<span style='color:red'>Renesas</span>：Enhance HMI User Experience with Built-in Large Memory MPU
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Renesas：Enhance HMI User Experience with Built-in Large Memory MPU

　　The HMI market continues to drive growth in better user experience and increased automation with the expansion of HMI applications. This results in a strong demand for improved functionality and performance in display-based applications, such as real-time plotting, smooth animation, and USB camera image capture, in affordable systems. Microprocessors (MPUs) with high-speed, large-capacity built-in memory that can be used like microcontrollers (MCUs) are gaining attention in the market. Renesas' RZ/A3M MPU with a built-in 128MB DDR3L SDRAM and a compatible package for a two-layer PCB design is the ideal solution for realizing smooth animation and high-quality HMI at a reasonable system cost.　　High-Performance HMI and Real-Time Graphics　　Integrating high-speed, large-capacity memory directly into the MPU package offers several advantages, including mitigating concerns about high-speed signal noise on the PCB and simplifying PCB design for the users. The large-capacity memory needed for high-performance HMIs is externally connected to the MPU in the conventional way. Additionally, PCBs equipped with DDR memory and high-speed signal interfaces require multi-layer PCB designs to account for signal noise, making it challenging to reduce PCB costs. Also, the common capacity of on-chip SRAM is typically between 1MB and 10MB, which is too small for high-performance HMIs that need to include a reasonable number of tasks in the near future. To overcome these issues, Renesas released an industry-leading RZ/A3M MPU with a large built-in 128MB DDR3L memory to support high-performance HMI and real-time graphics performance to enhance better and faster user experiences. Most importantly, the board does not require a high-speed signal interface and supports two-layer PCB design to reduce board noise and simplify system development for users.Figure 1. Strengths of Built-in DDR Memory　　Designing High-Performance PCBs at a Reasonable System Cost　　The number of PCB layers and the ease of design significantly impact the cost of system implementation and maintenance in user applications. As shown in Figure 2, using a wide pin pitch of 0.8mm allows for the layout of signal lines and placement of VIAs between the balls. Additionally, placing the balls handling the main signals in the outer rows of the 244-pin 17mm x 17mm LFBGA package and positioning the GND and power pins as inner balls allows for efficient routing of the necessary signal lines for the system (Figure 3). The RZ/A3M MPU is designed to build cost-effective systems with two-layer PCBs through its innovative packaging and pin assignments.Figure 2. Signal Wiring and Ball LayoutImageFigure 3. Optimized Ball Arrangement for a Two-Layer Board Layout　　User-Friendly Interface Enabling Smooth GUI Display　　The high-resolution graphic LCD controller integrated into the RZ/A3M supports both parallel RGB and 4-lane MIPI-DSI interfaces, accommodating displays up to 1280x800. Additionally, the 2D graphics engine, high-speed 16-bit 1.6Gbps DDR3L memory, and 1GHz Arm® Cortex®-A55 CPU enable high-performance GUI displays, including smooth animations and real-time plotting that increase the possibility of automation in HMI applications. Connecting a USB camera to the USB 2.0 interface enables smooth capture of camera images, making it easy to check inside of an apparatus, for example, the doneness of the food in the oven or the condition in the refrigerator.　　The EK-RZ/A3M is an evaluation kit for the RZ/A3M. It includes an LCD panel with a MIPI-DSI interface. With this kit, users can immediately start evaluation. Renesas also has several graphics ecosystem partners – LVGL, SquareLine Studio, Envox, Crank, RTOSX – who deliver GUI solutions utilizing the EK-RZ/A3M to further accelerate your development cycle.Figure 4. High-Definition HMI Example with the EK-RZ/A3M　　The RZ/A3M MPU, equipped with high-speed 128MB DDR3L memory and a 1GHz Arm Cortex-A55, excels in developing cost-effective HMI applications with real-time plot UIs, smooth animations, and USB camera capture. The integrated memory simplifies PCB design by removing the need for high-speed signal interface design. Visit www.renesas.com/rza3m to learn more about the technical details and how to start developing the next HMI applications for consumer electronics, smart home, building automation, healthcare, industrial applications, and office automation.
