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ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs

　　ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.　　In recent years, the rapid electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technological breakthroughs to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.　　The HSDIP20 features an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.　　Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.　　Product Lineup　　*1: Tc=25°C VGS=18V *2: Combines chips with different ON resistances　　*3: Q1, Q4 pins *4: Q2, Q3, Q5, Q6 pins　　Application Examples　　Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.　　◇ Automotive systems　　Onboard chargers, electric compressors and more.　　◇ Industrial equipment　　EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.　　Sales Information　　Pricing: $100/unit (samples, excluding tax)　　Availability: OEM quantities (April 2025)　　Supporting Information　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation under close to actual circuit conditions.　　For more information, please contact AMEYA360 or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　・EcoSIC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Power Factor Correction (PFC)　　A circuit that enhances the power factor by shaping the waveform of input power in the power supply circuit. By using a PFC circuit, the input power is made closer to a sine wave (power factor = 1), improving power conversion efficiency. While PFC circuits typically rely on diode rectification, OBCs often employ active bridge rectification using MOSFETs or bridgeless PFC. This approach is favored because MOSFETs offer lower switching losses, and especially in high power PFCs, using SiC MOSFETs reduces heat generation and power losses.　　LLC Converter　　A type of resonant DC-DC converter known for its high efficiency with low noise power conversion. The name LLC comes from its basic configuration, which combines two inductors (L) and a capacitor (C) in the circuit. By forming a resonant circuit, switching losses are significantly reduced, making it ideal for applications requiring high efficiency, such as OBCs, power supplies for industrial equipment, and server power supplies.

Key word：

ROHM

Release time：2025-04-24 17:23 reading：401 Continue reading>>

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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.

Key word：

Fibocom

Release time：2025-03-20 13:55 reading：465 Continue reading>>

SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT <span style='color:red'>modules</span>

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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.

Key word：

Simcom

Release time：2025-03-18 16:38 reading：419 Continue reading>>

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BIWIN Solutions for Communication Modules: High-Speed, Stable, and Built for Seamless Data Flow

