<span style='color:red'>Infineon</span> announces completion of acquisition of GaN Systems
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Infineon announces completion of acquisition of GaN Systems

　　Infineon Technologies AG recently announced the closing of the acquisition of GaN Systems Inc. (“GaN Systems”). The Ottawa-based company brings with it a broad portfolio of gallium nitride (GaN)-based power conversion solutions and leading-edge application know-how. All required regulatory clearances have been obtained and GaN Systems has become part of Infineon effective as of the closing.　　“GaN technology is paving the way for more energy-efficient and CO 2-saving solutions that support decarbonization,” said Jochen Hanebeck, CEO of Infineon. “The acquisition of GaN Systems significantly accelerates our GaN roadmap and further strengthens Infineon’s leadership in power systems through mastery of all relevant power semiconductor technologies. We welcome our new colleagues from GaN Systems to Infineon.”　　Infineon now has a total of 450 GaN experts and more than 350 GaN patent families, which expands the company’s leading position in power semiconductors and considerably speeds up time-to-market. Both companies’ complementary strengths in IP and application understanding as well as a well-filled customer project pipeline put Infineon in an excellent position to address various fast-growth applications.　　On 2 March 2023, Infineon and GaN Systems announced that the companies had signed a definitive agreement under which Infineon would acquire GaN Systems for US$830 million. The acquisition, an all-cash transaction, was funded from existing liquidity.
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Release time：2023-10-27 10:48 reading：1369 Continue reading>>
<span style='color:red'>Infineon</span> Inks Multi-Year Power Semiconductor Supply Agreements with Hyundai and Kia
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Infineon Inks Multi-Year Power Semiconductor Supply Agreements with Hyundai and Kia

　　Infineon, Hyundai, and Kia announced on October 18 that they have signed a multi-year agreement for the supply of SiC (Silicon Carbide) and Si (Silicon) power semiconductor modules and chips.　　Under this agreement, Infineon will supply SiC and Si power components to Hyundai and Kia until 2030, and in return, Hyundai and Kia will support Infineon’s production capacity and reserves.　　The demand for SiC power devices has surged with the growing popularity of new energy vehicles, and as a prominent industry leader, Infineon has embarked on numerous collaborations this year.　　Infineon and Resonac　　In January, Infineon declared a new multi-year supply and cooperation agreement with Resonac Co., Ltd. (formerly Showa Denko K.K.). According to this agreement, Resonac will provide Infineon with SiC materials for producing SiC semiconductor components, including 6-inch and 8-inch wafers. Initially focused on 6-inch wafers, Resonac will later supply 8-inch SiC wafers to support Infineon’s transition to 8-inch wafers. As part of the agreement, Infineon will also provide Resonac with SiC material technology-related intellectual property.　　Infineon and TanKeBlue, SICC　　In May, Infineon signed long-term agreements with TanKeBlue and SICC to ensure a more competitive and substantial supply of silicon carbide materials. These two suppliers will primarily provide Infineon with 6-inch silicon carbide substrates and offer 8-inch silicon carbide materials, aiding Infineon in transitioning to 8-inch SiC wafers. The agreements also encompass silicon carbide ingots, as Infineon had previously invested nearly 1 billion RMB in acquiring a laser-based wafer technology enterprise, aiming to enhance the utilization of silicon carbide substrates and device cost competitiveness.　　Notably, both TanKeBlue and SICC will account for a double-digit percentage of Infineon’s long-term demand volume.　　Infineon and Foxconn　　In the same month, according to the Foxconn’s official website, Infineon and Foxconn have signed a memorandum of cooperation to establish a long-term partnership in the field of electric vehicles. Under this agreement, the two companies will focus on the adoption of silicon carbide technology in high-power applications for electric vehicles, such as traction inverters, on-board chargers, and DC converters. They also plan to jointly establish a system application center in Taiwan to expand their collaboration further.　　Infineon and Schweizer Electronic　　Additionally, Infineon is collaborating with Schweizer Electronic to develop an innovative solution aimed at directly embedding Infineon’s 1200V CoolSiC™ chips into PCB boards. This move seeks to significantly enhance the driving range of electric vehicles while reducing the overall system cost.　　Infineon and Infypower　　In September, Infineon announced a partnership with Shenzhen Infypower (INFY) to provide the industry-leading 1200V CoolSiC™ MOSFET power semiconductor devices, boosting the efficiency of electric vehicle charging stations.　　In line with their goal of capturing a 30% share of the global SiC market by 2030, Infineon revealed plans to invest up to 5 billion euros over the next five years to construct the world’s largest 8-inch SiC power semiconductor facility in Malaysia.
