在pcb设计过程中需要注意的10个关键点

Release time:2022-01-14
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在PCB设计中,工程师难免会面对诸多问题,下面总结了PCB设计过程中需要注意的10个关键点,希望能对大家在PCB设计中能够起到一定的规避作用。

在pcb设计过程中需要注意的10个关键点

(1)加工层次定义不明确单面板设计在顶层,如不加说明正反做,也许做出的板子装上器件而引致不良焊接。

(2)大面积铜箔距外框太近大面积铜箔距外框应至少保证0.2mm以上的间距,因在铣削外形时如铣到铜箔上容易造成铜箔起翘及阻焊剂脱落问题。

(3)用填充块画焊盘用填充块画焊盘在设计线路时能够通过DRC检查,但对于加工不行。因此类焊盘不能直接生成阻焊数据,在上阻焊剂时,该填充块区域将被阻焊剂覆盖,导致器件焊装困难。

(4)电地层又是花焊盘又是连线花焊盘方式电源地层与实际印制板上图像相反的,所有连线都是隔离线。画几组电源或几种地隔离线时应小心,不能留下缺口,这会不但会使造成该连接区域封锁,更会引致短路。

(5)字符乱放字符覆盖焊盘SMD焊片,给PCB通断测试及元件焊接带来不便。字符设计太小会造成丝网印刷困难,太大会使字符相互重叠,难以分辨。

在pcb设计过程中需要注意的10个关键点(6)表面贴装器件焊盘太短这是对通断测试而言,对于太过密集的表面贴装器件,其两脚之间的间距相当小。安装测试针时,必须上下交错位置,如焊盘设计太短,虽然不影响器件安装,但会使测试针错不开位。

(7)单面焊盘孔径设置单面焊盘一般不钻孔,若钻孔需标注,孔径应设计为零。如果设计了数值,在产生钻孔数据时,此位置就出现了孔座标而出现问题。单面焊盘如钻孔应特殊标注。

(8)焊盘重叠在钻孔工序会因为在一处多次钻孔导致断钻头和导致孔损伤。多层板中两个孔重叠,绘出底片后表现为隔离盘,造成报废。

(9)设计中填充块太多或填充块用极细线填充产生的光绘数据有丢失现象,光绘数据不完全。因填充块在光绘数据处理时用线一条一条去画,因此产生的光绘数据量相当大,增加了数据处理难度。

(10)图形层滥用在一些图形层上做了一些无用连线,本来是四层板却设计了五层以上线路,使造成误解。违反常规性设计,设计时应保持图形层完整且清晰。

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