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Release time：2025-06-06 15:27 reading：235 Continue reading>>
<span style='color:red'>Renesas</span> Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions
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Renesas Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The RZ/A3M drives video and camera output on large LCD panels with resolutions up to 1280x800, addressing the display requirements in next-generation home appliances, industrial and office automation, healthcare devices and building control systems.　　Similar to its existing RZ/A3UL, the RZ/A3M features a 64-bit Arm® Cortex®-A55 core with a maximum operating frequency of 1 GHz and 128 KB (kilobytes) of on-chip SRAM. By integrating high-speed 128MB DDR3L-SDRAM in a single System-in-Package (SiP), the device eliminates the complex task of designing a high-speed signal interface for connecting external memory.　　Reducing System Cost with Built-in Memory and Simplified PCB Design　　The RZ/A3M is designed to reduce system costs and accelerate development. It supports both external NAND and NOR flash via QSPI for data and code storage. Paired with a driver, high-capacity NAND flash offers a cost-effective option for memory expansion. Additionally, the RZ/A3M's BGA package has a unique pin layout with two main rows positioned on the outside edge. This layout simplifies PCB routing and enables a low-cost, dual-layer printed wiring board design, providing significant cost and time savings. This memory integration simplifies PCB design by reducing the routing complexity and minimizing layout constraints.　　“I’m pleased to launch the RZ/A3M, the first RZ product with large built-in memory targeting high-function video/animation HMI performance while keeping overall system costs low,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “In addition, we aim to deliver a highly responsive user experience with high-quality, real-time graphics, and provide the ease of design and cost efficiency to help our customers build advanced HMI solutions quickly.”　　Comprehensive Development Environment　　Renesas offers a comprehensive HMI development environment that includes the Flexible Software Package (FSP), evaluation kits, development tools, and sample software. Graphical user interface (GUI) solutions from partner companies such as LVGL, Crank, SquareLine Studio, and Envox will be available for the RZ/A3M to facilitate rapid HMI graphics development.　　Key Features of RZ/A3M　　Arm Cortex-A55 CPU with a maximum operating frequency of 1GHz　　128KB SRAM with error correction, Built-in 128MB DDR3L SDRAM　　Graphics capabilities: LCD controller supporting resolutions up to 1280x800 (WXGA), parallel RGB and MIPI-DSI (4-lane) interfaces, 2D graphics drawing engine　　Peripheral functions: QSPI interface for serial NOR/NAND flash memory, SPI, I2C, SDHI, USB2.0, I2S, temperature sensor, timer　　Package: 244-pin LFBGA, 17mm x 17mm, 0.8mm pitch　　Renesas’ Comprehensive HMI Solutions　　Renesas offers a wide variety of HMI solutions ranging from the 32-bit RX and RA MCU families to the 64-bit RZ family supporting 4K displays. The RZ/A series, built on RTOS-based MPUs with fast startup, includes the new RZ/A3M, which delivers high-performance HMI capabilities with the same ease of use offered by MCUs using large memory capacity.　　Multi-HMI Winning Combination　　Renesas offers Multi-HMI Solution which combines the new RZ/A3M MPU with numerous compatible devices from its portfolio to offer HMI functions for appliances. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.