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Release time：2023-10-20 13:27 reading：1729 Continue reading>>
AMEYA360：<span style='color:red'>Infineon</span> Technologies EVAL-6ED2231S12TM1 Evaluation Board
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AMEYA360：Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board

　　Infineon Technologies EVAL-6ED2231S12TM1 Evaluation Board is designed to demonstrate the CoolSiC MOSFET module and Silicon-On-Insulator (SOI) gate driver technology for motor drives. This eval board is powered by a 6ED2231S12T 1200V, a three-phase gate driver.       The EVAL-6ED2231S12TM1 board features an EasyPACK 1B CoolSiC MOSFET 1200V module, one three-phase SOI gate driver IC, and an M1 connector. This eval board supports over current protection, Fault reporting, automatic Fault clear, and Enable function on the same pin (RFE). Typical applications include ceiling fans, Heating Ventilation and Air Conditioning (HVAC), industrial motor drives and controls, motor control and drives, and residential heat pumps.　　FEATURES　　1200V SOI technology　　5000W maximum motor power　　200V minimum and 800V maximum supply voltage　　Best-in-class minus VS performance　　Withstands negative 100V with repeating 700ns pulse widths　　Integrated, ultra-fast, and low RDSON bootstrap diode　　IO+ 350mA and IO- 650mA output current　　Over current protection (ITRIP ±5% reference)　　Integrated 360ns dead-time　　Independent under-voltage lockout for VCC and VBS　　3.3V, 5V, and 15V input logic compatible　　Fault reporting, automatic Fault clear, and Enable function on same pin (RFE)　　2.5kV HBM ESD and 25V VCC capable　　SOIC-28 with 4 pins removed for high clearance DSO-24 package　　APPLICATIONS　　Ceiling fan - motor control and drive solutions　　Heating Ventilation and Air Conditioning (HVAC)　　Industrial motor drives and controls　　Motor control and drives　　Residential heat pumps
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Release time：2023-03-28 14:59 reading：1926 Continue reading>>
Ameya360:<span style='color:red'>Infineon</span>’s WBG catch-up with GAN Systems acquisition
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Ameya360:Infineon’s WBG catch-up with GAN Systems acquisition

　　At a dinner held during CES 2023 in January, I had the opportunity to talk to a senior Infineon executive sitting next to me about the company’s widely talked about acquisition ambitions for this year expressed in a statement. The rationale was that while the semiconductor industry is going through a downward cycle, it’s a good window of opportunity to acquire strategic assets at a good price.　　A few days later, when I sat with GAN Systems CEO Jim Witham to get a sense of what’s new and latest in gallium nitride (GaN) semiconductor technology, what I found most striking was his remark about how quickly this market has emerged over the past decade or so. “If you go back five years, people were asking when GaN will happen, and now while GaN devices has established themselves in the market, it’s a little late to join the GaN party,” Witham said. Now it’s really about market penetration, he added.　　At that moment, I instantly began thinking about large power semiconductor players and what they will do to address this market reality. One company that came to mind was Microchip, which acquired Microsemi in 2018 to get hold of silicon carbide (SiC) assets. Very good timing, indeed.　　Another supplier of wide bandgap (WBG) semiconductors, UnitedSiC, was acquired by Qorvo in 2021. But what about other big analog and power semiconductor suppliers? What also came to mind was Infineon’s failed attempt to acquire Cree’s SiC business, Wolfspeed, back in 2017. Cree later named itself on its most successful brand, Wolfspeed, and its SiC business has rapidly grown since then.　　