As Apple Jilts Imagination, MIPS Goes on Block

发布时间:2017-05-05 00:00
作者:Ameya360
来源:EETimes
阅读量:1600

  Imagination Technologies Group disclosed Thursday (May 4) that it has started a "dispute resolution procedure" with Apple, as their negotiations have stalled. With the potential loss of Apple -- which accounts for about half of the U.K.-based company’s revenue -- looming large, Imagination is fighting for its survival.

  Not coincidentally, the company revealed plans to sell two businesses. Going on the block are MIPS, whose CPU business is focused on embedded processor market, and Ensigma, which offers IP licensing for connectivity in mobile computing.

  These moves mark the end of Imagination’s ambitious dream to compete with its rival ARM as an IP licensing powerhouse with GPU, CPU and connectivity technologies.

  Imagination today says it now hopes to “concentrate its resources on PowerVR and strengthen Imagination’s balance sheet.”

  Despite Imagination’s stated plan to sell off MIPS and Ensigma to save its PowerVR business, many industry observers believe Imagination might eventually go up for sale.

  Kevin Krewell, principal analyst at Tirias Research, told EE Times, “I expect that after the issues with Apple are resolved, Imagination itself will be sold. The results of the Apple resolution will determine Imagination's value at that time.”

  Disputes with Apple

  Imagination said last month that Apple had notified the firm it was developing its own graphics chips, Apple would no longer use Imagination's processing designs in 15 months to two years’ time.

  Imagination’s discussions with Apple thus far apparently yielded very little progress. In a statement issued Thursday, the company said, “Imagination has been unable to make satisfactory progress with Apple to date regarding alternative commercial arrangements for the current licence and royalty agreement.” Imagination “has therefore commenced the dispute resolution procedure under the licence agreement with a view to reaching an agreement through a more structured process,” the company added.

  Asked what such “a more structured process” entails, an Imagination spokeswoman declined to elaborate.

  In April, Imagination expressed doubts that Apple could go it alone without violating Imagination’s patents. Although industry analysts foresaw possible legal action against Apple, sources tell EE Times that Imagination isn’t currently planning any lawsuits.

  It’s widely understood that Imagination would face major challenges proving that Apple is infringing Imagination’s graphics engine IP. This is largely because Apple’s own new graphics chips -- which Apple claimed do not use Imagination’s processing designs -- won’t reach the market for more than a year. While Apple has every incentive to stall negotiations, it’s hard to imagine how Imagination could possibly make any breakthrough in discussions with Apple.

  Who will buy MIPS?

  Over the past month, Imagination’s board reviewed its business composition and decided dump MIPS and Ensigma. Industry debate now shifts inevitably to who might eventually acquire MIPS.

  Krewell told us, “MIPS is still a classic CPU design with scalability and an established software ecosystem.” Krewell expects that a design house (such as Cadence, Mentor or Synopsys) will look at it.

  He added, “It's also possible that a leading customer like Microchip would consider buying out its license. MIPS has also been used by a number of Chinese vendors and it could be bought by a Chinese entity.” In Krewell’s opinion, there's “still an opportunity for MIPS in the market, even though it's a diminished one.”

  Imagination's First Half, FY2017 Results

  However, Jim McGregor, principal analyst at Tirias Research, reminded that in the course of MIPS acquisition, the ownership of MIPS IP moved to a consortium which includes ARM.

  Indeed, in November, 2012, ARM announced that it is a leading member of Bridge Crossing LLC, "a consortium of major technology companies affiliated with Allied Security Trust, which has entered into an agreement with MIPS to obtain rights to its patent portfolio." At that time, ARM noted that the MIPS patent portfolio includes 580 patents and patent applications covering microprocessor design, system-on-chip design and other related technology fields.  "The consortium will pay $350 million in cash to acquire rights to the portfolio, of which ARM will contribute $167.5 million."

  McGregor said, "So, MIPS doesn't even own most of its IP. As a result, I don't see much value here, especially as many customers have moved to ARM."

  MIPS, Ensigma businesses

  Discussing the company’s half-year financial results (which ended in December 2016),  Imagination explained that MIPS profitability improved. Its royalties also grew 11 percent compared to that of a year ago, based on its volume growth. Licenses, however, remained flat.

