ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs
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ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs

　　ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.　　In recent years, the rapid electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technological breakthroughs to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.　　The HSDIP20 features an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.　　Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.　　Product Lineup　　*1: Tc=25°C VGS=18V *2: Combines chips with different ON resistances　　*3: Q1, Q4 pins *4: Q2, Q3, Q5, Q6 pins　　Application Examples　　Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.　　◇ Automotive systems　　Onboard chargers, electric compressors and more.　　◇ Industrial equipment　　EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.　　Sales Information　　Pricing: $100/unit (samples, excluding tax)　　Availability: OEM quantities (April 2025)　　Supporting Information　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation under close to actual circuit conditions.　　For more information, please contact AMEYA360 or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　・EcoSIC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Power Factor Correction (PFC)　　A circuit that enhances the power factor by shaping the waveform of input power in the power supply circuit. By using a PFC circuit, the input power is made closer to a sine wave (power factor = 1), improving power conversion efficiency. While PFC circuits typically rely on diode rectification, OBCs often employ active bridge rectification using MOSFETs or bridgeless PFC. This approach is favored because MOSFETs offer lower switching losses, and especially in high power PFCs, using SiC MOSFETs reduces heat generation and power losses.　　LLC Converter　　A type of resonant DC-DC converter known for its high efficiency with low noise power conversion. The name LLC comes from its basic configuration, which combines two inductors (L) and a capacitor (C) in the circuit. By forming a resonant circuit, switching losses are significantly reduced, making it ideal for applications requiring high efficiency, such as OBCs, power supplies for industrial equipment, and server power supplies.
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Release time：2025-04-24 17:23 reading：179 Continue reading>>
ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and AI Servers
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ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and AI Servers

　　ROHM has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers.　　The advancement of high-level data processing technologies and the acceleration of digital transformation have increased the demand for data center servers. At the same time, the number of servers equipped with advanced computing capabilities for AI processing is on the rise and is expected to continue to grow. These servers operate 24 hours a day, 7 days a week – ensuring continuous operation. As a result, conduction losses caused by the ON-resistance of multiple MOSFETs in the power block have a significant impact on system performance and energy efficiency. This becomes particularly evident in AC-DC conversion circuits, where conduction losses make up a substantial portion of total power loss – driving the need for low ON-resistance MOSFETs.　　Additionally, servers equipped with a standard hot-swap function, which allow for the replacement and maintenance of internal boards and storage devices while powered ON, experience a high inrush current during component exchanges. Therefore, to protect server components and MOSFETs from damage, a wide Safe Operating Area (SOA) tolerance is essential.　　To address these challenges, ROHM has developed its new DFN5060-8S package that supports the packaging of a larger die compared to conventional designs, resulting in a lineup of power MOSFETs that achieve industry-leading* low ON-resistance along with wide SOA capability. These new products significantly contribute to improving efficiency and enhancing reliability in server power circuits.　　The new lineup includes three products. The RS7E200BG (30V) is optimized for both secondary-side AC-DC conversion circuits and hot-swap controller (HSC) circuits in 12V power supplies used in high-performance enterprise servers. The RS7N200BH (80V) and RS7N160BH (80V) are ideal for secondary AC-DC conversion circuits in 48V AI server power supplies.　　All three models feature the newly developed DFN5060-8S package (5.0mm × 6.0mm). The package increases the internal die size area by approximately 65% compared to the conventional HSOP8 package (5.0mm × 6.0mm). As a result, the RS7E200BG (30V) and RS7N200BH (80V) achieve ON-resistances of 0.53mΩ and 1.7mΩ (at VGS = 10V), respectively – both of which rank among the best in the industry in the 5.0mm × 6.0mm class, significantly contributing to higher efficiency in server power circuits.　　Moreover, ROHM has optimized the internal clip design to enhance heat dissipation, further improving SOA tolerance, which contributes to ensuring application reliability. Notably, the RS7E200BG (30V) achieves an SOA tolerance of over 70A at a pulse width of 1ms and VDS = 12V, which is twice that of the conventional HSOP8 package MOSFETs under the same conditions, ensuring industry-leading SOA performance in a 5.0mm × 6.0mm footprint.　　Going forward, ROHM plans to gradually begin mass production of power MOSFETs compatible with hot-swap controller circuits for AI servers in 2025, continuing to expand its lineup that contributes to greater efficiency and reliability across a wide range of applications.　　Product Lineup　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Application Examples　　・AC-DC conversion and HSC circuits for 12V high-performance enterprise server power supplies　　・AC-DC conversion circuits for 48V AI server power supplies　　・48V industrial equipment power supplies (i.e. fan motors)　　Terminology　　Low ON-Resistance (RDS(on))　　The resistance value between the Drain and Source of a MOSFET during operation. A smaller RDS(on) results in lower power loss during operation.　　SOA (Safe Operating Area) Tolerance　　The range of voltage and current within which a device can operate safely without damage. Exceeding this range can lead to thermal runaway or device failure, making SOA tolerance a critical factor, especially in applications prone to inrush current or overcurrent.　　Power MOSFET　　A type of MOSFET used for power conversion and switching applications. N-channel MOSFETs are the mainstream choice, as they become conductive when a positive voltage is applied to the gate relative to the source, offering lower ON-resistance and higher efficiency than P-channel variants. Due to their low loss and high-speed switching capabilities, power MOSFETs are widely used in power circuits, motor drive circuits, and inverters.　　Hot-Swap Controller (HSC)　　A specialized integrated circuit (IC) that enables hot-swap functionality, allowing components to be inserted or removed while the power supply system remains active. It plays a crucial role in managing inrush current that occurs during component insertion, protecting both the system and connected components from damage.　　Inrush Current　　A sudden surge of current that momentarily exceeds the rated value when an electronic device is powered ON. Proper control of this current reduces stress on power circuit components, helping to prevent device failure and stabilize the system.
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Release time：2025-04-10 13:10 reading：257 Continue reading>>
Murata Commercializes Broadband-Compatible 1210 inch size, in-vehicle PoC Inductors, Reducing Component Size and Weight
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Murata Commercializes Broadband-Compatible 1210 inch size, in-vehicle PoC Inductors, Reducing Component Size and Weight

