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MWC Barcelona 2025: Fibocom Launches <span style='color:red'>Qualcomm</span> X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.

Key word：

Fibocom

Release time：2025-03-20 13:55 reading：272 Continue reading>>

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Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024

　　Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade. Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility, which is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.　　Taipei, Taiwan – June 7th 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm® QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.　　Flagship on-device AI solution powered by Qualcomm QCS8550 processor　　Utilizing the powerful Qualcomm QCS8550 processor, Fibocom’s flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno™ 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, videoconference systems, and more.　　Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT market　　The solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios. The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, in-vehicle infotainment (IVI) and industrial inspection.　　“We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions,” stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. “This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.”　　"It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."

Key word：

Fibocom

Release time：2024-06-18 16:12 reading：837 Continue reading>>

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Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024

Key word：

Fibocom

Release time：2024-04-16 11:14 reading：828 Continue reading>>

[News] Samsung Fails to Secure <span style='color:red'>Qualcomm</span>’s 3nm Orders for the Coming Year, Dual Foundry Strategy Postponed

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[News] Samsung Fails to Secure Qualcomm’s 3nm Orders for the Coming Year, Dual Foundry Strategy Postponed

　　According to TechNews’ report, TSMC and Samsung fiercely compete in the semiconductor foundry sector. Earlier market reports suggested that Qualcomm’s Snapdragon 8 Gen 4 mobile processor might adopt a dual-foundry strategy with TSMC and Samsung manufacturing simultaneously.　　However, according to the latest industry information, due to Samsung’s conservative expansion plan for next year’s 3nm production capacity and unstable yields, Qualcomm has officially canceled the plan to utilize Samsung for next year’s processors. The dual-sourcing model is now postponed until 2025.　　Samsung began mass production of its first-generation 3nm GAA (SF3E) process at the end of June last year, marking Samsung’s initial use of the innovative GAA architecture for transistor technology. The second-generation 3nm process, 3GAP (SF3), will utilize the second-generation MBCFET architecture, optimizing it based on the foundation of the first-generation 3nm SF3E. It is expected to enter mass production in 2024.　　The dual-foundry strategy for Qualcomm was initially leaked by the reputable source Revegnus via the X platform (formerly Twitter). It was mentioned that the Snapdragon 8 Gen 4 processor would adopt TSMC’s 3nm (N3E) process, while Samsung’s 3GAP process would be used for the Snapdragon 8 Gen 4 supplying Samsung’s Galaxy series smartphones. Other sources suggested that due to limited capacity at TSMC’s 3nm production, Qualcomm had to seek Samsung as an alternative chip foundry.　　As a result, Qualcomm originally anticipated dual-foundry production with both TSMC and Samsung in 2024, with hopes of being the first customer for the 3GAP process. However, considering Samsung’s conservative 3nm production capacity plan for next year and the instability in yields, Qualcomm decided to scrap the plan and exclusively rely on TSMC, pushing the dual-foundry strategy to 2025.　　Currently, TSMC’s 3nm process technology capacity is on the rise, with expectations that by the end of 2024, monthly production capacity will reach 100,000 wafers, and the revenue contribution will increase from the current 5% to 10%.

Key word：

Samsung

Release time：2023-12-01 14:48 reading：2259 Continue reading>>

<span style='color:red'>Qualcomm</span> and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market

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Qualcomm and Other Major Players Unveil New Arm-Based Processors, Targeting a Slice of the PC CPU Market

