ROHM Group Company SiCrystal and ST<span style='color:red'>Micro</span>electronics Expand Silicon Carbide Wafer Supply Agreement
Trade news

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

　　Kyoto, Japan and Geneva, Switzerland, April 22, 2024 – ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million.　　Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented “This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions”.　　“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality”. said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.　　Energy-efficient SiC power semiconductors enable electrification in the automotive and industrial sectors in a more sustainable way. By facilitating more efficient energy generation, distribution and storage, SiC supports the transition to cleaner mobility solutions, lower emissions industrial processes and a greener energy future, as well as more reliable power supplies for resource-intensive infrastructure like data centers dedicated to AI applications.　　About STMicroelectronics　　At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.　　Further information can be found at www.st.com .　　About ROHM　　Founded in 1958, ROHM provides ICs and discrete semiconductor devices characterized by outstanding quality and reliability for a broad range of markets, including automotive, industrial equipment and consumer market via its global development and sales network.　　In the analog power field, ROHM proposes the suitable solution for each application with power devices such as SiC and driver ICs to maximize their performance, and peripheral components such as transistors, diodes, and resistors.　　Further information on ROHM can be found at www.rohm.com .　　About SiCrystal　　SiCrystal, a ROHM group company, is one of the global market leaders for monocrystalline silicon carbide wafers. SiCrystal’s advanced semiconductor substrates provide the basis for the highly efficient use of electrical energy in electric vehicles, fast charging stations, renewable energies and in various fields of industrial applications.　　Further information on SiCrystal can be found at www.sicrystal.de .
Key word：
Release time：2024-04-24 11:10 reading：1270 Continue reading>>
CG Power and Industrial Solutions Limited, Renesas and Stars <span style='color:red'>Micro</span>electronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India
Trade news

CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."　　About CG Power and Industrial Solutions Limited　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.　　Since November 2020, the Company has become a part of the renowned Murugappa Group.　　About Murugappa Group　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation  empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Key word：
Release time：2024-03-05 13:10 reading：2826 Continue reading>>
BIWIN TF200 Series <span style='color:red'>Micro</span>SD: Enhanced Raspberry Pi 4B Compatibility
Trade news

BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.　　The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.　　The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.　　The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.
Key word：
Release time：2024-01-26 13:44 reading：2325 Continue reading>>
Renesas Launches RZ/G3S 64-bit <span style='color:red'>Micro</span>processor with Enhanced Peripherals for IoT Edge and Gateway Devices
Trade news

Renesas Launches RZ/G3S 64-bit Microprocessor with Enhanced Peripherals for IoT Edge and Gateway Devices

