Nexperia <span style='color:red'>China</span> Says MOSFET, Logic IC Supply Chains Complete as Independent Operations Largely in Place
  After last year’s control dispute between Wingtech and Nexperia’s Netherlands headquarters sent shockwaves through the industry, Nexperia China now says it has made significant progress in building independent operations. According to EE Times China, Wingtech Chairwoman Ruby Yang announced on May 29 that Nexperia China has largely completed the setup of its independent operating system.  Yang revealed that Nexperia China’s core management, R&D, and market teams are now fully based in China. The report notes that the company’s capacity and delivery capabilities have steadily recovered, while it continues to build a “China for China, China for Global” full-stack supply chain across wafer manufacturing, packaging and testing, and quality control.  The announcement comes as Wingtech faces mounting pressure. According to ESM China, the company said on April 29 that its auditor issued a “disclaimer of opinion” on its 2025 financial report, triggering a delisting risk warning under relevant rules.  Full-Stack Supply Chains Advance Across Key Product Lines  In terms of product layout, Nexperia China currently covers three core business lines: MOSFETs, logic ICs, and bipolar transistors, including protection devices. Yang said none of the three previously had a fully domestic, full-stack supply chain. However, according to the report, MOSFET and logic IC products have now established such supply chains.  The bipolar transistor line is being upgraded to a 12-inch platform and is expected to complete its full-stack domestic supply chain within 2026. Bipolar transistors entered small-batch mass production in March 2026, with capacity for protection devices such as ESD (Electrostatic Discharge) and TVS (Transient Voltage Suppressor) products expected to gradually come online in the second half of 2026, the report notes.  Under the plan, 19 products are expected to be ready for supply by next month, covering more than 80% of demand, the report adds. Despite the severe supply-chain fallout from last year’s Wingtech-Nexperia control dispute, the report indicates that Nexperia China has maintained large-scale delivery capabilities. Since mid-October 2025, it has shipped more than 11 billion chips to over 800 customers.  Wingtech Seeks Court Action in Nexperia Control Dispute  Meanwhile, the battle for control of Nexperia has escalated further. According to South China Morning Post, Wingtech said last week that it had filed a lawsuit in a court in China’s southern Guangdong province against Nexperia and three of its executives. The suit demands the restoration of full corporate control and 8 billion yuan, or US$1.18 billion, in compensation.  As Bloomberg notes, Wingtech asked the court to order the defendants to stop carrying out or supporting the disputed measures, including by withdrawing legal proceedings in the Netherlands and revoking a Dutch ministerial order issued last September under the Goods Availability Act. If the defendants fail to comply, Wingtech would seek the transfer of Nexperia and related subsidiaries to the company free of charge.
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Release time:2026-06-02 10:25 reading:613 Continue reading>>
SMIC Founder Says <span style='color:red'>China</span> May Gain Edge in Niche Chips as 80% of Demand Lies Outside Advanced Nodes
  As China pushes to strengthen its chip industry, Richard Chang, founder of SMIC, China’s largest foundry, suggests that success in semiconductors is not solely about winning the 2nm or 3nm race, with niche markets potentially emerging as a key competitive advantage for China. According to STAR Market Daily, Chang said that niche markets have become a key breakthrough point for China’s semiconductor industry, adding that advancing in specialized market segments could help strengthen the country’s overall chip capabilities.  SMIC remains limited to the 7nm node due to its reliance on older DUV lithography equipment. However, Richard Chang’s emphasis on niche markets suggests that the company’s mature-node technologies could still find meaningful opportunities across a range of applications, as noted by Wccftech.  SMIC Founder Highlights Opportunity Beyond Advanced Nodes  As noted by STAR Market Daily, Richard Chang argued that semiconductor success should not be defined solely by achieving 3nm or 2nm nodes, describing such thinking as a misconception and highlighting niche markets as a key opportunity for China’s chip industry.  Chang further noted that advanced nodes account for less than 20% of the global semiconductor market by product volume, while more than 80% of demand comes from mature-node and specialty-process segments. According to Chang, many niche markets still dominated by overseas players could represent key breakthrough opportunities for Chinese semiconductor companies.  The trend may already be emerging across parts of the supply chain. According to TrendForce, with Taiwanese foundries shifting capacity and raising prices, customers in HV processes and CIS applications are increasingly turning to Chinese foundries for more stable pricing and capacity availability. This order migration has been evident since the second half of 2025, driving strong demand for 90 nm-and-above 12-inch wafers among Chinese players.  Beyond Large Models: Richard Chang Highlights Edge AI Potential  In addition, Richard Chang argued that edge AI and scenario-driven applications remain underappreciated opportunities within the broader AI landscape. As STAR Market Daily notes, Chang said sectors such as industrial control, automotive electronics, and wearable devices could create strong demand for application-specific semiconductor solutions, offering startups room to pursue differentiated strategies outside direct competition with global AI giants.