　　During the Snapdragon Summit 2023 in October, Qualcomm made a big announcement by introducing the Snapdragon X Elite chip, built on TSMC’s cutting-edge 4nm process. Qualcomm’s claim is bold; they assert that the chip will deliver superior performance compared to Intel’s x86 architecture and Apple’s M2 chip. Simultaneously, towards the end of October, Apple revealed its own Arm-based M3 chip. Notably, semiconductor giants AMD and NVIDIA are rumored to be exploring the development of new PC processors on the Arm architecture. The future outlook suggests that Arm-based processors may gradually cut in the market share traditionally held by x86 architecture processors.　　TrendForce’s Insights:　　Qualcomm’s New PC Processor Poised to Expand the Arm-Based PC Processor Market　　Following Intel’s September 2023 Meteor Lake processor release, Qualcomm introduced the Snapdragon X Elite, its latest Arm-based PC processor in October. This chip leverages TSMC’s advanced 4nm technology. Qualcomm is forging partnerships with Taiwanese heavyweights such as Quanta, Compal, Wistron, Acer, Asus, Realtek, Nuvoton and others, aiming to secure a foothold in the CPU market within the PC supply chain. This collaborative effort is expected to yield new PC products hitting the market in 2024.　　As of 2023, Arm commands approximately 11% of the market share. Apple, a pioneer in PC chips built on the Arm architecture, has seen success with the release of three generations of processors since the 2020 debut of M1 chip.　　With Qualcomm entering the Arm architecture group, AMD also intends to step into Arm architecture with the upcoming Phoenix processor, set for launch in 2025. There are also whispers of NVIDIA partnering with MediaTek to develop a chip processor featuring SoC+GPU capabilities on the Arm architecture, with an initial focus on ChromeBook market, where MediaTek boasts years of experience.　　In the PC market, significant factors include processor development timelines, product performance, power efficiency, extended battery life, and compatibility with software and hardware. High-end CPUs and GPUs have become indispensable components for high-end computers. Currently, Intel leads the CPU market, with AMD following closely in the x86 landscape. As more companies delve into the development of Arm-based processors, there is potential for them to carve a share from the x86 market in the future.　　Arm Architecture Processors Gain Momentum, Intel Focusing on AI Software Application Processor Development　　Apple’s M-series chips demonstrate their efficiency and extended battery life. Microsoft recognizes the advantages of the Arm architecture and is dedicated to fostering a strategic collaboration for Windows on Arm. This collaboration involves integrating operating systems with processors to attract leading manufacturers to engage in Arm-based processor development, aligning with the growing demands for AI PCs.　　In the realm of x86 architecture, Intel enjoys a dominant position in the CPU market. To tap into the opportunities arising from AI PCs, Intel has integrated AI acceleration engine features into its processors, introducing a new generation of AI application processors that combine CPU, GPU, and NPU (Neural Processing Unit) functionalities. This caters to the growing demand for generative AI applications in enterprise mobile PCs. Furthermore, Intel has joined forces with major laptop brands to launch new AI PCs, aiming to seize a substantial share of the market.　　As momentum grows in Arm-based processor development, Intel maintains confidence that their immediate effect on the demand for x86 architecture processors will be restrained. It is unlikely to hinder Intel’s continuous advancement in developing new processors. Unlike competitors concentrating on Arm architecture processor development, Intel places a stronger focus on AI software applications and the market opportunities arising from its partnership with the Microsoft platform.

Key word：

Qualcomm

Release time：2023-11-07 14:45 reading：2336 Continue reading>>

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TSMC’s 3nm Wins Big Qualcomm 5G Deal, Outshines Samsung, Intel

