ROHM Develops a 1kW Class High Power Infrared Laser Diode
Trade news

ROHM Develops a 1kW Class High Power Infrared Laser Diode

　　ROHM has developed a high output laser diode - RLD8BQAB3 - for use in ADAS (Advanced Driver Assistance Systems) equipped with LiDAR for distance measurement and spatial recognition. ROHM will initially start supplying samples targeting consumer and industrial applications such as drones, robot vacuum cleaners, AGVs (Automated Guided Vehicles), and service robots.　　LiDAR is seeing growing adoption in recent years across a variety of applications that require automation such as automotive ADAS, AGVs, drones, and robot vacuums, facilitating precise distance measurement and spatial recognition. To detect information at greater distances with more accuracy, there is a need for laser diodes that serve as light sources to achieve high kW-level output while allowing multiple light sources to emit light at close intervals.　　ROHM has established proprietary patented technology that achieves the narrow emission width of lasers, enhancing the long-distance, high accuracy LiDAR, beginning with the commercialization of the 25W output RLD90QZW5 in 2019 and high-power 120W RLD90QZW8 in 2023. Building on these successes, we have developed a new 125W 8ch (1kW class) array-type product that meets the demand for a high output, high performance laser diode.　　The RLD8BQAB3 is an ultra-compact surface mount high-output 125W × 8ch infrared laser diode for LiDAR applications that utilize 3D ToF systems to carry out distance measurement and spatial recognition. The optimized design features 8 emission areas (each 300µm wide) per element, installed on a submount affixed to a high heat dissipation substrate.　　The package’s emitting surface incorporates a clear glass cap - an industry first for a surface mount laser diode - eliminating the risk of light scattering caused by scratches during dicing that tends to occur with resin-encapsulated products, ensuring high beam quality. Each emission area is wired with a common cathode, enabling the selection of the irradiation method based on application needs - ranging from individual emission that increases the number of light-emitting points to industry-leading* simultaneous emission at ultra-high outputs of 1kW class.　　The new product retains the key features of ROHM’s conventional laser diodes, including uniform emission intensity across the emission width along with a low wavelength temperature dependence of 0.1nm/°C (vs 0.26 to 0.28nm/°C for standard products). On top, the array configuration narrows the regions of reduced emission intensity between channels, while the bandpass filter minimizes the effects of ambient light noise from the sun and other sources, contributing to long-distance detection and high-definition LiDAR.　　Samples are available since August 2024 (please contact a sales representative or visit the contact page on ROHM’s website).　　Application Examples        Automotive: ADAS　　Consumer: Drones, robot vacuums, golf rangefinders, and more　　Industrial: AGVs, service robots, 3D monitoring systems (sensors for human/object detection), etc.　　Terminology        LiDAR　　Short for Light Detection and Ranging, an application that uses the ToF (Time of Flight) system (comprised of a light source and ToF or image sensor) to sense ambient conditions.　　3D ToF System　　An abbreviation for Time of Flight, a spatial measurement system which, as its name implies, measures the flight time of a light source. Refers to a system that uses ToF to perform 3D spatial recognition and distance measurement.　　Submount　　A small, flat mounting plate made from a material with high thermal conductivity.　　Bandpass Filter　　A filter that allows only signals in a specific light wavelength band to pass through. In optical devices, a narrow bandpass filter range allows for efficient extraction of light close to the peak waveform. This minimizes the effects of ambient noise such as sunlight, enabling lower power consumption at the same distance or longer range at the same optical output.　　IATF 16949　　IATF is the short for International Automotive Task Force, a quality management standard for the automotive industry. Based on the international standard ISO 9001 with additional specific requirements, compliance with IATF 16949 enables automakers and suppliers to meet international quality standards.　　AEC-Q102　　AEC stands for Automotive Electronics Council, an organization (comprised of major automotive manufacturers and US electronic component makers) responsible for establishing reliability standards for automotive electronics. Q102 is a standard specifically intended for optical devices.
Key word：
Release time：2025-03-17 13:49 reading：281 Continue reading>>
Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024
Trade news

Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024

　　Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade. Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility, which is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.　　Taipei, Taiwan – June 7th 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm® QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.　　Flagship on-device AI solution powered by Qualcomm QCS8550 processor　　Utilizing the powerful Qualcomm QCS8550 processor, Fibocom’s flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno™ 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, videoconference systems, and more.　　Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT market　　The solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios. The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, in-vehicle infotainment (IVI) and industrial inspection.　　“We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions,” stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. “This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.”　　"It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."
Key word：
Release time：2024-06-18 16:12 reading：837 Continue reading>>
A solution for automotive gear shift switch based on Hangshun chip automotive grade MCU HK32A040C8T3
Trade news

A solution for automotive gear shift switch based on Hangshun chip automotive grade MCU HK32A040C8T3

　　Throughout the global development of passenger cars, automatic transmission has been widely adopted. Its simple and easy to learn, convenient and intelligent characteristics bring drivers a more comfortable driving experience, and also better adapt to urban traffic.　　The implementation of the automatic shift function actually uses a gear shift switch instead of manual operation. The gear shift switch will control the shift fork and gear shift based on different engine speeds, vehicle speeds, and the driver's intention to press the accelerator. To achieve these automated operations, a shift switch requires a brain.　　The Hangshun chip M0 series automotive grade MCU HK32A040C8T3 is such a "brain", applied in gear shift switch schemes. Its main function is to receive signals from the gear shift switch and convert these signals into electrical signals that can control the car's engine, transmission, and other parts, thereby simplifying driving operations and providing great convenience for the driver.　　In the process of developing its new generation of electric vehicles, in order to ensure that the vehicle's performance, reliability, and safety reach the optimal level, after in-depth technical evaluation and multiple rounds of screening, Selis New Energy Vehicles finally chose a gear shift switch scheme based on the Hangshun chip HK32A040C8T3.　　The Selis engineering team has conducted a rigorous review of the functional characteristics, processing speed, power consumption performance, environmental adaptability, and cost-effectiveness of the Hangshun HK32A040C8T3 MCU in multiple dimensions. Hangshun's MCU has successfully conquered the engineering team with its outstanding performance, especially in high reliability and strong anti-interference ability. In addition, HK32A040C8T3 has high integration and flexible peripheral interfaces, providing engineers with greater design freedom and optimization space, making the entire electronic control system more compact and efficient.　　HK32A040 using ARM ® Cortex ®- M0 core, with a maximum operating frequency of 96MHz, built-in up to 124 Kbyte Flash and 10 Kbyte SRAM. By configuring the Flash controller registers, the remapping of interrupt vectors within the main Flash area can be achieved. And it supports traditional Flash Level 0/1/2 read-write protection and Flash code encryption (patented by Hangshun).　　Strong scalability　　32-bit ARM CPU architecture, good ecological environment　　Rich peripheral resources to meet platform expansion　　Multiple packaging options available for LQFP64, LQFP48, QFN32, and QFN28　　high reliability　　Car specification quality, compliant with AEC-Q100 Grade 1　　Complies with ISO 9001 and IATFT 16949 quality management systems　　Supports -40 ℃~125 ℃　　High cost performance ratio　　Equal performance/resources, with higher cost-effectiveness　　Quality service　　Complete ecological supporting facilities　　15 years of design life, with a supply chain guarantee of over 15 years　　The gear shift switch scheme based on the Hangshun Vehicle Class MCU HK32A040C8T3 has been successfully applied in the Sailis new energy vehicle, which not only improves the electronic control efficiency of the entire vehicle, but also achieves lower energy consumption and better user experience.　　The Hangshun chip series vehicle grade MCU HK32A040 can be widely used in vehicle domain controllers, such as doors and windows, tail lights, wipers, anti-theft alarms, car keys, air conditioning, electric seats, etc.　　Hangshun Chip adheres to the strategy of SoC+32-bit high-end MCU in automotive standards. In recent years, it has invested a large amount of research and development resources in the field of automotive electronics, committed to providing the market with higher reliability and more cost-effective automotive chip solutions, helping customers achieve a win-win situation in cost control and user experience.
Key word：
Release time：2024-05-09 11:48 reading：1258 Continue reading>>
Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024
Trade news

Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024

　　Nuremberg, Germany – April 10th, 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, in collaboration with Qualcomm Technologies Inc., a global leading semiconductor company, is proud to announce the launch of their cutting-edge Linux-based edge AI solutions which integrates a series of Qualcomm Technologies-powered Fibocom smart modules.　　This new series of solutions utilize a wide array of Fibocom’s smart modules SC171, SC171L, SC138, and SC126 series that are developed based on the Qualcomm® QCM6490/QCS6490, Qualcomm® QCM5430/QCS5430, Qualcomm® QCM6125, and Qualcomm® QCM2290 processors from Qualcomm Technologies with integrated Linux system, will unleash the peak performance of Linux-based industrial applications with robust connectivity and scalable operating system compatibility, and also accelerate the integration of advanced 5G, edge AI across emerging industries like robotics. With the expansion of digitalized industries, Fibocom will intensify the Linux-focused embedded computing intelligence, and leverage expertise in edge AI inclusion to help industry customers realize responsive decision-making, real-time communication and ultra-reliable system interoperability in industrial automation, smart manufacturing, smart retailing through the partnership.　　At the “heart” of Industry 4.0, interoperability is crucial for operators to get insights into the equipment’s performance in the field. This groundbreaking series solutions is poised to advance the industrial applications that demand wireless connection, high-integration expertise with design-in Linux operating system for easy integration, and long-term product lifecycle optimization. By adopting Linux-supported Fibocom’s smart modules, Linux engineers around the world have the ability to develop industrial devices such as industrial PCs (IPCs), edge AI workstations, smart POS terminals, and industrial routers with higher efficiency as well as potent multimedia processing capabilities.　　Harnessing the interoperability of the Linux operating system, industry-focused customers catered to the benefits below:　　· Utilizing the stability and reliability of the Linux system, the Linux-based edge AI solutions integrated with Qualcomm Technologies-powered smart modules ease the concerns of diverse system integration to industrial control systems and enable the 24/7 data transmission and management of industrial equipment with minimum risk of malfunction and downtime.　　· The Linux-based Edge AI Solutions are highly flexible and customizable compatible with industrial standards, and can be widely deployed in industrial PCs (IPCs), industrial cameras, edge AI workstations, smart POS terminals, and robotics.　　· Inherently beneficial from the robust feature and open-source nature of the Linux operating system, the solutions allow equipment manufacturers to safeguard product development and management with long-term upgradable support through the entire lifecycle.　　Fibocom Unveils Intelligent Lawn Mower Robotic Solution with Linux-based Smart Module SC171 Integrated　　The lawn mower robotic solution is a highly integrated solution equipped with Fibocom smart module SC171 and edge AI algorithm, empowering lawn mowers with unparalleled capabilities in environmental perception, precise positioning, map construction, path planning, autonomous obstacle avoidance, and seamless wireless connectivity. The revolutionary lawnmower robotic solution enables the autonomous navigation of the lawn mower without using boundary cables, significantly transforming the lawn mower industry. The core of this robotic solution lies in the AI-based lawn recognition algorithm, equipped with outdoor cameras, to achieve accurate detection and efficient planning of the lawn boundaries. It is worth mentioning that the solution also includes responsive obstacle avoidance and automatic recharging, in addition to the mapping function and an “edge-cutting mode” to facilitate precise mowing even at the sidelines. By deploying the solution, it will enhance the operational efficiency of the lawnmowers and reduce the time-to-market of lawnmower’s massive deployment in the global marketplace.　　"We are proud to collaborate with Fibocom to help them develop these Linux-based edge AI solutions for industrial applications," said Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. "By utilizing Fibocom's smart modules and Qualcomm Technologies’ powerful processors, Fibocom are enabling the integration of advanced edge AI technologies, empowering industries with responsive decision-making and real-time communication capabilities."　　“We have a clear vision for the edge AI-enabled future, and with the collaboration with Qualcomm Technologies, we will continue building the Linux-based edge AI-driven core solution for industrial-focused markets,” said Ralph Zhao, VP of MC BU at Fibocom. “The first landed implementation in the robotic industry has infused confidence into the utilization of both Fibocom and Qualcomm Technologies’ strength to empower an intelligent, future-promising digitalized world.­­”
Key word：
Release time：2024-04-16 11:14 reading：829 Continue reading>>
Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation
Trade news

