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BIWIN Industrial-Grade TDC200 Series Storage Cards: Built for Multi-Channel 4K Surveillance

　　Designed for high-definition, multi-channel video surveillance, the BIWIN Spec TDC200 Series Industrial-Grade SD Cards & microSD Cards come equipped with various self-developed firmware algorithms featuring high-reliable design and multichannel write optimizations to achieve stable write speeds across multiple video channels. And with design upgrades in physical structure and reliability, these cards are able to support operating temperature within -25°C to 85°C, as well as more protective capabilities like water-, dust-, shock-, wear-, X-ray-resistance and anti-magnetism. They are ideal for intensive scenarios such as vehicle surveillance, security systems, industrial inspection, and medical monitoring applications.　　Reliable Multi-Channel 4K Recording，10 Channels of Continuous Recording Without Frame Drops　　The BIWIN TDC200 series SD Card & microSD Card are equipped with smart data flow technologies which help to distinguish video stream data from system data and allocate them into separate storage zones. This optimized data structure through partitioned storage assists to reduce data fragmentation and write amplification caused by garbage collection (GC) during full-drive write scenarios, so as to extend products’ lifespan. Additionally, the built-in intelligent cache management system minimizes wear from high-frequency access, ensuring stability and reliability during high-load, continuous writing scenarios. The cards support 10 channels of 4K high-definition recording equipment with 7×24-hour stable continuous writing, ensuring no frame drops or stuttering in surveillance and high-definition recording scenarios, with no frame skipping or data loss during playback.　　Adaptive Power Saving for Extended Endurance，Ideal for Demanding Industrial Tasks　　Featured with smart low-power management technology, the TDC200 Series SD Card & microSD Card automatically switches to low power mode under standby state, reducing power consumption from milliamps (mA) to microamps (μA)—a drop of up to 85% in sleep mode. With microsecond-level wake-up response, the cards are especially suited for battery-powered or energy-sensitive applications, such as body-worn cameras, portable surveillance units, and inspection devices, significantly extending device uptime in the field.　　Comprehensive Protection from the Inside Out，Engineered for Harsh Industrial Environments　　In automotive and industrial settings, storage devices must withstand shocks, drops, vibrations, and extreme temperatures. The BIWIN TDC200 Series cards feature a reinforced physical design that ensures stable performance in environments ranging from -25℃ to 85℃. They are built to resist impact, vibration, water, dust, X-rays, and magnetic interference that can lead to circuit shorts or signal loss. Tested under rigorous reliability protocols, the TDC200 achieves a Mean Time Between Failures (MTBF) of up to 3 million hours, greatly reducing the risk of downtime and lowering maintenance costs in mission-critical deployments.　　Built with 3D TLC direct write and multiple software optimization technologies, BIWIN TDC200 Series SD Card & micro SD Card include capabilities of VDT (Voltage Detection Technology), S.M.A.R.T. health monitoring, Power Loss Protection, Intelligent Thermal Throttling and advanced ECC algorithms. VDT and S.M.A.R.T. provide predictive failure analysis and real-time health feedback, while intelligent thermal throttling and data retention safeguard data integrity under high-temperature conditions. These features work together to ensure long-term stability and durability even in the most demanding industrial environments.　　Conclusion　　In application scenarios requiring high-volume, multi-channel video recording, the BIWIN TDC200 Series Industrial-Grade SD & microSD Cards deliver exceptional stability and performance. With zero frame loss and uninterrupted data streams, every critical moment is captured in full. Thanks to superior shock and vibration resistance, these cards are the ideal choice for use in dashcams, in-vehicle DVRs, body-worn cameras, panoramic cameras, smart medical devices, industrial tablets, and industrial UAVs where data integrity is paramount.