　　According to a report from Economic Daily, TSMC’s 3-nanometer technology has attracted another heavyweight client. Following Apple and MediaTek, it is rumored that Qualcomm will also commission TSMC to produce its next-generation 5G flagship chip using the 3-nanometer process. The chip is expected to be unveiled in late October, making Qualcomm the third client for TSMC’s 3-nanometer technology.　　In response to these rumors, Qualcomm has not provided any comments, while TSMC has chosen to remain silent. Industry experts speculate that TSMC’s 3-nanometer technology will likely attract additional orders from major players such as NVIDIA and AMD in the future. With various leading-edge fabs continuously seeking TSMC’s services, it appears that TSMC’s 3-nanometer technology remains the top choice for international giants.　　Last year, Qualcomm unveiled its annual 5G flagship chip, the “Snapdragon 8 Gen 2,” manufactured using TSMC’s 4-nanometer process. The previous-generation Snapdragon “8 Gen 1” was produced using Samsung’s 4-nanometer process, but it encountered issues related to heat dissipation. Consequently, Qualcomm released an upgraded version, the “Snapdragon 8+ Gen 1,” using TSMC’s 4-nanometer process.　　Qualcomm has traditionally adopted a multi-supplier strategy for semiconductor manufacturing. It is rumored in the industry that Qualcomm has privately informed its smartphone brand customers about the upcoming next-generation 5G flagship chip, the “Snapdragon 8 Gen 3,” expected to be announced in late October. This chip will be available in two process versions: TSMC’s 4-nanometer (N4P) and 3-nanometer (N3E).

Key word：

TSMC’s

Release time：2023-09-26 14:52 reading：1647 Continue reading>>

<span style='color:red'>Qualcomm</span> Initiates Major Layoffs in China, Shanghai R&D Center Closure Rumored

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Qualcomm Initiates Major Layoffs in China, Shanghai R&D Center Closure Rumored

　　According to TechNews, the ongoing soft demand for smartphones, combined with Huawei’s launch of the Mate 60 Pro, has severely impacted Qualcomm. Reports within the Chinese industry suggest that Qualcomm is planning significant layoffs in China, with severance costs estimated to be as high as N+7.　　Based on discussions in Chinese forums and media reports, Qualcomm’s Shanghai R&D center is set to undergo substantial layoffs. This center primarily focuses on wireless-related businesses. The severance standards for permanent employees are at least N+4, which means the employee’s tenure plus an additional 4 months are considered for severance pay. As for contract employees, the severance compensation is set at N+7.　　In fact, Qualcomm announced its downsizing plan in August, with reports suggesting that Qualcomm Taiwan plans to lay off about 200 employees in October. Ths will affect personnel in product engineering, testing, and verification fields, comprising 11.8% of the total workforce. The company is also implementing cost-saving measures such as eliminating annual salary adjustments and reducing bonuses to 70%.　　This downsizing rumor has also extended to China, with reports at the time suggesting that Qualcomm China might lay off up to 40% of its workforce. The main reasons cited were sluggish demand for smartphones and Huawei’s new Kirin processor.　　Analyst Ming-Chi Kuo of TF International Securities stated that Huawei is expected to fully adopt its own designed Kirin processors in its upcoming phones next year. Qualcomm will be the major loser in this scenario, losing Huawei’s orders entirely.　　According to Kuo’s data, Huawei purchased 23 to 25 million smartphone SoCs (System on a Chip) from Qualcomm in 2022, but this number increased to 40 to 42 million in 2023. However, starting in 2024, Huawei will use its own chip designs, causing Qualcomm to not only lose orders but also face the risk of declining shipments from other Chinese brand customers due to Huawei’s increased market share.　　Kuo also expects that, influenced by Huawei’s actions, Qualcomm’s SoC shipments to Chinese smartphone brands will decrease by 50 to 60 million units next year and continue to decline in the following years.　　With a significant potential decline in performance in the Chinese market and increasing price competition towards the end of the year, Qualcomm is expected to carry out more layoffs. As of September last year, Qualcomm had approximately 51,000 employees worldwide. The company’s restructuring costs in the last quarter amounted to $285 million, with most of it being severance pay. In June of this year, the U.S. headquarters also reduced around 415 positions.

