SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis <span style='color:red'>IoT</span> modules
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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.
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Release time：2025-03-18 16:38 reading：316 Continue reading>>
Simcom：E7025 R3 High-Performance, Cost-Effective NB-<span style='color:red'>IoT</span> Connectivity
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Simcom：E7025 R3 High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.
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Release time：2024-12-25 11:39 reading：647 Continue reading>>
SIM8230: Advanced and Flexible 5G Connectivity for Demanding <span style='color:red'>IoT</span> Applications
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SIM8230: Advanced and Flexible 5G Connectivity for Demanding IoT Applications

　　The 5G RedCap specification, introduced in version R17 of the 3GPP standard, addresses the growing need for efficient connectivity in IoT devices that do not require the full performance of 5G. Also known as "Reduced Capability," this technology offers a more cost-effective and energy-efficient alternative to 4G, LTE-M, and NB-IoT.　　RedCap provides an optimal balance between speed and energy efficiency, making it ideal for applications that demand constant connectivity without requiring maximum 5G capacity.　　The SIM8230 module from SIMCom fits perfectly into this context, offering multi-band compatibility, intensive data transmission, and easy integration into IoT devices. Its efficient design meets the needs for economical connectivity, providing a viable solution for a wide range of IoT applications.　　The SIM8230 is a multi-band 5G NR/LTE-FDD/LTE-TDD module that supports 5G SA according to version R17 (3GPP), providing advanced connectivity capabilities. It stands out for its compatibility with a wide range of protocols, facilitating integration into various platforms.　　Compact and Easy to Integrate　　Equipped with interfaces like PCIe, USB 2.0, and GPIO, the SIM8230 offers developers great flexibility to customize their projects. Its LGA format optimizes design and installation, allowing for a more durable assembly and improving heat dissipation, saving space and simplifying installation.　　Rapid 5G Implementation with Minimal Reprogramming　　The compatibility of the SIM8230’s AT commands with the SIM7600/8200/8260 series reduces costs and accelerates time to market. This is especially advantageous for companies that need to implement 5G solutions quickly without requiring extensive reprogramming.　　Additionally, the SIM8230 is based on the Qualcomm X35 platform, which introduces the world's first 5G NR-Light modem-RF system, designed to enhance connectivity at the intelligent edge. This optimized architecture combines energy efficiency and lower complexity design, allowing compact devices to make the most of 5G connectivity. Thanks to its energy- saving features and improved performance, the X35 not only facilitates a smooth migration from LTE CAT-4+ devices but also enables a new wave of use cases for IoT devices, facilitating the rollout of 5G solutions with minimal reprogramming.　　Technical Specifications of the SIM8230　　- The SIM8230 is available in different regional versions to adapt to connectivity needs in various markets: The SIM8230C, SIM8230E, SIM8230G, SIM8230JP, SIM8230NA, and SIM8230SA models are presented in an LGA+LCC format with dimensions of 30.0x30.0x2.5 mm, optimized for compact devices. For M2 formats, the SIM8230C-M2, SIM8230E-M2, SIM8230G-M2, and SIM8230JP-M2 models have dimensions of 42.0x31.4x3.4 mm. Additionally, the SIM8230C-PCIE, SIM8230E-PCIE, SIM8230G-PCIE, and SIM8230JP-PCIE models are available in PCIe format with dimensions of 50.8x31.0x3.6 mm.　　- Supported Frequencies: 5G NR (Sub6G), LTE-FDD, LTE-TDD.　　- GNSS: Compatibility with global navigation systems, ideal for geolocation applications (GPS/GLONASS/BeiDou).　　- Temperature Range: Operates between -40℃ and +85℃, ensuring reliability in extreme weather conditions.　　- Electrical Characteristics: Operates with a voltage of 3.3 to 4.4 V, providing wide compatibility.　　- Data Transfer Performance: Sub-6G SA with speeds of up to 220 Mbps download and 100 Mbps upload; LTE with up to 200 Mbps download and 75 Mbps upload, providing solid performance on LTE networks.　　- Software Functions: Support for protocols such as TCP/IP, IPV4, IPV6, Multi-PDP, FTPS, HTTPS, MQTTS, and DNS, as well as USB/FOTA functionality for remote firmware updates.　　- Interfaces and Connectivity: Includes interfaces such as USB, UART, PCM, GPIO, I2C, and PCIe. Supports SIM cards of 1.8V/2.95V, expanding its compatibility.　　- Certifications: The SIM8230 is currently in the process of obtaining international certifications such as CE (RED), FCC, GCF, PTCRB and MNO TA.　　Versatile and Robust Applications　　The SIM8230 stands out as a key module in CPE and MiFi applications, offering efficient 5G connectivity and FWA access that meet the needs of both industrial and residential sectors. Its optimized design and low energy consumption make it ideal for remote environments, providing high-speed internet access in MiFi devices and converting 5G signals into WiFi in CPE installations.　　Moreover, its versatility makes it a preferred option for emerging sectors such as telemedicine, smart cities, and connected automotive, opening new possibilities for innovative IoT solutions. Its high efficiency, security, and flexibility make it an adaptable solution for future demands, ensuring fast and reliable connections in an increasingly interconnected world.