Key word：

BIWIN

Release time：2025-07-29 15:33 reading：308 Continue reading>>

Trade news

SIMCom：A7663E Achieves Key Global Certifications, Enabling Scalable 4G IoT Deployments

　　As the global demand for LTE Cat 1 modules continues to rise in industrial IoT, asset tracking, and metering applications, SIMCom (as a global leader in IoT communication and solution)'s A7663E stands out with a balanced mix of performance, integration flexibility, and certification readiness. The module has recently secured a comprehensive set of international certifications, including RoHS, REACH, CE (RED) for the European market, Anatel for Brazil, and Cybersecurity compliance, paving the way for faster IoT deployment in regulated global markets.　　The A7663E is built LGA form factor, offering high integration capability while maintaining reliability. It supports LTE-FDD with downlink speeds up to 10 Mbps and uplink up to 5 Mbps, making it suitable for medium-data-rate IoT scenarios that demand efficient wireless performance and long lifecycle support. The inclusion of integrated multi-constellation GNSS (GPS, GLONASS, BeiDou) further enhances its value for location-based applications like asset tracking, smart mobility, telematics, surveillance devices, industrial routers, and remote diagnostics and so on.　　Additionally, A7663E provides a rich set of interfaces to support diverse product architectures. Its software feature set includes FOTA (Firmware Over-The-Air), SSL encryption, and LBS—ensuring devices stay secure and up-to-date throughout their lifecycle. This greatly reduces time-to-market and engineering cost.　　With global compatibility, the A7663E is an ideal LTE Cat 1 solution for IoT developers aiming to scale deployments across multiple regions with confidence.

Key word：

SIMCom

Release time：2025-07-24 10:37 reading：301 Continue reading>>

Trade news

SIMCom Strengthens Japan Market Presence with SIM7672JP Certifications

　　SIMCom, a global leader in IoT communication solutions, announces that its SIM7672JP—powered by the Qualcomm® 216 LTE IoT modem—has successfully obtained key certifications for the Japanese market, including JATE, TELEC, and NTT Docomo Technical Approval (TA). Certification with KDDI is currently ongoing.　　These approvals mark a significant step in SIMCom's strategic expansion into Japan, one of the world’s most advanced and regulated IoT markets.　　Designed to meet Japan's stringent regulatory and operator requirements, the SIM7672JP offers reliable and cost-effective LTE Cat.1 bis connectivity tailored for a wide range of IoT applications. It has already been validated by IIJ (Internet Initiative Japan) and is compatible with the NTT Docomo network, ensuring strong local integration.　　With support for Power Saving Mode (PSM), the SIM7672JP enables long-term, low-power deployments—making it an ideal solution for diverse sectors such as automotive and transport (fleet management, UBI, DVR, public safety), energy and industrial (smart grids, industrial equipment, rugged tablets, infrastructure, pipeline monitoring), consumer and enterprise (payment systems, POS, networking, retail, surveillance), and residential and healthcare (home automation, security, wearables, remote medical devices).　　The SIM7672JP is now in mass production and available for Japanese market. With the latest Japanese certifications, SIMCom is well-positioned to deepen its collaboration with local partners and accelerate the deployment of reliable cellular IoT solutions throughout Japan. SIMCom remains committed to empowering the Japanese IoT ecosystem—with certified, future-proof LTE Cat.1 bis modules that deliver connectivity, efficiency, and compliance.

Key word：

SIMCom

Release time：2025-07-21 14:44 reading：320 Continue reading>>

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Fibocom Unveils the First LTE Cat.1 bis Module L610-IN with IRNSS and NAVIC for India