　　The Internet of Things (IoT) is on a steep upward trajectory. Statista predicts that by 2025, the world will see a surge of connected IoT devices to 29.422 billion units from 9.757 billion units, with CAGR reaching 11.67%. This explosion isn’t just powering the deployment of more smart gadgets; it’s opening up huge opportunities for hardware and storage tech. At the core of this ecosystem, communication modules serve as the vital link between the physical and digital realms. Their performance directly shapes the efficiency, stability, and security of IoT systems, handling everything from collecting sensor data to transmitting it wirelessly to the cloud or end devices—powering critical functions like remote monitoring and data analysis.　　With the rapid expansion of IoT applications, storage components within communication modules face heightened challenges. They must excel in high-bandwidth data transmission, multitasking concurrency, continuous data streaming over extended periods, efficient and stable data read/write operations, data security protection, and system compatibility to ensure real-time transmission and secure storage of critical data.　　In response to these industry challenges head-on, BIWIN draws on its “integrated R&D and packaging” expertise, along with its expertise from markets such as smartphones and smart wearables, to offer a comprehensive storage solution product matrix for communication modules, including eMMC, LPDDR, eMCP, uMCP, and more. These products have been widely applied to power 5G/4G and smart modules from industry leaders like Quectel, Fibocom, and MeiG Smart, providing solid foundations for the efficient and reliable operations of communication networks.　　01 Tackling Tough Scenarios with Top-Notch Storage　　In practical deployments across fields such as smart metering, industrial applications, routers, automotive systems, and POS machines, communication modules face numerous challenges. Particularly in outdoor environments, harsh weather, extreme temperatures, humidity fluctuations, prolonged continuous operation, and electromagnetic interference can all impact module performance. Any data loss or delay could result in IoT system failures or degraded service quality.　　Taking specific IoT application scenarios as an example, in surveillance systems requiring uninterrupted high-definition video recording, storage components must maintain stable, high-speed read/write performance. To meet these demanding requirements, BIWIN’s storage chips are featured with custom-designed firmware architectures, dynamic SLC caching and unique direct-write solutions, and firmware optimizations for garbage collection and data encryption, contributing to the consistently stable data read/write operations. Testings show that BIWIN’s eMMC products achieve full-disk write speeds exceeding 15MB/s with performance fluctuations below 5%, perfectly aligning with IoT-specific application standards. Additionally, BIWIN’s storage chips support remote firmware upgrades for communication modules, enhancing device operational efficiency.　　On the reliability front, BIWIN’s chips are loaded with cutting-edge packaging technologies like multi-layer die stacking, ultra-thin dies, and heterogeneous multi-chip integration, capable of realizing a perfect balance among performance, durability, and heat management. Meanwhile, the chips have also been tested with rigorous processes, covering electrical testing, signal integrity (SI) testing, reliability testing, and application testing. These chips can withstand gravitational acceleration up to 1500G, vibration amplitudes of 20-2000Hz, and achieve a mean time between failures (MTBF) exceeding 1.5 million hours, ensuring high-quality delivery and consistency across all aspects.　　02 Building a Comprehensive Product Matrix to Provide Efficient and Reliable Storage Support　　With key attributes such as highly stable read/write performance, exceptional reliability and durability, and excellent compatibility, BIWIN’s eMMC, LPDDR4X, eMCP3/4x, and uMCP2.2 series products have earned certifications from mainstream SoC platforms like Qualcomm, MediaTek, and Unisoc. They have been integrated into the supply chains of multiple renowned communication module manufacturers, continuously empowering the stable operation of communication modules.　　In conclusion　　As technologies such as AI, edge computing, 5G/6G, and LPWAN become deeply integrated, the IoT will evolve into more mature and diverse forms, permeating all aspects of life and generating immense demand for data computation, processing, transmission, and storage. Facing this trend, BIWIN will capitalize on its comprehensive strengths in R&D, controller design, packaging and testing, and supply chain management to deepen collaboration with communication module vendors and platform providers, fully addressing the multidimensional customization needs of edge-side communication modules for storage performance, reliability, and stability and jointly accelerating the expansion of IoT application boundaries.

Key word：

BIWIN

Release time：2025-03-13 11:40 reading：732 Continue reading>>

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NOVOSENSE Launches Automotive-Grade High-Side Switches for Body Control Modules and Zone Control Units

　　NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced a range of high-side switches for driving traditional resistive, inductive, and halogen lamp loads in automotive body control modules (BCM) as well as large capacitive loads commonly found in the first-level and second-level power distribution within zone control units (ZCU).　　At time of launch, the NSE34 and NSE35 families includes 26 single-, dual- and quad-channel devices developed for operation across 11 separate load currents intervals (11 A to sub-2 A). These devices have an Rds(on) resistance range from 8 mΩ to 140 mΩ and feature industry-leading load-driving capabilities and advanced diagnostic and protection functions such as advanced over-current protection and over-voltage clamping protection.　　All devices in the two families are fully compliant with multiple automotive standards, including AEC-Q100, AEC-Q100-006, AEC-Q100-012 Grade A, ISO7637, ISO16570 and CISPR25-2021 Class 5.　　Yang WANG, Product Line Marketing Director of NOVOSENSE said: “For electric and autonomous vehicles, body domain controllers have become increasingly important, enabling smart power distribution and functional integration. Indeed, they are essential for many applications, whether in resistive loads such as a seat heater, capacitive or halogen lamp loads for surge-current handling, or inductive loads such as in wipers, solenoids and relays, where it protects against negative voltage spikes.”　　The NSE34 and NSE35 families of high-side switches are available in 14- and 16-pin HSSOP packages measuring 4.9mm x 3.9mm respectively.

