AMEYA360:<span style='color:red'>ASML</span> Ban Affects China’s Advancement in Chips
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AMEYA360:ASML Ban Affects China’s Advancement in Chips

　　As part of an agreement between the U.S. government, the Netherlands, and Japan, ASML, Nikon, and Tokyo Electron won’t be supplying their high-end photolithography equipment to Chinese companies.　　According to the Wall Street Journal, “the Netherlands will bar ASML Holding NV, a Dutch maker of photolithography machines, from selling to China at least some immersion lithography machines, the most advanced kind of gear in the company’s deep ultraviolet lithography line.”　　ASML manufactures all of the world’s extreme ultraviolet lithography machines, which are critical for producing cutting-edge semiconductors.　　China could easily circumvent the export bans for advanced semiconductors, as it has been doing for many years. Acquiring huge lithography machines is much more difficult, and making them from scratch is nearly impossible. Furthermore, only a few hundred of those machines are sold every year, making it much easier to control their destination.　　ASML bans chip making equipment to China　　It is unknown how much of that critical equipment has already been sold to China and what capacity Chinese companies already have to produce the most advanced semiconductors.　　While China is unlikely to have the technology to produce sub-10nm chips, it is already investing in new fabs. Currently, only Taiwan’s TSMC can produce 5nm technology. To do that, it requires the advanced lithography machines that ASML has.　　Lithography in the U.S.　　A lithography system is a projection system. Light is projected through a blueprint of the pattern to print (known as a ‘mask’ or ‘reticle’). This process will be repeated 100 times or more, laying patterns on top of patterns to make a complete microchip.　　This crucial technology was discovered in 1957 by Jay Lathrop and James Nall, of the U.S. Army’s Diamond Ordnance Fuse Laboratories in Maryland. They patented the photolithographic techniques used to deposit thin-film metal strips about 200 micrometers wide to connect discrete transistors on a ceramic substrate.　　In 1959 Lathrop joined Texas Instruments, and Nall went to Fairchild Semiconductor. In 1958, engineers at Fairchild built one of the first “step-and-repeat” cameras to easily copy and multiply transistors on a single wafer using photolithography.　　In the early 1980s, GCA Corp. was considered the worldwide leader in photolithography and celebrated as one of the “hottest high-technology companies.” They invented the wafer stepper (the step-and-repeat camera), a device similar to a slide projector or a photographic enlarger, enabling further reductions in chip size. It was the first technology to exceed the 1-micron limit.　　At the time, Japanese competitors Nikon and Canon were catching up quickly and making bold technological investments. While American lithography companies were holding back in capital expenditures until they had a deal with semiconductor manufacturers, the Japanese worked hand-in-hand with them to define roadmaps and coordinate the delivery of new equipment.　　“It was impossible to make semiconductors without lithography tools, but the only remaining U.S. producers were struggling to survive,” wrote Chris Miller in Chip War: The Fight for the World’s Most Critical Technology.　　In 1993, after receiving at least $60 million in funds from the government-backed Sematech consortium, GCA closed its factory in Massachusetts as it could not compete with ASML, Nikon, and Canon.　　ASML can’t meet demand　　While other lithography manufacturers can print 10nm patterns, ASML’s EUV (extreme ultraviolet) technology enables the scale of the smallest feature to be reduced below that limit. That’s why they hold 100 percent of the market for the most advanced lithography machines.ASML Ban Affects China&#8217;s Advancement in Chips　　Recently, ASML reported revenues of $23 billion and $6.05 billion in net income for FY2022. The Dutch company sold 317 new and 28 used lithography systems to their customers. They expect an increase of 25 percent in net sales for FY2023.　　“For 2023, ASML expects continued strong growth with a net sales increase of more than 25 percent and a slight improvement in gross margin, relative to 2022. We expect first-quarter net sales between €6.1 billion and €6.5 billion with a gross margin between 49 percent and 50 percent,” said ASML President and CEO Peter Wennink.　　The new restrictions on exporting equipment to China won’t hurt the company’s bottom line, as the demand from Taiwan, Europe, and the U.S. will continue to grow.　　China might retaliate　　Chip-making equipment is critical for China’s ambitions to lead in artificial intelligence and quantum computing technologies.　　While it would be possible for large Chinese companies to source state-of-the-art chips and build new systems abroad, not being able to design and manufacture advanced semiconductors in mainland China is a step back in their ambitions.　　The Chinese government has not issued any comment yet on the new restrictions, but it will likely react. One possibility is trade restrictions on Western businesses.
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Release time：2023-05-11 11:05 reading：3343 Continue reading>>
Nikon, <span style='color:red'>ASML</span> and Carl Zeiss sign agreement to settle all litigation
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Nikon, ASML and Carl Zeiss sign agreement to settle all litigation

