustainability Yearbook Member for the second consecutive year

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ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year

　　ROHM Co., Ltd. was included for the second year in a row in the Sustainability Yearbook 2025, published by S&P Global on February 11, 2025, as a Sustainability Yearbook Member, one of the top 15% companies in the Semiconductor & Semiconductor Equipment industry.　　S&P Global annually evaluates the sustainability efforts of the world's leading companies from governance & economic, environmental, and social perspectives based on its proprietary Corporate Sustainability Assessment (CSA) methodology and selects companies with outstanding sustainability efforts in each industry for inclusion in the Sustainability Yearbook.　　This year, more than 7,690 companies worldwide from 60 industries were evaluated, and 780 companies (including 80 Japanese companies) were selected for this year's Yearbook.　　Encouraged by the results of this year's evaluation, ROHM will continue to promote sustainability activities and address social issues to create a sustainable society, aiming to be a company that meets the expectations of our stakeholders.

Key word：

ROHM

Release time：2025-03-20 10:11 reading：322 Continue reading>>

There is news that the new European plant of Taiwan Semiconductor Manufacturing will be delayed by two years as soon as <span style='color:red'>2025</span>

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There is news that the new European plant of Taiwan Semiconductor Manufacturing will be delayed by two years as soon as 2025

　　According to the latest report, the industry said that because the automotive semiconductor supply is no longer a serious shortage, and most of the automotive chip customers may switch to Japan, the United States and other new plants production, TSMC's European plant delayed by two years, as soon as 2025 to start construction of the plant.　　At the meeting, TSMC said it was in talks with customers and partners and would evaluate the possibility of setting up specialized fabs in Europe focusing on automotive technology, depending on customer demand and government support. In response to news of the delay in the construction of new plants in Europe, Taiwan Semiconductor said it maintained its previous statement at the legal briefing and had no updated response at this time.　　A team from Taiwan Semiconductor has visited Germany several times over the past two years to assess the feasibility of setting up a 12-inch fab in Germany, with the city of Dresden the most likely location, according to fab tool maker sources.　　In addition, there is also news that Global Crystal's acquisition of German peer World Generation because of the German authorities because of "too little time to review", causing a ripple effect. Sources said that the original said to set up a plant in Germany is still in the "very, very early stage", it is feared that due to Global crystal acquisition of World Tron failed, the new European plant will turn to evaluate the Czech Republic.　　Industry insiders pointed out that in the previous automotive chip shortage, TSMC not only accelerated production capacity scheduling in the factory in Taiwan, China, but also locked in the automotive field of new plants in Japan, Europe and other places. However, with the correction of the semiconductor economy, the main wafer foundries have more abundant capacity scheduling production of automotive chips, which makes the chip shortage improved to a certain extent, and even reached the balance between supply and demand.　　Once the construction of the European plant is delayed, the industry analysis, its European automotive chip customers may maintain in Taiwan, China, or even transfer to Japan, the United States and other places to produce new plants, which will help Taiwan Semiconductor better use of overseas plant capacity.

Key word：

Taiwan Semiconductor Manufacturing,2025

Release time：2023-02-20 17:00 reading：2920 Continue reading>>

Gartner Highlights Top Trends Impacting Technology Providers Through <span style='color:red'>2025</span>

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Gartner Highlights Top Trends Impacting Technology Providers Through 2025