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Release time：2024-12-19 10:34 reading：633 Continue reading>>
E7025 R3: High-Performance, Cost-Effective NB-<span style='color:red'>IoT</span> Connectivity
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E7025 R3: High-Performance, Cost-Effective NB-IoT Connectivity

　　Narrowband IoT (NB-IoT), also known as Low-Power Wide-Area Network (LPWAN), is transforming how IoT devices connect by enabling low-power, wide-area communication with extended battery life and reliable network performance. SIMCom's E7025 R3 exemplifies this innovation, offering a compact, versatile, and high-performing solution tailored for diverse IoT applications.　　Compact Design for Modern IoT Solutions　　Measuring just 15.7mm × 17.6mm × 2.1mm, the E7025 R3 is perfectly tailored for space-constrained devices such as smart meters, remote control systems, asset tracking, and remote monitoring applications. Its compact size supports sleek, efficient product designs while reducing manufacturing costs, making it an ideal choice for IoT communication needs. This small yet powerful module is a cornerstone for creating innovative, cost-effective IoT solutions across industries.　　Enhanced Performance and Broader Applications　　As the third generation of the E7025 series, the E7025 R3 takes optimization to the next level, offering improvements in both cost efficiency and power consumption. Now with an optional low-power Bluetooth feature, it caters to a wider range of application scenarios. Compliant with 3GPP R13 and R14 standards, this NB-IoT module provides robust communication capabilities, including significantly enhanced signal gain and extensive coverage compared to GSM. This ensures reliable connectivity even in challenging environments like basements or other signal-restricted locations. Designed for static or low-mobility use cases that require low-latency, real-time data transmission, the E7025 R3 excels in applications such as gas meters, smoke detectors, and gas alarms, demonstrating its immense potential in these specialized markets.　　Power Efficiency for Extended Operations　　Equipped with Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX), the E7025 R3 achieves up to 10 years of battery life, minimizing the need for frequent maintenance. This makes it an exceptional choice for remote and low-maintenance applications, including environmental monitoring, smart agriculture, and remote asset tracking.　　The E7025 R3 excels in connectivity, supporting frequency bands B1/B3/B5/B8/B20/B28 for deeper network penetration and enhanced indoor coverage. This ensures reliable operation in environments like underground parking, shielded utility meters, or urban smart city deployments. Its compatibility with protocols such as IPv4, IPv6, MQTT, CoAP, LwM2M, and FOTA allows seamless integration into diverse IoT applications.　　Reliable and Easy Integration　　The E7025 R3 uses an LCC+LGA package that enhances reliability and simplifies assembly. Combined with SIMCom’s reference designs, evaluation boards, and technical support, the module accelerates time-to-market for IoT innovations.　　Global Coverage with CE Certification　　Designed for global markets, the E7025 R3 has CE certification with its robust performance, cost-efficiency, and reliability are particularly valued. The E7025 R3’s ability to balance affordability with advanced capabilities has made it a standout choice to scale their IoT deployments.　　With its advanced capabilities, compact size, and exceptional performance, the SIMCom E7025 R3 is a versatile solution poised to lead the way in IoT innovation. Whether for smart meters, remote control systems, asset tracking, and remote monitoring applications. E7025 R3 empowers to create more connected world.　　Unlock the future of IoT with SIMCom’s E7025 R3—where innovation meets reliability.
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Release time：2024-12-18 11:00 reading：6722 Continue reading>>
Fibocom Fosters Local 5G A<span style='color:red'>IoT</span> Market with Newly Launched 5G Module FG370-KR at A<span style='color:red'>IoT</span> Korea 2024
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Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
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Release time：2024-12-13 10:55 reading：861 Continue reading>>
Fibocom Drives the Rapid Growth in the Economics of <span style='color:red'>IoT</span> Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024
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Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.