　　Nikon Corporation (“Nikon”) (TYO: 7731), ASML Holding N.V. (“ASML”) (NASDAQ: ASML) and Carl Zeiss SMT GmbH (“Zeiss”) have signed a Memorandum of Understanding relating to a comprehensive settlement of all legal proceedings over patents for lithography equipment and digital cameras.　　The Memorandum of Understanding is a binding agreement that concerns all pending disputes between Nikon, ASML and Zeiss in Europe, Japan and the United States, including at the U. S. International Trade Commission. The three companies expect to execute a definitive settlement and cross-license agreement and dismiss all legal proceedings between the parties in February 2019. The terms of the Memorandum include a payment to Nikon by ASML and Zeiss of a total of EUR 150 million (approximately 19.0 billion Japanese Yen*).  Furthermore, the cross-license agreement contemplated by the Memorandum includes mutual royalty payments of 0.8% over the sales of immersion lithography systems for 10 years from the signature date of the parties’ definitive agreement.　　* Based on an exchange rate of 1 EUR = 125 yen
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Release time：2019-01-24 00:00 reading：2010 Continue reading>>
Imec and <span style='color:red'>ASML</span> announce EUV lithography collaboration
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Imec and ASML announce EUV lithography collaboration

imec, the research and innovation hub in nanoelectronics and digital technologies, and ASML, a leading developer of lithographic equipment, have announced the next step in their ongoing and extensive collaboration.The two are looking to accelerate the adoption of EUV lithography for high-volume production, including the current latest available equipment for EUV (0.33 Numerical Aperture, NA). Moreover, they are looking to explore the potential of the next-generation high-NA EUV lithography to enable printing of even smaller nanoscale devices advancing semiconductor scaling towards the post 3 nanometer Logic node. As a result they have established a joint high-NA EUV research lab.In 2014, they created a joint research centre, the Advanced Patterning Center, to optimize lithography technology for advanced CMOS integration and to prepare the ecosystem to support advance patterning requirements. The next stage of this co-operation will see the installation of ASML’s most advanced and high-volume production dedicated EUV scanner (NXE:3400B) in imec’s cleanroom.Using imec’s infrastructure and advanced technology platforms, researchers and partner companies will be able to pro-actively analyse and solve technical challenges such as defects, reliability and yield, and as such help to accelerate the EUV technology’s industrialisation.With a 250W light source, ASML’s newest EUV system throughput will be more than 125 wafers per hour, one of the industry’s most important requirements for high-volume production. The NXE:3400B will also be equipped with the latest alignment and leveling sensors, to enable optimal process control at this high throughput. This will facilitate the overlay matching of the NXE:3400B to that of the latest immersion scanner, NXT:2000i, that will also be installed in imec’s cleanroom in 2019. In addition, ASML and imec will expand the metrology capability with new ASML YieldStar optical metrology and ASML-HMI Multi-electron beam metrology equipment, allowing more accurate and faster evaluation of nanoscale structures.The joint high-NA EUV research lab will see researchers from both organisations experiment with the next generation of EUV lithography at higher NA. Systems with a higher NA project the EUV light onto the wafer under larger angles, improving resolution, and enabling printing of smaller features. More specifically, the new high-NA EUV system, EXE:5000, that will be installed in the joint research lab, will have an NA of 0.55 instead of 0.33 in current NXE:3400 EUV systems.Already, the first joint scientific projects to facilitate the introduction of high-NA EUV, are ongoing. In the joint research lab, ASML and imec will perform research on the manufacturing of the most advanced nanoscale devices by high-NA EUV and assist the ecosystem of equipment and material suppliers to prepare for the introduction of high-NA EUV technology to the industry.Commenting Luc Van den hove, President and CEO of imec, said: “The new EUV scanners and ASML metrology equipment will allow our industry partners to perform collaborative research on the most advanced and industry relevant lithography and metrology equipment. ASML and imec have a nearly 30 year long tradition of joint research, leading to breakthrough patterning research to advance the semiconductor industry roadmap.”
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Release time：2018-10-26 00:00 reading：1356 Continue reading>>
50 EUV Systems Set to be Shipped by <span style='color:red'>ASML</span> by 2019
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50 EUV Systems Set to be Shipped by ASML by 2019

