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Hangshun chip: the world's highest technology 40nm NOR Flash mass production HK25Q20

　　The HK25Q20 (2M-Bit) serial flash supports the standard Serial Peripheral Interface (SPI)，and supports the Dual SPI: Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO)，I/O2 。The Dual I/O & Dual output data is transferred with Maximum speed of 208Mbits/s。　　FEATURES　　SPI Flash Meories　　– Densities: 2Mbit　　– Standard SPI: SCLK, /CS, SI, SO　　– Dual SPI: SCLK, /CS, IO0, IO1　　Highest Performance Serial Flash　　– 104MHz for fast read　　– Dual I/O Data transfer up to 208Mbits/s　　– Minimum 100,000 Program/Erase Cycles　　– More than 20-year data retention　　Low Power Consumption　　– Single 2.3V to 3.6V supply　　– 0.4μA standby current　　– 0.2μA deep power down current　　– 1.5mA active read current at 33MHz　　– 3.0mA active program or erase current　　Flexible Architecture　　– Uniform 256-byte Page Erase　　– Uniform 4K-byte Sector Erase　　– Uniform 32/64K-byte Block Erase　　– Program 1 to 256 byte per programmable page　　Fast Program and Erase Speed　　– 2ms page program time　　– 15ms page erase time　　– 15ms 4K-byte sector erase time　　– 15ms 32K/64K-byte block erase time　　Advanced Security Features　　– 128-Bit Unique ID for each device　　– 1*256-Byte Security Registers with OTP Locks　　Package Information　　– SOP8　　– USON8 (3x2 mm)　　– USON8(1.5x1.5mm)　　– USON6(1.2x1.2mm)　　– TSSOP8　　– KGD

Key word：

HK25Q20,Hangshun chip

Release time：2023-02-24 10:30 reading：7215 Continue reading>>

Applications

Plessey to demonstrate AR/VR glasses powered by microLEDs at CES

　　Next month's CES in Las Vegas will see Plessey demonstrate the first AR and VR glasses powered by microLEDs.　　The next generation of Vuzix smart glasses will be demonstrated using technology that ditches OLEDs in favour of microLED displays. Vuzix is the first company to present Plessey’s microLEDs in action for AR applications.　　Plessey says that its microLEDs offer 10 times the resolution, 100 times the contrast ratio, and up to 1,000 times the luminance of traditional OLEDs. This has been achieved by using just half the power consumption, doubling battery life in portable headsets.　　These benefits have been recognised by the Consumer Technology Association (CTA), owner and producer of CES, which has named Plessey a CES 2019 Innovation Awards Honoree in the Embedded Technologies category.　　Commenting Mike Lee, President of Corporate and Business Development at Plessey, said: “We’re looking forward to previewing the AR, VR and head-up display experience that microLEDs are set to create at CES. Compared with all other display technologies, microLEDs are brighter, smaller, lighter, more energy-efficient, and have a longer operating life.”　　Plessey microLEDs are developed using a scalable and economical, repeatable GaN-on-Silicon monolithic process that guarantees uniformly high quality and performance. This pioneering process has succeeded in eliminating the problems associated with the pick-an-place microLED display manufacturing techniques currently being used by other companies.　　According to Plessey, microLEDs are also about to have a huge impact on the design of pico- and micro-projectors. Here, microLED illuminators enable the form factor to be cut by 40% and optical efficiency boosted by 50%. The projects not only become smaller and lighter but they need less battery power and deliver higher quality images in every respect: brightness, resolution and contrast ratio. DMD (including DLP) and LCOS technologies are about to go the way of the cathode ray tube.　　Other demonstrations on the Plessey booth will include a 0.7 inch 1080p microLED comprising separate red, green and blue panels, and an addressable blue 0.7 inch microLED display running 1080p video.