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Release time：2024-07-03 13:57 reading：672 Continue reading>>
Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered <span style='color:red'>IoT</span> equipment
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Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.　　Specifications
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Release time：2024-06-28 11:31 reading：628 Continue reading>>
Fibocom Builds AI-specialized 'π' Shape Strategy upon 5G, AI, <span style='color:red'>IoT</span> to Empower Industry Transformation
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Fibocom Builds AI-specialized 'π' Shape Strategy upon 5G, AI, IoT to Empower Industry Transformation

　　The wave of intelligence is revolutionizing industries globally, with 5G, AI, and IoT playing key roles in this trend. During Computex 2024, Fibocom CEO - Tiger Ying shared his insights during the tradeshow.　　Fibocom, as China's first stock-listed wireless communication modules and solutions provider (stock code: 300638), has continuously employed innovative thinking and strategic market positioning in recent years. CEO Tiger Ying pointed out that, regardless of the technological or application aspects, in facing the transformative effects brought by these three major technologies, the company is well-prepared and ready to assist clients in seizing vast smart business opportunities.　　Remain Industry-Focused and is Confident to Accelerate 5G Deployment　　In the realm of 5G, this communication standard garnered significant market attention upon its release. The industry believes that 5G'sfeatures such as high speed, low latency, and large-scale connectivity not only enhance user experiences in the consumer sector but also serve as a crucial driver for deepening communication technology applications across industries.　　While the development of 5G has not been as fast as initially expected, communication giant Ericsson predicted in its 2023 report that the golden crossover period between 4G and 5G would be delayed until 2028.However, Tiger Ying pointed out that from the perspective of technical standards' development speed, this delay is still within a normal cycle.　　He mentioned that 5G's current development is focused on Enhanced Mobile Broadband (eMBB), Massive Machine Type Communications (mMTC), and Ultra-Reliable Low Latency Communications (URLLC). However, large-scale commercialization has not been achieved. This trend also highlights the versatility of 5G IoT architecture and applications.　　With the acceleration of 5G Advanced, it will truly replace4G as the mainstream technology for IoT applications and successfully drive market development within five years.　　Fibocom has responded to the trend of 5G development by formulating product strategies and solutions, actively expanding into different market sectors. Tiger Ying stated that the company's primary task is to promote the large-scale commercialization process of eMBB.　　They have already launched a diverse range of product portfolios. This includes the RedCap module, closely following the development of 5G technology and fully advancing the implementation of commercial plans.　　In terms of application areas, Fibocom is focused on industrial intelligence and smart cities, primarily because these two major application scenarios have diverse demands for 5G technology. For instance, in machine vision, which integrates edge computing with 5G's high bandwidth and low latency capabilities, it has been widely used in industrial quality inspection, promoting the development of industrial automation and intelligence.　　In response, Fibocom provides a complete product portfolio, such as the 5G smart module SC171 with computing power up to 12TOPS, to meet specific demands in application scenarios. In addition, endpoint devices with AI capabilities will also become a driving force in accelerating industrial intelligence processes.　　Fibocom has invested significant research and development resources in these products, aiming to integrate 5G and on-device AI technologies, thus strengthening the company's core competitiveness in industrial intelligence and smart city domains.　　Strengthening Edge AI Performance to Optimize Overall Cost-effectiveness　　AI has become a recent global industrial focus, and Fibocom's AI strategy centers on edge computing and the AI endpoint device solutions mentioned above. Since AI computing power can significantly increase the cost of endpoint devices, leading to reluctance from enterprises with implementation needs, cost control is crucial.　　Tiger Ying pointed out that the solution to this problem varies depending on the AI architecture. Devices using an offline AI architecture require precise control of edge computing power to balance cost and effectiveness, while devices using an online AI architecture require strong communication capabilities to avoid affecting user experience due to communication delays.　　Tiger Ying further stated that Fibocom has integrated the above two solutions into one through long-term research and development. The company has invested in smart module development, leveraging the computational efficiency and heterogeneous algorithm capabilities of modules to assist clients in rapidly deploying AI-capable terminal devices and optimizing costs.　　