　　Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, launched the L610-IN, the first LTE Cat.1 bis module that supports dual-mode, dual-frequency positioning technology with IRNSS (Indian Regional Navigation Satellite System) and NAVIC. With its precise positioning capabilities, high compatibility, and adaptability to various IoT scenarios, the L610-IN provides an efficient and cost-effective connectivity solution for the Indian IoT market. It fully complies with the AIS140 standard, empowering intelligent transformation in key sectors such as fleet management and electronic toll collection (eToll).　　The L610-IN integrates innovative IRNSS and NAVIC dual-mode, dual-frequency positioning functionality, significantly enhancing positioning accuracy and stability in India and neighboring regions. It effectively addresses the challenge of insufficient navigation signal coverage in complex environments. The module strictly adheres to the AIS140 regulations in India, ensuring compliance for applications like vehicle tracking and eToll collection, making it the ideal communication solution for smart transportation and logistics industries.　　The L610-IN features a compact LCC+LGA package with dimensions of 31mm x 28mm and is pin-to-pin compatible with Fibocom's LTE Cat.4 modules NL668/L716. This design enables customers to seamlessly transition between communication technologies while minimizing hardware modification costs. Supporting LTE/GSM networks, the module is ideal for mid-to-low-speed applications such as smart payment, shared economy, industrial IoT, asset tracking, and aftermarket automotive solutions. With additional features like VoLTE HD voice, camera support, LCD display, and multiple sensor interfaces (USB/UART/SPI/I2C/SDIO), the L610-IN delivers flexible and secure end-to-end connectivity for industry clients.　　In addition to the L610-IN for the Indian market, Fibocom has also introduced the L610-EU for Europe and the L610-LA for Latin America, covering major global operator frequency bands. These variants cater to seamless positioning and long-distance communication needs, further expanding the boundaries of smart city and intelligent tracking applications.　　The L610-IN is expected to begin CS in Q2 2025. With its high cost-efficiency and localized service capabilities, the module will accelerate the development of India's IoT ecosystem.　　Ragin Kallanmar Thodikai, Country Sales Manager of India at Fibocom, stated:　　"The launch of the L610-IN bridges the gap in the Indian market for high-precision Cat.1 bis modules while simplifying customer upgrades through technology compatibility, accelerating the global deployment of mid-to-low-speed IoT solutions."

Key word：

Fibocom

Release time：2025-07-17 16:25 reading：332 Continue reading>>

Trade news

Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions,introduced the RA2T1 microcontroller (MCU) group based on the Arm® Cortex®-M23 processor optimized for motor control systems in July9. RA2T1 devices are specifically designed for single-motor applications such as fans, power tools, vacuum cleaners, refrigerators, printers, hair dryers and many more.　　Feature Set Optimized for Motor Control　　The new RA2T1 devices include a number of features designed to enhance motor control function, specifically in single-motor systems. One of the notable features is a 3-channel S&H function that simultaneously detects the 3-phase current values of Brushless DC (BLDC) motors. This method provides superior control accuracy as opposed to sequential measurement methods. The RA2T1 MCUs also offer complementary Pulse Width Modulation (PWM) function of the timer, which enables automatic insertion of dead time and generation of an asymmetric PWM. This function is optimized for inverter drive, which facilitates control algorithm implementation.　　The RA2T1 devices offer safety features that are critical in motor control applications. They provide a Port Output Enable function and a high-speed comparator that work together to quickly shut off the PWM output when an overcurrent is detected. The shutdown state can be selected according to the inverter specifications.　　Renesas Leadership in Embedded Processing for Motor Control　　Renesas has shipped motor-control specific MCUs for over 20 years. The company ships over 230 million motor control embedded processors per year to thousands of customers worldwide. In addition to multiple RA MCU groups, Renesas offers motor-control specific devices in its 32-bit RX Family, its 16-bit RL78 MCUs and its 64-bit RZ MPUs.　　“Customers have trusted Renesas motor control solutions for many years across thousands of systems,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA2T1 MCUs enhance our leadership in this area with market-leading technology, low-power operation, and legendary Renesas quality and safety standards for single-motor systems.”　　Key Features of the RA2T1 Group MCUs　　Core: 64 MHz Arm Cortex-M23　　Memory: 64KB Flash, 8KB SRAM, 2KB Data Flash　　Analog Peripherals: 12-bit ADC with 3-channel Sample and Hold, temperature sensor, internal reference voltage, 2-channel high-speed comparators　　System: High-, mid- and low-speed On-chip Oscillators; clock output; power-on reset; voltage detection; data transfer, event link and interrupt controllers; low-power modes　　Safety: PWM forced shutdown, SRAM parity error check, ADC self-diagnosis, clock frequency accuracy measurement, illegal memory access detection　　Operating Temperature Range: Ta = -40°C to 125°C　　Operating Voltage: 1.6V to 5.5V　　Packages: 48LQFP, 32-LQFP, 48-QFN, 32-QFN, 24-QFN (4mm x 4mm)　　The new RA2T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of motor control designs to other RA Series devices.　　Winning Combinations　　Renesas has combined the new RA2T1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Portable Power Tools, Smart BLDC Ceiling Fan, Cordless Vacuum Cleaner, Cordless Leaf Blower. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RA2T1 Group MCUs are available now, along with the FSP software. The new MCUs are supported in Renesas’ Flexible Motor Control development kit that enables easy evaluation of motor control using permanent magnet synchronous motors (brushless DC motors), and the Renesas Motor Workbench development tool. This development kit offers a common design platform with numerous Renesas motor control MCUs from the RA and RX families, enabling migration of IP across numerous devices. Information on all these offerings is available at renesas.com/RA2T1. Samples and kits can be ordered either on the Renesas website or through distributors.　　Renesas MCU Leadership　　A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.