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Release time:2026-05-12 10:24 reading:659 Continue reading>>
BIWIN Mini SSD Wins “Memory of the Year” of 2026 <span style='color:red'>China</span> IC Design Awards
  Recently, the 2026 International IC & Component Exhibition and Conference (shortened as IIC), hosted by Aspencore, successfully concluded in Shanghai. At the concurrent 2026 China IC Design Awards Ceremony, BIWIN Mini SSD was honored with the “Memory of the Year” award. This recognition not only affirms the product’s technological innovation and commercial value, but also highlights BIWIN’s continued leadership and long-term commitment to advancing the memory industry.  01 Redefining SSD Form Factor and Architecture  “China IC Design Awards”, as one of the most authoritative and creditable industry awards, acknowledges enterprises and products that stands out in technological innovation, market application, and industry contribution. Among these, “Memory of the Year” Award, as one of the core evaluative unit, cites memory products that features innovative design, scaled production, and technical improvements.  Rather than merely a physically-miniaturized SSD, BIWIN Mini SSD breaks the traditional trade-off between performance, size, and scalability. Through innovating solutions and advanced packaging, Mini SSD offers a brand-new memory solution combined with compact form factor, strong performance and excellent scalability for AI PC and on-device AI scenarios. It effectively addresses key limitations of existing solutions, such as the oversized form factor of M.2 SSD, performance bottlenecks of MicroSD cards, and limited scalability of UFS/eMMC.  Ultra-compact, flagship performance  Delivers up to 2TB capacity, 3700MB/s read, and 3400MB/s write speeds in just 40% the size of an M.2 2230 SSD and about 1g weight.  Rugged and reliable  Engineered with IP68-rated dust and water resistance, 3-meter drop protection, and 12,000+ insertion cycles for demanding mobile environments.  Tool-free expandability  Features an industry-first standardized slot-based design, enabling seamless TB-level storage upgrades without tools.  Since its debut, BIWIN Mini SSD has received widespread global recognition, including Best Inventions of 2025 by TIME, CES 2026 TWICE Picks Award, Embedded World Best-in-Show, and MWC 2026 Best-in-Show. It has also been shortlisted for the 2026 Edison Awards, often referred to as the “Oscars of innovation.” This latest recognition further validates Mini SSD’s leadership across both technology innovation and commercial potential.  02 Accelerating Ecosystem and Standardization  BIWIN Mini SSD is more than a product—it is the foundation of an open ecosystem. It has already been adopted by leading brands such as One-Netbook, GPD, and Waterworld, enabling commercialization in AI PCs and handheld gaming devices. To accelerate adoption, BIWIN is collaborating with ecosystem leaders including Intel, Longcheer, BYD Electronics and Luxshare Precision.  Promoting Standardization to Reduce Compatibility Costs  Establishing IP enterprises, incentive mechanisms and royalty-sharing frameworks to to align ecosystem interests; opening up technical specifications and interface standards to lower integration barriers and reduce industry-wide adaptation costs.  Accelerating Adoption Across AI Devices  Focusing on key scenarios such as AI PC, intelligent robots, and gaming consoles, with multiple partners actively working on integration; collaborating with partners to speed up technical validation, introduction and industry-wide application.  Advancing the Technology Roadmap  Deploying forward-looking products such as PCIe Gen4 ×4 and Gen5 ×4 solutions to enhance bandwidth performance; advancing R&D on 4TB or larger-capacity products based on 32-die stacking packaging process.  03 Full-Stack Capabilities Power “Device–Edge–Cloud”  The success of BIWIN Mini SSD is rooted in BIWIN’s full-stack capabilities based on “Integrated Solutions and Manufacturing” strategy. With continuous investments in R&D to reinforce the innovation foundation, BIWIN has spent RMB 632 million in 2025, representing a 41.34% year-on-year growth. To date, BIWIN has accumulated 521 patents worldwide along with 66 software copyrights.  Backed by deep expertise across solution development, IC design, and advanced packaging technologies, BIWIN has built a comprehensive portfolio covering edge AI devices, smart terminals, industrial and automotive-grade applications, as well as enterprise storage. This end-to-end capability enables the company to effectively serve customers across the device–edge–cloud spectrum, translating technology into real-world competitiveness.  In emerging on-device AI, BIWIN’s ePoP solutions combine ultra-thin stacking with power-efficient firmware, supporting leading companies such as Google, Meta, Xiaomi, and Rokid. These solutions are optimized for wearables like smart glasses and smartwatches, where size, latency, and power efficiency are critical. In automotive, BIWIN has been adopted by 20+ OEMs and Tier 1 suppliers, with products already in mass production. In the cloud segment, its enterprise SSDs are shipping at scale to leading OEMs, AI server vendors, and major internet companies.  The “Memory of the Year” award at the 2026 China IC Design Awards underscores the technical strength and commercial momentum of BIWIN Mini SSD. BIWIN will continue to focus on innovation to meet the growing demands of the AI era and drive long-term growth.