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new 64-bit general-purpose microprocessor (MPU) for IoT edge and gateway devices that consumes significantly less power.　　As the latest addition to Renesas’ RZ/G Series MPU, the RZ/G3S is designed to meet the demanding requirements of modern IoT devices, offering power consumption as low as 10µW (microwatts) in standby mode and fast startup for the Linux operating system. The new MPU comes with a PCI Express interface that enables high-speed connectivity with 5G wireless modules. Additionally, the device boasts enhanced security features such as tamper detection to ensure data security. These features make the device ideal for IoT applications such as home gateways, smart meters, and tracking devices.　　“Renesas’ RZ/G has seen a steady increase in adoption in the global industrial human machine interface market,” said Daryl Khoo, Vice President of Embedded Processing 1st Division at Renesas. “The RZ/G3S represents the next generation products that will extend our reach to the rapidly growing 5G IoT and Gigabit Wi-Fi 7 gateway markets. Renesas has been aggressively expanding our connectivity portfolio in these markets through strategic acquisitions to offer advanced connectivity solutions that are power efficient at the system level and enhance data utilization."　　The RZ/G3S employs an Arm® Cortex®-A55 core as the main CPU with a maximum operating frequency of 1.1 GHz and two Cortex®-M33 cores as sub-CPUs operating at 250 MHz. Users can distribute the MPU’s workloads to sub-CPUs, allowing the device to efficiently handle tasks such as receiving data from sensors, controlling system functions and managing power systems. This reduces the workload on the main CPU, resulting in fewer components, lower costs and a smaller system size.　　Low-power Standby Mode with Fast Linux Startup　　The device’s newly added power management system is designed to reduce power consumption to extremely low levels -- less than 10 µW. The MPU also supports the DDR self-refresh function which allows to retain DRAM data, while also enabling fast Linux startup. The fast startup allows IoT devices, which frequently operate intermittently, to save power and significantly extend the runtime of battery-powered devices. Moreover, the device offers a standby mode that can maintain sub-CPU operation at a power level as low as 40 mW, offering the flexibility to optimize power consumption based on the specific operating requirements of each application.　　5G Connectivity Enabled by PCI Express　　The RZ/G3S is equipped with a wide range of peripheral functions including Gigabit Ethernet, CAN, USB, as well as the PCI Express interface. By connecting with 5G communication modules, the device can achieve high-speed communication at Gigahertz levels.　　High Reliability and Robust Security Functions　　Similar to other RZ/G devices, the RZ/G3S features an ECC (Error Correction Code) function in both internal memory and external DDR interface to maintain data integrity. The Verified Linux Package (VLP) based on the industrial-grade Linux software (Civil Infrastructure Platform™ (CIP) Linux) is available for the RZ/G3S. With VLP, developers receive over 10 years of maintenance support, ensuring long-term protection against security threats. The device also provides tamper detection along with secure boot, secure debug and more. RZ/G series products are already Level 2 PSA Certified from Arm and Renesas has plans to include the RZ/G3S in the future.　　“Our IAR Embedded Workbench for Arm inherently supports both MPUs and MCUs,” said Anders Holmberg, CTO at IAR. “By combining Renesas’ RZ/G3S MPU, which features a highly secure Root of Trust, with extensive security tool solutions from IAR, developers can rapidly develop high-performance, secure IoT devices and bring them to market faster."　　Winning Combinations　　Renesas has combined the new RZ/G3S MPU with optimized power management ICs and clock products to develop the “Single Board Computer Gateway”. The RZ/G3S's rich set of interfaces allows the device to connect with various sensors via USB, CAN, RS485, UART, and I2C. It also offers high performance wireless connectivity options to build a robust network for home automation or IoT applications. Its multicore design allows for real-time processing of data while being power efficient with its advanced sleep mode functions. The Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The RZ/G3S is available today. For more information on the product
Key word：
Release time：2024-01-19 11:14 reading：2198 Continue reading>>
Integrated circuits vs microcontrollers -what are the differences
Trade news

Integrated circuits vs microcontrollers -what are the differences

　　An integrated circuit is an electronic component that integrates multiple electronic devices (such as transistors, resistors, capacitors, etc.) onto a chip to achieve specific functions. The microcontroller is a special integrated circuit that integrates functional modules such as a central processing unit (CPU), memory (RAM, ROM), input/output interfaces and timers and is usually used to control and perform specific tasks. What are the differences between integrated circuits vs microcontrollers? Keep reading!　　Integrated CircuitsHistory and Development of Integrated Circuits　　Integrated Circuits　　The development of integrated circuits (ICs) began in the 1950s. Initially, these circuits consisted of several transistors, resistors, and capacitors mounted on a single silicon chip. With the advent of Moore’s Law, the complexity of integrated circuits has increased rapidly, allowing each silicon chip to accommodate thousands of transistors. This technological advancement has promoted the miniaturization, cost reduction and performance improvement of electronic devices.　　Types and Applications of Integrated Circuits　　Digital integrated circuits　　Digital integrated circuits process digital signals, and they play a central role in devices such as computers, digital storage devices, and mobile phones. These circuits are characterized by high speed and low power consumption. For example, a modern microprocessor is a complex digital integrated circuit that can consume anywhere from a few watts to hundreds of watts and perform billions of operations per second. The cost of manufacturing digital integrated circuits varies depending on the complexity of the design and manufacturing process. Custom chips produced in low volumes can be costly, while standard components produced in large quantities are less costly.　　Analog integrated circuit　　Analog integrated circuits process analog signals such as sound and radio waves. They are widely used in audio amplifiers, radio receivers and temperature sensors. The power consumption of analog integrated circuits is generally low, usually between milliwatts and several watts. Due to their simpler design and manufacturing processes, the cost is usually lower than that of digital integrated circuits. However, the performance of analog integrated circuits is limited by signal accuracy and noise levels.　　Hybrid integrated circuits　　Hybrid integrated circuits combine digital and analog technologies and can process digital and analog signals simultaneously. They are particularly important in complex systems such as automotive electronics and mobile communication devices. The cost and performance of hybrid integrated circuits depend on their complexity and application-specific requirements. For example, hybrid integrated circuits used in automotive collision avoidance systems must be very reliable and precise, which can result in higher manufacturing costs.　　Integrated circuit applications　　Integrated circuits have a wide range of applications. In computer technology, digital integrated circuits are used to process data and control the flow of information. In consumer electronics, such as smartphones and tablets, hybrid integrated circuits are used to process multiple types of signals, such as touchscreen input and wireless communications. In industrial and automotive applications, analog and hybrid integrated circuits are used in monitoring and control systems.　　Integrated circuits vs microcontrollers – what are the differencesMicrocontrollers　　Function: An integrated circuit is a general electronic component that can be used to implement various functions, such as amplification, filtering, digital processing, etc. The microcontroller is a dedicated integrated circuit specially designed to control and perform specific tasks, such as embedded system control, sensor data processing, etc.　　Architecture: Integrated circuits are usually composed of multiple functional modules that can implement various circuit functions. The microcontroller integrates functional modules such as a central processing unit, memory and input/output interface to complete specific control tasks.　　Application: Integrated circuits can be used in various electronic devices, such as mobile phones, televisions, computers, etc. Microcontrollers are usually used in embedded systems, such as smart homes, automotive electronic systems, industrial control and other fields.
Key word：
Release time：2023-12-22 15:58 reading：1592 Continue reading>>
ST<span style='color:red'>Micro</span>electronics to Invest EUR 5 Billion in New SiC Wafer Fab
Trade news