Key word：

Qualcomm

Release time：2023-09-21 16:48 reading：2674 Continue reading>>

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Qualcomm refused modems for 2018 iPhone models: Apple

　　Taking its legal battle with chip making giant Qualcomm to the next level, Apple has claimed it wanted to use Qualcomm modems in its 2018's iPhone models but the chip maker refused to sell them after being sued by the iPhone maker over its licensing practices.　　The US Federal Trade Commission(FTC) has accused Qualcomm of operating a monopoly in wireless chips, forcing companies such as Apple to work with it exclusively and charging excessive licensing fees for its technology.　　According to Apple Chief Operating Officer Jeff Williams's testimony in court during the FTC trial against Qualcomm, the latter refused to sell its 4G LTE modems to Apple because of the companies' licensing dispute, the CNET reported late on Monday.　　The chip making giant continues to provide the iPhone maker with chips for its older models, including the iPhone 7 and 7 Plus.　　"The strategy was to dual-source in 2018 as well. We were working toward doing that with Qualcomm but in the end they would not support us or sell us chips," the report quoted William as saying.　　Apple reportedly dialled Intel's CEO at the time, Brian Krzanich, to ask the company to supply all modems needed for the iPhone instead of only half the volume.　　However, Williams' comments appear to contradict testimony from Qualcomm's CEO Steven Mollenkopf.　　Mollenkopf on Friday had said on the stand that as of spring 2018, Qualcomm was still trying to win a contract supplying chips for iPhones but that it hadn't "had any new business" from Apple since its previous contracts expired, the report added.

Key word：

Qualcomm

Release time：2019-01-16 00:00 reading：3379 Continue reading>>

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Apple Reveals Qualcomm Patent Fees

Qualcomm charges a 5% royalty, or about $12 to $20, per smartphone plus a large “CDMA tax,” Apple’s chief operating officer testified in an antitrust case here. The testimony put on the record some details of Qualcomm’s licensing practices that have long drawn industry complaints.Apple struck a deal with Qualcomm in 2007 to set royalties on iPhones at $7.50 per handset. In 2011, the two struck a deal to keep royalties at the same level while giving Qualcomm “short-term” exclusivity as the iPhone’s cellular baseband supplier.The “7.50 [royalty] may not sound like a lot, but it [amounted to] billions of dollars a year,” said Jeff Williams, who led the first iPhone team and is now Apple’s COO. “It is not FRAND, in our view, compared to everyone else … Qualcomm charged more than everyone else together.”“The alternative was that it defaults to the contract manufacturer’s rate of $17 to $18 [per phone, and] if we pursued them legally, we wouldn’t have access to chips … [and] risk getting our brand-new iPhone enjoined,” said Williams, adding, “Qualcomm represented [$7.50] as the average price paid.”Although patent licensing at the handset level has become widely used, Apple found it unfair.“We led the charge to add a lot of NAND memory” in handsets, but “if we put an extra $100 in NAND, they would get $5 of that even though they didn’t have anything to do with it,” he said. Apple spends “an extra $60 in stainless steel enclosures, and Qualcomm would collect an extra $3 — that didn’t make sense to us, and it still doesn’t today,” he added.The original $7.50 royalty “didn’t apply to CDMA phones or iPads,” said Williams, later calling licensing terms for the cellular protocol that Qualcomm developed “roughly a $250 million CDMA tax.”Apple initially proposed that it pay $1.50 per baseband chip used. Under the final deal, Apple’s contract manufacturers paid Qualcomm its usual 5% handset royalty under their existing patent licenses, Apple reimbursed them, and Qualcomm reimbursed Apple. Apple avoided striking a patent deal directly with Qualcomm under the arrangement.As part of the 2011 deal, Apple asked Qualcomm for a billion dollars to transition from using Infineon basebands.“They wanted exclusivity,” Williams said. “We proposed that we’d give them 100% sole-sourced for the short term, [but] in the long term, that wasn’t our plan.”However, “long-term [exclusivity] provisions wound up in the agreement … [and] made it prohibitively expensive to work with someone else,” he added. “For example, it cut off work with Intel” on a baseband for an iPad Mini in 2013 … overall, “our strategy is to dual-source.”Today, “Qualcomm continues to ship products on [Apple] design wins they have,” Williams said. “We have been unable to get them to support us on new design wins since [Apple sued Qualcomm in 2017]. This has been a challenge.”“Our strategy was to dual-source [basebands] in 2018,” he said. “We were working toward doing that with Qualcomm, but in the end, they would not support us and sell us chips.”As a result, “I went to [Intel CEO] Brian Krzanich and said that I was sorry, but instead of 50%, I need 100%” of iPhone basebands. “He had to scramble and go to his board to get almost a billion in capital to support us,” Williams said.Meanwhile, Qualcomm “is suing us in court all over the world on non-essential patents,” he said. “They are trying to get a hit in any one of those courts with an injunction to cause enough pain to make us pay tens of billions of dollars in their ransom … They said [that Apple is] an ideal target [because] unless [we] run the table, they will win.”In testimony Friday, Qualcomm’s CEO gave his own views on the deal and its efforts to continue working with Apple.Under cross-examination, a Qualcomm attorney noted that Apple gave the chip vendor a “moonshot challenge” to deliver a single chip baseband for LTE. The chip made it into the iPhone 5. In its launch, Apple founder Steve Jobs called the chip “one of the real breakthroughs” of the handset.