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Release time:2026-04-24 10:27 reading:800 Continue reading>>
PRI Certification, the #2 Certification Body in <span style='color:red'>China</span>, Launches IATF 16949 Services to Support Growing Automotive Industry
  PRI Certification Expands by Adding IATF 16949 Certification Services in China and Enhances Position as One of the Top Two Chinese CBs with 18% Market Share  PRI Certification proudly announces the official launch of IATF 16949 certification services in China. The expansion through PRI China’s Beijing office allows the organization to offer IATF 16949 services directly to the Chinese marketplace. In addition to this stronger presence in China, PRI Certification also holds the #2 market share in the United States. This dual-market leadership underscores PRI’s global credibility and trusted reputation across two of the world’s most significant manufacturing regions.  This strategic move solidifies PRI Certification’s commitment to delivering high-quality, industry-specific certification solutions throughout Asia. While the Beijing office will serve as the local hub for client engagement and auditing, all technical and certification decisions will continue to be supported through PRI’s team in Warrendale, Pennsylvania, USA—ensuring global consistency, technical rigor, and impartial oversight.  Over a Decade of Experience in Asia  PRI Certification has been delivering IATF 16949 certification in Japan for over 10 years, earning a strong reputation for excellence and reliability in the region. Expanding into China is a natural progression that aligns with growing demand in the Asian automotive market.  Expert Auditors with Deep Automotive Knowledge  PRI’s auditors bring unmatched technical expertise and practical insight to each audit. This ensures clients receive not just compliance evaluations but also process improvements that contribute to lasting business value.  Tailored Audits Across 30+ Industries  PRI Certification has successfully delivered certification services across more than 30 industries worldwide. The organization’s approach to auditing is tailored to the specific needs of the automotive sector, making PRI a trusted partner for companies pursuing or maintaining IATF 16949 Certification.  Continuing a Legacy of Quality in China  PRI has been providing certification services in China since 2010, helping organizations achieve international quality benchmarks across a wide range of sectors. The introduction of IATF 16949 services marks a significant milestone, strengthening PRI’s ongoing commitment to the region’s automotive manufacturing excellence.
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Release time:2025-08-05 14:46 reading:1123 Continue reading>>
Jiangsu Runic Technology Co., Ltd Honored with <span style='color:red'>China</span> IC Design Achievement Award & Selected in <span style='color:red'>China</span> Fabless100 List
  On March 29th, the award ceremony of "2024 China IC Design Achievement Award" organized by ASPENCORE was held in Zhangjiang Science Hall, Shanghai. Jiangsu Runic RS50XX series of low noise, high accuracy and ultra-low temperature-drift precision voltage references were awarded the Best Amplifier/Data Converter/Isolator of the Year in China IC Design Achievement Award.  Jiangsu Runic Technology Co., Ltd has been listed as one of the "Top 10 Analog Signal Chain Companies" for two consecutive years.  Jiangsu Runic Technology Co., Ltd as China's high-performance, high-quality analog/mixed-signal IC R&D and sales of high-tech semiconductor design company has been selected for two consecutive years in the China Fabless100 list of Top 10 analog signal chain companies, fully demonstrates Runic in the analog signal chain market area of technical strength and competitive advantage, and has been widely recognized by the industry.  The China IC Design Fabless 100 list is based on quantitative mathematical models, corporate public information, vendor questionnaires, and first-hand interviews by a team of AspenCore analysts, who carefully select the companies with the strongest overall strength and growth potential in China's IC design industry; the Top 10 companies are selected according to the category (each company is categorized into one category only); and the criteria for selecting the Top 10 companies in each category are as follows The selection criteria for each category of Top 10 companies are as follows:  Companies headquartered in mainland China and Hong Kong/Macau, but excluding Taiwan enterprises  Fabless companies only, IDM companies with fabs are excluded from screening  Self-developed and designed chip products have been mass-produced and have been put into commercial use or entered the supply chain of mainstream OEMs.  Owns a number of patents for Invention Technology, and has strong chip R&D and application design capabilities
