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8-Inch Wafer <span style='color:red'>Fabs</span> to Increase Monthly Production Capacity by 14% in 2026

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8-Inch Wafer Fabs to Increase Monthly Production Capacity by 14% in 2026

　　Source to China Times, the International Semiconductor Industry Association (SEMI) forecasts that from 2023 to 2026, the global semiconductor industry will add 12 new 8-inch wafer fabs, with 8-inch fab monthly production capacity increasing by 14% to a historic high of 7.7 million wafers. In response, UMC stated that from a supply and demand perspective, capacity growth still lags behind demand growth. UMC emphasized that it remains optimistic about the future of the 8-inch wafer market, thanks to ongoing advancements in special processes and differentiation.　　SEMI notes that the continuous rise in the penetration rate of electric vehicles (EVs) worldwide is driving substantial growth in the demand for inverters and charging stations. The future mass adoption of EVs is the primary driver for increased investments in 8-inch fabs and the continued expansion of global 8-inch fab capacity.　　Examining the situation of new 8-inch fabs in various countries, Southeast Asia will see the largest capacity increase, with a growth rate of approximately 32%. SEMI predicts that China’s 8-inch fab capacity will follow, with an increase of about 22%, reaching a monthly production capacity of 1.7 million wafers. The United States, Europe, the Middle East, and Taiwan are expected to have growth rates of approximately 14%, 11%, and 7%, respectively.　　SEMI reports that by 2023, China’s 8-inch fab capacity will account for approximately 22% of the global total, with Japan at around 16%, Taiwan at around 15%, and Europe, the Middle East, and the United States each at about 14%. Furthermore, to meet future market demand, suppliers such as Bosch, Infineon, Mitsubishi, Onsemi, and STMicroelectronics are accelerating their 8-inch fab capacity expansion. It is estimated that from 2023 to 2026, the 8-inch fab capacity for automotive and power semiconductors will increase by 34%.　　Concerns have been raised about potential oversupply as global 8-inch fabs expand, but UMC, a major semiconductor foundry, states that given the current rate of 8-inch fab expansion worldwide, the increase in capacity is relatively modest compared to demand. From a supply and demand perspective, it is certain that capacity growth will not keep pace with the growing global demand for 8-inch wafers.　　UMC further notes that while 8-inch fabs are increasing, demand is unlikely to remain stagnant. Currently, the majority of semiconductor fabs being built worldwide are 12-inch fabs, making the expansion of 8-inch fabs relatively limited, and the supply-demand balance has not worsened.

Key word：

fab

Release time：2023-09-22 16:08 reading：2093 Continue reading>>

SEMI: Global IC Industry Projected to Invest Over $500B in New <span style='color:red'>Fabs</span> by 2024

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SEMI: Global IC Industry Projected to Invest Over $500B in New Fabs by 2024

　　The projected growth in global factory count includes a record high 33 new semiconductor manufacturing facilities starting construction this year and 28 more in 2023.　　The worldwide semiconductor industry is projected to invest more than $500 billion in 84 volume chipmaking facilities starting construction from 2021 to 2023, with segments including automotive and high-performance computing fueling the spending increases, according to SEMI’s latest quarterly World Fab Forecast report.　　The projected growth in global factory count includes a record high 33 new semiconductor manufacturing facilities starting construction this year and 28 more in 2023.　　“The latest SEMI World Fab Forecast update reflects the increasing strategic importance of semiconductors to countries and a wide array of industries worldwide,” said Ajit Manocha, SEMI president and CEO. “The report underscores the significant impact of government incentives in expanding production capacity and strengthening supply chains. With the bullish long-term outlook for the industry, rising investments in semiconductor manufacturing are critical to laying the groundwork for secular growth driven by a diverse range of emerging applications.”　　New Semiconductor Facilities Starting Construction by Region　　The SEMI World Fab Forecast reports data from SEMI’s seven regions:　　In the Americas, the U.S. Chips and Science Act has vaulted the region into the lead worldwide in new capital spending as the government investment spawns new chipmaking facilities and supporting supplier ecosystems. From 2021 through next year, the Americas is forecast to start construction on 18 new facilities.　　China is expected to outnumber all other regions in new chip manufacturing facilities, with 20 supporting mature technologies planned.　　Propelled by the European Chips Act, Europe/Mideast investment in new semiconductor facilities is expected to reach a historic high for the region, with 17 new fabs starting construction between 2021 and 2023.　　Taiwan is expected to start construction on 14 new facilities, while Japan and Southeast Asia are each projected to begin building six new facilities over the forecast period. South Korea is forecast to start construction on three large facilities.