Dutch semiconductor equipment vendor  ASML said Wednesday it is on track to ship 20 extreme ultraviolet (EUV) systems in 2018 and expects to ship at least 30 more in 2019.The company's estimates came as part of ASML's second quarter financial report, which included better-than-expected sales of EUV tools and overall sales of about $3.2 billion. "Gross margin was slightly above our guidance, reflecting the strength of our DUV and applications business and progress in EUV profitability," said ASML CEO Peter Wennink.ASML shipped four EUV systems in the second quarter, one more than forecast, as logic customers prepare to ramp next-generation devices starting later this year, Wennink said.EUV — the successor to the workhorse deep ultraviolet (DUV) technology in advanced semiconductor manufacturing — is finally on the cusp of production after years of delays. Leading-edge semiconductor manufacturers include Samsung, Intel and TSMC are planning to use EUV in volume production beginning in the next year, though concerns remain about the availability of the EUV power source and other items in the EUV supply chain, including pellicles.ASML says it has now demonstrated four-week availability of well above 85% on a number of its new NXE:3400B EUV systems and is executing several programs to improve consistent availability to over 90% in 2019.Wennink said ASML's deep-ultraviolet lithography business continues to thrive, driven largely by the memory market, which  continues to require a significant number of lithography systems at least throughout this year and into 2019. After an excellent first half of 2018, we expect the second half."After an excellent first half of 2018, we expect the second half to be stronger, with improved profitability and continued growth from Q3 to Q4,” Wennink said.For the third quarter,  ASML said it expects sales of between 2.7 billion and 2.8 billion euro (roughly $3.15 billion to $3.26 billion).
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Release time：2018-07-23 00:00 reading：1088 Continue reading>>
<span style='color:red'>ASML</span> to Ship 20 EUV Systems in 2018
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ASML to Ship 20 EUV Systems in 2018

Dutch semiconductor equipment vendor  ASML said Wednesday it is on track to ship 20 extreme ultraviolet (EUV) systems in 2018 and expects to ship at least 30 more in 2019.The company's estimates came as part of ASML's second quarter financial report, which included better-than-expected sales of EUV tools and overall sales of about $3.2 billion. "Gross margin was slightly above our guidance, reflecting the strength of our DUV and applications business and progress in EUV profitability," said ASML CEO Peter Wennink.ASML shipped four EUV systems in the second quarter, one more than forecast, as logic customers prepare to ramp next-generation devices starting later this year, Wennink said.EUV — the successor to the workhorse deep ultraviolet (DUV) technology in advanced semiconductor manufacturing — is finally on the cusp of production after years of delays. Leading-edge semiconductor manufacturers include Samsung, Intel and TSMC are planning to use EUV in volume production beginning in the next year, though concerns remain about the availability of the EUV power source and other items in the EUV supply chain, including pellicles.ASML says it has now demonstrated four-week availability of well above 85% on a number of its new NXE:3400B EUV systems and is executing several programs to improve consistent availability to over 90% in 2019.Wennink said ASML's deep-ultraviolet lithography business continues to thrive, driven largely by the memory market, which  continues to require a significant number of lithography systems at least throughout this year and into 2019. After an excellent first half of 2018, we expect the second half."After an excellent first half of 2018, we expect the second half to be stronger, with improved profitability and continued growth from Q3 to Q4,” Wennink said.For the third quarter,  ASML said it expects sales of between 2.7 billion and 2.8 billion euro (roughly $3.15 billion to $3.26 billion).
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Release time：2018-07-20 00:00 reading：1109 Continue reading>>
<span style='color:red'>ASML</span> perfecting ‘microchip shrink’ for tech giants
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ASML perfecting ‘microchip shrink’ for tech giants

