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AMEYA360 VIETNAM Electronics Production Equipment and Microelectronics Industry Exhibition N<span style='color:red'>EPC</span>ON VIETNAM successfully concluded

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AMEYA360 VIETNAM Electronics Production Equipment and Microelectronics Industry Exhibition NEPCON VIETNAM successfully concluded

　　From September 6th to 8th, 2023, the three-day 2023 VIETNAM Electronic Production Equipment and Microelectronics Industry Exhibition NEPCON VIETNAM was held grandly at Hanoi International Exhibition Center, Vietnam. The exhibition brought together electronic component material and production equipment manufacturers and agents, suppliers and visitors from around the world, making it an important event in the field of Vietnam’s electronics manufacturing industry.　　The exhibition covered a wide range of areas, including raw materials, equipment, systems and services used in printed circuit board , semiconductor packaging, production, design, testing and assembly. It also included microelectronic components such as active/passive components, electromechanical components, and electronic processing services including surface mount technology equipment and services, test and measurement equipment and services, electronic product manufacturing services, electronic components and mobile phone components and other fields. In recent years, Vietnam has become one of the latest advanced electronics product manufacturing centers in ASEAN, attracting numerous excellent electronic companies to establish their presence.　　AMEYA360 as a professional electronic components agent/distributor also participated in this exhibition. During the exhibition, AMEYA360 booth received a continuous flow of visitors seeking information and consultation. It attracted customers from different countries for discussion and exchanges. The team from AMEYA360 , with high spirits, warmly welcomed every visitor to the booth, providing professional and meticulous services to exhibition attendees, allowing customers to gain a deeper understanding of AMEYA360’s remarkable capabilities in the industry.　　Exhibition　　The exhibition was a showcase of our company’s strength on a global scale, as well as an opportunity to drive the development of the electronic component industry. We engaged in-depth exchanges with industry elites from around the world, learning from each other, and striving to provide more efficient and intelligent services for the global electronics manufacturing industry, thus promoting the overall advancement of the industry.　　From the initial preparation to the closing, from the past to the present, AMEYA360 has continuously working hard, staying true to its mission, and committed to pursuing excellent quality to create a great user experience. We value every opportunity to communicate, negotiate, and cooperate with each customer and sincerely appreciate your visits, trust, and support. In the future , AMEYA360 will continue to innovate and accelerate its development, driving the electronic industry’s supply chain to reduce costs and increase efficiency!

Key word：

Electronics fair

Release time：2023-09-11 15:52 reading：2695 Continue reading>>

AMEYA360 invites you to visit the N<span style='color:red'>EPC</span>ON VIETNAM2023 Electronics Exhibition

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AMEYA360 invites you to visit the NEPCON VIETNAM2023 Electronics Exhibition

　　From September 6th to 8th, NEPCON VIETNAM will be held in Hanoi International Center for Exhibition (Vietnam).　　NEPCON VIETNAM is the most influential and only Electronic Trade Show in Vietnam — the proving ground for latest technologies introduction and global innovators. This is where more than 300 brands do business and meet new partners, and the sharpest innovators hit the stage.　　NEPCON VIETNAM 2023 focuses on the innovative concept of “Emerging Trends In Electronics - The Future Of Global Supply Chains". The exhibition will bring together 300 brands and companies to showcase - SMT, Testing Technologies, Equipment, Supporting Industries, Intelligent Manufacturing and other relevant areas will also be exhibited.　　This exhibition brings together high-quality electronic companies from both domestic and international markets. As a renowned distributor of electronic components, AMEYA360 will be participating in this exhibition. We cordially invite you to visit the AMEYA360 booth at P01 and explore, observe, and discuss. There will be many on-site gifts and abundant benefits. We look forward to your presence!　　AMEYA360 Booth Information:　　Date: 9/6/2023 - 9/8/2023　　Address: Hanoi International Center for Exhibition　　AMEYA360 booth number：P01 Booth　　Contact information:　　BK Lau ：+6012 4083435　　Calvin Keoh： +6017 4720840

Key word：

Exhibition invitation

Release time：2023-08-17 14:17 reading：3052 Continue reading>>

Ameya360:<span style='color:red'>EPC</span> Expands Footprint-Compatible GaN FET Family