Key word：

IC

Release time：2022-12-29 15:00 reading：2003 Continue reading>>

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GIGAPHOTON announces seven major semiconductor chipmakers implement FABSCAPE data products

GIGAPHOTON Inc., a manufacturer of light sources used in semiconductor lithography, announced that following the high level of response to its initial March 2018 announcement of “FABSCAPE™” for the operational monitoring and analysis of semiconductor manufacturing equipment, at least seven major semiconductor chipmakers have been implementing the functionality into their manufacturing within 9 months after FABSCAPE™ was launched.FABSCAPE™ is an open platform capable of integrating the collection and analysis of operational data for the many and varied devices used in semiconductor manufacturing processes, and also efficiently resolving various problems relating to productivity and yield. With the introduction of FABSCAPE™, customer FAB and the various GIGAPHOTON service bases are connected through the network, enabling real-time monitoring and analysis of the data from each tool. In the future, applications will be provided to solve users’ specific individual issues, and improvement will be made to realize more efficient operation across all semiconductors manufacturing environment.Katsumi Uranaka, President & CEO of GIGAPHOTON commented, “FABSCAPE™ has received favorable reviews from those customers who have already introduced it, and we are confident that those customers planning to do so will also be very happy with the outcome. GIGAPHOTON will continue to contribute in further productivity improvements for our customers.”

Key word：

Instant news

Release time：2018-12-19 00:00 reading：1290 Continue reading>>

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New fabs invest over $220B,2019 to mark all-time spending high

Global fab equipment spending will increase 14 percent this year to US$62.8 billion and is expected to rise 7.5 percent, to US$67.5 billion, in 2019, marking the fourth consecutive year of spending growth and the highest investment year for fab equipment in the history of the industry, according to the latest World Fab Forecast Report published today by SEMI. Investments in new fab construction are also nearing a record with a fourth consecutive year of growth predicted and capital outlays next year approaching US$17 billion.Investments for fab technology and product upgrades, as well as for additional capacity, will grow as the emergence of numerous new fabs significantly increases equipment demand, the forecast shows. The World Fab Forecast Report currently tracks 78 new fabs and lines that have or will start construction between 2017 to 2020 (with various probabilities) and will eventually require more US$220 billion in fab equipment (Figure 1). Construction spending for these fabs and lines is expected to reach US$53 billion during this period.Figure 1: Shows the investment potential of new fabs and lines starting construction between 2017 and 2020.Korea is projected to lead other regions in fab equipment investments with US$63 billion, US$1 billion more than second-place China. Taiwan is expected to claim the third spot at US$40 billon, followed by Japan at US$22 billion and the Americas at US$15 billion. Europe and Southeast Asia will share sixth place, with investments totaling US$8 billion each. Fully 60 percent of these fabs will serve the Memory sector (the lion’s share will be 3D NAND), and a third will go to Foundry.Of the 78 fab construction projects starting construction between 2017 and 2020, 59 began construction in the first two years (2017 and 2018), while 19 are expected to begin in the last two years (2019 and 2020) of the tracking period.Equipping a new fab typically takes one to one and a half years, though some fabs take two years and others longer, depending on various factors as such the company, fab size, product type and region. Approximately half of the projected US$220 billion will be spent from 2017 and 2020, with less than 10 percent invested in 2017 and 2018, nearly 40 percent in 2019 and 2020, and the rest after 2020.While the US$220 billion estimate is based on current insights of known and announced fab plans, total spending could exceed this level as many companies continue to announce plans for new fabs. Since the last quarterly publication of the report published last quarter, 18 new records – all new fabs – have been added to the forecast. Up-to-date and detailed analysis, with a bottoms-up approach, is available by subscribing to SEMI’s World Fab Forecast Report.Since its June 1 publication, more than 340 updates have been made to the World Fab Forecast. The report now includes more than 1,200 records of current and future front-end semiconductor facilities from high-volume production to research and development. The report covers data and predictions through 2019, including milestones, detailed investments by quarter, product types, technology nodes and capacities down to fab and project level.