Figure 1 GaN semiconductors facilitate higher power density, higher energy efficiency, and smaller device form factor. Source: Infineon Technologies　　Well, Infineon Technologies has answered the call by snapping GAN Systems for $830 million. Industry watchers believe this could trigger a consolidation wave around the emerging WBG semiconductor industry. Besides Ottawa, Canada-based GAN Systems, other GaN semiconductor specialists include Cambridge GaN Devices, Efficient Power Conversion (EPC), Navitas Semiconductor, Transphorm, and Vanguard International Semiconductor.　　Acquisition merits　　While we’ve seen several SiC-centric acquisitions in recent years, Infineon’s deal marks the first major GaN asset purchase. And, given GaN’s crucial significance in power electronics, it’s very likely that it won’t be the last.　　For Infineon, the number one power semiconductors business in terms of market share, it’s also critical that it fills the GaN missing link in its power semiconductors portfolio. Though not a prolific acquisition player, Infineon has made two highly successful deals in recent years. First, in 2014, it bought power semiconductor pioneer International Rectifier to bolster its automotive offerings. The acquisition also brought Infineon some GaN technology assets as an add-on to this deal.　　Next, in 2019, Infineon acquired Cypress Semiconductor to further boost its portfolio for the automotive markets. Both deals—International Rectifier and Cypress—have gone well for Infineon. So, given Infineon’s track record and prevailing market conditions, the GAN Systems purchase looks like a timely call.　　Figure 2 GaN semiconductors have been incorporated into Canoo’s on-board charger (OBC) to convert AC power from the wall receptacle into the DC power that charges the EV battery. Source: GAN Systems　　Besides strengthening Infineon’s GaN technology roadmap, it provides the German chipmaker timely access to applications such as mobile charging, data center power supplies, residential solar inverters, and on-board chargers (OBCs) for electric vehicles (EVs). As GAN Systems chief Witham points out, the deal will also combine Infineon’s in-house manufacturing with GaN Systems’ foundry corridors. TSMC is GAN Systems’ manufacturing partner.　　Here, it’s important to note that in February 2022, Infineon announced to double down on WBG manufacturing by investing more than €2 billion in a new front-end fab in Kulim, Malaysia. The first wafers will leave the fab in the second half of 2024, complementing Infineon’s existing WBG manufacturing capacities in its fab at Villach, Austria.　　End of another chip startup story　　It’s the end of the road for the Canadian startup founded in Ottawa in 2006. Girvan Patterson and John Roberts co-founded GaN Systems after seeing GaN as an opportunity and growth venue in the power industry, especially in data centers, industrial motors, and mobile chargers. Ottawa, the Canadian capital, had a research facility, National Research Council (NRC), which gave the upstart a small GaN fab to acquire fast learning cycles. “That’s why we could develop working GaN transistors fast enough,” Witham told EDN at CES 2023.　　Figure 3 GaN Systems, based in Ottawa, has more than 200 employees.　　GaN Systems has been a success story in the rapidly emerging WBG semiconductors arena. GaN semiconductors are now being targeted at a wide range of power applications due to their smaller form factor and energy-saving credentials enabled by higher power density and energy efficiency. According to market research firm Yole, the GaN revenue for power applications is expected to grow by 56% CAGR to approximately $2 billion by 2027.　　GaN Systems claims it’s the only GaN semiconductors company with a production program for automotive. At CES 2023, it displayed an OBC from Canoo and a DC-DC converter from Vitesco for EVs. The adoption of GaN devices in EVs is at a tipping point, as Infineon CEO Jochen Hanebeck acknowledged in the press release announcing this acquisition.