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Release time：2025-05-26 14:49 reading：289 Continue reading>>
<span style='color:red'>Renesas</span> Partners with Indian Government to Drive Innovation Through Startups and Industry-Academia Collaboration, Strengthening India’s Semiconductor Ecosystem
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Renesas Partners with Indian Government to Drive Innovation Through Startups and Industry-Academia Collaboration, Strengthening India’s Semiconductor Ecosystem

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced its partnership with the Ministry of Electronics & Information Technology (MeitY), Government of India, to support local startups and academic institutions in the field of VLSI and embedded semiconductor systems. Renesas also celebrated the expansion of its offices in Bengaluru and Noida to accommodateits growing R&D teams, with the inauguration ceremonies held today. This strategic move underscores Renesas’ commitment to innovation and excellence in India and aims to drive continued growth in the region.　　Renesas and the Centre for Development of Advanced Computing (C-DAC), an autonomous scientific society of MeitY, today signed and exchanged two Memoranda of Understanding (MOUs) under the MeitY Chips to Startup (C2S) programme (Note). These MOUs focus on 1) Supporting local startups by enabling them to drive technological advancement andpromote local manufacturing in alignment with the Make in India initiative; and 2) Enhancing industry-academia collaboration by fostering an innovative, product-focused mindset among students.　　Shri Ashwini Vaishnaw, Minister for Railways, Information & Broadcasting, and Electronics & Information Technology, Government of India; along with Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas; and Rea Callendar, Head of Platform Adoption and Ecosystem Enablement at Altium, which joined forces with Renesas in August 2024, attended the celebration at the Noida office. Hidetoshi Shibata, CEO of Renesas, also joined virtually, underscoring the global significance of this milestone.　　India is a key market for Renesas, offering significant growth potential and access to a highly skilled talent pool. Renesas is committed to deepening its partnerships with local companies, startups, and universities, with the target to generate over 10 percent of itsglobal revenue from the Indian market by 2030. Recent collaborations include the OSAT factory project with CG Power and Stars Microelectronics in Gujarat and the MOU with IIT Hyderabad. Renesas is also expanding its operations in India, with plans to increase its headcount to 1,000 by the end of 2025. This growth initiative reinforces Renesas' long-term commitment to India and supports its ambition to become an employer of choice in this dynamic and fast-evolving market.　　"The inauguration of our expanded offices marks a significant milestone for Renesas in India. It reflects our unwavering commitment to innovation, excellence, and the nurturing of local talent. By building products in India, for India and the world, we continue to drive growth and deliver meaningful impact across the Indian market,” said Malini Narayanamoorthi, India Country Manager and VP, MID Engineering, Analog & Connectivity Group at Renesas. "We are proud to sign two MOUs under the MeitY C2S programme, focused on advancing research, fostering innovation, and nurturing product-focused engineers. These strategic collaborations align with the Make in India initiative, aiming to strengthen local design and manufacturing capabilities and empower homegrown talent to drive the future of industry."　　MOUs under MeitY C2S programme　　Renesas and C-DAC signed two MOUs to collaborate in the field of VLSI and embedded semiconductor systems, with the aim of supporting local startups and academic institutions to accelerate innovation and foster self-reliance in India’s semiconductor and product ecosystem. The C2S programme encompasses collaboration with over 250 academic institutions and R&D organizations across the country, including IITs, NITs, IIITs, government and private colleges, along with approximately 15 startups, creating a strong ecosystem for indigenous innovation.　　MOU for Startups: Renesas will help strengthen the product engineering capabilities of local startups by providing Renesas development boards and Altium Designer, the leading PCB design software.　　MOU for Academic Institutions: Renesas will support experiential learning by offering development boards, PCB education and training, Altium Designer software, and access to the Altium 365 cloud platform, aiming to empower the next generation of electronics engineers and nurture a community of innovators.　　Opening of new offices in Bengaluru and Noida　　In May, Renesas consolidated and relocated its existing offices in Bengaluru and Noida into new, state-of-the-art office spaces, marking a significant milestone in the company’s growth and expansion in India.　　The new Bengaluru office is Renesas’ largest site in India, encompassing world-class design teams, test labs, and comprehensive facilities to support employees. It brings together approximately 500 team members, including R&D engineers, business teams, and employees from the recently acquired Altium and Part Analytics, creating a unified and collaborative workspace. The facility is designed to leverage India’s rich talent ecosystem to drive the development of innovative products.　　The new Noida office brings the engineering and business teams together to accelerate the delivery of world-class high-performance compute solutions, driving automotive market growth through innovation, collaboration, and consistent execution. This strategic expansion reinforces Renesas’ commitment to investing in top-tier local talent and strengthening its capabilities in R-Car system-on-chip (SoC) solutions. Designed to integrate cutting-edge tools and workflows, the new Noida site will further enhance synergy across the global engineering team and support Renesas’ long-term strategy in this critical domain.　　(Note) Chips to Startup (C2S) programme: An initiative launched by the Indian government in December 2021 to boost semiconductor and display manufacturing in the country. C2S not only aims at developing specialized manpower in VLSI/Embedded System Design domain but also addresses each entity of the electronics value chain via specialized manpower training, creation of reusable IP repository, design of application-oriented Systems/ASICs/FPGAs, and deployment by academia/ R&D organization by way of leveraging the expertise available at Startups/MSMEs. For more details, please visit the C2S programme website.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube and Instagram　　(Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