　　Murata Manufacturing Co., Ltd. (hereinafter “Murata”) has commercialized the 1210 size in-vehicle PoC inductor LQW32FT_2H series (hereinafter “this product”). 　　With Advanced Driver Assistance Systems (ADAS) becoming more commonplace in recent years, the numbers of high-definition cameras on vehicles are also increasing. High-speed interface PoC*2 that combine both signal and power transmissions on a single coaxial cable are being used on vehicle camera systems with LVDS*1 transmission. In a PoC circuit, a circuit processor handles broadband signals, and usually multiple inductors are used for a wider bandwidth to maintain the high impedance required to separate the signal and the power.　　In response, we applied our proprietary ceramic materials and product structures in order to achieve a high impedance, reducing the number of PoC inductors. This contributes to component size and weight reduction through implementation space reduction.　　Going forward, Murata will strive to develop products to meet market needs and contribute to the shift to high-performance and high-functionality automobiles.　　Specifications　　*1LVDS (Low Voltage Differential Signal): The most general technical standard for the transmission of differential data.　　*2PoC (Power Over Coax): A method that combines the signal line and power line to a single coaxial cable.　　*3AEC-Q200: One of the standards defined by the AEC (Automotive Electronics Council).
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Release time：2025-04-08 14:17 reading：265 Continue reading>>
Supporting up to 1500W motor drive, NSUC1602 from NOVOSENSE easily addresses high current challenges
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Supporting up to 1500W motor drive, NSUC1602 from NOVOSENSE easily addresses high current challenges