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Release time:2024-04-10 13:24 reading:1217 Continue reading>>
<span style='color:red'>China</span>'s SiC capacity is expected to account for 50% of the world's share in 2024
  As reported by Taiwanese media, there’s a gradual uptick in TSMC’s capacity utilization lately, accompanied by a noticeable surge in orders from TSMC’s clients. Some segments of the market are showing signs of rekindled demand, hinting at a possible upswing in the semiconductor industry. Nevertheless, certain semiconductor manufacturing firms remain cautious in their industry outlook.  TSMC’s Capacity Utilization Rate on the Rise  Media’s report indicates that TSMC’s capacity utilization rate has gradually recovered. The 7/6nm utilization, which had dropped to 40% at one point, is now around 60% and could potentially reach 70% by the end of the year. Similarly, the 5/4nm utilization is at 75-80%, and the 3nm capacity, which increases seasonally, is approximately 80%.  Concurrently, TSMC is experiencing a significant uptick in orders from their clients, including tech giants like Apple, MediaTek, NVIDIA, AMD, Intel, Broadcom, Marvell, and STMicroelectronics. Furthermore, AI chip clients such as AMD’s subsidiary Xilinx, Amazon, Cisco, Google, Microsoft, and Tesla have all accepted TSMC’s plan for a price increase in 2024.  Taking Tesla as an example, they are building a supercomputer facility in Austin to accelerate the development of their autonomous driving system, expanding the computing power of Dojo. The core D1 of Dojo is produced using TSMC’s 7nm process and advanced packaging technology. Based on this, Tesla is deepening its collaboration with TSMC, and it’s expected that their order volume will increase from around 5,000 pieces this year to 10,000 pieces next year.  Amid the ongoing AI surge, NVIDIA is actively seeking additional production capacity. On October 19th, NVIDIA’s CEO, Jensen Huang, revealed in an interview that the global demand for AI chips remains robust. He has met with TSMC’s CEO, C.C. Wei, to discuss providing more capacity to serve customers. NVIDIA is in the planning stages for the next generation of chips designed for AI-based infrastructure and has also engaged in discussions with partners such as Quanta and ASUS to strategize collaboration.  Is the Semiconductor Industry on the Rebound?  During TSMC’s Q3 earnings call, C.C. Wei pointed out that, in addition to strong AI demand, there’s a rebound in demand for smartphones and personal computers. As for automotive electronics, benefiting from the continued growth of electric vehicles, the demand for next year is expected to be quite robust. Regarding when the semiconductor industry might hit bottom, Wei remarked that there are some early signs appearing in the PC and mobile phone sectors. However, it remains challenging to predict a strong resurgence as customers are still cautiously managing their inventories.  In response to industry concerns about smartphone growth, TSMC’s CFO, Wendell Huang, noted that smartphone growth is anticipated to remain lower than the company’s future growth rate. High-Performance Computing (HPC) is expected to be the most robust growth segment, making substantial contributions to growth in the coming years.  On the other hand, other semiconductor foundry companies, such as PSMC, have also shared their perspectives on the fourth quarter and future industry developments. Recently, PSMC’s President, Brian Shieh, pointed out that the supply chain’s inventory seems to have reached a reasonable level, with growing demand for mobile panel driver ICs, surveillance system CIS chips, and visibility extending beyond one quarter. Prices for special memory products have started to show an upward trend. Demand for Power Management ICs (PMIC) also displays signs of recovery, even though the trend isn’t as pronounced as that of driver ICs and CIS chips.  Regarding UMC, the company is scheduled to hold an earning call on 25th October. In their previous earnings call for the last quarter, UMC mentioned that due to ongoing adjustments in the supply chain’s inventory, the outlook for wafer demand remains uncertain. Although the industry glimpsed a modest recovery in the second quarter, the overall sentiment in the end-market remains subdued, and customers continue to maintain stringent inventory management practices.