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Release time：2025-05-14 14:21 reading：357 Continue reading>>
<span style='color:red'>Renesas</span> Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware
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Renesas Unveils Complete Lithium-Ion Battery Management Platform with Pre-Validated Firmware

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced all-in-one solutions for managing lithium-ion battery packs in a wide range of battery-powered consumer products, such as e-bikes, vacuum cleaners, robotics and drones. With pre-validated firmware provided, the R-BMS F (Ready Battery Management System with Fixed Firmware) will significantly reduce the learning curve for developers, enabling rapid designs of safe, power-efficient battery management systems.　　Designed for lithium-ion batteries in both 2-4 and 3-10 cell series (S), R-BMS F solutions include Renesas’ industry-leading fuel gauge ICs (FGICs), an integrated microcontroller (MCU) and an analog battery front end, pre-programmed firmware, software, development tools and full documentation – all available in complete evaluation kits that are now ready to ship.　　Pre-programmed Firmware to Simplify Development　　Firmware is essential in battery management systems as it is used to monitor batteries’ state of charge (SoC), state of health (SoH), current, and temperature, as well as actively balancing the voltages of the individual cells, and detect faults. In some cases, however, consumer electronics developers may lack the highly specialized expertise needed to develop control algorithms that keep the batteries operating in a safe temperature region and ensure adequate battery life over many charge/discharge cycles.　　Renesas’ R-BMS F solutions include built-in, pre-tested firmware designed to work with the FGIC’s on-board MCU. The firmware includes critical pre-programmed functions to maximize battery life and ensure safe operation. These include cell balancing, current control, and voltage and temperature monitoring. For added flexibility, the battery management system lets developers set many parameters to meet specific requirements and adjust the solution for different cell chemistries via a graphical user interface (GUI), without the need for a full integrated development environment (IDE).　　“One of the biggest bottlenecks for designing advanced power management solutions is the complex task of firmware development and validation,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “Not everyone has the expertise or in-house resources to write their own algorithms. Our all-in-one R-BMS F battery management system eliminates this process and provides market-ready power solutions that work without requiring specialized technical knowledge of MCU programming or advanced battery management design.”　　All-Inclusive Evaluation Kits Ready to Ship　　Both R-BMS F solutions contain a full evaluation kit, which has all the hardware, software, tools and documentation required to start developing. The underlying hardware powering the R-BMS F is Renesas’ FGIC solution, which combines an analog battery front end and an ultra-low-power RL78 MCU into a single, small package. The analog portion provides accurate measurements of cell voltage, current and temperature, as well as controlling the external MOSFETs and converting analog data to digital signals. The digital section is where synchronous functions reside, including the main CPU, clocks, timers and serial interfaces. Also included in the evaluation kits are: pre-programmed firmware stored in embedded flash memory with the flexibility to set the battery pack and cell chemistry parameters; the USB System Management Bus (SMBus) interface; GUI-based software; cables to communicate with the host system; dedicated development tools for parameter setting; and full documentation, including schematics and an engineering bill of materials (eBOM). With these resources, developers can confidently innovate intelligent power management systems that safely monitor battery usage and provide longevity, while reducing their impact on the environment. Renesas plans to include turn-key R-BMS F solutions in all future FGICs.　　2-4 Cell Series Solution (RTK0EF0163DK0002BU)　　The R-BMS F for 2 to 4S cell (~8V to 16V) solutions targets small vacuum cleaners, robotic vacuums, consumer and medical devices and runs on Renesas’ RAJ240055 Li-ion battery FGIC. Renesas offers Smart Robot Vacuum Cleaner | Renesas by combining this FGIC with other devices from its portfolio.　　3-10 Cell Series Solution (RTK0EF0136DK0002BU)　　The R-BMS F for 3 to 10S cell (~12V to 40V) solutions runs on Renesas RAJ240100 and RAJ240090 Li-ion battery FGICs, with target applications including e-bikes, e-mobility, vacuum cleaners, robotics, drones and industrial, consumer and medical systems.　　Renesas has combined these FGICs with other devices from its portfolio to offer Wall to Battery Low Power Energy Storage System and USB-PD All in One Battery and Charging Solution. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　Both R-BMS F solutions are available today in production volumes.