Key word：

Market trend

Release time：2018-09-18 00:00 reading：1023 Continue reading>>

92 IC Wafer <span style='color:red'>Fabs</span> Closed or Repurposed From 2009-2017

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92 IC Wafer Fabs Closed or Repurposed From 2009-2017

　　150mm and 200mm wafer fabs accounted for two-thirds of total closures.　　Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. The spree of merger and acquisition activity and the migration to producing IC devices using sub-20nm process technology has also led suppliers to eliminate inefficient wafer fabs. From 2009-2017, semiconductor manufacturers around the world have closed or repurposed 92 wafer fabs, according to data compiled, updated, and now available in IC Insights’ Global Wafer Capacity 2018-2022 report.　　Figure 1 shows that since 2009, 41% of fab closures have been 150mm fabs and 26% have been 200mm wafer fabs. 300mm wafer fabs have accounted for only 10% of total fab closures since 2009. Qimonda was the first company to close a 300mm wafer fab after it went out of business in early 2009.　　Figure 1　　More recently, ProMOS closed two 300mm memory fabs in 2013 and Renesas sold its 300mm logic fab to Sony in 2014. Sony repurposed that fab to make image sensors. In 2017, Samsung closed its 300mm Line 11 memory fab in Yongin, South Korea, also repurposing it to manufacture image sensors.　　Semiconductor suppliers in Japan have closed a total of 34 wafer fabs since 2009, more than any other country/region. In the 2009-2017 timeframe, 30 fabs were closed in North America and 17 shuttered in Europe, and only 11 wafer fabs were closed throughout the Asia-Pacific region (Figure 2).　　Figure 2　　Worldwide fab closures surged in 2009 and 2010 partly as a result of the severe economic recession at the end of the previous decade. A total of 25 fabs were closed in 2009, followed by 22 being shut down in 2010. Ten fabs closed in 2012 and 2013. Two fabs were closed in 2015, the fewest number of closures per year during the 2009-2017 time span. In 2017, 3 wafer fabs were removed from service. IC Insights has identified three wafer fabs (two 150mm fabs, one 200mm fab) that are targeted for closure this year and next.　　Given the flurry of merger and acquisition activity seen in the semiconductor industry recently, the skyrocketing cost of new wafer fabs and manufacturing equipment, and as more IC companies transition to a fab-lite or fabless business model, IC Insights expects more fab closures in the coming years—a prediction that will likely please IC foundry suppliers.　　Report Details: Global Wafer Capacity 2018-2022　　IC Insights’ Global Wafer Capacity 2018-2022—Detailed Analysis and Forecast of the IC Industry’s Wafer Fab Capacity report assesses the IC industry’s capacity by wafer size, minimum process geometry, technology type, geographic region, and by device type through 2022. The report includes detailed profiles of the companies with the greatest fab capacity and gives comprehensive specifications on existing wafer fab facilities. Global Wafer Capacity 2018-2022 is priced at $4,490 for an individual user license. A multi-user worldwide corporate license is available for $7,190.