　　NOVOSENSE announced the launch of NSUC1602, a high-integration embedded motor control IC, following its introduction of NSUC1610, a small motor driver SoC for automotive applications in early 2023. Compared to the single-chip NSUC1610 that integrates LIN and MOS power stages, NSUC1602 as a SoC, supports an external independent power MOSFET design. This innovative approach enables it to effortlessly address applications requiring higher current.　　In addition, NSUC1602 integrates three half-bridge pre-drivers, expanding the motor control power range to 20W-1,500W. This enhancement not only further optimizes the control performance of BLDC motors, but also better meets the requirements of applications with higher power output. In the realm of xEV, thermal management systems are particularly complex and crucial for ensuring overall vehicle performance. These systems are responsible for managing the temperatures of electric motors, power electronics, and battery, while ensuring optimal comfort for passengers in the cabin. An efficient thermal management system not only helps extend battery life, but also prevents the risks of thermal runaway caused by overheat, thereby safeguarding safe operation of xEVs.　　In the realm of xEV, thermal management systems are particularly complex and crucial for ensuring overall vehicle performance. These systems are responsible for managing the temperatures of electric motors, power electronics, and battery, while ensuring optimal comfort for passengers in the cabin. An efficient thermal management system not only helps extend battery life, but also prevents the risks of thermal runaway caused by overheat, thereby safeguarding safe operation of xEVs.　　To achieve these objectives, thermal management systems rely heavily on precise control of various actuators, such as electric compressor, electronic water pump, oil pump, fan motors, valves, and HVAC control modules. The motors driving these actuators typically need high power output to ensure stable and precise performance under a wide range of operating conditions, thereby meeting the strict requirements of efficient and accurate control for xEV thermal management systems.　　NSUC1602, a highly integrated embedded motor control IC from NOVOSENSE, plays a pivotal role in managing key actuators in xEVs with its exceptional integration features and powerful motor control algorithms. This IC integrates an ARM® Cortex®-M3 core and efficient three-phase pre-driver circuits, and supports more advanced and complex motor control algorithms, such as FOC sensored or sensorless vector control. These advanced algorithms significantly enhance the precision and efficiency of temperature management for motors and electronic devices, providing robust technical support for intelligent three-phase brushless DC motor control applications, including automotive electronic cooling fans and electronic water pumps. Additionally, NSUC1602 incorporates a series of optimization designs to significantly improve overall system efficiency, ensuring stable performance under high-load operating conditions.　　NSUC1602 meets the reliability requirements of AEC-Q100 Grade 0, and operates stably at extreme temperatures (up to 175°C wafer junction temperature). This SoC comes with further enhanced built-in diagnostics and protection functions that ensure high system reliability and comprehensive security protection for users.　　While maintaining a highly integrated design, NSUC1602 also has an optimized power management solution. The LIN port supports ±40V reverse voltage protection, and the BVDD pin supports a withstand voltage range from -0.3V to 40V, allowing direct power supply from a 12V automotive battery. This helps simplify system design and notably reduce development costs.　　NSUC1602 demonstrates extensive applicability for diverse applications. With superior motor control performance, NSUC1602 can play a crucial role in a wide range of BLDC and BDC applications requiring precise temperature control and efficient power transmission, such as automotive electronic water pumps, cooling fans, air conditioning blowers, seat adjustment, sunroof control, or tailgate control. Its optimized power management solution ensures that these devices achieve significant energy consumption reduction and substantial service life extension, while providing exceptional performance.
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Release time：2025-04-07 13:29 reading：322 Continue reading>>
Commercialized high precision agricultural CO2 sensors with superior long-term stability
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Commercialized high precision agricultural CO2 sensors with superior long-term stability