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Release time：2023-03-07 13:21 reading：694 Continue reading>>
Ameya360:ASUKA Taps Exosite and <span style='color:red'>Infineon</span> for CO2 Monitoring Cloud System
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Ameya360:ASUKA Taps Exosite and Infineon for CO2 Monitoring Cloud System

　　ASUKA Autotronics & Smart Sensing Inc. has cooperated with Infineon Technologies and Exosite to launch its Indoor CO2 Monitoring Cloud System, which is targeted at smart buildings, industrial workplace monitoring, smart agriculture, and other related use cases. The solution helps enterprises to swiftly establish an indoor air quality monitoring system that meets the Environmental Protection Administration (EPA) regulations, and add value to the system integrators’ IoT service.　　Carbon dioxide (CO2) is a colorless and odorless gas emitted by human activities. It is the most critical indicator of indoor air quality. The CO2 level of outdoor fresh air is around 400 ppm, while the CO2 level of a well-ventilated office is about 600-800 ppm. If people are exposed to high CO2 levels (more than 1000 ppm) for a period of time, the CO2 itself can cause headache, dizziness, nausea and other symptoms.　　Governments around the world are developing ventilation guidelines and regulations that should maintain a comfortable environment (such as schools, hospitals, shopping malls, working facilities, etc.) for most occupants. Taiwan EPA framed the “Indoor Air Quality Management Act ” that regulates certain premises owners to measure, announce, and keep records of CO2 concentration for inspection every two years.　　ASUKA leverages Infineon and Exosite　　ASUKA KP-201 is a high-sensitive, system-level CO2 sensing module by utilizing Infineon’s PAS technology CO2 sensing IC, microcontrollers, and Wi-Fi. It is capable of measuring the indoor air quality every minute and uploading the sensor data via Wi-Fi to Exosite’s ExoSense, a condition monitoring cloud application that provides visualizations and operational insights. The IoT data is securely stored in Exosite’s IoT software platform and can also be accessed by ASUKA mobile APP.　　“We have made the two important things, CO2 sensing and cloud data processing, easier,” said Dr. Ron Hu, President of ASUKA Autotronics. “Because ASUKA’s system-level CO2 sensing module KP-201W has been successfully integrated with Exosite ExoSense and other well-known public cloud platforms, its sensing data can be easily and quickly sent to the cloud without editing any code, achieving a painless plug-n-play IoT system.”　　The next step　　Hu said that the next product will be a system-level module integrating Infineon’s CO2 sensing IC and 60GHz mmWave radar sensor. The mmWave radar can capture subtle movement of people and vehicles. It can be used in smart homes, smart buildings, security monitoring etc. Thanks to its low power consumption, mmWave radar can be used to control electronic appliances to achieve the goal of energy saving and environmental sustainability. The new product will be also compatible with Exosite ExoSense condition monitoring cloud application.
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Release time：2023-02-10 13:35 reading：1896 Continue reading>>
Ameya360:<span style='color:red'>Infineon</span> Leads Intelligent Power Electronics Research Initiative
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Ameya360:Infineon Leads Intelligent Power Electronics Research Initiative

　　Over 100 representatives from 39 companies and 23 research institutions kicked off PowerizeD, a European research initiative focusing on intelligence in power electronics and decarbonizing European society.　　PowerizeD is to take the sustainability and resilience of the European energy chain, from generation to application, to a new level and strengthen Europe’s technological sovereignty. Sixty-two research partners from 13 European countries are involved in the major European project with an overall volume of 72 million euros. PowerizeD addresses a new level of technology and relies increasingly on the digitalization of power applications. Infineon Technologies AG initiated the project, is an active participant with several corporate divisions and is also the overall project coordinator.　　“We have to make highly efficient use of energy if we are to achieve net-zero climate protection goals. Digitalization can help here as a highly decisive lever for more energy efficiency,” says Constanze Hufenbecher, Infineon Chief Digital Transformation Officer. “We are pleased to be able to combine our strengths with the strengths of so many excellent partners from research and business to jointly make the ambitious European research initiative PowerizeD a success.”　　“Power electronics is key to the energy transformation and is used anywhere and everywhere that electricity is generated, transferred and used efficiently,” says Dr. Rutger Wijburg, Chief Operations Officer at Infineon. “The broad spectrum of power electronics applications makes it very important that we collaborate with partners across the boundaries of corporate entities and organizations to jointly advance Europe as innovation engine.”　　