Key word：

IC Wafer Fabs

Release time：2018-03-06 00:00 reading：1220 Continue reading>>

Tsinghua in Deal to Invest $100 Billion in <span style='color:red'>Fabs</span>

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Tsinghua in Deal to Invest $100 Billion in Fabs

　　SAN FRANCISCO — Tsinghua Unigroup has joined with China-backed semiconductor investment firm Sino IC Capital and the municipal government of Chongqing in a joint venture that plans to invest up to $100 billion in Tsinghua manufacturing facilities in the next 10 years, according to China's state-run Xinhua news agency.　　The joint venture has an initial fund worth about $15.8 billion, according to the report.　　As part of the deal, Tsinghua Unigroup — China's largest chip company — agreed to build an industrial park in Chongqing, a municipality of about 28 million in southwestern China. The park will be home to Tsinghua Unigroup's R&D center and a manufacturing base for various ICs, according to the Xinhua report.　　Sino IC Capital manages China's National IC Industry Fund, part of China's ambitious plan to invest more than $161 billion over 10 years to bolster the company's domestic semiconductor industry.

Key word：

Tsinghua,Fabs

Release time：2018-03-05 00:00 reading：1218 Continue reading>>

Why <span style='color:red'>Fabs</span> Worry About Tool Parts

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Why Fabs Worry About Tool Parts