STMicroelectronics to Invest EUR 5 Billion in New SiC Wafer Fab

　　STMicroelectronics, following its EUR 7.5 billion wafer fab project with GlobalFoundries in Crolles, France. is set to invest EUR 5 billion in building a new SiC super semiconductor wafer fab in Catania, Sicily, Italy. The fab in Italy will specialize in producing SiC chips, a pivotal technology for electric vehicles with substantial growth potential, according to French media L’Usine Nouvelle on November 26th,　　STMicroelectronics competitively plans to transition to 8-inch wafers starting from 2024. The company will integrate Soitec’s SmartSiC technology to enhance efficiency and reduce carbon emissions. Simultaneously, STMicroelectronics aims to increase capacity, achieve internal manufacturing, and collaborate with Chinese firm Sanan Optoelectronics to raise SiC chip-related revenue from the expected USD 1.2 billion in 2023 to USD 5 billion by 2030.　　On June 7th earlier this year, STMicroelectronics and Sanan Optoelectronics announced a joint venture to establish a new 8-inch SiC device fab in Chongqing, China, with an anticipated total investment of USD 3.2 billion.　　To ensure the successful implementation of this extensive investment plan, Sanan Optoelectronics said to utilize its self-developed SiC substrate process to construct and operate a new 8-inch SiC substrate fab independently.　　TrendForce: over 90% SiC market share by major global players　　According to TrendForce, the SiC industry is currently dominated by 6-inch substrates, holding up to 80% market share, while 8-inch substrates only account for 1%. Transitioning to larger 8-inch substrates is a key strategy for further reducing SiC device costs.　　8-inch SiC substrates offer significant cost advantages than 6-inch substrates. The industry’s major players in China, including SEMISiC, Jingsheng Mechanical & Electrical Co., Ltd. (JSG), Summit Crystal, Synlight Semiconductor, KY Semiconductor, and IV-SemiteC, are advancing the development of 8-inch SiC substrates. This shift from the approximately 45% of total production costs associated with substrates is expected to facilitate the broader adoption of SiC devices and create a positive cycle for major companies.　　Not only Chinese companies but also international semiconductor giants like Infineon Technologies and Onsemi are actively vying for a share of the market. Infineon has already prepared the first batch of 8-inch wafer samples in its fab and plans to convert them into electronic samples soon, with mass production applications scheduled before 2030. International device companies like Onsemi and ROHM have also outlined development plans for 8-inch SiC wafers.　　Currently, major companies hold over 90% of the market share, intensifying competition. A slowdown in progress could provide opportunities for followers. According to TrendForce, the market share of the top 5 SiC power semiconductor players in 2022 was dominated by STMicroelectronics (36.5%), Infineon (17.9%), Wolfspeed (16.3%), Onsemi (11.6%), and ROHM (8.1%), leaving the remaining companies with only 9.6%.
Key word：
Release time：2023-11-30 10:53 reading：2754 Continue reading>>
Renesas Electronics RA8M1 Arm® Cortex®-M85 <span style='color:red'>Micro</span>controllers
Trade news

Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers

　　Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers (MCUs) are a high-performance MCUs based on the Arm® Cortex®-M85 core with Helium for compute-intensive DSP and AI/ML tasks. Leading performance of 480MHz with up to 2MB code flash memory, 1MB SRAM, and advanced peripherals that support a broad range of IoT applications. Octal SPI interface with decryption-on-the-fly for highly secure interface to external memory. High integration with 16-bit CEU camera interface, 12-bit A/D converter, 12-bit D/A converter, PWM timers, High-Speed Analog Comparators, Ethernet MAC with DMA, CAN-FD, USB HS/FS, SCI, SPI, I2C/I3C and safety features. Advanced security with TrustZone®, next-gen cryptography, immutable storage for FSBL, secure boot and tamper protection, including DPA/SPA side-channel attack protection.      The Renesas Electronics RA8M1 is built on a highly efficient 40nm process and supports a wide operating voltage range of 1.68V-3.6V. To ease application development, the RA8M1 is supported by the Flexible Software package (FSP), evaluation kits, software development tools, and Cloud solutions.      FEATURES　　》480MHz Arm Cortex-M85 core with Helium　　*M-Profile vector extension for AI/ML　　*High-performance core featuring Armv8.1m architecture with Helium for DSP/ML acceleration　　*Up to 2MB Flash memory and 1MB SRAM included TCM; 384KB user SRAM and 128KB TCM are ECC-protected　　*32KB I/D caches (ECC protected), 12KB data Flash　　*Advanced security with TrustZone, RSIP Cryptographic engine, immutable storage, and tamper protection　　*Scalable from 100-pin to 224-pin packages　　*Octal SPI interface with decryption-on-the-fly, Ethernet MAC with DMA, CAN-FD, and USB HS/FS (host and device) connectivity options　　*CEU Camera i/f, 12-bit ADCs, 12-bit DACs, high-speed analog comparators, and 3x sample and hold circuits　　*SCI (UART, simple SPI, simple I2C), SPI, I2C, I3C　　*High-performance MCUs @ 480MHz for a broad base of compute-intensive IoT applications　　*High integration for lower costs and simplified design　　*Octal SPI interface with a secure interface to external memory for storage of code and data　　*Advanced security for highly secure IoT　　*Open Arm Ecosystem, easy-to-use Flexible Software Package and comprehensive solutions to enable fast development　　*S/H enable motor control applications　　APPLICATIONS　　*Broad-based IoT applications　　*Industrial automation　　*IoT gateways/hubs　　*Smart home/home automation products　　*Thermostats　　*Home appliances (refrigerators, ovens, washing machines, etc.)　　*Security cameras　　*Building automation (HVAC, access)
Key word：
Release time：2023-11-27 14:40 reading：1953 Continue reading>>
<span style='color:red'>Micro</span>soft Unveils In-House AI Chip, Poised for Competitive Edge with a Powerful Ecosystem
Trade news

Microsoft Unveils In-House AI Chip, Poised for Competitive Edge with a Powerful Ecosystem