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Ameya360:EPC Expands Footprint-Compatible GaN FET Family

　　Efficient Power Conversion (EPC) has launched the 200V, 10mΩ EPC2307 that completes a family of six GaN transistors rated at 100V, 150V, and 200V, offering higher performance, smaller solution size, and ease of design for DC-DC conversion, AC/DC SMPS and chargers, solar optimizers and microinverters, and motor drives.　　The EPC2307 comes in a thermally enhanced 3-by-5mm QFN package, and is footprint compatible with the previously released 100V, 1.8mΩ EPC2302, the 100V 3.8mΩ EPC2306, the 150V, 3mΩ EPC2305, the 150V, 6mΩ EPC2308, and the 200V, 5mΩ EPC2304, allowing designers to trade off RDS(on) vs. price to optimize solutions for efficiency or cost by dropping in a different part number in the same PCB footprint.　　The device’s extremely small thermal resistance improves heat dissipation through a heatsink or heat spreader for excellent thermal behavior, while wettable flanks simplify assembly, and footprint compatibility offers design flexibility to specs change for fast time to market.　　This family of devices bring several benefits to motor drive designs including very short deadtimes for high motor and inverter system efficiency, lower current ripple for reduced magnetic loss, lower torque ripple for improved precision, and lower filtering for lower cost.　　For DC-DC conversion applications, these devices offer up to five times higher power density, excellent heat dissipation, and lower system costs in both hard switching and soft switching designs. Additionally, ringing and overshoot are both significantly reduced for better EMI.　　“The continued expansion of this family of footprint compatible, easy to assemble devices provides engineers the flexibility to optimize their designs quickly without delaying time-to-market,” said Alex Lidow, EPC’s co-founder, and CEO. “This family of devices is ideal for smaller, lighter weight motor drives, more efficient and smaller DC-DC converters, and higher efficiency solar optimizers and microinverters.”　　The EPC90150 development board is a half bridge featuring the EPC2307 GaN. The purpose of these boards is to simplify the evaluation process and speed time to market. The 50.8-by-50.8mm boards are designed for optimal switching performance and contain all critical components for easy evaluation.

Key word：

EPC,GaN

Release time：2023-02-03 11:49 reading：1727 Continue reading>>

Ameya360:<span style='color:red'>EPC</span> GaN eToF Laser Driver IC Enables Higher Density Lidar Systems

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Ameya360:EPC GaN eToF Laser Driver IC Enables Higher Density Lidar Systems

　　Efficient Power Conversion (EPC) has launched the EPC21701, a laser driver that monolithically integrates an 80V, 40A FET with gate driver and 3.3 logic level input into a single chip for time-of-flight lidar systems used in robotics, surveillance systems, and vacuum cleaners. It is tailored to lidar systems for gesture recognition, time of flight (ToF) measurement, robotic vision, or industrial safety.　　The EPC21701 laser driver uses 5V supply voltage and is controlled using 3.3V logic. It is capable of very high frequencies greater than 50MHz and super short pulses down to 2ns to modulate laser driving currents up to 15A. Voltage switching time is less than 1ns and delay time from input to output is less than 3.6ns. The EPC21701 is a single-chip driver plus GaN FET using EPC’s proprietary GaN IC technology in a chip-scale BGA form factor that measures only 1.7-by-1-by-0.68mm. The wafer level packaging is small, low inductance, and lays out very well with the laser system. With this small form factor and the integration of several functions, the overall solution is 36% smaller on the printed circuit board (PCB) compared to an equivalent multi-chip discrete implementation.　　The 80V EPC21701 complements the ToF driver IC family in chip-scale package (CSP) that also includes the 40V, 15A EPC21601 and the 40V, 10A EPC21603 options.　　Integrated devices in a single chip are easier to design, easier to layout, easier to assemble, save space on the PCB, increase efficiency, and reduce cost. This family of products will enable faster adoption and increased ubiquity of ToF solutions across a wider array of end-user applications.　　“This new family of GaN integrated circuits dramatically improves the performance while reducing size and cost for time-of-flight lidar systems,” said Alex Lidow, CEO, and co-founder of EPC. “Integrating a GaN FET with driver on one chip generates an extremely powerful and fast IC and reduces size and cost for wider adoption in consumer and industrial applications. With EPC21701 we expand the family to 80V and 15A and will soon extend the family further to 100V and 125A.”　　The EPC9172 development board features the EPC21701 eToF laser driver IC and is primarily intended to drive laser diodes with short, high current pulses. Capabilities include minimum pulse widths of <2ns, 15A peak currents, and bus voltage rating of 40V.　　Designers interested in replacing their silicon MOSFETs with a GaN solution can use the EPC GaN Power Bench’s cross-reference tool to find a suggested replacement based on their unique operating conditions.