Key word：

Apple,Qualcomm

Release time：2019-01-15 00:00 reading：3355 Continue reading>>

<span style='color:red'>Qualcomm</span> calls Apple CEO's settlement talk comment

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Qualcomm calls Apple CEO's settlement talk comment "misleading"

　　Qualcomm Inc on Tuesday responded to comments Apple Inc Chief Executive Tim Cook made in an interview, in which he said there had been no recent settlement talks between the iPhone maker and chip supplier in their global legal battle, calling Cook's remarks "misleading."　　The two companies are disputing comments their CEOs have made over settlement talks: Apple's chief on Tuesday said any talks ended in September 2018. In November, Qualcomm's Chief Executive Steve Mollenkopf made comments about the supplier's efforts to resolve the dispute.　　Qualcomm on Tuesday said Cook miscast Mollenkopf's remarks, which did not mention a settlement and which Qualcomm maintains are accurate.　　The war of words is unlikely to play a major role in the outcome of the legal fight between the two firms. But it signals the high stakes and deeply entrenched positions of each side, with Apple arguing in court that Qualcomm charges an unfair "tax" on its phones while Qualcomm fights to protect a patent licensing model it argues has helped bring connectivity to billions of new users through wireless networks.　　In a television interview on CNBC earlier on Tuesday, Cook responded to a question from host Jim Cramer about whether Apple would settle with Qualcomm after Qualcomm had announced legal victories against Apple in patent cases in China and Germany.　　"Look, the truth is, we haven't been in any settlement discussions with them since the third calendar quarter of last year. That is the truth. So I'm not sure where that thinking is coming from," Cook said.　　Cook's comments contrasted with those Mollenkopf made in November on CNBC.　　"We do talk as companies, and I think what you're seeing, really, are activities consistent, really, with the fourth quarter of the game, and not the first quarter," Mollenkopf told CNBC then. "We always talk about – and I've been very consistent - that this second half of and into, is when we're really on the doorstep of finding a resolution."　　In a statement, a Qualcomm spokesperson said the company stands by Mollenkopf's remarks.　　"We have been consistent for the last 18 months in making clear that we have, at various times, been in discussions with Apple about a possible resolution to our licensing dispute," a Qualcomm spokesperson said in a statement. "We have also stated clearly on several occasions that we believe it will be resolved, one way or the other, in the near future, either through a settlement or court decisions."　　The primary case in Apple and Qualcomm's legal battle goes to trial in April.　　Apple has accused Qualcomm of engaging in illegal patent licensing practices to preserve a dominant market position in so-called modem chips, which help mobile phones connect to wireless data networks. Qualcomm has argued that its practices followed decades-long tech industry norms and that Apple has not fairly compensated it for its intellectual property.

Key word：

Qualcomm,Apple

Release time：2019-01-11 00:00 reading：3401 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor
TL431ACLPR	Texas Instruments

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics

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