The project partners are focusing on applications from the fields energy and mobility. Seventeen demonstrator paths are concerned among other things with improvement of drives for the rail industry, charging systems for the automotive industry, liquid batteries for the energy industry as well as drives for the manufacturing industries. The research partners will take an interdisciplinary approach with topics including modeling and Digital Twin, Federated Learning as well as reliability and sustainability.　　The newly developed key technologies are to be realized and demonstrated in concrete form, and are to be evaluated in terms of a large number of universally applicable results. The immediate project objectives include:　　Reduction of power loss in power conversion by 25 percent　　Extension of the service lives of devices and systems by 30 percent　　Reduction of chip size by at least 10 percent　　Shortening development times by a challenging 50 percent　　Technologically speaking, PowerizeD is to increase the degree of mechanical and electrical integration of control, driver and switching functionalities in components and to advance the integrated optimization of all power switch functionalities, independent of the semiconductor material used. New switching topologies and advanced control strategies involving the application of Artificial Intelligence are to improve efficient, robust and reliable operations even further.　　The European Union is funding PowerizeD with approximately 18 million euros as part of the joint program for digital key technologies (Key Digital Technologies Joint Undertaking, KDT JU) in its Digital Agenda. The amount will be matched by funding from the national governments of the respective countries involved. The subsidies from Germany are being provided by the German Federal Ministry of Education and Research. A summary of all the project partners and supporting organizations is available on the project web site. The project will have a three-year duration and is expected to end in December 2025.
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Release time：2023-02-08 14:58 reading：1962 Continue reading>>
Ameya360:MathWorks Simulink Now Supports <span style='color:red'>Infineon</span>’s Automotive MCUs
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Ameya360:MathWorks Simulink Now Supports Infineon’s Automotive MCUs

　　MathWorks and Infineon Technologies AG have launched a hardware support package for the MathWorks Simulink products for Infineon’s latest AURIX TC4x family of automotive microcontrollers (MCUs). Automotive engineers designing advanced electric vehicles, sensor fusion, and radar signal processing functions can use the hardware support package, even before silicon is available. With the package, they can validate use cases, rapidly and automatically generate the embedded software, and test algorithms.　　“Our newest AURIX TC4x microcontroller family will give customers unparalleled real-time safety and security performance,” said Marco Cassol, Director of Microcontroller Product Marketing for ADAS, Chassis and EE Architecture applications at Infineon Technologies. “Support for these chips from the widely used MathWorks capabilities for model-based design enables engineers to get an earlier start on pre-silicon software development and automate code generation to accelerate that development. The resulting time-to-market benefits could significantly impact our customers’ success.”　　“This close collaboration with Infineon will enable our mutual customers to accelerate the pace of development of electric vehicle systems,” said Jim Tung, MathWorks Fellow. “Engineers can tackle complex systems while managing risk, with an improved understanding of system-level behavior, continuous verification, and a digital thread to requirements. We are proud to contribute to these activities that help make vehicles cleaner, more efficient, and more reliable.”　　The MathWorks and Infineon partnership delivers capabilities that enable automotive engineers to accelerate the development of electric vehicle and driver-assistance functions. These capabilities simplify the development of increasingly complex automotive systems. Model-based design with MATLAB and Simulink can accelerate embedded-system development and verification by 30 to 40 percent over traditional approaches, making the seamless support of Infineon’s automotive microcontrollers valuable for engineers and researchers.　　This is the latest in a series of collaborations between Infineon and MathWorks. Another recent example is the inclusion of Infineon’s SPICE models for the OptiMOS 5 MOSFET devices in MathWorks’ Simscape physical modeling environment, enabling faster design and effective control of electric motors for powertrain and cooling, pumps, and other automotive control features to increase efficiency and decrease CO2 emissions.