Renesas Launches Cloud-Based Environment to Accelerate Automotive AI Software Development and Evaluation

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched a new cloud-based development environment aimed at streamlining the software design process for automotive AI engineers. The new platform, AI Workbench, is an integrated virtual development environment that empowers automotive AI engineers to design, simulate and fine-tune their automotive software - all within the cloud.　　With this environment, engineers can immediately begin designing automotive software by leveraging Microsoft Azure services including Azure Compute, IaaS services, Microsoft Entra ID and Azure Security. Instead of installing tools on a PC or obtaining an evaluation board, they can perform tasks such as performance evaluation, debugging and verification using simulation tools online. This approach aligns with the "Shift-Left" approach, which enables software creation and testing earlier in the design cycle, even before the actual hardware becomes available. For example, it is possible to start developing AI-enabled application software to support ADAS (Advanced Driver Assistance System) and autonomous driving for the upcoming fifth-generation R-Car System on Chip (SoC) prior to the availability of hardware samples. This environment will serve as a unified development platform for designing and testing Renesas’ scalable automotive SoCs and microcontrollers (MCUs), regardless of product type or application.　　“We are thrilled to introduce a cloud-based virtual development and AI model performance testing environment for automotive AI engineers in collaboration with Microsoft, a leading cloud technology provider," said Mandali Khalesi, Global VP, HPC AI and Cloud Technology at Renesas. “We are committed to improving the AI development environment through new features such as continuous monitoring and analysis of software usage.”　　“Cloud-based development is a secure and cost-effective method to address the increasing complexities of today’s embedded projects. The collaboration between Renesas and Microsoft aims to tackle this challenge and accelerate the digital transformation of the automotive industry,” said Ulrich Homann, Corporate Vice President & Distinguished Architect, Cloud + AI, Microsoft. “With Renesas’ AI Workbench, developers can now efficiently build and test software for a myriad of applications using Renesas SoCs in a cloud-based environment powered by Azure."　　The AI Workbench includes the following four functional blocks today. Renesas plans to enhance its offering in the future with additional features such as selected functionality or customization options tailored to support various development processes.　　Upgraded AI Compiler Toolchain　　Renesas will upgrade its SoC AI compiler toolchain with a novel “Hybrid Compiler (HyCo)” architecture and make it available through the AI Workbench. The new HyCo architecture developed in house and kernel libraries will allow engineers to unlock broader AI model and ONNX operator coverage, beyond the coverage of existing-third party hardware accelerator compilers available on Renesas SoC such as DSPs and NPUs.　　AI Model Performance Testing Environment　　Renesas will provide NNPerf, an online test environment for developers to evaluate the performance of AI models running on live Renesas SoCs with an updated hybrid AI compiler. Testing will run on real hardware in Renesas’ global device farm, without the need for evaluation boards. With the ability to batch code programs, perform real-time inference tests, and compare performance across different AI models, application engineers can estimate and make decisions on tradeoffs between models, memory footprints, latency and more.　　Software Development Environment　　Microsoft's code editor, Visual Studio Code (VSCode) and a software development kit (SDK) from Renesas are both available in the cloud. Using the tool suite, developers can launch their development environment in the cloud in a matter of minutes. Developers can customize their independent development environment and perform all design work using just a web browser on their PC.　　Software Evaluation/Verification Environment　　Renesas will also provide an environment for developers to test and verify their application software using the AI models defined in the AI model performance testing tool NNPerf. This includes simulators such as SILS (Software in the Loop Simulator), and HILS (Hardware in the Loop Simulator), allowing users to verify the operation designed for their specific AI application.
Key word：
Release time：2023-12-25 15:41 reading：2258 Continue reading>>
Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce
Trade news

Top Ten IC Design Houses Ride Wave of Seasonal Consumer Demand and Continued AI Boom to See 17.8% Increase in Quarterly Revenue in 3Q23, Says TrendForce