Key word：

Ameya360,EPC,eToF

Release time：2023-01-28 11:04 reading：2013 Continue reading>>

Ameya360:Richtek and <span style='color:red'>EPC</span> Partner on Compact 140W Fast-charging Solution

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Ameya360:Richtek and EPC Partner on Compact 140W Fast-charging Solution

　　Efficient Power Conversion (EPC) and Richtek have launched a 4-switch bidirectional buck-boost controller reference design board that converts an input voltage of 12V–24V to a regulated 5V–20V output voltage and delivers up to 5A continuous current and 6.5A maximum current.　　The combination of the new Richtek RT6190 controller with ultra-efficient EPC2204 GaN FETs from EPC shrinks the solution size by greater than 20% compared to traditional solutions for high-power density applications. The solution achieves greater than 98% efficiency for 20V and 12V output voltage, and can operate without heatsink with maximum rise temperature below 15°C for 20V to 5V, and 55°C for 12V to 20V, at 5A continuous current.　　The high-power density makes this solution ideal for buck boost converters with input 4V–36V and output 3V–36V like the ones used for 5V–36V battery chargers, battery stabilizers to 5V–36V and USB PD 3.1 charging (5V, 20V, 28V, 36V support). GaN FETs provide the fast switching, high efficiency and small size that can meet the stringent power density requirements of these leading-edge applications.　　The reference design uses the EPC2204 100 V enhancement-mode EPC GaN FET and the RT6190 4-switches buck boost controller with integrated drivers.　　The RT6190 is a 4-switch bidirectional buck boost controller with I2C interface using peak current mode control. The input voltage ranges between 4V and 36V and the output voltage is programmable between 3V and 36V and supports dynamic voltage scaling. The switching frequency reaches up to 1MHz for high power density and the device offers power saving mode for high light load efficiency. Output current, voltage and soft start can be precisely programmed, and the device is fully protected and offers OCP, UVLO, OVP, OTP, cycle by cycle current limit, and PGOOD in a tiny package, 5-by-5mm.　　The EPC2204 is a 100V GaN FET with 6mΩ max RDS(on), 5.7nC QG, 0.8nC QGD, 1.8nC QGS and zero QRR in a super small 2.5-by-1.5mm footprint and can deliver up to 29A continuous current and 125A peak current. The excellent dynamic parameters allow very small switching losses at 500kHz–1MHz switching frequency, especially in hard switching applications like buck boost converters. Higher switching frequency enable to reduce the inductor value, size, and DCR and the capacitor count for less losses and higher power density.　　“GaN FETs are required to achieve the maxim power density for DC-DC converters. We are delighted to work with Richtek to combine the benefits of their advanced controllers with the performance of GaN to provide customers with the highest power density and low component count solution that increases the efficiency, increases power density, and reduces system cost,” commented Alex Lidow, CEO of EPC.　　“The Richtek Device’s RT6190 is designed to fully exploit the high performance of EPC’s eGaN FETs for high power density solutions,” said Eason Chen, Sr. Application Marketing Manager at Richtek, “The RT6190 offers higher switching frequency and integrates all protections feature and functionality required for 4-switch buck boost controller for battery chargers and battery management/stabilizers to a fixed voltage, very common for consumer USB applications for PC and smart phone, e-bike, e-scooter, battery-operated appliances and power tools, medical, industrial and solar applications. With these new controllers, customers can take advantage of the very fast switching of GaN for the highest power density.”

Key word：

Richtek,Ameya360

Release time：2023-01-16 11:44 reading：3309 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor

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