　　Murata Manufacturing Co., Ltd. (hereinafter "Murata") has commercialized "IMG-CA0012-12" (hereinafter "this product"), a case and cable type CO2 sensor. This high precision product primarily connects to environment measurement equipment in agricultural greenhouses and stably measures CO2 concentration. Through linkage with photosynthesis accelerators, this product will contribute to improving crop quality and increasing yield. Additionally, it improves energy efficiency by injecting an optimal amount of CO2 at an optimal timing. Mass production and supply for this product has begun in Hakui Murata Manufacturing.　　In the field of agriculture, increased yield and quality improvement per unit area are required since there is a reduction in yield and decline in quality due to global warming as well as a drop in agricultural worker population. Technology for accelerating crop photosynthesis using CO2 application is an effective means of addressing these challenges. Furthermore, due to the recent increase in energy costs, effective CO2 application based on environmental data measurements is crucial. As a result, high-precision CO2 sensors, which offer long-term stability, require no calibration, and are resistant to malfunction, play a crucial role in photosynthesis accelerator technology.　　This product is equipped with an automatic calibration function that runs on our unique calibration curve algorithm and dual wavelength (for measurement and reference) NDIR*1. Therefore, atmospheric calibration is not required. This ensures high precision and long-term stability, making it maintenance-free. Furthermore, its case and cable type design enhances user handling and ease of installation.　　*1NDIR: Non-Dispersive Infrared Absorption　　Specifications　　CO2 sensors were installed in greenhouses and were used for a year for tomato cultivation and 2 years for rose cultivation. After use, CO2 concentration characteristics and temperature characteristics were evaluated.　　It was discovered that CO2 concentration differences were minimal even when they were used for a long period of time in actual fields.　　CO2 concentration characteristics　　Temperature characteristics
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Release time：2025-04-02 15:44 reading：301 Continue reading>>
Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation A<span style='color:red'>SI</span>L B Automotive Display Systems
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Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.　　As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).　　Renesas’ Automotive Video Signal Processing Expertise　　Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.　　Key Features of the RAA278830　　Dual Open-LDI Input/Output　　ISO 26262 Functional Safety ASIL B rating　　CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path　　Video Diagnostic Capabilities　　Input/Output monitoring of video timing, signal integrity, and content　　Flickering, flashing, occlusion, and glare detection　　Spread Spectrum for lower system level EMI profile　　Image enhancement engine for superior image quality　　Dual host interface: I2C & SPI (configurable)　　SPI-Flash based OSD as well as an embedded font based OSD　　SPI boot capability (boot from SPI Flash, no MCU needed)　　Supports multi-bank for fail-safe OTA updates　　Space-efficient 72SCQFN, 10mm x 10mm　　AEC-Q100 Grade 2 qualified　　“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
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Release time：2025-04-01 14:36 reading：332 Continue reading>>
Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors
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Mazda and ROHM Begin Joint Development of Automotive Components Using Next-Generation Semiconductors

　　Mazda Motor Corporation (hereinafter “Mazda”) and ROHM Co., Ltd. (hereinafter “ROHM”) have commenced joint development of automotive components using gallium nitride (GaN) power semiconductors, which are expected to be the next-generation semiconductors.　　(Left) Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of MAZDA / (Right) Katsumi Azuma, Member of the Board and Senior Managing Executive Officer of ROHM　　Since 2022, Mazda and ROHM have been advancing the joint development of inverters using silicon carbide (SiC) power semiconductors under a collaborative framework for the development and production of electric drive units. Now, they have also embarked on the development of automotive components using GaN power semiconductors, aiming to create innovative automotive components for next-generation electric vehicles.　　GaN is attracting attention as a next-generation material for power semiconductors. Compared to conventional silicon (Si) power semiconductors, GaN can reduce power conversion losses and contribute to the miniaturization of components through high-frequency operation.　　Both companies will collaborate to transform these strengths into a package that considers the entire vehicle, and into solutions that innovate in weight reduction and design. Mazda and ROHM aim to materialize the concept and unveil a demonstration model within FY2025, with practical implementation targeted for FY2027.　　“As the shift towards electrification accelerates in pursuit of carbon neutrality, we are delighted to collaborate with ROHM, which aims to create a sustainable mobility society with its outstanding semiconductor technology and advanced system solution capabilities, in the development and production of automotive components for electric vehicles” said Ichiro Hirose, Director, Senior Managing Executive Officer and CTO of Mazda. “We are excited to work together to create a new value chain that directly connects semiconductor devices and cars. Through collaboration with partners who share our vision, Mazda will continue to deliver products filled with the 'joy of driving' that allows customers to truly enjoy driving, even in electric vehicles.”　　“We are very pleased to collaborate with Mazda, which pursues the 'joy of driving,' in the development of automotive components for electric vehicles” said Katsumi Azuma, Member of the board and Senior Managing Executive Officer of ROHM. “ROHM's EcoGaN™, capable of high-frequency operation, and the control IC that maximizes its performance are key to miniaturization and energy-saving. To implement this in society, collaboration with a wide range of companies is essential, and we have established various partnerships for the development and mass production of GaN. By collaborating with Mazda, which aims to create 'cars that coexist sustainably with the earth and society,' we will understand the requirements for GaN from the perspective of application and final product development, contributing to the spread of GaN power semiconductors and the creation of a sustainable mobility society.”　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
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Release time：2025-03-31 15:46 reading：256 Continue reading>>
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers
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ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