　　TrendForce reports that 3Q23 has been a historic quarter for the world’s leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.　　NVIDIA’s revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.　　Qualcomm, riding the wave of its newly launched flagship AP Snapdragon 8 Gen 3 and the release of new Android smartphones, saw its third-quarter revenue climb by 2.8% QoQ to around US$7.4 billion. However, NVIDIA’s rapid growth eroded Qualcomm’s market share to 16.5%. Broadcom, with its strategic emphasis on AI server-related products like AI ASIC chips, high-end switches, and network interface cards, along with its seasonal wireless product stockpiling, managed to offset weaker demand in server storage connectivity and broadband. This strategic maneuvering led to a 4.4% QoQ revenue boost to US$7.2 billion.　　AMD witnessed an 8.2% increase in its 3Q revenue, reaching US$5.8 billion. This success was due to the widespread adoption of its 4th Gen EPYC server CPUs by cloud and enterprise customers and the favorable impact of seasonal laptop stockpiling. MediaTek's revenue rose by 8.7% to US$3.5 billion in the third quarter, buoyed by a healthy replenishment demand for smartphone APs, WiFi6, and mobile/laptop PMIC components, as inventories across brand clients stabilized.　　Cirrus Logic ousts MPS from tenth position thanks to smartphone inventory replenishment　　Marvell also made significant gains, with its third-quarter revenue hitting US$1.4 billion, a 4.4% QoQ increase. This growth was primarily driven by increasing demand for generative AI from cloud clients and the expansion of its data center business—despite declines in sectors like enterprise networking and automotive. However, the outlook for some sectors remains mixed, with areas like TV and networking still facing uncertainties, leading to a cautious approach from clients. This resulted in some IC design companies, such as Novatek and Realtek, witnessing a decline in revenues by 7.5% and 1.7%, respectively.　　Will Semiconductor benefited from the demand for Android smartphone components, breaking free from past inventory corrections with a 42.3% increase in 3Q revenue to US$752 million. Cirrus Logic, similarly capitalizing on the smartphone component stockpiling trend, saw a significant 51.7% jump in revenue to US$481 million, ousting MPS from the top ten.　　In summary, TrendForce forecasts sustained growth for the top ten IC design houses in the upcoming fourth quarter. This optimistic outlook is underpinned by a gradual normalization of inventory levels and a modest seasonal rebound in the smartphone and notebook market. Additionally, the global surge in LLMs extends beyond CSPs, internet companies, and private enterprises, reaching regional countries and small-to-medium businesses, further bolstering this positive revenue trend.
Key word：
Release time：2023-12-22 16:13 reading：1915 Continue reading>>
Aluminum-based PCB vs Ceramic-based PCB – A Comprehensive Comparison for Your Electronics
Trade news

Aluminum-based PCB vs Ceramic-based PCB – A Comprehensive Comparison for Your Electronics