Key word：

Renesas

Release time：2025-07-14 14:38 reading：384 Continue reading>>

Trade news

Fibocom-Powered Robotic Mower Solution Featured at SPOGA+GAFA 2025, Pioneering the Future of Boundary-Free Smart Lawn Care

　　Cologne, Germany – June 24, Fibocom, a global leader incommunication modules and AI solutions, had its state-of-the-art intelligentrobotic lawn mower solution prominently showcased at SPOGA+GAFA 2025, theworld’s leading trade fair for the garden and outdoor living industry. Multiplerobotic lawn mowers powered by Fibocom’s technology demonstrated seamlessnavigation across simulated garden environments—autonomously detectingboundaries, planning precise mowing routes, and avoiding obstacles—all withoutrelying on traditional physical perimeter wires. This impressive demonstrationhighlighted the disruptive potential of AI-driven, boundary-free lawn caresolutions.　　The global smartrobotic mower market holds vast potential, with Europe and North Americaaccounting for 72% of the world’s 250 million private gardens. Yet, adoptionremains low—under 6% in North America and 10–30% in Europe—highlightingsubstantial room for growth as demand for intelligent lawn care accelerates.　　Fibocom’ssolution integrates advanced AI vision, multi-sensor fusion, and intelligentnavigation to eliminate the need for traditional boundary wires. This enablesrobotic mowers to autonomously detect perimeters and obstacles, ensuring safe,efficient, and precise operation while significantly improving mowing productivity.It’s worth mentioning that, having accumulated over 350,000 kilometers ofreliable autonomous performance worldwide, this solution has proven itsrobustness in diverse and complex garden environments.　　Fibocom provides two solution variantstailored to diverse customer needs: a standard pure-vision model and a flagshipversion combining binocular VIO (Visual-Inertial Odometry) with RTK (Real-TimeKinematic) for superior stability, precision, and large-area coverage—ideal forprofessional and commercial applications. This comprehensive suite, encompassingstereo cameras, AI processing boards, motor control units, and customizablemobile applications, enables OEM partners to accelerate product developmentcycles and focus resources on product differentiation and go-to-marketstrategies. For end users, it revolutionizes lawn care with smart mapping,autonomous operation, and auto-recharging for a safer, easier experience.　　Strategic partnerships with top global brandsare fast-tracking the launch of Fibocom-powered products in key internationalmarkets over the next six months, underscoring Fibocom’s technologicalleadership and growing influence in the smart lawn care industry. Leveragingcutting-edge innovation and manufacturing excellence, Fibocom empowers partnersto penetrate top-tier European retail channels and scale globally, where everyimpeccably maintained lawn showcases the strength of Chinese smartmanufacturing on the world stage.