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Release time：2025-05-08 13:23 reading：393 Continue reading>>
<span style='color:red'>Renesas</span> Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range
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Renesas Debuts New Group in Popular RA0 Series with Best-in-Class Power Consumption and Extended Temperature Range

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm® Cortex®-M23 processor. The new, cost-competitive devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.　　Renesas introduced the RA0 MCU series in 2024 and it has quickly become very popular with a wide range of customers due to its affordability and low power consumption. RA0E1 devices have already been adopted in consumer electronics, appliance and white goods, power tools, industrial monitoring and other applications.　　RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.　　Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.　　Feature Set Optimized for Low Cost　　The RA0E2 devices have a feature set optimized for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.　　In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.　　“The market reception for our RA0 Series has exceeded even our own high expectations,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “The RA0E2 Group MCUs deliver the same ultra-low power and price point that have been so popular with our customers. The addition of extended temperature range and more memory opens up even more applications and use cases. We plan to further expand the RA0 product lineup, delivering optimal solutions for 8-16 bit MCU users transitioning to 32-bit MCUs.”　　Key Features of the RA0E2 Group MCUs　　Core: 32MHz Arm Cortex-M23　　Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM　　Extended Temperature Range: Ta -40°C to 125°C　　Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC　　Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs　　Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage　　Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection　　Security: Unique ID, TRNG, AES libraries, Flash read protection　　Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP　　The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.　　Availability　　The RA0E2 Group MCUs are available now, along with the FSP software and the RA0E2 Fast Prototyping Board. Samples and kits can be ordered either on the Renesas website or through distributors. More information on the new MCUs is available at renesas.com/RA0E2.　　Renesas MCU Leadership　　The world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.
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Release time：2025-04-29 10:54 reading：436 Continue reading>>
<span style='color:red'>Renesas</span> Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
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Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.　　Optimized Design to Deliver Unparalleled Power Efficiency　　Building on Renesas’ leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.　　Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features　　The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.　　“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”　　Lower Bill-of-Materials Reduces Costs and Simplifies Development　　Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).　　A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.　　Key Features of the DA14533　　Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems　　64KB RAM and 12KB One-Time Programmable (OTP) memory　　2.4 GHz radio transceiver　　Integrated low IQ buck DC-DC converter　　External SPI flash　　Single XTAL operation (single crystal oscillator)　　Software stack qualified against Bluetooth Core 5.3　　AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)　　WFFCQFN 22-pin 3.5 x 3.5 mm package
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Release time：2025-04-08 14:06 reading：509 Continue reading>>
<span style='color:red'>Renesas</span> Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems
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Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.　　As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).　　Renesas’ Automotive Video Signal Processing Expertise　　Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.　　Key Features of the RAA278830　　Dual Open-LDI Input/Output　　ISO 26262 Functional Safety ASIL B rating　　CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path　　Video Diagnostic Capabilities　　Input/Output monitoring of video timing, signal integrity, and content　　Flickering, flashing, occlusion, and glare detection　　Spread Spectrum for lower system level EMI profile　　Image enhancement engine for superior image quality　　Dual host interface: I2C & SPI (configurable)　　SPI-Flash based OSD as well as an embedded font based OSD　　SPI boot capability (boot from SPI Flash, no MCU needed)　　Supports multi-bank for fail-safe OTA updates　　Space-efficient 72SCQFN, 10mm x 10mm　　AEC-Q100 Grade 2 qualified　　“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
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Release time：2025-04-01 14:36 reading：459 Continue reading>>