　　In the realm of electronics, the choice of printed circuit board (PCB) material plays a pivotal role in determining the functionality, performance, and longevity of electronic devices. Two prominent contenders in this domain are aluminum-based PCBs and ceramic-based PCBs, each with its distinct advantages and specialized applications. Let’s delve deeper into the characteristics, pros, and cons of aluminum-based PCB vs ceramic-based PCB to aid in your decision-making process.　　Aluminum-based PCBsAluminum-based PCBs, also recognized as metal core PCBs (MCPCBs), boast a core constructed from an aluminum alloy. These boards have garnered attention for their exceptional thermal conductivity and find extensive usage in applications that demand efficient heat dissipation.　　Aluminum-based PCBs　　Advantages of Aluminum-based PCBs　　Thermal Conductivity: The standout feature of Aluminum-based PCBs is their remarkable thermal conductivity. This property makes them a preferred choice in applications where heat dissipation is critical, such as LED lighting systems, power converters, and automotive electronics. The ability to efficiently transfer heat away from sensitive components ensures enhanced reliability and longevity of the devices.　　Cost-Efficiency: Aluminum-based PCBs often present a more budget-friendly option compared to certain high-performance materials. This cost-effectiveness makes them attractive for projects where optimizing expenses without compromising quality is a priority.　　Lightweight Nature: Despite their robust construction, Aluminum-based PCBs maintain a relatively lightweight profile. This attribute proves advantageous in applications where weight considerations are pivotal, such as portable electronic devices or aerospace applications.　　Manufacturing Simplicity: The manufacturing process for Aluminum-based PCBs is often simpler and more straightforward compared to some other materials, leading to reduced production time and costs.　　However, these PCBs do come with their set of limitations, which might impact their suitability for specific applications.　　Limitations of Aluminum-based PCBs　　Electrical Insulation Requirements: Aluminum-based PCBs necessitate an insulating layer between the circuit and the metal base to prevent short circuits. This requirement adds complexity to the manufacturing process and design considerations, potentially increasing production costs.　　Mechanical Strength: While durable, Aluminum-based PCBs might not offer the same level of mechanical strength as Ceramic-based PCBs. This factor could limit their use in applications exposed to harsh physical environments or substantial mechanical stress.　　Ceramic-based PCBsCeramic-based PCBs, typically crafted from materials like aluminum oxide or aluminum nitride, have gained prominence owing to their outstanding electrical insulation properties and reliability in diverse applications.　　Ceramic-based PCBs　　Advantages of Ceramic-based PCBs　　Superior Electrical Insulation: The hallmark of Ceramic-based PCBs lies in their superior electrical insulation capabilities. These boards excel in preventing signal interference and short circuits, making them ideal for high-voltage applications where maintaining signal integrity is crucial.　　Enhanced Mechanical Strength: Ceramic-based PCBs exhibit greater mechanical strength compared to their Aluminum-based counterparts. This characteristic makes them well-suited for deployment in rugged environments or applications where resistance to mechanical stress is imperative.　　High-Frequency Applications: With low dielectric loss and excellent signal integrity properties, Ceramic-based PCBs are highly sought after for high-frequency circuits and radio frequency (RF) applications.　　Chemical Resistance: Ceramics demonstrate remarkable resistance to chemicals and corrosion, making Ceramic-based PCBs suitable for applications exposed to harsh and corrosive environments, such as in aerospace or industrial settings.　　However, these boards also come with certain limitations that might influence their suitability for specific projects.　　Limitations of Ceramic-based PCBs　　Cost Considerations: Ceramic-based PCBs typically entail higher manufacturing costs due to the expense of materials and the complexity involved in their production. This factor might limit their feasibility for projects with stringent budget constraints.　　Brittleness: Despite their mechanical strength, ceramics can be inherently brittle. Careful handling is required during production, assembly, and installation to prevent breakage, which can add to the overall project timeline and costs.　　ConclusionThe choice between Aluminum-based and Ceramic-based PCBs hinges on a comprehensive evaluation of your project’s requirements, budget considerations, and the specific environmental conditions the electronic device will encounter.　　For applications where thermal management and cost-effectiveness are paramount, Aluminum-based PCBs might prove more suitable. Conversely, if superior electrical insulation, mechanical robustness, and reliability in harsh conditions are essential, Ceramic-based PCBs could be the preferred option.　　Ultimately, consulting with experienced PCB manufacturers or engineers remains pivotal in making an informed decision aligned with the unique demands of your electronic project.
Key word：
Release time：2023-12-15 13:26 reading：1720 Continue reading>>
ROHM’s New High Power 120W Laser Diode for LiDAR: Increasing Measurement Range by Reducing Wavelength Temperature Dependence by 66%
Trade news

ROHM’s New High Power 120W Laser Diode for LiDAR: Increasing Measurement Range by Reducing Wavelength Temperature Dependence by 66%