ASML’s chief operating officer Frederic Schneider-Maunoury. AFPVELDHOVEN (AFP) – They call it “the shrink” – it’s the challenge of how to pack more circuits onto the microchips which power everything from our phones to our computers, even our coffee machines.And pushing the boundaries of this technology is Dutch company ASML, which since its foundation in 1984 has quietly become a world leader in the semiconductor business.“There is more power in your smartphone today than was used to put man on the moon,” says ASML’s chief operating officer Frederic Schneider-Maunoury, animatedly waving his mobile phone in the air.When you open an app on your phone, the chain allowing you to book a flight, message a friend or check out who’s hot in your neighbourhood arcs all the way back most likely to ASML.Headquartered in Veldhoven, near the Belgian border, it builds sophisticated lithography machines to enable the world’s top chip makers – Intel, Samsung and Apple supplier Taiwan Semiconductor Manufacturing (TSMC) – to produce the smallest, most powerful, most cost-effective microprocessors on the planet.Its newest machines use highly-focused extreme ultra-violet (EUV) light to imprint designs on the chips, and are at the cutting-edge of what is scientifically and technologically possible in the art of miniaturisation.Last year after two decades of research and development and billions of euros, ASML shipped its first 12 EUV machines to clients. Each costs about 120 million euros ($145 million).This year it has projected sales of 20 machines – by 2020, it hopes to be selling 35 to 40 a year.It is ironic that these machines, which produce chips of infinitesimally small dimensions, are the size of a bus. Three Boeing 747 aircraft are needed to transport one machine to a client.Long seen as a bellwether of the tech industry, the company is listed on both the Amsterdam bourse, the AEX, and the Nasdaq in New York.Last year it announced profits had almost doubled to 2.12 billion euros on record sales of 9.05 billion euros.Only two other companies in the world – the Japanese giants Nikon and Canon – make lithography machines and neither has yet developed EUV technology.“Our problem is not just to find the technologies, we than have to put it into the products in an economical way,” Schneider-Maunoury told AFP, in his office overlooking ASML’s sprawling site.“Why buy a new phone? It’s not to make calls on. I buy a new phone precisely because it allows me to do things that the previous phone didn’t,” he said.But this is a competitive market, and if the new phone “is going to cost me 10 times more, than I’m not going to buy it”.A former vice-president at French rail giant Alstom, he joined ASML in 2010 and has become increasingly passionate about its innovative technology.The EUV system works by projecting the light through a blueprint, ASML explains.Using a series of complex optics, made by German company Zeiss, “the pattern is reduced and focused onto a thin slice of silicon coated with a light-sensitive chemical”.“The light interacts with the chemical effectively printing the pattern onto the silicon or wafer. When the unwanted silicon is etched away a three-dimensional structure is created.” This is repeated dozens of times, layer upon layer, leaving a grid of hundreds of chips on one silicon wafer.The light has to be focused in a vacuum to stop it being absorbed by air – a difficult technological feat – and the parameters are so small that the machine is working “to within the size of an atom”.The tiniest speck of dust infiltrating the machine could ruin the design, leaving blank spaces on the chips.ASML now employs about 20,000 people, mostly engineers and most in Veldhoven, but it also has sites in Asia and the US.And as it grows it is hiring. Some 3,000 new posts were added last year, with a similar number of new jobs expected this year.
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Release time：2018-05-14 00:00 reading：1315 Continue reading>>
<span style='color:red'>ASML</span> Updates EUV Roadmap
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ASML Updates EUV Roadmap