Key word：

AR/VR

Release time：2019-01-03 00:00 reading：9698 Continue reading>>

Applications

New standards provide public assurance on safety, security and etiquette for use of drones

　　The first ever worldwide standards for the drone industry are being released by the International Standards Organisation (ISO).　　After several years of global collaboration between standards institutions from across the world, the long-awaited drone standards have been developed.　　These regulations are expected to trigger rapid acceleration of growth within the drone industry as organisations throughout the world are galvanised to adopt drone technology against a new background of reassurance on safety and security. The new standards will play an essential role in guiding how drones are used safely and effectively in a framework of regulatory compliance.　　The ISO Draft International Standards for Drone Operations have been formally released today (21 November 2018) for public consultation, with drone professionals, academics, businesses and the general public being invited to submit comments by 21 Jan 2019. Final adoption of these Standards can be expected in the US, UK and worldwide next year.　　The announcement is the first important step in the standardisation of the global drone industry, encompassing applications for all environments - surface, underwater, air and space. Today’s standards are particularly significant for the general public and Government, in that they address Operational Requirements of the more recognised and prevalent aerial drones, including protocols on safety, security and overall etiquette for the use of drones, which will shape regulation and legislation going forward. They are the first in a four part series for aerial drones, with the next three addressing General Specifications, Manufacturing Quality and Unmanned Traffic Management (UTM).　　Air safety　　A prime characteristic of the ISO Standards announced today, is their focus on air safety, which is at the forefront of public attention in connection with airports and other sensitive locations. The new standards act as a new etiquette for drones which promote and reinforce compliance regarding no-fly zones, local regulation, flight log protocols, maintenance, training and flight planning documentation. Social responsibility is also at the heart of the standards, strengthening the responsible use of a technology that aims to improve and not obstruct everyday life. The effectiveness of the standards in improving air safety will be further strengthened by the rapid development of geo-fencing and of counter-drone technology, providing frontline protection against ‘rogue’ drone use.　　Privacy and data protection　　The standards are also set to address public concerns surrounding privacy and data protection, demanding that operators must have appropriate systems to handle data alongside communications and control planning when flying. The hardware and software of all related operating equipment must also be kept up to date. Significantly, the fail-safe of human intervention is required for all drone flights, including autonomous operations, ensuring that drone operators are accountable.

Key word：

Robot drone

Release time：2018-12-03 00:00 reading：5296 Continue reading>>

Applications

UltraSoC launches “any processor” lockstep solution for safety-critical systems

　　UltraSoC has launched the Lockstep Monitor, a hardware-based, scalable solution, that helps functional safety by checking that the cores at the heart of a critical system are operating reliably, safely and securely.　　UltraSoC’s flexible IP supports all common lockstep/redundancy architectures, including full dual-redundant lockstep, split/lock, master/checker, and voting with any number of cores or subsystems.　　The Lockstep Monitor can support any processor architecture or other subsystem, including custom logic or accelerators. Lockstep operation is needed for safety standards such as ISO26262 for automotive, IEC 61508, EN50126/8/9 and CE 402/2013.　　The Monitor consists of a set of configurable semiconductor IP (SIP) blocks that are protocol aware and can be used to cross-check outputs, bus transactions, code execution and even register states, between two or more redundant systems. It can be used with any processor architecture, including those – such as the emerging RISC-V architecture – which lack native support for lockstep configurations. In addition to traditional processor cores, it can also check other subsystems or accelerators. Because it is implemented in hardware, it responds at wire speed and imposes no execution overhead on the host system.　　Unlike more traditional approaches, the Lockstep Monitor includes flexible, run-time configurable embedded intelligence, allowing the SoC designer to tailor the monitoring and response system precisely to the application.　　Monitoring can be implemented at a variety of levels of granularity: at the subsystem level (comparing the outputs of the two processors); at the transaction level (for example comparing bus traffic); at the instruction level, using UltraSoC’s advanced instruction trace capability; and at the most fundamental hardware-level, checking processor internal states or register contents.　　By embedding intelligence in the system, UltraSoC also allows more sophisticated comparisons between the operation of the lockstep processors than can be achieved with traditional solutions.　　RISC-V is gaining increasing traction in safety-critical applications, particularly in the automotive industry. However, the RISC-V ecosystem lacks support for the functional safety and security principles – such as lockstep operation – mandated by global standards such as ISO26262 for functional safety, J3061 for cybersecurity, IEC 61508, EN50126/8/9 and CE 402/2013.　　UltraSoC’s Lockstep Monitor allows any RISC-V system, whether using open source or commercial cores, to incorporate sophisticated safety capabilities.　　Lockstep systems employ two or more processor subsystems running the same code in a redundant backup configuration. The cores may be clock-cycle synchronised, or offset by a small number of cycles, an arrangement that protects against transient errors in the surrounding system.The outputs, code execution or bus traffic from the subsystems are compared and if the results differ, an error can be signalled. Lockstep systems with two processors are typically configured in a ‘master/checker’ arrangement; those with more than two processors may use ‘voting’ or other redundancy schemes.　　More sophisticated “split/lock” processor arrangements may allow the lockstep function to be dynamically engaged and disengaged, allowing the cores to run in redundant mode or to run different code for higher performance.