　　How a single O ring can affect yield, and what to do about it.　　Achieving high yields with acceptable costs is becoming much more difficult as chipmakers migrate to next-generation 3D NAND and finFET devices—but not just because of rising complexity or lithography issues.　　To fabricate an advanced logic chip, for example, a wafer moves from one piece of equipment to another in what amounts to 1,000 process steps or more in a fab. Any glitch with the equipment or a process step can cause defects, thereby impacting yield. The culprit may be a malfunction in seemingly insignificant parts or sub-systems in the equipment itself.　　Simply put, defects introduced by process-critical components in fab equipment can impact wafer yields, according to members from SEMI’sSemiconductor Components, Instruments, and Subsystems (SCIS) Special Interest Group, an organization that represents suppliers of components and sub-systems. The issues have been known for some time, but they are expected to become more problematic as chipmakers move to 10nm/7nm and beyond, according to SCIS. The group’s members include GlobalFoundries, IM Flash, Intel, Micron, TI and Samsung as well as major fab tool and component suppliers.　　The components and sub-systems in fab equipment are taken for granted, but they play a critical role in the semiconductor supply chain. For example, the more sophisticated fab tools incorporate more than 50,000 parts from dozens of suppliers. Chambers, pumps, RF generators, seals and valves are among the key components in a tool.　　Generally, the components are robust and don’t cause problems, but at times they can contribute to issues in the fab. For instance, based on real events from chipmakers, here’s just a small sample of what can go wrong in the fab:The wrong O-rings were installed in a portion of the sub-fab, which could cause contamination in the flow. An O-ring is a part that serves as a seal in a system.A pressure regulator malfunctions in the ultra-pure water system, causing contamination in the process.A liner material breach occurs in a bulk chemical distribution system, causing corrosion in the unit.　　“Sub-components have a major impact in facility systems, which in turn affects fab equipment performance,” said Norm Armour, managing director of worldwide facilities and corporate EHS at Micron Technology. “Our sub-component and material suppliers are doing a good job keeping up with our roadmap. But once in a while, there is a hiccup. The hiccup is what can upset the whole ecosystem.”　　For that reason, the industry’s supply chain is undergoing some changes. Not long ago, equipment vendors mainly specified the tool component from suppliers. Now, in addition to tool makers, chipmakers also are involved, and they are collaborating with component vendors in an effort to prevent a potential problem from occurring in the fab.　　“The moral of the story here is that you have to spec not only your fab tool components, but also your sub-components,” Armour said at a recent event at Semicon West. “We have been collaborating on the tool side for 40 years. Why not do that with the sub-component manufacturers as well?”　　Collaboration is only part of the solution, however. At advanced nodes, the industry wants to perform more rigorous tests on tool components, but they also need to find a better way in terms of how defects are measured on these parts. The problem is that measurement standards are either inadequate or non-existent. For example, there are few, if any, standard specs in the IC industry for O-ring seals, which were originally developed for steam engines in the 1800s.　　Seeking to address these issues, SEMI’s SCIS Special Interest Group is establishing new standards and methods for measuring defects introduced by components. In addition, there are other solutions to solve the problem, such as advanced metrology, wafer monitoring and simulation techniques.　　Fab challenges　　Today’s fabs have a number of moving pieces. According to UC Berkeley, a theoretical fab with 50,000 wafer starts per month requires the following equipment:50 scanners/steppers plus wafer tracks;10 high-current and 8 medium-current ion implanters;40 etch machines, and30 CVD tools.　　Fig. 1: Inside a fab. Source: GlobalFoundries　　In addition, 300mm fabs are also automated plants that make use of an assortment of automated material handling systems and wafer transport mechanisms.　　Fig. 2: Unified fab transport system. Source: Daifuku　　In the fab, the tools must process smaller and more exact features. And at each node, the defects are becoming smaller and harder to find, thereby requiring new and advanced metrology techniques. “We are shrinking the area of a circuit by 50% every generation,” said David Fried, chief technology officer at Coventor. “You are going to have 30 different metrology techniques in the fab.”　　At times, though, the fab flow encounters a problem. Defects can crop up in any part of the process. Then, a tool can run into a problem in the fab, which could mean any number of issues.　　Generally, a fab tool incorporates various sensors. The sensors monitor several functions in the tool, such as the gas flow, temperature, pressure and RF power. “Every tool has hundreds, if not thousands, of sensors,” Fried said. “Each has an acceptable range. If a tool sensor detects a fault, it usually (triggers an) alarm and takes itself off the automatic dispatch system so that no more lots of wafers will be sent to the tool for processing.”　　Other issues can also crop up. “After most process steps, measurements or metrology operations are performed to measure the success of the process,” he said. “If those measurements are out of spec, the lot is held for further evaluation. But this can lead to the preceding process tool being taken down for maintenance or further testing.”　　