　　ROHM has developed a high-power laser diode - the RLD90QZW8. It is ideal for industrial equipment and consumer applications requiring distance measurement and spatial recognition.　　In recent years, LiDAR is being increasingly adopted in a wide range of applications that require automation - including AGVs (Automated Guided Vehicles), robot vacuums, and autonomous vehicles - where it is necessary to accurately measure distance and recognize space. In this context, there is a need to improve the performance and output of laser diodes when used as light sources to increase detection distance and accuracy.　　To meet this demand, ROHM established original patented technology to achieve a narrower emission width that contributes to longer range and higher accuracy in LiDAR applications. In 2019, ROHM released a 25W laser diode RLD90QZW5 followed by a 75W laser diode RLD90QZW3 in 2021. In response to the growing market demand for even higher output, ROHM developed a new 120W laser diode.　　The RLD90QZW8 is a 120W infrared high output laser diode developed for LiDAR used in distance measurement and spatial recognition in 3D ToF systems. Original device development technology allows ROHM to reduce the temperature dependence of the laser wavelength by 66% over general products, to just ⊿11.6nm (Ave. 0.10nm/°C). This makes it possible to narrow the bandpass filter while extending the detection range of LiDAR. At the same time, a uniform light intensity of 97% is achieved over the industry's smallest class* of emission width of 270µm, representing a range of 264µm that contributes to higher resolution. Additional features that include high power-to-light conversion efficiency (PCE) enables efficient optical output that contributes to lower power consumption in LiDAR applications.　　A variety of design support materials necessary for integrating and evaluating the new product is available free of charge on ROHM’s website that facilitate market introduction. In order to drive laser diodes with high nano-second order speed required for LiDAR applications, ROHM developed a reference design available now that combines ROHM’s 150V EcoGaN™ HEMT and gate drivers.　　ROHM has also acquired certification under the IATF 16949 automotive quality management standard for both front-end and back-end processes at its manufacturing facilities. As a result, product development of laser diodes for automotive applications (AEC-Q102 compliant) is underway, with commercialization planned by the end of 2024.　　Application ExamplesConsumer: Robot vacuums, Laser rangefinders　　Industrial: AGVs (Automated Guided Vehicles), service robots, 3D monitoring systems (sensors for human/object detection)　　and more...　　Support PageA broad range of design data is available on ROHM’s website free of charge, including simulation (SPICE) models, board development data, and application notes on drive circuit design necessary for integration and evaluation that supports quick market introduction.　　Reference DesignsReference designs for LiDAR incorporating these new products together with ROHM’s 150V EcoGaN™ and high-speed gate driver (BD2311NVX series) are now available on ROHM’s website.　　Reference Design Part Nos.　　・REFLD002-1　　(120W High Power Laser Diode [RLD90QZW8] built-in)　　・REFLD002-2　　(75W High Power Laser Diode [RLD90QZW3] built-in)　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.　　Online Sales InformationSales Launch Date: September 2023　　Pricing: $30.0/unit (samples, excluding tax)　　Online Distributors: DigiKey, Mouser and Farnell　　The product will be offered at other online distributors as they become available.　　Target Product: RLD90QZW8-00A　　Online Distributors　　TerminologyLiDAR　　Short for Light Detection and Ranging, a type of application that uses ToF (Time of Flight) system (comprised of a light source and ToF or image sensor) to sense ambient conditions.　　3D ToF System　　An abbreviation for Time of Flight, a spatial measurement system which, as its name implies, measures the flight time of a light source. Refers to a system that uses ToF to perform 3D spatial recognition and distance measurement.　　Bandpass Filter　　A filter that allows only signals in a specific light wavelength band to pass through. In optical devices, a narrow bandpass filter range allows for efficient extraction of light close to the peak waveform. This minimizes the effects of disturbance light noise such as sunlight, enabling lower power consumption at the same distance or longer range at the same optical output.　　IATF 16949　　IATF is the short for International Automotive Task Force, a quality management standard for the automotive industry. Based on the international standard ISO 9001 with additional specific requirements, compliance with IATF 16949 enables automakers and suppliers to meet international quality standards.　　AEC-Q102　　AEC stands for Automotive Electronics Council, an organization (comprised of major automotive manufacturers and US electronic component makers) responsible for establishing reliability standards for automotive electronics. Q102 is a standard specifically intended for optical devices.
Key word：
Release time：2023-12-05 15:21 reading：1891 Continue reading>>
Loongson Unveils 3A6000 CPU, Aims to Match Intel’s Advanced Process in Next Phase
Trade news

Loongson Unveils 3A6000 CPU, Aims to Match Intel’s Advanced Process in Next Phase