Its product portfolio includes 5G data modems, SoC 5G solutions based on Linux, and Android, and built-in AI computing capabilities. He mentioned that while AI may slightly increase device costs, its excellent performance leads to overall cost optimization considering macroscopic aspects such as user experience and value creation.　　He also mentioned that Fibocom has constructed heterogeneous computing on the network, enabling the scheduling of CPU, GPU, NPU, and DSP processor performance as needed. In addition, Fibocom has developed its toolchain and integrated it with heterogeneous algorithms, RTK, high-precision positioning, and other functions into firmware.　　Its products based on Linux, Android, and Windows architectures can meet the needs of different industry customers. Looking ahead, Fibocom will focus on areas such as robotic lawnmowers, low-speed autonomous vehicles, PCs, and robotic development platforms, providing deeper vertical domain solutions.　　Enhancing π-shaped Capabilities to Meet Three Major IoT Demands　　Regarding IoT, Tiger Ying pointed out that although the IoT architecture and concept have been around for over a decade and have become increasingly widespread in recent years, practical constraints mean that adoption varies across industries. To accelerate IoT adoption, several key factors are necessary.　　First is the ability to apply AI capability to IoT devices, as AI significantly impacts data collection costs and processing quality. IoT leveraging AI will be more readily accepted by enterprises, thus speeding up adoption in specific fields.　　Second is security design, which has become a major focus in IoT in recent years. Only IoT architectures that can ensure data integrity and privacy protection will be able to deploy in vertical markets.　　Lastly, communication technology is crucial. Advanced technologies like 5G-Advanced (5.5G) and Non-terrestrial Networks (NTN) ensure that communication coverage is no longer a weak point, broadening the scope of IoT applications.　　Fibocom has introduced corresponding products to address AI, data privacy, and satellite communications needs. In terms of AI, the company's 5G smart module SC171 and SC151 series are suitable for various 5G smart terminal devices.　　For security, blockchain technology was deployed on 4G networks and commercialized. On the satellite communications front, Fibocom released NTN-supported communication modules in 2023.　　Moving forward, the company plans to integrate these technologies and products, working with ecosystem partners to focus on specific vertical solutions, providing customers with high-quality and high-performance IoT solutions.　　Fibocom consistently prioritizes intelligence in product innovation. Tiger Ying stated that this will continue to be the foundation for future development, with a market-driven approach to introducing cross-domain AI solutions.　　He emphasized that while the market previously demanded "T-shaped" capabilities combining vertical telecommunication expertise to serve the horizontal industries, the AI era requires an additional vertical capability—AI specialization. Through "π-shaped" capabilities, which integrate horizontal and dual vertical expertise, Fibocom aims to create high-performance IoT architectures tailored to customers' needs.　　The company is progressively enhancing these "π-shaped" capabilities. It will continue to collaborate with ecosystem partners, integrating 5G, AI, and IoT technologies to help clients seize smart business opportunities.
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Release time：2024-06-06 11:47 reading：1056 Continue reading>>
Murata’s Latest Partnership Aids <span style='color:red'>IoT</span> Development, Enabling M.2 Wireless Module Integration for STM32 Nucleo Boards
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Murata’s Latest Partnership Aids IoT Development, Enabling M.2 Wireless Module Integration for STM32 Nucleo Boards

　　Murata, a leading electronics manufacturer, in collaboration with Infineon are pleased to announce a new IoT development solution. This comprehensive innovation allows Murata’s Infineon-based Wi-Fi® and Bluetooth® modules to seamlessly integrate with a wide range of STM32 Nucleo-144 boards, helping to reduce the time-to-market for many wireless-enabled applications.　　The joint project is built on the collaboration with Infineon and Murata. / By combining each company’s extensive expertise, the collaboration has engineered a complete hardware and software solution that addresses a number of IoT development requirements. At its core, the platform solution allows STM32 microcontroller to connect Murata M.2 wireless modules featuring Infineon chipsets. Providing the hardware connection is Murata’s new Nucleo-144 to M.2 adapted board, while software integration is enabled through Infineon AIROC™ STM32 Expansion Pack. Whether you are evaluating low-power implementations, such as wearables and battery-powered devices, or high-performance deployments, such as industrial equipment and smart homes, this exciting solution creates a more efficient evaluation process.　　