Key word：

safety-critical

Release time：2018-12-03 00:00 reading：7976 Continue reading>>

Applications

World’s first TPM for cybersecurity in the connected car

　　Infineon Technologies says it is enabling a “crucial” step toward greater cybersecurity in the connected car, as the world’s first semiconductor manufacturer to put a Trusted Platform Module (TPM) specifically for automotive applications on the market.　　The OPTIGA TPM 2.0 is designed to protect communication between the car manufacturer and the vehicle which increasingly turns into a computer on wheels.　　Mobility of the future requires the exchange of huge volumes of data. Cars send real-time traffic information to the cloud or receive updates from the manufacturer “over the air”, for example to update software quickly and in a cost-effective manner. The senders and recipients of that data, whether car makers or individual components in the car, require cryptographic security keys to authenticate themselves.　　By using TPM, Infineon says car manufacturers can incorporate sensitive security keys for assigning access rights, authentication and data encryption in the car in a protected way. The TPM can also be updated so that the level of security can be kept up to date throughout the vehicle’s service life. The critical keys are particularly protected against logical and physical attacks in the OPTIGA TPM as if they were in a safe.　　Furthermore, incorporating the first or initial key into the vehicle is a particularly sensitive moment for car makers. When the TPM is used, this step can be carried out in Infineon’s certified production environment. After that, the keys are protected against unauthorised access; there is no need for further special security precautions throughout the various stages of the – often globally distributed – value chain.　　The TPM likewise generates, stores and administers further security keys for communication within the vehicle. And it is also used to detect faulty or manipulated software and components in the vehicle and initiate troubleshooting by the manufacturer in such a case.　　Whereas a vehicle has an average service life time of 12 to 15 years, security features and algorithms keep on being developed and enhanced on a continuous basis. The TPM’s firmware can be updated by remote access so the security it offers can be kept up-to-date – including the cryptographic mechanisms (cryptoagility).　　The OPTIGA TPM 2.0 SLI 9670 from Infineon is a plug & play solution for automotive applications. It is especially suited for use in a central gateway, the telematics unit or the infotainment system of the vehicle.　　The SLI 9670 consists of an attack-resistant security chip and high-performance firmware developed in accordance with the latest security standard. The firmware enables immediate use of security features, such as encryption, decryption, signing and verification.　　According to Infineon, the TPM can be integrated quickly and easily in the system thanks to the open source software stack (TSS stack) for the host processor, which is also provided by Infineon. It has an SPI interface, an extended temperature range from -40°C to 105°C and the advanced encryption algorithms RSA-2048, ECC-256 and SHA-256.　　The new TPM complies with the internationally acknowledged Trusted Computing Group TPM 2.0 standard, is certified for security according to Common Criteria and is qualified in accordance with the automotive standard AEC-Q100. It is available now available and manufactured in security-certified production facilities of Infineon Germany and the Philippines.