Still, the goal is to keep the fab up and running without a stoppage. “There is never a step in the process where wafers must go through one tool,” he said. “In any fab, there are many of the same tools to permit high-volume manufacturing to flow through the factory, even with ‘tool-downs.’”　　Regardless, fab tools require maintenance. Every tool has a preventive maintenance plan where the system is taken offline for cleaning and upgrades. So the fab keeps spare parts on hand.　　“Some fabs do their own maintenance, which are groups often called ‘Equipment Engineering,’” he said. “Many fabs buy their tools with ‘vendor maintenance contracts,’ which means if the tool goes down for unexpected reasons, the vendor is required to come to service it. These are stressful times for both parties.”　　Indeed, if a tool has an issue, it’s sometimes an arduous task to troubleshoot and fix the problem. It can be a time-consuming and costly process as well.　　For example, a component could not only malfunction in a tool, but it could cause a possible process-induced defect. The number of components varies from tool to tool, but the more sophisticated systems have a staggering number of parts. Consider Zeiss’ AIMS line of photomask inspection tools for extreme ultraviolet (EUV) lithography applications. The system consists of 4,500 sub-systems and 64,000 individual parts from 134 different suppliers, according to data from Intel. The AIMS tool is one of the more advanced systems in the market, but it exemplifies the complexity of today’s tools.　　Hypothetically, if the AIMS tool has an issue in the field, there might be a problem with one or more parts in the system. Finding them is a difficult task. “If we are chasing a defect on the tool, we are looking for a needle in a haystack,” said Ya-hong Neirynck, a technology enabling specialist at Intel.　　Potential issues with the components give chipmakers just one more thing to worry about in an already complicated supply chain and process flow in the fab. “You have more numbers of variables that can impact your wafer,” said Pawitter Mangat, director of global incoming quality at GlobalFoundries. “Tracking those variations, tracking those components and (tracking the) traceability of processes all lead into those variables. We cannot afford to have parts that don’t sustain the performance. Think about this in terms of the cost and the qualifications we have to go through every time an O-ring is changed and the validation.”　　And as chipmakers move to 10nm/7nm and beyond, there is no margin for error in the fab. “The variations have to be controlled,” Mangat said. “The message is that some of these variations that we see from processes over time are no longer going to be the norm for advanced nodes, which require a lot more rigorous controls, spec limits and operations.”　　There is hope, however. On the components/sub-systems front, Mangat listed several solutions for the industry:More collaboration in the supply chain.Bolster the quality programs for component suppliers.Develop baseline metrics and defect testing standards for components.Devise ways to trace the problem.　　Boosting collaboration　　The process starts when a tool maker develops a new system. From there, an equipment maker procures components for the system.　　Over the years, tool makers have developed a list of preferred component suppliers who they know and trust. They also know which suppliers to avoid.　　Even chipmakers keep tabs on suppliers. “We follow a very stringent internal SOP to ensure that our parts and sub-systems meet quality standards,” according to officials from UMC. “The measures include inspection for safety, hardware performance and ensuring that the delivered output is in line with the required specifications. Keeping an independent qualification process within UMC enables us to set our own rigorous quality benchmarks as well as control the parameters and conditions involved in qualifying incoming tools or materials.”　　Obviously, vendors must do their homework. They must understand the characteristics of a given component so they can anticipate a potential problem before it occurs in the fab.　　“It varies depending on the supplier,” said Kirk Hasserjian, vice president of service product development at Applied Global Services for Applied Materials. “Some of these technologies are very sensitive to certain types of defects. Others technologies are much less sensitive. CMOS image sensors are a classic example. They are extremely sensitive to metal containments and trace metals.”　　In addition, tool makers must continue to re-emphasize the need for quality among their suppliers, and for good reason. “The technology changes,” said Aki Sekiguchi, vice president and general manager of the Advanced Semiconductor Technology Division at Tokyo Electron Ltd. (TEL). “What is okay for 10nm may not be good for 7nm, 5nm and so forth. In general, as the technology gets tighter and tighter, the specs are tighter.”　　There are some limitations, however. It makes sense to implement more rigorous controls and testing for the critical components. It’s impossible to implement the same controls for every part because it’s too expensive.　　Yet every part must meet spec. So tool vendors and their component suppliers must strike a balance between how much a part is tested versus cost. “There is an associated cost,” Sekiguchi said. “If you really take control over every single component, the economic format breaks down.”　　Component suppliers attempt to provide the best solutions, but in general they are unaware of the exact conditions or recipes that their products are subjected to during the actual process. Sometimes chipmakers and tool vendors don’t want to reveal their key intellectual property to suppliers.　　