　　SAN JOSE, Calif. — ASML showed stepwise progress in an update on the performance of its latest extreme ultraviolet (EUV) lithography system and its roadmap at the SPIE Advanced Lithography conference here. The talks showed that getting EUV into production will be a nail-biter, and keeping it useful in the next generation will require multiple field upgrades.　　Over the weekend, the NXE 3400B system delivered 140 wafers/hour with a 245-W light source integrated in a system at the company’s headquarters in the Netherlands. ASML aims to tune the light source to 250 W for throughput of 150 wafers/hour and ship it to customers before June for use on 7-nm process nodes.　　The lab demo was conducted without use of a protective pellicle on the wafers. The tests exposed a full field with 96 fields using a dose of 20 mJ/cm2.　　A test using an 83% transmissive pellicle reached 100 WPH. ASML targets a 90% transmissive pellicle with 125-WPH throughput that can withstand a 300-W light source.　　In its efforts to reduce defects from contaminating particles, ASML is working in parallel on the pellicle and a cleaner scanner that doesn’t need a pellicle. Last year, it eliminated all but six particles in a run of 10,000 wafers and aims to reduce it to one particle per 10,000 wafers next year.　　The company targets a greater-than-90% uptime for the system by 2018–2019, when it should be in volume production. A day earlier, a Globalfoundries executive said that productivity levels were the key gating item on the first commercial use of the systems.　　To meet the needs of 5-nm nodes, ASML plans three upgrades to the system delivered over the next two years.　　Late this year, ASML aims to deliver a so-called overall and focus improvement package that enables overlays down to 1.7 nm, slightly below the required 1.9-nm target for 5 nm. In mid-2019, it plans a productivity enhancement package that boosts throughput to 145 WPH.　　ASML is considering a model 3400C that it could deliver in 2020 with additional improvements, boosting throughput to 155 WPH. Details of the system are still under discussion with the small handful of big chip vendors who would be its users.　　The NXE 3400B, large and ambitious as it is, is dwarfed by emerging plans for a follow-on tool nearly twice its size.　　The 0.55-NA system aims to use larger optics, a higher-power light source, and faster internal pathways to kick out a maximum of 185 WPH while printing features with dimensions as small as 8 nm. If successful, the new system could print in one pass the kind of 3-nm features that today’s 3400B is expected to need three passes to create.　　A talk on the new system here gave only a few glimpses at its progress but rammed home the point of its gigantic scope and scale. Optics maker Carl Zeiss SMT is now installing the first metrology system — the size of a small submarine — needed to make the system’s new and significantly larger lenses.　　Zeiss is now constructing multiple buildings to house manufacturing for the optics. In November, it got a pledge of a $1.9 billion investment from ASML as part of their collaboration.　　Meanwhile, engineers have finished their feasibility study and started design work on the system. It includes stands to help slide away a top module and remove a vacuum hull for servicing and upgrades, a process that, in an animation, looked akin to replacing an engine in a two-story locomotive.　　Among other interesting details, the scanner requires a wafer cooling subsystem. That’s because it aims to focus two to three times more power on the wafer than the 3400B.　　The subsystem is needed to ensure that heat generated by the light source deforms a wafer by no more than a nanometer while printing. Without it, a wafer could warp as much as 11.4 nm — larger than some of the features that it prints.　　Jan Van Schoot, who leads the high-NA design for ASML, said that he sees no change in the existing power density needed for a protective pellicle.　　Separately, ASML and Imec are exploring a stitching subsystem. It would knit two slightly deformed test images into one more perfect one to print. The process aims to speed throughput and help make increasingly large server chips.　　The stitching concept has long been studied but never successfully implemented, noted one audience member in a Q&A session.　　“Our study is ongoing and we may be showing more than we intend to do,” said Van Schoot. “We know it’s hard to do, so if we can’t implement it, we envision [that] less critical structures will be made at crossover points.”
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Release time：2018-03-01 00:00 reading：1567 Continue reading>>
EUV Backlog Grows as <span style='color:red'>ASML</span> Sets Sales Record
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EUV Backlog Grows as ASML Sets Sales Record

　　Lithography system provider ASML posted strong fourth quarter results, capping a year in which it posted record sales and shipped 10 next-generation extreme ultraviolet (EUV) lithography tools.　　Oft-delayed EUV is finally on the cusp of being inserted into production, with some leading-edge chip makers planning to use it late this year or early next.　　Peter Wennink, ASML's president and CEO, said "preparations for inserting EUV into high-volume chip manufacturing shifted into a higher gear" in 2017.　　ASML recorded EUV revenue for the year of 1.1 billion euros (about $1.34 billion) and picked up an additional 10 EUV system orders during the fourth quarter, exiting the year with a new high water EUV backlog of 28 systems.　　In all, ASML reported 2017 sales of 9.05 billion euro (about $11.04 billion) up 33 percent from 2016. The company posted a profit for the year of 2.12 billion euro (about $2.59 billion), up 44 percent from 2016.　　In the fourth quarter, ASML had total sales of 2.56 billion euros (about $3.12 billion), up 4 percent from the third quarter. The company reported a net income for the quarter of 644 million euros (about $786 million), up 16 percent from the third quarter.　　Wennink said ASML shipped two EUV systems earlier than expected in the fourth quarter, as industry strength prompted customers to ask for earlier delivery of both EUV and optical lithography systems.　　ASML also reported that it increased system sales to China by more than 20 percent from 2016 as the company continued to support China's expanding semiconductor industry. Alongside shipments to mainland fabs operated by non-Chinese customers, it is also planning to ship to five domestic Chinese customers in 2018.　　Shipments of optical lithography tools also grew substantially in 2017. The company said optical lithography system shipments increased by 21 percent over 2016, reaching 161 systems.　　ASML said it expects first quarter sales to be about 2.2 billion euro (about $2.7 billion).
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Release time：2018-01-19 00:00 reading：1214 Continue reading>>
<span style='color:red'>ASML</span> Continues to Ramp EUV Shipments
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ASML Continues to Ramp EUV Shipments