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Release time:2023-10-25 11:35 reading:2175 Continue reading>>
Top 10 Processors CPU and GPU Chip Companies in <span style='color:red'>China</span>
  China is home to some of the leading processor chip manufacturers in the world. These companies are responsible for producing some of the most advanced and innovative CPU, GPU, FPGA, and ASIC chips available on the market. In this article, we will be discussing the top 10 processor chip companies in China. Let’s get started!  1、Unigroup Guoxin Microelectronics Co., Ltd.  Unigroup Guoxin Microelectronics Co., Ltd. focuses on the design and development of integrated circuits chips. It is a leading provider of integrated circuit chip products and solutions. Its products and applications are all over the world. Its core business areas such as chips, safe independent FPGA, power semiconductor devices, and ultra-stable crystal frequency devices have formed a leading competitive situation and market position.  2、Hygon information Technology Co., Ltd.  Hygon information Technology Co., Ltd. was established in 2014. It is mainly engaged in the research and development of computing chip products and systems such as high-end processors and accelerators. It aims to become a world-class chip company and provide core computing engines for Digital China.  3、Amlogic(Shanghai) Co., Ltd.  Amlogic is a world leading fabless semiconductor company that specializes in the design, development and application of high-performance, multimedia system-on-chip (SoC). As a result of its cutting-edge technologies and best-in-class solutions, it has actively expanded into new areas including smart vision, wireless connectivity and automotive electronics, ushering in a new era of smart life.  By providing complete turnkey solutions in combination with industry-leading software and hardware technologies, including UHD multimedia processing, content security protection, advanced CPU and GPU, customers can rapidly optimize and develop market-leading products with state-of-the-art performance and power consumption.  4、Hunan Goke Microelectronics Co., Ltd.  Established in 2008, Goke Microelectronics Co., Ltd. has its headquarters in Changsha and subsidiary offices in Chengdu, Shanghai, Shenzhen, Beijing and Changzhou.GOKE spends more than 20% of its annual revenue on research and development.  GOKE is committed to developing mass-volume integrated circuit solutions for storage,smart set-top boxes and IOT. It has introduced a series of products with in-house IP. These include ASICs and SOCs that incorporate the NDS advanced security decoder, the H.265 high-definition codec, high-performance acoustic processor, enterprise solid-state drive controller.  5、Shanghai Fullhan Microelectronics Co., Ltd.  Fullhan Microelectronics was established in April 2004 and focus on video semiconductor design.The mission of Fullhan is providing the most competitive chips and solutions for video products.  Fullhan provides H.264 codec SoC,image signal processor IC and various solutions of video products.  Fullhan works closely with solution providers and equipment manufacturers from domestic and worldwide to provide high performance, cost-effective products and services, increase market shares and achieve substantial business success.  6、Shanghai Anlogic Infotech Co., Ltd.  Shanghai Anlogic Infotech Co., Ltd. founded in November 2011, is a leading integrated circuit design company in China.  The company has the independent research and development capabilities of FPGA chip hardware and FPGA compilation software, focusing on the development of general programmable logic chip technology and system solutions. The SALPHOENIX® high-performance product series, SALEAGLE® high-efficiency product series, SALELF® low-power product series and SALSWIFT® system chip series FPSoC® produced by the company have been successfully used in industrial control, consumer electronics, medical equipment, and networks with excellent quality. communications and other fields.  7、Rockchip Electronic Co., Ltd.  Rockchip Electronics Co., Ltd., established in 2001, is headquartered in Fuzhou, with branches and subsidiaries in Shenzhen, Shanghai, Beijing, Hangzhou, and Hong Kong. Rockchip is a leading fabless IC design company that focuses on Intelligent IoT.  Rockchip specializes in SoC design, analog circuit chip design, and algorithm research. It has extensive experience in processor and analog-digital mixed chip design, multimedia processing, image algorithm. Rockchip has expertise in system software development. In addition to processor chips, it also provides full solutions including PMICs, analog-digital mixed chips, optoelectronic products, and development boards.  8、Allwinner Technology Co., Ltd.  Allwinner Technology, founded in 2007, is an outstanding designer dedicated to intelligent application SoC, high performance analog component and wireless connectivity IC. It is headquartered in Zhuhai China, with other R&D centers and offices in Shenzhen, Xi’an,Shanghai,Chengdu,Hengqin,Guangzhou,Beijing and HongKong,.  