One of the drawbacks of the traditional way of doing business is that the part may fail and the supplier has no idea, or only a vague inkling, why it didn’t meet spec. The obvious solution is collaboration. For this, the various parties must get more involved in the product development process.　　The challenge is when the parties need to share IP. Sharing IP on basic parts is simple. But companies are much more cautious about revealing IP on the more critical components, such as process chambers.　　To solve these issues, the industry must find a happy medium. “There has to be a balance,” Sekiguchi said. “You have to strike a balance between the amount of information that you share and the kinds of information you share.”　　The components require more rigorous characterization and testing as chipmakers migrate to more advanced nodes. But how that gets accomplished isn’t clear.　　“To date, there is no industry alignment on how defects are measured on various components and sub-components and on how these results are reported,” said Paul Trio, senior manager of strategic initiatives at SEMI.　　Take an O-ring for example. An O-ring is a small item that fits between two or more parts, which forms a seal at the interface. Each fab tool has several different seal types, including those for the lids, ports and windows. But each seal vendor develops proprietary products. Therefore, each vendor has different and proprietary data about their products, but there is no standard way to test or package these items.　　“The problem is the same spec that was invented for the steam engine is the same spec they use for these seals today. Therein lies the problem. There is no spec,” said Dalia Vernikovsky, chief executive of Applied Seals North America and co-chair for SCIS.　　Many other types of components are in the same boat, prompting the need for standards. So in 2013, SEMI and others launched SCIS. Besides major chipmakers, Applied Materials, ASMI, ASML, KLA-Tencor, Lam and TEL are members of SCIS as well as a number of component vendors.　　Fig. 3: Participating Companies in SCIS. Source: SEMI　　SCIS’ charter is to get chipmakers, tool vendors and parts suppliers in the same room and hammer out “a baseline for measuring defects introduced by process-critical components,” according to SEMI.　　“The first two years was really spent working on test methods for seal impurities,” SEMI’s Trio said. “SCIS has since expanded to other critical components.”　　Today, SCIS has eight working groups in the following areas—chambers; gas delivery; liquid delivery; pumps; RF generators; seals; and valves. The eighth group, the Traceability Verification Group, is developing an “Information Exchange Model.” This involves providing traceability data to a potential issue in the fab via the cloud.　　Fig. 4: SCIS Organizational Structure. Source: SEMI SCIS　　So far, the group has made progress on several fronts. “It depends on the type of components we are talking about. The industry should come together on the simpler ones, such as valves, pumps, seals, sub-fab areas and abatement,” Applied Seals’ Vernikovsky said. “Things that may be considered IP-sensitive, such as shower heads and others, may take longer. IP concerns may never get us there, but many of the sub-components already have definitions of some type that can be aligned to everyone’s agreement.”　　Standards make sense for various reasons. “Industry standards will be important in providing consistent parameters to enable users to compare similar parts and assess performance differences,” SEMI’s Trio said. “Chipmakers and tool vendors can reference these specs to ensure that their suppliers or prospective suppliers measure the same way. Doing so enables users to compare similar parts, assess performance differences, and select the appropriate component that is best suited for their intended process application.”　　Fig. 5: SCIS Activity Status. Source: SEMI SCIS　　Other solutions　　Collaboration, standards and testing methodologies are a big step in the right direction, although there are other solutions, as well.　　If a problem crops up, it’s unrealistic to test every component and troubleshoot them in a fab. “In my view, you very quickly get to a completely intractable solution,” Coventor’s Fried said. “You can overwhelm yourself very quickly looking where any single possible defect could arise from.”　　So a fab must not only troubleshoot the tool, but it should look at the problem from a wafer perspective. “If I look at it from the wafer perspective at any given process operation, there are certain types of defects, materials of defects, sizes of defects and locations of defects,” Fried said. “That basically describes every defect at any given step. Some of them are killers and some of them are not.”　　By looking at the wafer, the fab can then begin to solve the problem. “You can’t go after every single problem in the universe at the same time with an equal amount of resources. You have to go after the killer defects first, and then you go after the lower level defectivity later,” he said. “You have to look at the manufacturing perspective, and then you can understand this massive system of components, sub-components and materials.”　　For this, chipmakers can go several routes. One way is to use simulation techniques to predict potential problems. By modeling the process, chipmakers can reduce silicon learning cycles and development costs.　　Tool monitoring is another approach. In tool monitoring, bare wafers are processed in the fab. Then, an inspection tool determines if a given piece of fab equipment is the root cause of defects on the wafer. If so, the tool can be moved offline and evaluated.