　　Dutch microlithography system vendor ASML said it on track to grow sales by at least 25 percent this year after a strong third quarter characterized by strong demand for 193-nm tools and the continued ramp up deliveries for next-generation extreme ultraviolet (EUV) systems.　　ASML (Veldhoven, the Netherlands) said it shipped three Twinscan NXE:3400B EUV tools in the third quarter, raising the total for the year so far too six. NXE:3400B is ASML's second-generation EUV production tool intended for volume production at the 7nm and 5nm nodes.　　ASML said it currently has a backlog of 23 EUV systems, down from a backlog of 27 systems at the end of the second quarter. The company said it also demonstrated during the second quarter that its EUV pellicle — which protects the photomask from particles during exposure — is capable of withstanding 250 watts of EUV power, another important milestone in the development of EUV.　　Among other third quarter highlights, ASML also announced the shipment of the first product jointly developed with the engineering team of Hermes Microvision, the Taiwanese pattern verification system vendor it bought last year for about $3.1 billion. The product, ePfm5, is a pattern fidelity metrology tool that offers customers enhanced capabilities for detecting patterning defects, ASML said.　　ASML reported third quarter sales of about 2.45 billion euros (about $2.9 billion), up 17 percent compared with the second quarter. The firm reported a third quarter net income of 557 million euros (about $657 million), up 20 percent from the second quarter.　　For the fourth quarter, ASML said it expects sales to slide to about 2.1 billion euros (about $2.48 billion). The firm expects its fourth quarter gross margin to be about 44 percent, up from 42.9 percent in the third quarter.　　With the strong third quarter sales and fourth quarter guidance, ASML affirmed its earlier guidance that its 2017 sales will be up at least 25 percent compared to 2016.　　"Our current view is that the positive business environment that we are seeing today will continue in 2018, supported by our strong backlog of 5.7 billion euros [$6.7 bill], which is driven by all product categories," said ASML President and CEO, Peter Wennink, in a press statement.
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Release time：2017-10-20 00:00 reading：1245 Continue reading>>
<span style='color:red'>ASML</span> Posts Strong Sales as EUV Orders Surge
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ASML Posts Strong Sales as EUV Orders Surge

　　Semiconductor lithography equipment vendor ASML Holdings NV posted better-than-expected second quarter revenue driven by sales to the booming memory chip sector and reported a significant increase in sales of next-generation extreme ultraviolet (EUV) lithography tools.　　ASML (Veldhoven, the Netherlands) reported that it sold an additional eight EUV systems in the second quarter, bringing  its EUV backlog to 27 tools valued at about 2.8 billion euro (about $3.26 billion). The firm also announced that it demonstrated the key productivity metric of 125 wafers per hour (125) on an EUV tool at its headquarters.　　Second quarter sales increased to 2.1 billion euro (about $244) million, up 8 percent compared to the year ago quarter. The company said it is on track to grow sales about 25 percent this year.　　ASML said it expects sales to memory companies—DRAM vendors—to grow about 50 percent this year as the memory sector enjoys one of its best upcycles in history.　　The demonstration of 125 WPH productivity is considered a key milestone for EUV tools. Chip vendors have long insisted that EUV tools must be capable of this level of throughput to be cost effective in volume manufacturing. ASML announced last week that its EUV source power had been demonstrated to achieve a level of 250 watts—the power threshold seen as the key to 125 MPH productivity.　　Leading edge chip manufacturers, including Intel, Samsung and TSMC, are hoping to insert oft-delayed EUV lithography into volume production in the next two years.　　A spokesperson for ASML said the 250 MPH metric was achieved in a standard test at the company's Veldhoven headquarters according to conditions like those that ASML runs for standard acceptance test protocol. This protocol typically includes many tests that are completed to qualify a system for shipment and test to ensure the tool performs according to specification, according to the spokesperson.　　ASML said it expects sales to increase to about 2.2 billion euro (about $2.56 billion) in the third quarter.　　"Our current view is that the positive business trends that we are seeing in 2017 are likely to continue as we enter 2018," Peter Wennink, ASML president and CEO, said.
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Release time：2017-07-21 00:00 reading：1191 Continue reading>>

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