Key word：

Fibocom

Release time：2025-07-11 11:28 reading：285 Continue reading>>

Trade news

Murata Begins World’s First Mass Production of 47µF Multilayer Ceramic Capacitor in 0402-inch Size

　　Murata Manufacturing Co., Ltd. has begun the world’s first mass production of the 0402-inch size (1.0 × 0.5 mm) multilayer ceramic capacitors (MLCC) with a capacitance of 47µF*. The new product line, available in two variants with different temperature characteristics, is designed to advance MLCC miniaturization and enhance customer system performance.　　In recent years, high-performance IT solutions, such as those used in AI servers and data centers, have seen rapid growth. Due to the often high component density demanded by these devices, optimized component placement within limited PCB areas is paramount. As a result, there is increasing demand for capacitors that offer both miniaturization and higher capacitance, along with high reliability under high-temperature conditions caused by heat generated from PCBs and integrated circuits (ICs).　　In response to these requirements, Murata has utilized its proprietary technologies in ceramic dielectric layers and internal electrode miniaturization to facilitate the world’s first mass production of this innovative 47µF product in the compact 0402-inch size. Compared to Murata’s conventional 0603-inch size product with the same capacitance, this new capacitor reduces mounting area by approximately 60%. Additionally, it delivers about 2.1 times the capacitance of Murata’s previous 22µF product in the same 0402-inch size.　　The MLCC is available in two variants – the X5R (EIA) GRM158R60E476ME01 with an operating temperature range of -55 to +85°C, and the X6S (EIA) GRM158C80E476ME01 with an operating temperature range of -55 to +105°C. The ability to operate in environments up to 105°C, makes the X6S variant well-suited for placement near ICs, thereby contributing to improved device performance and integration. Both devices feature a ±20% tolerance and rated voltage of 2.5Vdc.　　Murata is committed to advancing miniaturized capacitors with higher capacitance and improved high-temperature reliability to meet evolving market demands. These innovations not only support the ongoing miniaturization and functional enhancement of electronic devices but also contribute to lower material usage and increased production efficiency per unit, ultimately helping reduce power consumption at Murata’s factories and lessen environmental impact.　　For inquiries regarding this product, please contact us.　　Notes　　*Based on Murata research as of July 9, 2025.

Key word：

Murata

Release time：2025-07-10 14:13 reading：342 Continue reading>>

Trade news

ROHM Develops an Ultra-Compact MOSFET Featuring Industry-Leading* Low ON-Resistance Ideal for Fast Charging Applications