Key word：

NOVOSENSE

Release time：2024-11-06 14:11 reading：1404 Continue reading>>

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Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless Modules

　　Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi® 6 Dual Band 2.4GHz to 5GHz and BLUETOOTH® 5.4® Modules are wireless radio modules with integrated Bluetooth BDR/EDR/Low Energy (LE). These modules are designed for highly integrated and cost-effective applications requiring high data rates and low power consumption. The PAN9019/PAN9019A features integrated power management, a dual-core CPU, 802.11i security standard support, and high-speed data interfaces. The modules provide a combination of Wi-Fi, Bluetooth, and 802.15.4 wireless connectivity, allowing for high throughput applications and enhanced flexibility. Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi 6 Dual Band 2.4GHz to 5GHz and Bluetooth 5.4 Modules are available in an M.2 form factor for use with host processors as an evaluation tool using an M.2 Key E socket.FEATURES　　Dual-band 2.4GHz to 5GHz 802.11a/b/g/n/ac/ax Wi-Fi, Bluetooth, and 802.15.41 combo module　　Supports WPA3 security　　Secured boot and firmware　　802.11e quality of service supported for multimedia application　　IEEE 802.11ax, 1x1 spatial stream with up to 600Mbps data rate　　OFDMA (UL/DL) and MU-MIMO (UL/DL)　　Bluetooth 5.4 (LE and long range)　　WCI-2- and 5-wire PTA coexistence interfaces　　SDIO 3.0, high-speed UART, and SPI2 for host processor connection general interfaces　　OS driver support for RTOS, Linux, and Android　　Available in M.2 form for evaluation with host processor using an M.2 Key E socket　　SPECIFICATIONS　　PAN9019　　NXP IW611 WLAN 2.4GHz and 5GHz, Bluetooth single-chip solution inside　　PAN9019A　　NXP IW612 WLAN 2.4GHz and 5GHz, Bluetooth and 802.15.4 single-chip solution inside　　15.3mm x 12mm x 2.5mm SMT package size　　-98dBm Rx sensitivity at IEEE 802.11b　　IEEE 802.11ax 20MHz, 40MHz, 80MHz channel bandwidth　　1.8V to 3.3V power supply range　　-40°C to +85°C operating temperature range　　BLOCK DIAGRAM　　PRODUCT OVERVIEW

Key word：

Panasonic

Release time：2024-07-15 14:05 reading：1188 Continue reading>>

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Nidec to Expand Its Production Capacity for Water-cooling Modules

　　Nidec Corporation (TSE: 6594; OTC US: NJDCY) (“Nidec” or the “Company”) today announced that it will enhance its CDU (Coolant Distribution Unit) production line in Thailand, the Company’s manufacturing base for water-cooling modules for servers, to increase the factory’s monthly CDU production capacity from 200 to 2,000 units by June 2024.　　Nidec’s water-cooling module　　The CDU production capacity expansion is in response to the adoption by Supermicro, an American AI server manufacturer. The jointly developed with Supermicro 100 to 250 kW products will be manufactured at the Ayutthaya Plant in Thailand, where the existing line has been expanded.　　So far, the fan-based air-cooling method has mainly been employed for computing servers in data centers, research institutes, and other similar facilities. However, in AI, the market expected to grow going forward, semiconductor-based arithmetic units (CPUs and GPUs) that utilize AI to process learning information with big data generate significantly more heat than their predecessors. Thus, as the air-cooling method, which relies on air-conditioning equipment, is insufficient to cool a myriad of servers lined up in a building. This is why the water-cooling system, whose cooling capability is far superior to the air-cooling system’s, is expected to become indispensable in the future.　　As the water-cooling module market is forecast to continue its growth, Nidec intends to expand its monthly CDU production capacity to more than 3,000 units in the future, while expecting the size of related products’ markets to be 10 billion yen in FY2023, and more than 80 billion yen in FY2024.　　Nidec’s cooling systems employ a liquid-to-liquid method, where cooling modules installed in each server supply cooling water via metal pipes to directly cool each server’s computing devices. The systems comprise a CDU (coolant distribution unit), a cooling water distributor; a CDM (coolant distribution manifold), a cooling water piping; and an LCM (liquid cooling module), a water-cooling module.　　The aforementioned product features the redundancy of its pumps, electricity sources, circuit substrates, and other important units, which are all in pairs to improve the system’s reliability. Additionally, those units are replaceable even during maintenance, without stopping its cooling system, to keep the server operating (a hot-swap functionality).　　To contribute to the development of the world’s AI, Nidec stays committed to working as a comprehensive thermal solution manufacturer to provide products that perfectly reflect people’s needs. By offering proposals a step ahead of the competition, and with an enhanced lineup of its high-reliability products, Nidec presses ahead to become a market leader.