Motivated by customer-oriented strategy, Allwinner aligns remarkable R&D teams with long-term core-technology investment in UHD video processing, high-performance multi-core CPU/GPU integration with AI and advanced manufacturing process in terms of high integration , ultra-low power consumption and full-stack integration platform, providing competitive turnkey solutions with considerate services. The products powered by Allwinner spread across from industry control, smart home, smart hardware, tablet, automotive electronics, robot, virtual reality, OTT box, wireless communication to analog products.  9、Changsha Jingjia Microelectronics Co., Ltd.  Changsha Jingjia Microelectronics Co., Ltd. was established in April 2006. It is committed to technology and comprehensive applications in the field of information detection, processing and transmission, and provides customers with highly reliable and high-quality solutions, products and supporting services.  The company’s products cover integrated circuit design, graphics and image processing, computing and storage products, small radar systems, wireless communication systems, electromagnetic spectrum application systems, etc., and are widely used in professional fields such as aviation, aerospace, navigation, and vehicles that require high reliability.  10、Loongson Technology Corparation  In response to the demands for information development, Loongson Technology always stays abreast of international IT trends and focuses on industry development and system construction based on independent innovation. Until now, it has mastered core computing technologies on CPU instruction set architecture (ISA) design (LoongArch®), processor IP core, and operating system.  On this basis, Loongson Technology strives to create an independent and open software and hardware ecosystem and information industry system so as to provide self-developed, safe, and reliable processors to meet national strategic needs as well as high-performance, low-cost processors and basic software and hardware solutions to boost the innovative development of the information industry.
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Release time:2023-10-19 14:23 reading:2585 Continue reading>>
Qualcomm Initiates Major Layoffs in <span style='color:red'>China</span>, Shanghai R&D Center Closure Rumored
  According to TechNews, the ongoing soft demand for smartphones, combined with Huawei’s launch of the Mate 60 Pro, has severely impacted Qualcomm. Reports within the Chinese industry suggest that Qualcomm is planning significant layoffs in China, with severance costs estimated to be as high as N+7.  Based on discussions in Chinese forums and media reports, Qualcomm’s Shanghai R&D center is set to undergo substantial layoffs. This center primarily focuses on wireless-related businesses. The severance standards for permanent employees are at least N+4, which means the employee’s tenure plus an additional 4 months are considered for severance pay. As for contract employees, the severance compensation is set at N+7.  In fact, Qualcomm announced its downsizing plan in August, with reports suggesting that Qualcomm Taiwan plans to lay off about 200 employees in October. Ths will affect personnel in product engineering, testing, and verification fields, comprising 11.8% of the total workforce. The company is also implementing cost-saving measures such as eliminating annual salary adjustments and reducing bonuses to 70%.  This downsizing rumor has also extended to China, with reports at the time suggesting that Qualcomm China might lay off up to 40% of its workforce. The main reasons cited were sluggish demand for smartphones and Huawei’s new Kirin processor.  Analyst Ming-Chi Kuo of TF International Securities stated that Huawei is expected to fully adopt its own designed Kirin processors in its upcoming phones next year. Qualcomm will be the major loser in this scenario, losing Huawei’s orders entirely.  According to Kuo’s data, Huawei purchased 23 to 25 million smartphone SoCs (System on a Chip) from Qualcomm in 2022, but this number increased to 40 to 42 million in 2023. However, starting in 2024, Huawei will use its own chip designs, causing Qualcomm to not only lose orders but also face the risk of declining shipments from other Chinese brand customers due to Huawei’s increased market share.  Kuo also expects that, influenced by Huawei’s actions, Qualcomm’s SoC shipments to Chinese smartphone brands will decrease by 50 to 60 million units next year and continue to decline in the following years.  With a significant potential decline in performance in the Chinese market and increasing price competition towards the end of the year, Qualcomm is expected to carry out more layoffs. As of September last year, Qualcomm had approximately 51,000 employees worldwide. The company’s restructuring costs in the last quarter amounted to $285 million, with most of it being severance pay. In June of this year, the U.S. headquarters also reduced around 415 positions.
