Sensor fusion and radar to drive Advanced Driver Assistance Systems
  While radar will remain a key technology, boosted by the 79 GHz spectrum band expected to become available globally, camera sensors and machine vision technology hold the promise of propelling ADAS into the mainstream because of its lower cost, flexibility, and multi-purpose character.  ABI Research forecasts automotive camera sensor shipments to reach 197 million by 2020. Main opticalsensor suppliers include Aptina (recently acquired by ON Semiconductor), OmniVision, Sony, STMicro, and Toshiba. LiDAR and IR sensor uptake will remain limited during the forecast period due to its high cost.  “Advances in RF transceivers, microcontrollers, and open platforms are also critical as they allow cost reduction through ECU consolidation by sharing MCUs across multiple sensors, and the promise for car OEMs of the availability of end-to-end solutions via ecosystems of software and application vendors. This is illustrated by Freescale’s recent partnerships with CogniVue, Neusoft, and Green Hills,” comments VP and practice director Dominique Bonte.  However, the arrival of autonomous driving will be the single biggest driver for the uptake of ADAS, which will be a critical component of driverless car technology. In the meantime, ADAS should be seen as a precursor of self-driving vehicles and is already becoming the subject of regulation, with the European NCAP including the presence of Speed Assistance Systems, Autonomous Emergency Braking, and Lane Departure Warning/Lane Keep Assist as criteria to determine safety ratings. In the United States similar initiatives are being discussed by NHTSA which recently proposed changes to its five-star safety program.
Key word:
Release time:2017-03-14 00:00 reading:2459 Continue reading>>
Using <span style='color:red'>sensor</span> controllers to reduce power consumption in mobile computing
  Challenges in mobile computing  The most common challenges facing mobile computing system architects are reducing system size, cost, power consumption, and improving human machine interfaces (HMI). Size is a key feature in mobile computing because for mobile devices the systems have to be designed as small and as light as possible. Main processors and RAM are stacked up system-in-PCB to reduce the size of the printed circuit board (PCB). The3G/4G, GPS, Wi-Fi, near field communication (NFC), Bluetooth, and AM/FM radios are now combined in system-in-packages. The battery charger, fuel gauge, oscillators, and power regulators are also combined in a single package. The challenge is to keep miniaturizing these modules while adding more features to the system.  cost is one of the other driving requirements of the design cycle. The cost of the bill of materials (BOM) should be as low as possible without sacrificing system features. Self-sufficient devices with minimal external components are always desired. Every resistor, capacitor, inductor, regulator, or glue-logic associated to an active component impacts the total cost of the system.  Users now expect that a device will run for at least 8 hours. Current rechargeable battery technologies are based on lithium-polymer chemistry, which has helped increase battery life from 4-5 hours to at least 8 hours, but improving battery technology alone is not enough to assure maximum running time. System architects have to create a power budget for every block inside the system. The most power-hungry blocks are the 3G/4G and GPS radios, followed by the Wi-Fi, Bluetooth, NFC, and AM/FM radios. These radios are usually combined in a single package and are controlled individually by the host processor. A host processor consumes most of the battery charge since it has to be on most of the time. It manages complex tasks such as receiving/transmitting information over the 3G/4G radios, computes complex algorithms to render the images displayed on the screen, accesses information stored on the memory, plays music files, etc. System and software architects work together to keep the main processor in low-power modes as much as possible.  Sensors are a fundamental part of the human machine interface; sensors help the system identify the context and environmental conditions. Motion sensors such as accelerometers, gyroscopes, and magnetometers identify whether the system is on a flat surface or whether it is being moved or tilted in a certain position. They provide the orientation of the system and also help provide a more accurate position of the system by increasing the resolution of the GPS with dead-reckoning algorithms. They can also be used in conjunction with the Wi-Fi or 3G/4G radios to determine the position of the system inside a building where the GPS signal is not available. They are the preferred interface, and commonly used, in gaming and augmented reality applications. Sensors in mobile computing applications can track ambient light, barometric pressure, touch, temperature, and voice recognition.  Ambient light sensors help dim the backlight of the screen according to the surrounding light and can also be used as proximity sensors. Multiple ambient light sensors configured as proximity sensors can be used to identify gestures and offer an alternative to touch sensing interfaces. Barometric pressure sensors are used in altimeter applications. These sensors, along with the motion sensors, enable the device to become an indoor navigation system.  Touch sensors are currently the most common human machine interface; they are on every smartphone and tablet and are the preferred typing interface in small factor devices. Touch sensors are typically mounted on the displays.  Temperature sensors are widely used to keep track of the hot spots on the system. They provide feedback to the system to do thermal and power management.  Finally, voice recognition has been re-introduced to mobile computing devices. Algorithms have been enhanced so they can filter out noise and can understand people with different accents. Technological advances in microphones and analog-to-digital (ADC) devices have made this technology more affordable and efficient.
Key word:
Release time:2016-04-14 00:00 reading:6085 Continue reading>>

Turn to

/ 1

  • Week of hot material
  • Material in short supply seckilling
model brand Quote
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
model brand To snap up
STM32F429IGT6 STMicroelectronics
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below:

verification code