Key word：

Fabs,ool Parts

Release time：2017-09-05 00:00 reading：1497 Continue reading>>

NXP to Spend $22 Million to Expand U.S. <span style='color:red'>Fabs</span>

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NXP to Spend $22 Million to Expand U.S. Fabs

　　NXP Semiconductors NV will spend about $22 million to expand manufacturing at its fabs in Texas and Arizona to make secure ID chips for U.S. government programs, the company said.　　The expansion will enable NXP fabs in Austin, Texas, and Chandler, Ariz., to be certified to manufacture finished products that exceed the highest U.S. and international security and quality standards, according to NXP.　　“This initiative advances NXP’s long-term commitment to developing secure ID solutions for federal, state and local government programs in the United States and demonstrates our deep dedication to serving the American market,” said Ruediger Stroh, executive vice president of security and connectivity at NXP, in a press statement.　　NXP (Eindhoven, the Netherlands) claims market leadership in secure ID chips. The company says its chips are used for ID documents in more than 120 countries and passports issued by 95 countries.　　Steve Adler, mayor of Austin, said in the NXP statement that he expects the expansion to “secure thousands of jobs and further foster the growth of Austin as a major technology hub.”　　NXP said its R&D manufacturing facilities in San Jose, Austin and Chandler have also undergone a thorough security site certification process to produce Common Criteria EAL6+ SmartMX microcontroller family products. Common Criteria is an international set of guidelines and specifications developed for evaluating information security products to ensure they meet a rigorous security standard for government deployments.

Key word：

NXP,Fabs

Release time：2017-07-25 00:00 reading：977 Continue reading>>

U.S. Paves Roads to Trusted <span style='color:red'>Fabs</span>

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U.S. Paves Roads to Trusted Fabs

　　The U.S. Department of Defense is working with partners on multiple technologies that would make any foundry a trusted source to make classified ASICs for the military. If the government is successful it will be able to tap leading-edge process technologies from multiple fabs by 2019.　　The U.S. government currently works with a single fab now operated by Globalfoundries and limited to 32nm and higher design rules. The partnership is a continuation of a longstanding “trusted foundry” deal with IBM, which sold its fabs to GF in 2015.　　“We have a very good partner in Globalfoundries, and many people are still there from the [former] IBM…[that help] manage that government ASIC business, and that still works quite well for 32nm and up,” said Bill Chappell, a director at the Defense Advanced Research Projects Agency that oversees the trusted foundry programs.　　“Beyond 32nm, we will need to play a bigger role. All [foundries] are part of global multinationals, even if they [have fabs] onshore. The DoD has to figure out how to tap into them for its needs,” Chappell said.　　The gap between the state-of-the-art and the processes running at the former IBM fab has grown and will grow in future, Chappell said. “The theory is to open ourselves to any and all [fabs]. Even Globalfoundries is part a global network,” he said.　　Ironically, perhaps “the lion’s share of 14nm manufacturing is onshore [in the U.S.] with Samsung Austin and Intel, mostly onshore, and Globalfoundries in Malta. None of those are within our trust barrier today,” he added.　　One DARPA program in Chappell’s division, called SHIELD, aims to eliminate counterfeit integrated circuits using 100x100 micron tags packing encryption, sensors and near-field communications. The program “has some key tests planned…to secure industry and community buy-in,” said a DARPA spokesman.　　Separately, a university is helping develop an obfuscation technique that lets engineers “design [a chip] with a flat netlist and program it when it gets back into a trusted facility. The true nature of the circuit is not revealed until it is in the trusted location,” Chappell said.　　Another effort involves breaking a chip into trusted and untrusted portions. The trusted part monitors and programs the untrusted part and can be made in a 90 or 180nm fab where we have trusted programs,” he said.　　The DoD is already engaged at various levels with all the major foundries.　　“We have manufacturing at TSMC for research, Samsung has done work for IARPA [part of the U.S. intelligence community] and we’re doing chip development with Intel today…from a research perspective,” he said.　　The size of the DoD’s ASIC business is estimated to be somewhere between $10 and $100 million a year. “It’s not very large, but it’s important,” said Chappell.　　“We aren’t a [tech] driver for any of those companies, so it’s incumbent on us to figure out how to work with them. There’s a lot of R&D we do and a lot of different chips, but there’s no volume there,” he said.

Key word：

Fabs

Release time：2017-07-12 00:00 reading：1101 Continue reading>>

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STM32F429IGT6	STMicroelectronics
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