  The company said, “MIPS has been refocused on the embedded processor markets, where the group is strong.”

  MIPS’ design wins have been mainly in networking, routers and DTV/STB, according to the company. “Good progress is also being made in mobile LTE modems, as the Group targets its differentiated technology to customers’ needs.”

  Imagination at that time also highlighted “Mobileye’s selection of MIPS I6500 for its latest EyeQ5 product [expected to reach the market in 2018], and Denso’s announcement to collaborate on joint research on hardware multi-threading for next-generation in-vehicle electronic systems.”

  Meanwhile, Ensigma is now focused on IP licensing for connectivity covering “the complete end-to-end WiFi and Bluetooth solutions.” Imagination acknowledged that Ensigma has been loss-making, but saw “strong licensing revenues” -- up 2.1 million pounds -- in the first half of FY2017, “by covering R&D costs for the first time.”

  Imagination's disclosure last month on the potential loss of Apple as its key customer immediately sent the company's shares down 70 percent and the stock has not recovered since.

(备注:文章来源于网络,信息仅供参考,不代表本网站观点,如有侵权请联系删除!)

在线留言询价

相关阅读
Apple A22 Pro May Adopt 1.4nm in 2028; TSMC Remains Primary Supplier, Intel Reportedly Considered
  Apple is expected to use TSMC’s 2nm for its A20 and A20 Pro chips, but industry discussions are already shifting to the A22 Pro and a potential move to 1.4nm. According to Bloomberg, Apple is expected to adopt a 1.4nm process for the A22 Pro, which is slated for high-end iPhone models in 2028. While TSMC is expected to remain Apple’s primary manufacturing partner, the report notes that the company is also evaluating Intel as a potential secondary production source.  Based on the reported timeline, the A21 Pro is expected to remain on TSMC’s 2nm, potentially transitioning to the enhanced N2P variant, which offers incremental improvements over N2, according to Wccftech.  Wccftech also notes that costs could rise significantly, with TSMC’s 1.4nm wafers estimated to cost around US$45,000 each. As a result, the report suggests that only the A22 Pro, rather than the standard A22, will be manufactured on the 1.4nm node.  As noted by MacRumors, current rumors suggest Intel could manufacture lower-end chips for products such as the iPad and Mac. At the same time, Intel CEO Lip-Bu Tan is seeking to revive the company’s foundry business by focusing on leading-edge nodes. According to TechPowerUp, Intel expects its 14A node to enter risk production in 2028, followed by high-volume manufacturing in 2029.  Beyond the possibility of Apple adopting TSMC’s 1.4nm node for its A22 chips, the company is reportedly preparing three major product launches for late 2027. According to 9to5Mac, citing Bloomberg, these include a 20th-anniversary iPhone featuring a nearly edge-to-edge display and curved glass that wraps around the sides, a second-generation foldable iPhone, and AirPods equipped with built-in cameras.  TSMC’s A14 Roadmap Takes Shape  TSMC has been accelerating construction of its 1.4nm fab at the Central Taiwan Science Park. According to Economic Daily News, foundation piling for the first phase has largely been completed, with progress reportedly ahead of schedule. Trial production could begin as early as 3Q27, with mass production targeted for the second half of 2028.  Compared with N2, A14 is expected to deliver a 10–15% performance improvement at the same power level, or reduce power consumption by 25–30% at the same performance level, while increasing logic density by more than 20%, according to TSMC.
2026-06-18 10:15 阅读量:243
Apple May Debut M5 Ultra-Powered Mac Studio at WWDC, Boosting Demand for TSMC N3P and SoIC-mH
  Apple’s annual Worldwide Developers Conference (WWDC) is set to kick off on June 9. According to Commercial Times, beyond updates to Apple Intelligence, Siri, and macOS 27, market attention is focused on whether a next-generation Mac Studio powered by Apple’s M5 Ultra chip will also make an appearance.  The M5 Ultra is expected to retain Apple’s UltraFusion dual-die architecture, combining two M5 Max dies and delivering interconnect bandwidth of more than 1,000GB/s. Specifications are rumored to include a 36-core CPU, an 84-core GPU, and up to 512GB of unified memory, the report adds.  Notably, as the report highlights, TSMC’s N3P is expected to serve as the key manufacturing foundation for the M5 Ultra, potentially adding to demand for already tight 3nm capacity.  