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Release time:2023-09-21 16:48 reading:4413 Continue reading>>
BYD’s Acquisition of Jabil’s <span style='color:red'>China</span> Factory: Expanding Beyond iPhone Casings into EMS Orders
  Last month, the primary iPhone casing supplier, American company Jabil, announced that it had reached a preliminary agreement with China’s prominent EMS (Electronic Manufacturing Services) firm, BYD, to sell its Mobile Business Unit for $2.2 billion. The completion of the subsequent transaction will depend on due diligence findings and final agreement terms.  AMEYA360 analysis reveals that as Jabil’s main focus in its Mobile Business Unit is iPhone casing manufacturing, the successful conclusion of this deal would leave iPhone casing supply primarily in the hands of Chinese and Taiwanese manufacturers, potentially bolstering China’s position in the supply chain.  Furthermore, BYD’s acquisition of Jabil’s China Metal Business not only marks its formal entry into the iPhone supply chain, expanding its presence, but also signals its aspirations to become a supplier in the iPhone assembly business.  Jabil’s main production facilities for its Mobile Business Unit are located in Wuxi and Chengdu, China. Wuxi primarily handles iPhone aluminum frame manufacturing, while Chengdu focuses on stainless steel components. This year, the iPhone 15 Pro features a titanium alloy frame for the first time, and Jabil is a key supplier for this component.  In terms of operational performance, Jabil’s Wuxi facility, due to its smaller scale compared to Foxconn and Lens Tech, and lower product prices, has underperformed expectations. Conversely, Chengdu, responsible for high-end metal components, has superior technical capabilities and better performance.  Considering Jabil Group’s global footprint and the configuration of its key customer supply chains, the company had been seeking a buyer for some time. Initially, Luxshare was a contender in the acquisition, but a consensus on the purchase price was not reached, leading BYD to secure the deal at a higher price.  AMEYA360 believes that BYD’s acquisition presents an opportunity to replicate Lens Tech’s experience in acquiring the Catcher’s Taizhou factory in 2020, becoming a direct supplier of iPhone casings. Given Jabil’s involvement in both high-end and low-end iPhone casing businesses, BYD might even be in a position to directly compete with Foxconn for high-end orders. This move would make it difficult for Lens Tech, which still lacks a high-end product line and advanced manufacturing processes, to join the ranks of high-end product suppliers.  In the long term,AMEYA360 believes that BYD, which is already an iPad EMS supplier, aims to leverage its position in critical components to venture into iPhone EMS business in the future, expanding its EMS business footprint.
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Release time:2023-09-15 11:19 reading:4223 Continue reading>>
Top 10 Automotive relay manufacturers in <span style='color:red'>China</span>
  Different from traditional vehicles, new energy vehicles need to be equipped with high-voltage DC relays, which, as rigid components in new energy vehicles, play a vital role in protecting the safety of automotive circuits. In recent years, under the catalysis of the new energy vehicle market and the encouragement of relevant policies, high-voltage DC relay technology has developed rapidly and has achieved large-scale application in new energy vehicles.  In this article, we recommend the top 10 automotive relay manufacturers in China for you to select.  一、Xiamen Hongfa Electroacoustic  Company profile  Hongfa Co., Ltd. (stock code: SH600885) was established in 1984. For more than 30 years, it has established a complete relay industry system with complete categories and supporting facilities. At present, Hongfa has more than 40 subsidiaries, and established three R&D and production bases in Xiamen, Zhangzhou, East and West.  Main business and products  Hongfa has been deeply involved in the automotive relay industry for nearly 30 years and has maintained stable cooperative relations with world-renowned OEMs and Tier1 suppliers. The automotive relays, 48V relays, charging modules, BCMs, gateways, high-voltage DC relays, high-voltage boxes, oxygen sensors and relays for general modules are provided by Hongfa.  二、Sanyou Corporation  Company profile  Founded in 2008 and located in Dongguan, Guangdong, Sanyou Corporation Limited is a professional high-tech enterprise integrating R&D, manufacturing and sales of relay, and one of Top 100 Electronic Component Enterprises in China.  Main business and products  Sanyou products include more than 100 series and tens of thousands of product specifications, covering five categories of general power relays, magnetic latching relays, automotive relays, new energy relays, and transformers. Products are widely used in household appliances, smart meters, industrial control, smart home, automobile manufacture, new energy applications, electric power, electromechanical leakage protection, distribution transformer monitoring, and other fields.  三、Doublecircle Electronics Group  Company profile  Bengbu Doublecircle Electronics Group Co., Ltd. was established in 1990 and reformed into a joint stock limited company in 2015. The main well-known customers of the company at home and abroad include CASIC, CASC, AVIC, CRRC , ZTE, Xiaomi, NVC lighting, ABB, Wells, Rockwell, GE, Siemens, etc. It is a national high-tech enterprise and an innovative enterprise in Anhui Province.  