Key word：

Nidec

Release time：2024-04-22 14:27 reading：1558 Continue reading>>

TAIYO YUDEN EYSPBNZUA series Bluetooth® 5.2 <span style='color:red'>modules</span>

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TAIYO YUDEN EYSPBNZUA series Bluetooth® 5.2 modules

　　TAIYO YUDEN EYSPBNZUA is a long range, low power consumption module with the latest Bluetooth® Core Specification version 5.2. Based off the powerful Nordic nRF52833 chipset, EYSPBNZUA is a certified module with an onboard antenna to reduce time to market. Featuring an extended temperature range and low cost, for supporting the latest designs in IoT, smart home, and smart wearable markets.　　Features　　Bluetooth® Version: 5.2 (support: 2M/1M/500k/125kbps/AoA/AoD)　　Single Mode Bluetooth® low energy/802.15.4 radio support　　ARM® Cortex M4F 32bit processor and 512KB flash and 128KB RAM　　Integrated high performance antenna　　Bluetooth® and Japan, FCC, ISED qualified　　Integrated System clock/sleep clock　　Applications　　Smart home sensors and controllers　　Industrial IoT sensors and controllers　　LED lighting　　Smart watches　　Health/fitness sensor and monitor devices　　Wireless payment enabled devices　　Interactive entertainment devices　　Advanced computer peripherals

Key word：

TAIYO YUDEN

Release time：2023-11-24 15:42 reading：3191 Continue reading>>

Murata and MobileKnowledge partnership brings accurate UWB position detection <span style='color:red'>modules</span> to complete and powerful UWB development kits

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Murata and MobileKnowledge partnership brings accurate UWB position detection modules to complete and powerful UWB development kits

　　Murata is pleased to announce its partnership with MobileKnowledge, combining market-leading Ultra-wideband (UWB) expertise with a range of comprehensive products and in-depth customer support. MobileKnowledge’s UWB development kits provide the most comprehensive and powerful tools to evaluate and design solutions for accurate position detection in IoT devices, leveraging NXP’s UWB TrimensionTM technology.　　MobileKnowledge is an expert UWB engineering consultant and the market leader in UWB development kits offering a wide variety of tools, created to meet the demands and needs of specific segments of the IoT ecosystem. The MK UWB Kit SR150/SR040 is the most comprehensive reference design and development platform for UWB-based IoT solutions. The MK UWB Kit Mobile Edition is the first development kit that allows users to evaluate UWB interoperability with Apple® and AndroidTM mobile devices. The MK UWB Kit RTLS supports the deployment of accurate indoor localization systems using Time Difference of Arrival (TDoA) technique.　　Each kit features ready-to-run demonstration apps, reference hardware including Arduino compatible development boards, 3D Angle of Arrival (AoA) support and reference software examples to enable fast prototyping with minimal effort. In this new partnership, MobileKnowledge and Murata will also develop specific IoT reference use cases to accelerate the adoption of UWB technology in the IoT ecosystem.　　MobileKnowledge will offer UWB development kits integrating the Murata Type 2BP and Type 2DK NXP based modules. As the world’s smallest UWB module, the Type 2BP features NXP’s TrimensionTM SR150 UWB chipset, providing enhanced and secure ranging with 3D AoA. Designed for deployment in both larger infrastructures, such as indoor positioning anchors, and in consumer products like game consoles, Type 2BP is a perfect match for MobileKnowledge’s versatile solutions.　　The Type 2DK is designed with minimal power draw in mind, enabling integration across several portable devices. Leveraging on NXP’s TrimensionTM SR040 UWB chipset and QN9090’s (Bluetooth® LE + MCU chipset) efficient power management, the Type 2DK can run off a single coin-cell battery. The combined UWB and Bluetooth® LE capabilities of Type 2DK make it ideal for location tags, such as personal and asset trackers, supporting the latest market requirements.　　The flexibility provided by both modules, combined with Murata’s technical expertise, helps customers meet the evolving requirements of UWB for IoT. Both the Type 2BP and Type 2DK modules control PHY/MAC operation within the IC in accordance with the FiRa™ Consortium specifications, ensuring interoperability with the growing IoT ecosystem.　　“Throughout the design process of the UWB modules, “ said Rui Ramalho, , Product Manager, Connectivity Module for Murata, “it was vital that the end products offered easy integration, high levels of reliability and unmatched flexibility. MobileKnowledge’s all-in-one platform is a perfect fit for both the Type 2DK and 2BP, and we are excited to see the future implementations of our modules”.　　Pedro Martinez, CEO of MobileKnowledge, stated: “In partnering with Murata for our MK UWB Kits, we can use both their extensive wireless communication portfolio and knowledge as well as their manufacturing dependability and strong IoT market presence to provide the highest quality development solutions and increase our visibility to IoT solution providers. MobileKnowledge UWB development kits have already helped our customers to integrate accurate positioning in numerous IoT applications. Now with Murata’s innovative modules and technical experience, they will have access to the latest hardware, development tools and reference IoT use cases.”