　　ROHM has developed a 30V N-channel MOSFET — AW2K21 — in a common-source configuration that achieves an industry-leading ON-resistance of 2.0mΩ (typ.) in a compact 2.0mm × 2.0mm package.　　With the rise of compact devices featuring large-capacity batteries, such as smartphones, the need for fast charging functionality to shorten charging times continues to grow. These applications require bidirectional protection to prevent reverse current flow to peripheral ICs and other components when not actively supplying or receiving power. What’s more, fast charging involves high current power transfer, leading smartphone manufacturers to demand stringent specifications for MOSFETs, including a maximum current rating of 20A, breakdown voltage between 28V and 30V, and an ON-resistance of 5mΩ or less. However, meeting these requirements with standard solutions typically necessitates the use of two large low ON-resistance MOSFETs, increasing board space along with mounting complexity.　　In response, ROHM developed an ultra-compact low ON-resistance MOSFET optimized for fast high-power charging. The AW2K21 adopts a proprietary structure that enhances cell density while minimizing the ON-resistance per unit chip area. Two MOSFETs are integrated into a single package, allowing a single part to support bidirectional protection applications (commonly required in power supply and charging circuits).　　The proprietary structure also places the drain terminal on the top surface, unlike on the backside in standard vertical trench MOS structures. This enables the use of a WLCSP, which achieves a larger chip-to-package area ratio that further reduces ON-resistance per unit area. As a result, the new product not only minimizes power loss but also supports high current operation, making it ideal for high-power fast charging applications despite its ultra-compact size.　　For example, in power supply and charging circuits for compact devices, standard solutions typically require two 3.3mm × 3.3mm MOSFETs. In contrast, the AW2K21 can achieve the same functionality with a single 2.0mm × 2.0mm unit, reducing the footprint and ON-resistance by approximately 81% and 33%, respectively. Even compared to similarly sized GaN HEMTs, ON-resistance is decreased by up to 50%, contributing to lower power consumption and increased space savings across a variety of applications.　　The AW2K21 is also suitable for use as a unidirectional protection MOSFET in load switch applications, where it maintains the industry’s lowest ON-resistance. At the same time, ROHM is further pushing the limits of miniaturization with the development of an even smaller 1.2mm × 1.2mm model.　　Going forward, ROHM remains dedicated to supporting the miniaturization and energy efficiency of electronic systems through compact, high-performance solutions that contribute to the realization of a sustainable society.　　Key Product Characteristics　　Application Examples　　• Smartphones　　• VR (Virtual Reality) headsets　　• Compact printers　　• Tablets　　　　 • Wearables　　　　　　　　　　 • LCD monitors　　• Laptops　　　　 • Portable gaming consoles　　　 • Drones　　And other applications equipped with fast charging capability.　　Terminology　　MOSFET (Metal Oxide Semiconductor Field Effect Transistor)　　A field-effect transistor (FET) featuring a metal oxide semiconductor structure (the most commonly used type). It consists of three terminals: gate, drain, and source. Applying a voltage to the gate (control terminal) regulates current flow from the drain to the source.　　N-channel MOSFETs turn ON when a positive voltage is applied to the gate relative to the source. A common-source configuration MOSFET integrates two transistor elements that share a single source terminal.　　ON-Resistance　　The resistance between the Drain and Source of a MOSFET when it is in the ON state. A smaller RDS(on) reduces power loss during operation.　　Breakdown Voltage　　The maximum voltage that can be applied between the drain and source terminals of a MOSFET without causing damage. Exceeding this limit results in dielectric breakdown, potentially leading to device failure or malfunction.　　WLCSP (Wafer Level Chip Scale Package)　　An ultra-compact package in which terminals and wiring are formed directly on the wafer before separated into individual chips. Unlike general packages where the chips are cut from the wafer and then molded with resin to form terminals, WLCSP allows the package size to match the chip itself, making it possible to further reduce size.　　GaN HEMT　　GaN (Gallium Nitride) is a compound semiconductor material used in next-generation power devices. It offers superior physical properties over conventional silicon, enabling higher frequency operation with faster switching speeds. HEMT stands for High Electron Mobility Transistor.

Key word：

ROHM

Release time：2025-07-08 17:04 reading：335 Continue reading>>

Trade news

Murata Launches World’s First 10µF/50Vdc MLCC in 0805-inch Size for Automotive Applications