　　Printed Circuit Boards (PCBs) are the fundamental building blocks of modern electronics, comprising a myriad of components meticulously arranged to enable the functionality of electronic devices. Identifying these components on a PCB and understanding their roles is essential for troubleshooting, repairs, and even designing electronic circuits.　　In this comprehensive guide, we delve into the world of PCB components, unraveling their types, functionalities, and methods of identification.　　Understanding PCB Components1. Resistors:　　• Identification: Resistors are usually small, cylindrical components with colored bands indicating resistance values. Use a multimeter to measure resistance if the bands are unclear.　　• Function: Resistors limit current flow in a circuit, adjusting voltage levels or protecting components.　　2. Capacitors:　　• Identification: Capacitors come in various shapes (cylindrical, rectangular) and sizes, often labeled with capacitance values and voltage ratings.　　• Function: They store and release electrical energy, filtering signals or stabilizing voltage.　　3. Diodes:　　• Identification: Diodes appear as small cylindrical or square-shaped components with a stripe indicating polarity.　　• Function: They allow current flow in one direction, blocking it in the opposite direction.　　4. Transistors:　　• Identification: Transistors come in different shapes (often three-legged), with part numbers indicating their type.　　• Function: They amplify or switch electronic signals, serving as the basic building blocks of electronic devices.　　5. Integrated Circuits (ICs):　　• Identification: ICs are rectangular components with multiple pins. The part number often includes information about the manufacturer and type.　　• Function: ICs integrate various functions (logic, memory, amplification) into a single package.　　6. Inductors:　　• Identification: Inductors resemble wire coils and are labeled with inductance values.　　• Function: They store energy in a magnetic field and resist changes in current flow.　　7. Connectors and Headers:　　• Identification: Connectors are ports or slots for external connections. Headers are sets of pins for internal connections.　　• Function: They facilitate the connection of external components or other PCBs.　　Techniques for Identifying PCB componentsVisual Inspection:　　Markings and Labels: Many components have printed markings indicating their values, part numbers, or manufacturers.　　Physical Characteristics: Size, shape, and color often provide clues about a component’s type and function.　　Multimeter and Testing:　　Resistance Measurement: Use a multimeter in resistance mode to identify resistors and check for their values.　　Capacitance Measurement: Multimeters with capacitance measuring capabilities can identify capacitors.　　Datasheets and Component Manuals:　　Online Resources: Manufacturers provide datasheets detailing component specifications and identification information.　　Component Manuals: Some components have manuals with comprehensive details for identification.　　Challenges and Conclusion　　Identifying PCB components can present challenges due to the sheer diversity of shapes, sizes, and labeling conventions across manufacturers. Furthermore, miniaturization and surface-mount technology have made identification more intricate.　　In conclusion, mastering the identification of PCB components is a foundational skill for electronics enthusiasts, engineers, and technicians. Utilizing a combination of visual inspection, testing tools, datasheets, and experience will empower individuals to decipher the complexities of PCBs, enabling effective troubleshooting, circuit design, and maintenance within the dynamic landscape of electronics.
Key word：
Release time：2023-11-23 13:19 reading：2021 Continue reading>>
<span style='color:red'>Micro</span>soft First In-House AI Chip “Maia” Produced by TSMC’s 5nm
Trade news

Microsoft First In-House AI Chip “Maia” Produced by TSMC’s 5nm

　　On the 15th, Microsoft introducing its first in-house AI chip, “Maia.” This move signifies the entry of the world’s second-largest cloud service provider (CSP) into the domain of self-developed AI chips. Concurrently, Microsoft introduced the cloud computing processor “Cobalt,” set to be deployed alongside Maia in selected Microsoft data centers early next year. Both cutting-edge chips are produced using TSMC’s advanced 5nm process, as reported by UDN News.　　Amidst the global AI fervor, the trend of CSPs developing their own AI chips has gained momentum. Key players like Amazon, Google, and Meta have already ventured into this territory. Microsoft, positioned as the second-largest CSP globally, joined the league on the 15th, unveiling its inaugural self-developed AI chip, Maia, at the annual Ignite developer conference.　　These AI chips developed by CSPs are not intended for external sale; rather, they are exclusively reserved for in-house use. However, given the commanding presence of the top four CSPs in the global market, a significant business opportunity unfolds. Market analysts anticipate that, with the exception of Google—aligned with Samsung for chip production—other major CSPs will likely turn to TSMC for the production of their AI self-developed chips.　　TSMC maintains its consistent policy of not commenting on specific customer products and order details.　　TSMC’s recent earnings call disclosed that 5nm process shipments constituted 37% of Q3 shipments this year, making the most substantial contribution. Having first 5nm plant mass production in 2020, TSMC has introduced various technologies such as N4, N4P, N4X, and N5A in recent years, continually reinforcing its 5nm family capabilities.　　Maia is tailored for processing extensive language models. According to Microsoft, it initially serves the company’s services such as $30 per month AI assistant, “Copilot,” which offers Azure cloud customers a customizable alternative to Nvidia chips.　　Borkar, Corporate VP, Azure Hardware Systems & Infrastructure at Microsoft, revealed that Microsoft has been testing the Maia chip in Bing search engine and Office AI products. Notably, Microsoft has been relying on Nvidia chips for training GPT models in collaboration with OpenAI, and Maia is currently undergoing testing.　　Gulia, Executive VP of Microsoft Cloud and AI Group, emphasized that starting next year, Microsoft customers using Bing, Microsoft 365, and Azure OpenAI services will witness the performance capabilities of Maia.　　While actively advancing its in-house AI chip development, Microsoft underscores its commitment to offering cloud services to Azure customers utilizing the latest flagship chips from Nvidia and AMD, sustaining existing collaborations.　　Regarding the cloud computing processor Cobalt, adopting the Arm architecture with 128 core chip, it boasts capabilities comparable to Intel and AMD. Developed with chip designs from devices like smartphones for enhanced energy efficiency, Cobalt aims to challenge major cloud competitors, including Amazon.
Key word：
Release time：2023-11-17 16:00 reading：2220 Continue reading>>
Top 7 Global RF <span style='color:red'>Micro</span>wave MLCC Manufacturers
Trade news