　　ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.　　In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.　　A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.　　The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.　　While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.　　Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.　　Key Specifications　　For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers　　Sales Information        Pricing: $14.50/unit (excluding tax)　　Availability: Now (OEM quantities)　　Application Examples        • A4-sized mobile printers　　• Industrial control label printers　　• Tattoo stencil printers, etc.　　Terminology        dpi (dots per inch)　　A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).　　Thermal Printing Method　　A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.　　Thermal Transfer Printing Method　　A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
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Release time：2025-03-31 15:36 reading：270 Continue reading>>
<span style='color:red'>SI</span>MCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications
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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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Release time：2025-03-20 13:58 reading：242 Continue reading>>
NOVOSENSE Achieves ISO 26262 A<span style='color:red'>SI</span>L D
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NOVOSENSE Achieves ISO 26262 ASIL D "Defined-Practiced" Certification, Reinforcing Automotive Safety Leadership

　　NOVOSENSE Microelectronics today announced it has earned the ISO 26262 ASIL D "Defined-Practiced" certification from TÜV Rheinland, a significant milestone validating the company's robust functional safety management system.　　This achievement confirms NOVOSENSE's successful implementation of functional safety practices in critical automotive applications, including ABS wheel speed sensors and isolated gate drivers. Moving from the "Managed" (system establishment) to the "Defined-Practiced" (system implementation) level signifies a major leap in NOVOSENSE's functional safety capabilities and underscores the maturity of its research and development (R&D) and quality management systems.　　Transitioning from Compliance to Real-World Application　　Since securing the ISO 26262 ASIL D "Managed" certification in December 2021, NOVOSENSE has focused on refining its R&D processes and strengthening its functional safety management. TÜV Rheinland's comprehensive audit assessed various aspects, including functional safety lifecycle management, safety culture, and R&D proficiency. The review specifically examined the practical application of these systems in NOVOSENSE's NSM41xx series wheel speed sensors and the NSI6911 isolated gate driver, confirming the company's systems meet the stringent "Defined-Practiced" standard.　　Key Product Highlights:　　• NSM41xx Series ABS Wheel Speed Sensors: These AMR-based sensors, designed to ISO 26262 ASIL B (D) standards, support ASIL D system-level functional safety. They offer precise wheel speed monitoring for critical systems like ABS, ESP, and EPS, ensuring reliability in demanding conditions. These are currently in mass production.　　• NSI6911 Isolated Gate Driver: Designed for new energy vehicle (NEV) main drives, this ASIL D-compliant driver features a 12-bit high-precision ADC, advanced diagnostics, and an SPI programmable interface. It provides robust driving and protection for SiC MOSFETs and IGBTs, ensuring NEV safety. Samples are now available.　　Commitment to Automotive Excellence　　Automotive applications remain a core focus for NOVOSENSE, driving the company to uphold its "Robust & Reliable" values. Building strong functional safety capabilities is a strategic priority, supported by a comprehensive ISO 26262:2018-compliant development process and a rigorous automotive-grade quality management system.　　As of 2024, NOVOSENSE has shipped over 500 million automotive chips, with automotive business representing more than 35% of its total revenue. Its products are trusted by leading NEV OEMs and Tier-1 suppliers.　　NOVOSENSE aims to be a preferred chip supplier in the global automotive supply chain. Through its strong R&D, reliable quality assurance, proven mass production, and flexible customization, NOVOSENSE delivers high-quality, high-reliability, and high-performance analog and mixed-signal chips, along with comprehensive system-level solutions.
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Release time：2025-03-20 09:57 reading：423 Continue reading>>

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