Main business and products  Doublecircle Electronics Group specializes in the R & D, production and sales of various electronic components such as resistors, inductors and high-voltage contactors. Its products are widely used in aviation, aerospace, shipping, communications, automatic control, instrumentation, rail transit, charging piles, new energy vehicles, LED lighting and other fields.  四、HKE  Company profile  HKE was founded in 1976, for about 40 years HKE has become the leading relay manufacturer in China, As one of the National High-Tech enterprises HKE has been counted among the “China Top 100 Electronic Component Enterprises” since 2004. HKE’s quality control system conforms to ISO9001 and ISO/TS16949 Environment system conforms to ISO14001, and also becomes SONY GREEN PARTNER. HKE products are UL, CSA, TUV, VDE and CQC approved.  Main business and products  HKE mainly produces signal relays, power relays and automotive relays. They are widely used in air conditioners, refrigerators, microwave oven, OA equipment, car alarm, central locking system, power window, seat adjustment control, fan motor, etc.  五、Tianbo Electronics  Company profile  Founded in 1989, Tianbo Electronics is a high-tech enterprise specializing in the research, development, production and sales of relays. The company has established a provincial-level high-tech enterprise research and development center. Tianbo has repeatedly entered the ranks of “China’s Top 100 Electronic Components Enterprises” and is committed to product innovation, process innovation and management innovation.  Main business and products  Tianbo Electronics products cover the range of telecom relays, power relays, automotive relays and magnetic latching relays, and have passed domestic and international safety certifications,such as UL/CUL,VDE,TUV, CE, SEMKO and CQC.The company has passed ISO9001, IATF 16949, ISO14001 and intellectual property management systems, and has a complete quality assurance system.  六、SUJIDIANQI  Company profile  Founded in 2003 and located in Suzhou, SUJIDIANQI has decades of rich experience in the field of power protection components and equipment manufacturing. The company has always been market-oriented, seized opportunities, and actively expanded products in the fields of photovoltaics, new energy and automobiles on the basis of the original main business.  Main business and products  SUJIDIANQI mainly produces and sells products including electric relays, high-voltage DC contactors, automotive eddy current retarder control systems and components, automotive engine intelligent cooling systems (SJATS) and control units, etc.  七、GuoLi Electronic Technology  Company profile  Founded in 2000, Kunshan GuoLi Electronic Technology Co., Ltd.(GLVAC) is a high-tech stock-holding enterprise that specializes in developing and manufacturing electrical vacuum products. GLVAC has obtained the certification of quality management system TS16949 and ISO14001.  Main business and products  Kunshan GuoLi Electronic Technology Co., Ltd.(GLVAC) engages in R&D, manufacturing and selling High Voltage Relays, Vacuum Capacitors, Vacuum Interrupters, DC and AC Contactors, Circuit Breakers, Hydrogen Thyratrons, Magnetrons, Spark Gaps and other vacuum electrical apparatus.  These products are mainly used in mining, broadcast communication, new energy (including motor vehicles), metallurgy, power, medical, semiconductor, environmental protection, industry flaw detection, security inspection and other devices.  八、OMRON  Company profile  Omron Automation (China) Co., Ltd. is a multinational company leading industrial automation products and applying advanced technologies. As part of Omron’s global business, it has become a leader in the field of automation.  Main business and products  As a global leader in the field of automation, OMRON’s business fields cover a broad spectrum, ranging from industrial automation and electronic components to social systems including automated ticket gates and solar power conditioners, healthcare.  General relay  Safety Relays  Terminal relay  I/O relay terminals  Solid state relay  Power conditioner  PCB relays  九、FUJITSU  Company profile  Fujitsu Component Limited manufactures and sells Switching Devices (relays) and Human Interface Devices (touch panels, thermal printers, keyboards, wireless modules, KVM switches). It supports customers with its sophisticated component solutions and products together with group companies around the world.  Main business and products  Fujitsu Component provides the wide range of PCB relays for signal, power, and automotive applications as one of the top relay manufacturers. It also provides eco-friendly products like cadmium-free power relays and relays for PV systems and High Voltage DC distribution systems that contribute the reduction of CO2 emission.  十、DENSO  Company profile  As the only electronic products company in the DENSO Group with an integrated manufacturing system covering every stage from design to development to production, Denso Electronics contributes to driving culture as a supplier of electrical and electronic automotive components.  Main business and products  Denso Electronics produces a diverse range of products including relays, buzzers, a variety of ECUs, sensors, and more.  Power Relay  Solid State Relay Module  High Voltage Relay  Acoustic Vehicle Alerting System (AVAS)
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