Key word：

Murata

Release time：2023-09-18 16:11 reading：2462 Continue reading>>

Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G <span style='color:red'>modules</span> at MWC Shanghai 2023

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Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

　　During MWC Shanghai 2023, Fibocom introduces the cutting-edge 5G FWA solution embedded with 3GPP Release 17 compliant modules FG190 and FG180, with the advanced and scalable configurations, the solution ensures the smooth escalation of 5G FWA applications towards 10 Gigabits era, especially crucial for CPE and mobile hot-spot use cases.　　a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.　　As 5G technology has improved, mobile broadband service providers are no longer limited to older technologies, mobile data subscriptions associated with mobile phones, dongles or even hot-spot devices are looking for agile and high data throughput network connectivity solutions. The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180. The 5G CPE solution is architected with a set of rich interfaces plus flexible dual-band/tri-band Wi-Fi 7 combinations. For example, an FG190 can simultaneously connect three PCIe and two USXGMII ports, in addition to the Wi-Fi 7 selections, CPE customers can adjust the combinations between QFW7114 and QFW7124 to utilize the band capacity from maximum BE21000 to BE5000. Regarding the wired configurations, either the10GbE+2.5GbE or 2.5GbE+2.5GbE could be the most recommendable and efficient options to unleash the full potential of cable access.　　However, the solution for 5G mobile hot spot offers a range of top-quality wireless performance to mobile scenarios. In the support of a highly integrated WCN7851 chip, the multi-channel options will be utilized efficiently to increase the data rate, depending on the requirements, the dual-band options can be switched to 2.4GHz/5GHz/6GHz to achieve maximum throughput up to BE5800. The seamless Wi-Fi 7 connectivity is also benefiting from the contribution of MLO (Multi-Link Operation) and 4K QAM modulation schemes, offering a highly reliable connectivity service, especially in congested environments like airport terminals, sports venues, and hospitals, etc.　　In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.　　Powered by the Snapdragon® X75 and X72 5G Modem-RF System, Fibocom FG190 and FG180 is compliant with 3GPP Release 17 and equipped with a quad-core A55 CPU to enable a lightning-fast and ultra-reliable 5G network experience. With Snapdragon®X75, Fibocom FG190 supports 5G Sub-6GHz and mmWave dual-connectivity, thus capable of NR 10CA with up to 1000MHz bandwidth in the mmWave spectrum, and NR5CA with up to 300MHz bandwidth in the Sub-6GHz, significantly elevating the maximum downlink speed to 10Gbps. Followed by the FG180, the module integrated with Snapdragon® X72, offers an agile solution for various 5G FWA customers by supporting up to 400MHz bandwidth of NR 4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz. Both FG190 and FG180 are adopting LGA form factors, therefore making both modules the ideal wireless solution for a diversified FWA market.

Key word：

Fibocom

Release time：2023-09-12 10:52 reading：3473 Continue reading>>

model	brand	Quote
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies

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