　　Gartner Inc. highlighted the top trends that will impact technology providers through 2025. These trends reflect three overarching themes: businesses increasing their reliance on technology, new opportunities emerging through technology and the impact of external macro forces.　　“The march of digitalization continues even amidst disruption, and technology providers have a leading role to play,” said Rajesh Kandaswamy, Distinguished VP Analyst and Gartner Fellow. “In 2023, product leaders and technology executives must balance short-term planning with long-term strategy to stay ahead of the immediate shocks to the economy and the underlying ‘permacrisis’ forces shaping business.”　　Here are the trends Gartner identified that will impact technology customers, buyers, products, ecosystems, business models and operating models worldwide for at least the next three years:　　Democratization of technology　　The democratization of technology empowers non-IT workers to seek out, select, implement and custom fit their own technology. This trend offers opportunities to meet the needs of a new set of citizen developers and business technologists. Gartner predicts that by 2025, 55% of all successful emerging technology solutions will be delivered to “nontraditional” buyers – for example, outside IT – within enterprises, enabling vendors to expand into new markets and forge new customer relationships.　　Federated enterprise technology buying　　In a federated buying process, buying decisions are made by representatives across the business. Driven by the democratization of technology, federated enterprise technology buying is accelerating, with just 26% of technology buyers in a recent Gartner survey reporting that purchases are funded solely by IT.　　“Federated buying creates opportunities for product leaders as it enables a focus on more value-added services for business customers,” said Emil Berthelsen, VP Analyst at Gartner. “However, it also adds complexity, forcing changes to go-to-market models and demanding a greater focus on value scenarios and outcomes.”　　Product-led growth　　Product-led growth (PLG) is a go-to-market strategy in which users experience value through free product offers or interactive or automated demonstrations. Then, users are either converted directly to paid accounts or their advocacy and influence helps to drive purchases. By 2025, 95% of software-as-a-service (SaaS) providers will employ a form of self-service PLG for new customer acquisition.　　“PLG is hitting its stride in B2B after much acclaim in the B2C technology world,” said Kandaswamy. “It can reduce cost to acquire customers and shorter sales cycles relative to traditional buyer-oriented, top-down marketing and sales strategies.”　　Co-innovation ecosystems　　The co-innovation ecosystem approach is an emerging practice that enables the convergence of internal, external, collaborative and co-creative ideas to create new value. Businesses are actively using technology to differentiate and succeed, so they are increasingly co-innovating with tech providers.　　“With a co-innovation partner ecosystem, technology providers can meet pressing customer needs through use of shared skills, technology expertise, investment and incentives,” said Kandaswamy.　　Digital marketplaces　　Technology buyers are embracing digital marketplaces to easily find, procure, implement and integrate technology solutions. Non-tech buyers are also increasingly looking to marketplaces to meet their requirements for composable and easily consumable technology solutions.　　“Technology and service providers are increasing their investment in marketplace channels as they seek growth opportunities and competitive advantage,” said Kandaswamy. “A digital marketplace accelerates time to market, extends outreach to target segments, expands partner ecosystems and speeds up the sales cycle.”　　Intelligent applications　　Intelligent applications will create value and disrupt markets by learning, adapting and generating new ideas and outcomes. For example, generative artificial intelligence (AI) is an emerging technology quickly gaining traction for commercial use within intelligent applications. Generative AI can produce novel media content (including text, image, video and audio), synthetic data and models of physical objects.　　“Product leaders should expect generative AI features that empower workforces with augmented and creative capabilities to be a new competitive front in intelligent applications,” said Kandaswamy.　　Metaverse technologies for marketing and customer experience (CX)　　Metaverse technologies are rapidly gaining traction in marketing for creating unique experiences, impactful interactions and novel engagement. By 2027, over 40% of large organizations worldwide will be using a combination of Web3, spatial computing and digital twins in metaverse-based projects aimed at increasing revenue.　　“B2B marketers have an opportunity to apply metaverse technologies and the immersive experiences they provide to expand customer reach and engagement and improve CX,” said Kandaswamy. “Early adopters are using metaverse technologies to host events in virtual spaces, conduct internal and external sales meetings, showcase products and more.”　　Sustainable business　　“Sustainable business has transformed into a ‘must have’ rather than a ‘nice to have,’” said Kandaswamy. “In an increasingly technology-driven world, sustainable business is underpinned by sustainable technology.”　　Technology providers must improve the sustainability of their products that enable sustainable business outcomes. A recent Gartner survey found that 42% of leaders are currently leveraging sustainability activities to drive innovation, differentiation and enterprise growth through sustainable products. Gartner predicts that by 2025, tech providers that can quantify their offering’s positive contribution to customers’ sustainability objectives will increase their win rate by 20%.　　Techno-nationalism　　A trend away from globalization and into mercantilism is causing global markets to become increasingly local, impacting global technology ecosystems. Policy decisions are driving countries to implement of digital sovereignty regulations, causing a divergence of technology stacks. In response to this trend, product leaders must balance meeting specific country-level localization needs and product profitability.

Key word：

Gartner

Release time：2023-02-08 14:47 reading：1809 Continue reading>>

Foldable AMOLED panel shipments to top 50m units by <span style='color:red'>2025</span>, IHS Markit says

Trade news

Foldable AMOLED panel shipments to top 50m units by 2025, IHS Markit says

Spurred on by growing demand for innovative user experience in smartphones, shipments of foldable active-matrix organic light-emitting diode (AMOLED) panels are expected to reach 50 million units by 2025 for the first time since their launch in 2018, according to IHS Markit.The foldable AMOLED panels are predicted to account for 6 per cent of total AMOLED panel shipments (825m), or 11 per cent of total flexible AMOLED panel shipments (476m) by 2025.“As the conventional smartphone market has become saturated, smartphone brands have tried to come up with an innovative form factor for a smartphone,” said Jerry Kang, senior principal analyst of display research at IHS Markit. “A foldable AMOLED panel is considered to be the most attractive and distinguishable form factor at this moment.”In October 2018, China’s Royole Corporation unveiled the world’s first foldable-screen smartphone with a 7.8-inch AMOLED panel. A few other brands are also expected to launch foldable-screen smartphones in 2019.“Smartphone brands are cautious about launching foldable smartphones because the phones should be durable enough for repeated folding and thin and light enough even when supporting a larger display and battery,” Kang said. “Unit shipments of foldable AMOLED panels may not grow as fast for the first few years, but area per unit will be expected to be larger than that of conventional displays. Panel makers are forecast to see an increase in fab utilisation.”Due to lower demand for conventional flexible AMOLED panels, suppliers are hoping that smartphone brands release foldable devices as early as possible. With more optimism, some are even considering investing in another fab solely for foldable AMOLED panels, adds IHS.“Panel suppliers should consider how much demand will increase for the foldable application before investing in additional fabs, because the supply of flexible AMOLED panels is forecast to exceed demand even as we move into 2019,” Kang said.According to the AMOLED & Flexible Display Intelligence Service by IHS Markit, the supply capacity of flexible AMOLED panels will account for more than half of total AMOLED capacity in the fourth quarter of 2019.

Key word：

Market trend

Release time：2018-11-09 00:00 reading：1111 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies

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