<span style='color:red'>Renesas</span> Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger
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Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller. The two new ICs combine to provide a premier Extended Power Range (EPR) USB Power Delivery (PD) solution.　　Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs, Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.　　The RAA489118 functions as either a battery charger supporting two to seven battery cells in series or as a voltage regulator supporting 30V input and 30V output. It employs Renesas’ patented R3™ (Robust Ripple Regulator) technology, which combines the best features of fixed-frequency and hysteretic Pulse-Width Modulation (PWM) technologies. R3 modulation technology delivers acoustic noise-free operation, fast dynamic response, and best-in-class light-load efficiency for longer battery life.　　The RAA489118 includes an SMBus (System Management Bus) interface that is widely employed in power tools, home appliances and light industrial products. The SMBus interface, combined with the buck-boost and bidirectional features, allows the RAA489118 to work seamlessly with the RAA489400 and other components in USB-C PD implementations. Its input and output voltage levels also match mainstream solar power voltage levels, making it an ideal fit for solar portable power station applications.　　The RAA489400 port controller supports USB-PD VBUS power up to 48V/5A. It features an integrated PHY, both Sink and Source Power Path Gate Drivers with external NFETs, short-circuit protection, VBUS discharge, a VCONN MUX and dead battery support.　　“Renesas has been a worldwide leader in battery charging for many years based on advanced technology, adaptability, and exceptional value,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “The RAA489118 and RAA489400 bring those strengths along with Renesas’ strong legacy of safety and reliability to new applications such as power tools and light industrial products. We expect to see strong demand from customers across multiple markets.”　　Key Features of the Renesas USB EPR PD Solution　　Battery charger supporting two to seven battery cells in series　　Buck-boost voltage regulator supporting 30V input and 30V output　　Renesas R3™ technology ensures minimal power loss and improved efficiency　　Advanced control scheme delivers fast transient response and system performance　　Robust thermal management and protection features for safety and reliability　　Adaptable configurations support a wide range of applications　　Built-in protection against overcharging, overheating, and voltage anomalies　　Bidirectional power flow　　USB-IF certified reference design reduces compliance testing time and effort　　Comprehensive design support and tools　　Winning Combinations　　Along with other USB-PD controllers, battery management ICs, and Type-C port management products, Renesas offers a turnkey USB-PD Charger Winning Combination that minimizes the effort required for customers to integrate USB-PD and battery management system features into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Device Availability　　The RAA489118 comes in a 4×4 mm 32-lead TQFN package, and the RAA489400 is packaged in a 32-Ld 3x5 mm FCQFN. Both products are available today from Renesas. Comprehensive design support and tools, including VIDWriter configuration tools and battery charger GUI software to configure designs, are also available.　　Renesas Power Management Leadership　　A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　(Remarks). USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
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Release time：2024-12-10 14:06 reading：1130 Continue reading>>
<span style='color:red'>Renesas</span> Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
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Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).　　The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.　　Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.　　“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”　　Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.　　Availability　　Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
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Release time：2024-12-03 14:43 reading：786 Continue reading>>
<span style='color:red'>Renesas</span> Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
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Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RZ/T2H, the highest performance microprocessor (MPU) offered by Renesas for industrial equipment. Thanks to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision control of industrial robot motors for up to 9 axes. It supports a variety of network communications including Industrial Ethernet on a single chip. The MPU targets industrial controller equipment such as programmable logic controllers (PLCs), motion controllers, distributed control systems (DCSs), and computerized numerical controls (CNCs).　　