TSMC’s SoIC-mH Emerges as Potential M5 Ultra Enabler  TSMC’s advanced packaging is also expected to play a key role in boosting the performance of the M5 Ultra. According to institutional investors cited by Commercial Times, SoIC-mH could emerge as a core technology platform if Apple adopts a higher-density heterogeneous integration approach alongside its UltraFusion high-speed interconnect architecture.  As TechNews notes, SoIC-mH uses a molded horizontal packaging architecture and integrates multiple chips directly at the wafer level through no-bump hybrid bonding technology. The approach can increase packaging density, improve signal transmission efficiency, and enhance thermal performance.  In addition, TechPowerUp notes that TSMC’s SoIC-mH allows Apple to separate the CPU and NPU from the GPU. This enables Apple to scale CPU clusters and GPU dies independently, adding more cores as needed. The approach also gives Apple greater flexibility to expand its product lineup without pushing die sizes close to the 830 mm² reticle limit. According to the report, this can improve yields and reduce defects associated with larger silicon dies.  Despite these potential advantages, the launch timing of the next-generation Mac Studio remains uncertain. According to Macworld, citing Bloomberg, supply-chain constraints are affecting production of Apple’s next-generation professional Macs and could delay the debut of the M5 Ultra-powered system until October 2026.  Touchscreen MacBooks Could Create New Opportunities for TSMC  Meanwhile, macOS 27 is another key focus of this year’s WWDC. Commercial Times notes that Apple is expected to strengthen touch support features, laying the groundwork for future touchscreen MacBooks through the early adoption of on-cell touch panel integration.  Institutional investors cited by the report say that the shift toward OLED displays and touch-enabled MacBooks is expected to drive demand for upgraded display driver ICs, TDDI chips, and touch controllers, while also benefiting TSMC’s specialty process. The report adds that TSMC has completed reliability certification for its 16nm high-voltage process platform and is set to enter the yield-validation stage in 2026, potentially helping customers develop more competitive OLED display driver ICs.
2026-06-09 13:50 阅读量:454
Apple Reportedly Keeps 2nm 5G Modem Orders with TSMC Amid Intel Cooperation Signals
  While recent market chatter has focused on a potential shift by Apple between longtime foundry partner TSMC and Intel, the Economic Daily News, citing industry sources, reports that the Cupertino-based company remains heavily dependent on the Taiwanese foundry giant, as it plans to place its entire in-house 5G modem orders with TSMC, leveraging its 2nm process technology.  The report suggests that Apple’s self-developed 5G modem chips are expected to power future iPhone, iPad, and Apple Watch devices, replacing modems from Qualcomm. The volume used across its product lineup is projected to reach hundreds of millions of units, the report adds.  Notably, Apple’s iPhone 17 lineup is expected to be the last to ship with Qualcomm Incorporated’s 5G modems, as the company moves toward a full transition to its in-house C2 baseband chip across all iPhone 18 models, according to Wccftech.  The C2 development builds on Apple’s earlier in-house modem effort. Apple’s C1, first introduced in early 2025 with the iPhone 16e, marked its most complex chip system to date, integrating a 4nm baseband modem and a 7nm transceiver, according to earlier reporting from Reuters. The Economic Daily News further reports that Apple Inc.’s in-house C2 5G modem is expected to add full mmWave support—addressing the Sub-6 GHz limitation of its predecessor—while also incorporating satellite connectivity.  Supply chain sources cited in the Economic Daily News report say TSMC has already secured foundry orders for Apple’s modem chips. Its back-end testing partner is also reportedly preparing for higher demand, with around 600 test systems being procured, as capacity is set to ramp from 2027.  Apple’s Chip Tug-of-War: TSMC vs Intel  Though claims of an Apple order shift to Intel remain unconfirmed, and any such move would not signal a departure from TSMC, cooperation between Apple and Intel appears to be warming. According to The Wall Street Journal, the two companies have reportedly reached a preliminary agreement for Intel to manufacture some of the chips powering Apple devices.  