Key word：

Vehicle electronics

Release time：2018-10-31 00:00 reading：3274 Continue reading>>

Applications

Whiskers, surface growth and dendrites in lithium batteries

　　Assistant Professor Pen Bai from Washington University in St. Louis has identified three key current boundaries when it comes to creating energy-dense lithium metal batteries. According to the Assist Prof, engineers had been looking for one solution to what turns out to be three problems.　　Figure A　　A lithium-ion battery is made of three layers: one layer of low-voltage material (graphite) called the anode; one of high-voltage material (lithium cobalt oxide) called the cathode; and a layer of porous plastic which separates the two.　　The separator is wetted by a liquid called an electrolyte. When the battery discharges, lithium-ions empty out of the anode, passing through the liquid electrolyte, and move into the cathode. The process is reversed as the battery charges.　　"With half of the lithium-ion-hosting electrode materials empty at all times," Assist Prof. Bai said, "you are wasting half of your space."　　Engineers have known that they could build a more energy-dense battery (a smaller battery with a similar output capabilities) by discarding some of the dead weight that comes with half of the host materials always being empty. They have been minimally successful by removing the graphite anode, then reducing the lithium-ions with electrons during recharge, a process which forms a thin plating of lithium metal.　　"The problem is that the lithium metal plating is not uniform," Assist Prof. Bai said. "It can grow 'fingers.'”　　Researchers have referred to these fingers as "dendrites." As they spread from the lithium metal plating, they can penetrate the separator in the battery, leading to a short circuit.　　But not all fingers are the same. "If you call them all dendrites, you're looking for one solution to solve actually three problems, which is impossible," Assist Prof. Bai said. "That's why after so many years this problem has never been solved."　　His team has identified three distinct types of fingers, or growth modes, in these lithium metal anodes. They also outline at which current each growth mode appears.　　"If you use very high current, it builds at the tip to produce a treelike structure," Bai said. Those are "true dendrites" (see Figure A). Below the lower limit you have whiskers growing from the root (see Figure B). 　　Figure B　　And, within those two limits there exists the dynamic transition from whiskers to dendrites, which Assist Prof. Bai calls "surface growth" (see Figure C).　　These growths are all related to the competing reactions in the region between the liquid electrolyte and the metal deposits.　　The study found that a nanoporous ceramic separator can block whiskers up to a certain current density, after which surface growths can slowly penetrate the separator. With a strong enough current, true dendrites form, which can easily and very quickly penetrate the separator to short the battery.　　At this point, Assist Prof. Bai said, "Our unique transparent cell revealed that the voltage of battery could look quite normal, even though the separator has been penetrated by a lithium metal filament. Without seeing what is happening inside, you could be easily fooled by the seemingly reasonable voltage, but, really, your battery has already failed."　　Figure C　　In order to build a safe, efficient, reliable battery with a lithium metal anode, the three growth modes need to be controlled by three different methods.　　This will be a challenge considering consumers want batteries that can store more energy, and at the same time want them to be charged more quickly. The combination of these two inevitably yields a higher and higher charging current, which may exceed one of the critical currents identified by Assist Prof. Bai's team.　　Moreover, batteries can degrade, and when they do, the critical currents identified for the fresh battery no longer apply; the threshold becomes lower. At that point, given the same fast charge current, there's a higher likelihood that the battery will short.　　"Battery operation is highly dynamic, in a very wide range of currents. Yet its disposition varies dramatically along the cycle life,” Assist Prof. Bai said. "That is why this becomes necessary."