With the growing demand for unmanned and labor-saving manufacturing, industrial robots such as vertically articulated robots, and industrial controller equipment are being deployed to accelerate automated production. The Renesas RZ/T2H MPU combines all the functionality and performance required for developing these applications. While industrial systems traditionally required multiple MPUs or a combination of field programmable gate arrays (FPGAs) to control these applications, the RZ/T2H MPU can now meet all the requirements on a single chip. This reduces the number of components and saves time and costs of FPGA program development.　　“We have enjoyed outstanding market success with RZ/T2M and RZ/T2L,” said Daryl Khoo, Vice President of Embedded Processing 1st Business Division at Renesas. “The RZ/T2H builds on that momentum, allowing our industrial customers to leverage their existing design assets while addressing even more innovative, demanding industrial motor control and Linux applications. Our customers have been particularly impressed that the RZ/T2H enables them to implement a 9-axis motor control all on just one chip!”　　High-Performance Application Processing and Fast Real-Time Control on a Single Chip　　The RZ/T2H is equipped with four Arm® Cortex®-A55 application CPUs with a maximum operating frequency of 1.2 GHz. For external memory, it supports 32-bit LPDDR4-3200 SDRAM. Two Cortex-R52 CPUs with a maximum operating frequency of 1 GHz handle the real-time processing, with each core equipped with a total of 576 KB of high-capacity tightly coupled memory (TCM). This allows high CPU- and memory-intensive tasks such as running Linux applications, robot trajectory generation, and PLC sequence processing, to be executed on a single chip. At the same time, the RZ/T2H can handle fast and precise real-time control such as motor control and Industrial Ethernet protocol processing.　　Motor control of up to 9 axes reduces component costs and development time　　The Renesas RZ/T2H controls up to 9-axis servo motors in industrial robots with high-speed and accurate operation. The RZ/T2H comes with everything required for up to 9 axes of motor control including 3-phase PWM timers, delta-sigma interfaces for measuring current values, and encoder interfaces (A-format™, EnDat, BiSS®, Hyperface DSL, and FA-CODER are all supported). Furthermore, peripheral functions for motor control are placed on a Low Latency Peripheral Port (LLPP) bus of the Cortex-R52 real-time CPU core, allowing high-speed access from the CPU.　　Flexible support for network communications including Industrial Ethernet　　The RZ/T2H has four Ethernet ports, three Gigabit Ethernet MAC (GMAC), plus an Ethernet switch. It also supports EtherCAT, PROFINET, EtherNet/IP, OPC UA, and the next-generation Time-Sensitive Networking (TSN) standard. The combination of these Ethernet switches and GMAC allows the MPU to support multiple Industrial Ethernet controllers and devices, providing flexibility to adapt to a wide range of controller requirements, such as upper-layer Ethernet communications.　　Specialized boards and software available for industrial robots and controllers　　The RZ/T2H comes with the Renesas Flexible Software Package (FSP), as with all Renesas MPUs, together with a Linux package that comes with long term support. An out-of-the-box multi-axis motor control evaluation solution is available including inverter boards for driving 9-axis motors, a multi-axis motor control software package, and Motion Utility Tool (a motor control software tool). Sample protocols for industrial Ethernet and software PLC package are also included to kick-start system development.　　“As industrial equipment continues to evolve, these systems increasingly require more complex functions and performance,” said Micael Borgefeldt, Product Manager at IAR Systems. “Including the latest RZ/T2H MPU from Renesas, we empower the developers to unlock flexible application configurations across 32-bit MCUs and 64-bit high-end MPUs multi-core environments. Our IAR development solution enables engineers to accelerate next-generation industrial innovation, streamlining development and boosting efficiency like never before.”　　Winning Combinations　　Renesas also offers “9-axis Industrial Motor Control with Ethernet” solution that combined the RZ/T2H with numerous compatible devices such as the RV1S9231A IGBT Drive Photocoupler and RV1S9353A Optically Isolated Delta-Sigma Modulator to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio: renesas.com/win.　　Availability　　The RZ/T2H is available today. Renesas plans to release the new RZ/N2H device in Q1/2025, which offers the same performance as the RZ/T2H in a smaller package. This is ideal for industrial controller equipment such as PLCs and motion controllers.　　The RZ/T2H is managed under the Product Longevity Program (PLP) for industrial equipment that requires long life cycles. For more information on the RZ/T2H, visit: https://www.renesas.com/rzt2h.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Arm and Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. All names of products and services mentioned in this release are trademarks or registered trademarks of their respective owners.
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Release time：2024-12-02 14:31 reading：1190 Continue reading>>

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