　　Murata Manufacturing Co., Ltd. has announced the new GCM21BE71H106KE02 multilayer ceramic capacitor (MLCC) has entered mass production. The device is the world's first 0805-inch size (2.0 x 1.25 mm) MLCC to offer a capacitance of 10µF with a 50Vdc rating and is specifically engineered for automotive applications*. This cutting-edge product marks a significant advancement in MLCC design, delivering a smaller 0805-inch package while maintaining capacitance, voltage rating, and MLCC reliability.　　Advancements in advanced driver-assistance systems (ADAS) and autonomous driving (AD) technologies necessitate deploying an increased number of integrated circuits (ICs) within vehicle systems. This surge in ICs simultaneously leads to a greater demand for supporting high-capacitance passive components while imposing tighter spatial constraints – as a greater number of capacitors must be accommodated on increasingly crowded automotive printed circuit boards (PCBs).　　Designed for 12V automotive power lines, the GCM21BE71H106KE02 capacitor leverages Murata’s proprietary ceramic material and thinning technologies to help engineers to save PCB space and reduce the overall capacitor count, resulting in smaller, more efficient, and reliable automotive systems. As the first automotive-specific MLCC to achieve a 10µF capacitance with a 50Vdc rating in the compact 0805-inch size the GCM21BE71H106KE02 represents a significant advancement in capacitance efficiency. It offers roughly 2.1 times the capacitance of Murata’s previous 4.7µF/50Vdc product, despite sharing the same physical size. Furthermore, compared to the previous 10µF/50Vdc MLCC in the larger 1206-inch size (3.2 x 1.6 mm), the new MLCC occupies approximately 53% less space, providing substantial space savings for automotive applications.　　Murata will continue to pursue further miniaturization and increased capacitance of MLCCs, while expanding its product lineup to meet the evolving needs of the automotive market. These efforts will support the industry as they look to develop higher-performance and more multifunctional vehicles. In addition, by downsizing electronic components, Murata aims to reduce material usage and improve production efficiency per unit, helping to lower electricity consumption at its manufacturing sites and reduce overall environmental impact.

Key word：

Murata

Release time：2025-07-04 13:59 reading：411 Continue reading>>

Trade news

TAIYO YUDEN: World's First Multilayer Metal Power Inductor Capable of Withstanding Temperatures up to 165°C

　　TAIYO YUDEN CO., LTD. has commercialized four items, including the multilayer metal power inductor MCOIL™ "LACNF2012KKTR24MAB" (2.0 x 1.25 x 1.0 mm, maximum height value shown), which complies with the "AEC-Q200" reliability qualification test standard for passive automotive components. Through advancements made in our proprietary metal materials and multilayer construction methods, we have achieved an upper operating temperature limit of 165°C for a multilayer metal power inductor, a world’s first *1 .　　These products are used as choke coils in DC-DC converters used in automotive engine ECUs, control systems such as BMS, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　By extending the upper operating temperature limit range of our conventional product "LCCNF2012KKTR24MAD" (operating temperature range: -55°C to +150°C) to 165°C, these new products are able to contribute to the miniaturization and performance enhancement of power supply circuits by enabling high-density mounting in high-temperature environments such as in automobiles.　　Mass production of these products began at our subsidiary, WAKAYAMATAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture, Japan), in April 2024. Samples are available for 50 yen per unit.　　The advancements that we have seen in recent years in electronic controls in production vehicles, as typified by ADAS units, has led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. Furthermore, performance also continues to improve through functional integration, such as in integrated cockpits that combine instrument clusters and infotainment devices. While the throughput of IC chips continues to grow as these devices become increasingly multifunctional and high-performance, there is also a growing need to make on-board electronic components smaller and thinner in order to arrange devices in highly dense configurations and integrate them into single modules. Components mounted at high densities become more susceptible to the effects of heat, as their reduced volumes makes it more difficult for the heat generated by the components to dissipate. Furthermore, since ECUs are increasingly being installed in engine compartments—a high temperature environment—on-board electronic components must be able to withstand high temperatures.　　To address these challenges, TAIYO YUDEN further improved the reliability of the MCOIL™ LCCN series of multilayer metal power inductors, which had the advantage of being smaller and thinner, and launched the AEC-Q200 certified LACN series which provides an extended operating temperature range of - 55°C to +165°C.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　*1 As of May 30, 2024, according to TAIYO YUDEN study.　　■Application　　Choke coils in DC-DC converters used in automotive engine ECUs, control systems such as BMS, safety systems such as ABS, body-related systems such as ADAS, and information systems such as instrument clusters.　　■Characteristics　　*2 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)　　*3 The temperature rise current value(Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)　　*4 The rated current is the DC current value that satisfies both of current value saturation current value and temperature rise current value.　　* Derating of rated current is necessary depending on the ambient temperature. Please see our website below for detailed specifications

Key word：

TAIYO

Release time：2025-05-30 14:21 reading：345 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor

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