Key word：

Whiskers

Release time：2018-10-31 00:00 reading：2806 Continue reading>>

Applications

Next-generation quantum communications technology under development

　　Part of the European Quantum Flagship initiative, the Fraunhofer HHI is developing a range of optical integration solutions.　　Part of the UNIQORN project, the Institute is looking to develop quantum technologies suitable for the mass market and, to that end, has developed a hybrid photonic integration platform. The PolyBoard enables the flexible and efficient combination of various optical functionalities on a single chip.　　This toolbox will be further developed in the coming years as part of the "Quantum Flagship" of the European Union to meet the specific requirements of quantum technologies.　　The project UNIQORN (Affordable Quantum Communication for Everyone: Revolutionizing the Quantum Ecosystem from Fabrication to Application) has set itself the goal of miniaturising quantum technologies using photonic integration and making them available to users as system-on-chip solutions.　　The project will develop the key components for the quantum communications systems of the future and an important focus of the research is on integrated system-on-chip solutions. They are the basis for highly miniaturised optical systems that can fully exploit quantum mechanical properties such as entanglement and squeezed light.　　The core of this integration is the micro-optical bench technology of the PolyBoard platform, which makes it possible to combine large, millimeter size, optical components such as crystals for generating entangled photons with typically sub-millimeter sized integrated optical components and functionalities on a PolyBoard chip.　　It is based on the generation of free-space optical areas inside photonic integrated chips with the help of specially adapted lenses.　　As a result, known material systems for quantum technology can be combined directly with photonic integrated circuits, without having to compromise on the performance of the micro-optical components.　　So far, this technology facilitated the development of miniaturized optical components for telecom and datacom applications as well as micro-optical chips for analytics and sensor technology.　　In the UNIQORN consortium, which is coordinated by the AIT (Austrian Institute of Technology), 17 partners from all over Europe are working on a multidisciplinary research agenda. Research institutes (AIT, Fraunhofer HHI, Interuniversity Microelectronics Center) with many years of experience in the transfer of academic basic research into industrial applications will work with quantum researchers with theoretical and experimental know how (University of Vienna, University of Paderborn, University of Innsbruck, Technical University of Denmark).　　The project can also draw on photonics and electronics as well as integration and packaging expertise (Eindhoven University of Technology, Micro-Photon Devices, Politecnico Milano, Smart Photonics, Institute of Computer and Communication Systems of Athens, VPI Photonics, Cordon Electronics).　　The perspective of the industrial end users is being introduced by the system provider Mellanox and the operator Cosmote. Field evaluation will be conducted in a Smart City test environment operated by the University of Bristol.

Key word：

Communications technology

Release time：2018-09-18 00:00 reading：3198 Continue reading>>

Applications

Developers of ChibiOS-based designs can now leverage HCC’s suite of middleware

　　HCC Embedded (HCC), specialists in software for securely storing and communicating embedded data, has extended the range of platforms supported within its Advanced Embedded Framework to include the ChibiOS real time operating system (RTOS).　　Embedded developers can now add HCC Embedded’s communications, security, and flash file system software to a variety of complex ChibiOS-based designs to reduce time to market and improve product reliability.　　“ChibiOS is a compact and flexible pre-emptive embedded RTOS, freely available under a GPL license and is widely used on many 32-bit embedded MCUs,” said Giovanni Di Sirio, developer of ChibiOS. “As with many embedded systems, the challenge for developers is to achieve high performance and verifiable quality while guaranteeing reliable operation. HCC’s focus on reliability and quality ensures this can be achieved in even the most complex areas of any application.”　　“Many embedded software components fail to provide sufficient quality assurance,” said HCC Embedded CEO Dave Hughes. “For example, numerous file systems and flash management software products fall short of ensuring the reliable and safe storage of data, and a number of network stacks on the market are vulnerable to security risks and denial-of-service attacks. To help customers avoid such problems, HCC enables them to augment their chosen RTOS with high-quality embedded components that are fully documented and supported by the team that developed them. This is critical for building cost-effective and reliable products.”　　HCC middleware is designed to be independent and portable, meaning that it works with any embedded processor and provides support for any RTOS or scheduler. HCC’s networking and storage solutions include TCP/IPv4 and IPv6 networking stacks; CryptoCore security; and MQTT, SNMP, and TLS/DTLS software modules, all of which are developed with rigorous MISRA adherence.　　HCC’s range of high-performance, fail-safe file systems and Flash Translation Layer (FTL) solutions guarantee the integrity of the file system and its data while managing any type of flash media such as NAND, NOR, and eMMC. With this range of commercial peripherals and software components, designers can choose the components they need and put them together in a reliable and consistent way to build a variety of ChibiOS-based products to the same, high-quality standard every time.