The two sides have been engaged in intensive talks for more than a year, with a formal deal said to have been hammered out in recent months, the report adds.  In parallel, Commercial Times reported earlier that Apple is evaluating Intel’s 18A-P process for its M-series chips. Looking further ahead, The New 7 reports that the first Intel-manufactured low-end M-series chips could emerge as early as mid-2027 under contract production, likely targeting entry-level Macs or iPads.  As highlighted by The Wall Street Journal, Apple’s reported outreach to Intel may reflect growing supply chain pressures, as the Cupertino firm—long TSMC’s top customer—faces tightening access to advanced manufacturing capacity amid surging demand from NVIDIA and other AI chip designers.  Intel previously played a central role in powering Apple’s Mac lineup, before Apple transitioned in 2020 to its own Arm-based custom chips, the report points out.
2026-05-11 11:12 阅读量:768
Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification
  Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially providing a second sourcing option alongside its longstanding supplier, TSMC.  Sources say the company has held early-stage discussions with Intel about leveraging its foundry services, while Apple executives have also visited a Samsung facility under construction in Texas that is expected to produce advanced chips.  That said, the report notes that neither effort has led to any orders so far. Engagements with both suppliers remain at a preliminary stage, as Apple continues to have reservations about adopting non-TSMC manufacturing technologies.  One of the key drivers behind Apple’s potential shift is supply constraints at TSMC, according to Bloomberg. As the report notes, Apple executives addressed the issue during the company’s quarterly earnings call last week, indicating that limited chip availability for iPhone and Mac devices is currently weighing on growth.  In early 2026, Tim Cook identified access to advanced-node manufacturing as the main bottleneck for Apple’s iPhone output, according to CNBC. He noted that production is constrained by limited capacity for the company’s A-series and M-series system-on-chip (SoC) chips, which are fabricated on TSMC’s 3nm process.  In addition, it also aims to maintain at least two suppliers for key components, allowing Apple to strengthen its negotiating leverage on pricing while reducing the risk of supply disruptions, Bloomberg adds.  Apple’s Reported Supplier Talks May Open Door for Intel Comeback, Samsung Gains  Apple’s talks with both companies reportedly began before the most recent supply constraints emerged. As Bloomberg notes, collaborating with Intel could offer an added advantage, potentially strengthening Apple’s ties with the Donald Trump administration. As for Samsung, the report indicates that it has already been working on supplying more peripheral components for Apple’s devices, including power management parts.  In an August 2025 press release, Apple also announced a partnership with Samsung to co-develop a new chip manufacturing technology at Samsung’s Austin fab. Citing industry sources, Business Korea adds that the chip Samsung is expected to produce will likely be used as an image sensor in future iPhones and other Apple products.  Separately, industry momentum appears to be building around Intel’s foundry push. According to Commercial Times, major tech firms including Google and Apple are weighing a shift to Intel’s foundry. The report adds that Apple’s M-series chips are evaluating Intel’s 18A-P node.  Apple’s potential shift could provide a boost to both Samsung and Intel. As the report notes, securing external customers for its foundry business is central to Intel’s turnaround strategy under CEO Lip-Bu Tan. Winning Apple as a client would mark a major milestone for Tan and could help draw in additional business. Samsung, meanwhile, would also stand to gain significantly from an endorsement by Apple.
2026-05-06 14:44 阅读量:618
  • 一周热料
  • 紧缺物料秒杀
型号 品牌 询价
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
型号 品牌 抢购
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
热门标签
ROHM
Aavid
Averlogic
开发板
SUSUMU
NXP
PCB
传感器
半导体
相关百科
关于我们
AMEYA360微信服务号 AMEYA360微信服务号
AMEYA360商城(www.ameya360.com)上线于2011年,现 有超过3500家优质供应商,收录600万种产品型号数据,100 多万种元器件库存可供选购,产品覆盖MCU+存储器+电源芯 片+IGBT+MOS管+运放+射频蓝牙+传感器+电阻电容电感+ 连接器等多个领域,平台主营业务涵盖电子元器件现货销售、 BOM配单及提供产品配套资料等,为广大客户提供一站式购 销服务。

请输入下方图片中的验证码:

验证码