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Release time：2023-02-02 15:03 reading：2073 Continue reading>>
Ameya360:<span style='color:red'>Infineon</span> and REE Automotive Collaborating to Promote Sustainable Mobility
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Ameya360:Infineon and REE Automotive Collaborating to Promote Sustainable Mobility

　　Infineon Technologies AG is collaborating with REE Automotive Ltd to accelerate green and smart mobility. The automotive technology company developed the REE modular Electric Vehicle platform which serves as a foundation for a wide variety of electric vehicle (EV) types, from robotaxis and commercial vans all the way to electric passenger shuttles.　　Infineon and REE last week showcased the REEcorner technology at electronica 2022 in Munich. REEcorner packs critical vehicle components into a compact module positioned between the chassis and the wheel, enabling REE to build fully flat EV platforms. REE’s flagship P7 EV platform is based on four REEcorners with REE’s x-by-wire technology. The ultra-modular P7 EV platform offers greatest interior space for passengers, cargo and batteries as compared to vehicles with an internal combustion engine (ICE) or EVs of similar size. REE’s design and technology affords auto manufacturers, delivery and logistic companies and new technology players vast design freedom allowing them to build vehicles tailored to their exact needs.　　“Infineon is an important forerunner in the mobility transformation. The REEcorner technology demonstrates the breadth and flexibility of our high-quality semiconductor technologies and system expertise,” said Peter Schiefer, President of the Automotive Division of Infineon. “Innovative and modular EV platform designs add new options for both established and emerging industry players to further accelerate electromobility.”　　“REE provides customers with full design freedom to create the broadest range of EVs and autonomous vehicles for current and future applications. Electric vehicles powered by REE are geared to deliver substantial benefits to customers, including significantly reduced Total Cost of Ownership, enhanced maneuverability and safety with x-by-wire steering and drive and operational efficiencies,” said Daniel Barel, REE Co-Founder and CEO.　　To increase safety and cybersecurity – especially with regard to fail-operational drive-by-wire requirements – the REE platform uses as many as 11 AURIX microcontrollers (TC3xx). There are two in each corner module in the platform’s design to actuate all the native driving functions like steering and braking. Two additional microcontrollers are located in the center module, where they function as domain controllers, collecting and controlling data and synchronizing the four corner modules. Another AURIX is responsible for vehicle chassis management in a separate ECU. In addition, the platform also contains numerous other automotive components from Infineon including MOSFETs, power supply ICs (DCDC) and magnetic sensors.　　Infineon is the market leader in automotive semiconductors, pairing the broadest automotive semiconductor product portfolio with system-level competence. The offering ranges from sensors, microcontrollers, high-performance memory for specific applications to power semiconductors based on silicon and silicon-carbide (SiC), as well as components for human-machine interaction and vehicle connectivity.　　Infineon is at the core of the transformation of the automotive industry towards green mobility and partners with established Tier 1s, OEMs and new automotive players.　　Electromobility is showing strong growth driven by emission regulations placed on manufacturers as well as environmental consciousness of consumers. Cars with fully or partially electrified drivetrains will account for more than 50 percent of cars produced in 2027, as per analyst forecasts. Already in 2021, approximately every second of the BEVs (Battery Electric Vehicle) and PHEVs (Plug-in Hybrid Electric Vehicle) produced had integrated Infineon semiconductors in the inverter, the ‘heart’ of an electric drivetrain. Furthermore, Infineon’s AURIX microcontroller fosters the trends of electromobility, advanced driver assists systems (ADAS) and automated driving, automotive electric-electronic (E/E) architectures and affordable artificial intelligence (AI) applications.