Key word：

Intelligent hardware

Release time：2018-09-18 00:00 reading：1972 Continue reading>>

Applications

Piezoelectric energy harvester in wearable device

　　A wearable device that can generate enough power to run a personal health monitoring system through body movements alone, has been created by a team of researchers from Penn State's Materials Research Institute and the University of Utah.　　"The devices we make using our optimised materials run somewhere between 5 and 50 times better than anything else that's been reported," said Professor Susan Trolier-McKinstry of Penn State.　　Prof. Trolier-McKinstry and her former doctoral student, Hong Goo Yeo, used the piezoelectric material known as PZT; coating it on both sides of a flexible metal foil to a thickness four or five times greater than in previous devices. Greater volume of the active material equates to generation of more power. By orienting the film's crystal structure to optimise polarisation, the performance - known as the figure of merit - of energy harvesting was increased. The compressive stresses that are created in the film as it is grown on the flexible metal foils also means that the PZT films can sustain high strains without cracking, making for more robust devices.　　"There were some good materials science challenges," Prof. Trolier-McKinstry said. "The first was how to get the film thickness high on a flexible metal foil. Then we needed to get the proper crystal orientation in order to get the strongest piezoelectric effect."　　Collaborators at the University of Utah and in Penn State's Department of Mechanical Engineering designed a wristwatch-like device that incorporates the PZT/metal foil materials. The device uses a freely rotating, eccentric brass rotor with a magnet embedded, and multiple PZT beams with a magnet on each beam. When the magnet on the rotor approaches one of the beams, the magnets repel each other and deflect the beam, plucking the beam in a process that is referred to as frequency up-conversion. The slow frequency of a rotating wrist is converted into a higher frequency oscillation. The design of this device is more efficient than a standard electromagnetic harvester - like those used in self-powered watches - according to Prof. Trolier-McKinstry.　　In future work, the team believes they can double the power output using the cold sintering process, a low-temperature synthesis technology developed at Penn State. In addition, the researchers are working on adding a magnetic component to the current mechanical harvester to scavenge energy over a larger portion of the day when there is no physical activity.

Key word：

wearable device

Release time：2018-09-18 00:00 reading：3157 Continue reading>>

Applications

High-capacity sodium-ion could replace lithium in rechargeable batteries

　　Scientists of the University of Birmingham are paving the way to swap the lithium in lithium-ion batteries (LIB) with sodium.　　With a rising demand for electric vehicles (EVs), finding a replacement for this expensive and sparse material is becoming a particular area of interest, as the need for a reliable rechargeable battery becomes more apparent.　　According to the Birmingham scientists, sodium is inexpensive and can be found in seawater – so is virtually limitless. However, sodium is a larger ion than lithium, so it is not possible to simply "swap" it for lithium in current technologies. For example, unlike lithium, sodium will not fit between the carbon layers of the ubiquitous LIB anode, graphite.　　The scientists needed to find new materials to act as battery components for sodium-ion batteries that will compete with lithium for capacity, speed of charge, energy and power density.　　Running quantum mechanical models on supercomputers, Dr Andrew Morris's team from the University of Birmingham's Department of Metallurgy and Materials was able to predict what happens when sodium is inserted into phosphorus.　　In collaboration with Dr Lauren Marbella and Professor Clare Grey's team at the University of Cambridge, who performed the experiments which have verified the predictions, they found that the phosphorus forms helices at intermediate stages of charging.　　The researchers say they identified the final composition of the electrode, which provides a final capacity of charge carriers seven times that of graphite for the same weight, and gives fresh insights into how to make high-capacity sodium-ion anodes.

Key word：

Power battery

Release time：2018-09-18 00:00 reading：3386 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics

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