　　Loongson Technology Corp Ltd, unveiled its latest domestic CPU, Loongson 3A6000, on November 28th in Beijing, China. Notably, this CPU is entirely based on Chinese in-house design, free from reliance on any foreign licensed technology. During the product launch, Weiwu Hu, the chairman of Loongson, announced that next phase will utilize mature processes to achieve performance comparable to Intel’s advanced process, reported by CTEE.　　Loongson 3A6000 adopts a China domestic instruction set architecture(ISA), showcasing China’s capability to self-develop a new generation CPU, as reported by CCTV News. This CPU can run various cross-platform applications, catering to the needs of diverse large and complex desktop scenarios.　　The release of the Loongson 3A6000 signifies a pivotal milestone, highlighting China’s achievement in self sufficiency and product performance, bringing it on par with international mainstream products.　　According to Mydrivers.com, test results indicate that the overall performance of the Loongson 3A6000 processor is comparable to Intel’s 10th Gen Core quad-core processor launched in 2020. Notably, the Loongson 3A6000 is built on the self-developed ISA “LoongArch,” showcasing complete independence from foreign licensing, from top-level structure to ISA and application binary interface (ABI) standards.　　In terms of core performance, the Loongson 3A6000 boasts a main frequency of 2.5GHz, supports 128-bit vector extension (Loongson SIMD eXtension, LSX), and 256-bit advanced vector extension (Loongson Advanced SIMD eXtension, LASX). It also supports simultaneous multi-threading technology (SMT2), featuring a total of 8 logical cores on the entire chip.　　Hu highlighted that the 3A6000 has charted a path based on mature processes, optimizing performance through design. This achievement marks comparable performance with Intel and AMD under relatively weaker process conditions. The next step involves continuing to use mature processes to achieve performance levels on par with Intel’s advanced technology.　　Regarding the upcoming Loongson 3B6000, Hu mentioned during the third-quarter earnings briefing that Loongson is strategically focused on enhancing efficiency, aiming to reach or approach the performance level of Apple’s CPU for each GHz.
Key word：
Release time：2023-11-29 14:09 reading：1343 Continue reading>>
Notice Regarding the Completion of Purchase and Settlement of Tendered Shares Certificates, etc
Trade news

Notice Regarding the Completion of Purchase and Settlement of Tendered Shares Certificates, etc

　　As announced in the press release dated November 14, 2023, “Notice Regarding the Results of the Tender Offer for Takisawa Machine Tool Co., Ltd. (Securities Code: 6121)”, in the tender offer conducted by Nidec Corporation in accordance with the Financial Instruments and Exchange Act (Act No. 25 of 1948, as amended) and related laws and regulations (the “Tender Offer”), regarding the common shares issued by Takisawa Machine Tool Co., Ltd. (listed on the Standard Market of the Tokyo Stock Exchange, Inc. Securities Code: 6121. the “Target Company”), the total number of the share certificates, etc. tendered for the Tender Offer (the “Tendered Share Certificates, etc.”) exceeded the minimum number to be purchased in the Tender Offer, and therefore Nidec Corporation was scheduled to purchase, etc. all of the Tendered Share Certificates, etc.　　Today, we would like to announce that Nidec Corporation has completed the purchase, etc. and settlement of all of the Tendered Share Certificates, etc. of 5,502,183 shares in total through Mita Securities Co., Ltd. and Monex Inc. (subagent). As a result, we owns 86.14% of the voting rights in the Target Company and it has become a member of Nidec Group. The Target Company's lathes will be newly added to Nidec’s machine tool business portfolio, and under the goal of becoming the world's No.1 comprehensive machine tool manufacturer, we aim to enhance not only the Target Company’s corporate value but also an entire corporate value of Nidec group by creating synergies between Nidec Group and the Target Company.　　We will advance and carry out squeeze-out procedures through consolidation of shares in the Target Company in order to make the Target Company our wholly owned subsidiary as soon as possible.
Key word：
Release time：2023-11-21 10:28 reading：1862 Continue reading>>

Turn to

/ 9

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
MC33074DR2G onsemi
RB751G-40T2R ROHM Semiconductor
BD71847AMWV-E2 ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
TL431ACLPR Texas Instruments
model brand To snap up
STM32F429IGT6 STMicroelectronics
IPZ40N04S5L4R8ATMA1 Infineon Technologies
TPS63050YFFR Texas Instruments
BP3621 ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code