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Release time：2023-02-01 11:18 reading：1944 Continue reading>>
Ameya360:<span style='color:red'>Infineon</span> Expands Partnership with Resonac on SiC Material Supply
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Ameya360:Infineon Expands Partnership with Resonac on SiC Material Supply

　　Infineon Technologies AG has extended its cooperation with Resonac Corp. (formerly Showa Denko K.K.) by signing a new multi-year-supply and cooperation agreement on silicon carbide (SiC) material supply.　　According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade.　　While the initial phase focuses on 6″ SiC material supply, Resonac will also support Infineon’s transition to 8″ wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon-Resonac partnership contributes to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC.　　“The demand for SiC is growing rapidly and we are preparing for this development with a significant expansion of our manufacturing capacities,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “We are pleased to deepen our collaboration with Resonac and strengthen the partnership between our two companies.”　　“The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers. We are very happy that our partnership with Resonac will strongly support our market-leading position,” said Peter Wawer, President of Infineon’s Industrial Power Control division.　　“We are pleased to team-up with Infineon as a global leader in power semiconductors in order to meet the growing demand for SiC in the years to come. We will continuously improve our Best-in-Class SiC material and develop the next generation of 8″ wafer technology. We value Infineon as an excellent partner in this regard,” said Jiro Ishikawa, Executive Adviser of Device Solutions Business Unit at Resonac.　　Infineon is currently expanding its SiC manufacturing capacity in order to reach a market share of 30 percent by the end of the decade. Infineon’s SiC manufacturing capacity is about to increase tenfold by 2027. A new plant in Kulim is scheduled to start production in 2024. Today, Infineon already provides SiC semiconductors to more than 3,600 customers worldwide.
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Release time：2023-01-31 11:01 reading：1719 Continue reading>>
Ameya360:<span style='color:red'>Infineon</span> Divests HiRel DC-DC Converter Business
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Ameya360:Infineon Divests HiRel DC-DC Converter Business

　　Micross Components Inc. has entered a definitive agreement to purchase Infineon Technologies AG’s HiRel DC-DC converter business, including its hybrid and custom board-based power products. This sale will enable Infineon to extend its focus and investments on core semiconductor developments for the high-reliability market, while deemphasizing businesses that require more customized product offerings for the high-reliability industry. The deal is expected to close in the first quarter of 2023.　　“Infineon is pleased to have reached an agreement with Micross to provide a more strategic home for our HiRel DC-DC converter business,” said Bob LeFort, President of Infineon Technologies Americas. “We believe this sale is in the best interest of both companies; our customers, employees, and shareholders. This transaction enables Infineon to remain focused on the HiRel business areas that benefit from Infineon’s leading semiconductor technologies. We look forward to working with Micross to ensure a seamless transition for our customers and employees.”　　“We are pleased to have reached an agreement with Infineon on their HiRel DC-DC converter business and to have the opportunity to partner with their highly experienced team which further expands Micross’ design capabilities. We are excited about the significant proprietary power management IP that combined with their state of the art manufacturing capabilities and product portfolio leads the way for advancement of innovative solutions. We will be better positioned to produce an even wider range of high-quality products for our customers. Together, we plan to pursue a number of compelling opportunities to further realize our exciting growth prospects, all while upholding excellent quality and service to our customers,” said Vince Buffa, Chairman and CEO of Micross.　　The HiRel DC-DC converter business is a leading provider of high reliability DC-DC power conversion solutions for the toughest environments, including outer space, and will operate under the Micross Hi-Rel Products business segment. These DC-DC converter products are complete power solutions, including main power converter, control circuits, filters and housing.　　“We are dedicated to our customer and partner base, and will continue to leverage our existing resources and talent to develop innovative solutions together,” said Chris Opoczynski, Sr. Vice President and General Manager, HiRel Business Line, Infineon Technologies. “In our retained HiRel businesses, Infineon will strengthen its focus on these target applications, along with others that demand the highest reliability and highest performance. We are committed to the mission-critical space, defense, and aerospace industries.”
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Release time：2023-01-19 13:35 reading：1862 Continue reading>>

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