Top 7 Global RF Microwave MLCC Manufacturers

　　Welcome to the exciting world of RF Microwave MLCC Manufacturers! Get ready to dive into the top 7 global RF microwave MLCC manufacturers who are revolutionizing the industry with their cutting-edge technology and innovative solutions. From delivering superior performance to pushing the boundaries of what’s possible, these manufacturers are leading the way in shaping the future of RF Microwave MLCCs.　　一、Murata　　Murata Manufacturing Co., Ltd. is a Japanese manufacturer of electronic components, based in Nagaokakyo, Kyoto. It produces ceramic passive electronic components, primarily capacitors, and has a majority marketshare worldwide in ceramic filters, high-frequency parts, and sensors.　　As of March 31, 2013 Murata Manufacturing has 24 subsidiaries in Japan and 52 overseas in the United States, Canada, Mexico, Brazil, Germany, France, Italy, the United Kingdom, Switzerland, the Netherlands, Spain, Hungary, Finland, China, Taiwan, South Korea, Singapore, Malaysia, the Philippines, Thailand, Hong Kong, Vietnam and India.　　二、KYOCERA AVX　　KYOCERA AVX is a leading global manufacturer & supplier of advanced electronic components and innovative sensor, control, connectors and antenna solutions.　　KYOCERA AVX has an expansive global footprint comprised of several dozen research, development, and manufacturing facilities spanning more than 15 countries and staffed with talented personnel dedicated to innovation, component quality, and customer service.　　三、Knowles　　Knowles is a market leader and global provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions, serving the consumer electronics, communications, MedTech, defense, electric vehicle, and industrial markets.　　Knowles uses its leading position in SiSonic™ MEMS microphones, balanced armature speakers, and strong capabilities in audio processing technologies to optimize audio systems and improve the user experience in mobile, ear, IoT, computing, and MedTech applications. Knowles is also a leader in high-performance capacitors and RF solutions for a diverse set of markets.　　四、Exxelia　　Exxelia is a leading designer and manufacturer of high-reliability passive components and precision subsystems focusing on highly demanding markets, applications and functions. Exxelia’s product portfolio includes a wide range of capacitors, magnetics, resistors, filters, position sensors, slip rings and high-precision mechanical parts. Products are commonly used for power electronics, power generation, energy storage, and signal filtering functions in numerous leading industrial areas such as aviation, defense, space, medical, railway, oil & gas and telecommunications. Exxelia is valued for its ability to meet complex specifications and develop standard and custom products complying with the most demanding qualifications (MIL, ESA).　　五、Dalicap　　Dalian Dalicap Technology Co., Ltd., located in Dalian of China, one of its famous industrial bases, is a professional enterprise specializing in R&D, manufacturing and sales of multi-layer ceramic capacitors (MLCC). Dalicap is also a leading supplier of Hi-Q, RF/Microwave MLCC applied, especially in the fields of MRI, semiconductor devices, industrial laser equipment, testing and analyzing instruments, high-speed railway and 4G/5G PA etc.　　六、Johanson Technology　　Johanson Technology Incorporated is located in Camarillo, California, and has over twenty-five years of experience specializing in the design and manufacture of high-quality RF and microwave ceramic chip capacitors, inductors and integrated passives.　　JTI previously operated as the Special Products Group of Johanson Dielectrics and in 1993 was separately incorporated to consistently focus its high-frequency expertise in meeting customer needs for specialized and custom ceramic capacitor products as well as embark on research and development of new passive ceramic components for the wireless market sector.　　七、VISHAY　　Vishay Intertechnology, Inc. is an American manufacturer of discrete semiconductors and passive electronic components founded by Polish-born businessman Felix Zandman. Vishay has manufacturing plants in Israel, Asia, Europe, and the Americas where it produces rectifiers, diodes, MOSFETs, optoelectronics, selected integrated circuits, resistors, capacitors, and inductors.　　Vishay is one of the world’s foremost manufacturers of power MOSFETs. They have a wide range of power electronic applications, including portable information appliances, internet communications infrastructure, power integrated circuits, cell phones, and notebook computers.
Key word：
Release time：2023-11-14 10:59 reading：1763 Continue reading>>

Turn to

/ 12

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
model brand To snap up
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code