Murata Nucleo-144 to M.2 Adapter board　　Providing physical M.2 support for STMicroelectronics STM32 Nucleo board for microcontrollers, including the popular STM32U5 and STM32H5 series, is the Murata Nucleo-144 to M.2 adapter board. This innovative PCB-based adapter effortlessly mounts to the STM32 and features a convenient top-mounted M.2 socket. The M.2 dock grants effortless physical integration and swapping of Embedded Artists Murata M.2 modules which use Infineon chipsets. This allows the STM32 to accept a wide range of Wi-FiWi-Fi® and Bluetooth® combination units, including Wi-Fi 4, Wi-Fi 5 and industrial grade modules.　　AIROC™ STM32 Expansion Pack　　Produced by Infineon, a leading global semiconductor manufacturer, Infineon AIROC™ STM32 Expansion Pack provides the framework required to facilitate the Murata hardware. Using the Common Microcontroller Software Interface Standard (CMSIS), the AIROC™ STM32 Expansion Pack enables the integration of Infineon based Wi-Fi® and Bluetooth® module with STM32 STM32Cube ecosystem, including STM32CubeMX tool. Within the semiconductor industry, CMSIS establishes a consistent approach for software components, hardware parameters and code, helping to increase development productivity. Documentation, libraries and example projects are also available on Infineon’s dedicated Expansion Pack GitHub page,helping to support the quick deployment of your hardware environment.　　Innovation Through Collaboration　　Through the Infineon AIROC™ STM32 Expansion Pack, engineers can leverage an effective design environment to evaluate a range of Murata M.2 wireless modules (featuring Infineon chipsets) with STM32 Nucleo boards. With full support from dependable hardware, extensive documentation and example libraries, this comprehensive solution is the perfect tool for accelerating IoT development across an extensive variety of applications.　　Comment from Infineon　　Neil Chen, Director, Wi-Fi Product Line Marketing, IoT Compute and Wireless Business Unit at Infineon said “To reduce the barrier to entry for first-time IoT developers, semiconductor and module companies must come together to offer simple, easy-to-use and ease-to-productize solutions to market. Our collaboration with Murata does just that by leveraging our industry-leading AIROC™ Wi-Fi and Bluetooth portfolio to simplify the development of next-generation IoT products for a variety of applications.”　　Comment from Murata　　Masatomo Hashimoto, Director, Connectivity Module Division, Communication and Sensor Business Division, Murata Manufacturing Co. Ltd., said “We are excited to collaborate with Infineon, a global leader in semiconductors in the IoT and power systems to deliver this innovation. Customers face many barriers when bringing connectivity products to market, but this partnership provides a solution for a variety of development challenges and reduces time-to-market for a wide range of applications.”
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Release time：2024-03-08 14:47 reading：831 Continue reading>>
Renesas Launches RZ/G3S 64-bit Microprocessor with Enhanced Peripherals for <span style='color:red'>IoT</span> Edge and Gateway Devices
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Renesas Launches RZ/G3S 64-bit Microprocessor with Enhanced Peripherals for IoT Edge and Gateway Devices

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new 64-bit general-purpose microprocessor (MPU) for IoT edge and gateway devices that consumes significantly less power.　　As the latest addition to Renesas’ RZ/G Series MPU, the RZ/G3S is designed to meet the demanding requirements of modern IoT devices, offering power consumption as low as 10µW (microwatts) in standby mode and fast startup for the Linux operating system. The new MPU comes with a PCI Express interface that enables high-speed connectivity with 5G wireless modules. Additionally, the device boasts enhanced security features such as tamper detection to ensure data security. These features make the device ideal for IoT applications such as home gateways, smart meters, and tracking devices.　　“Renesas’ RZ/G has seen a steady increase in adoption in the global industrial human machine interface market,” said Daryl Khoo, Vice President of Embedded Processing 1st Division at Renesas. “The RZ/G3S represents the next generation products that will extend our reach to the rapidly growing 5G IoT and Gigabit Wi-Fi 7 gateway markets. Renesas has been aggressively expanding our connectivity portfolio in these markets through strategic acquisitions to offer advanced connectivity solutions that are power efficient at the system level and enhance data utilization."　　The RZ/G3S employs an Arm® Cortex®-A55 core as the main CPU with a maximum operating frequency of 1.1 GHz and two Cortex®-M33 cores as sub-CPUs operating at 250 MHz. Users can distribute the MPU’s workloads to sub-CPUs, allowing the device to efficiently handle tasks such as receiving data from sensors, controlling system functions and managing power systems. This reduces the workload on the main CPU, resulting in fewer components, lower costs and a smaller system size.　　Low-power Standby Mode with Fast Linux Startup　　The device’s newly added power management system is designed to reduce power consumption to extremely low levels -- less than 10 µW. The MPU also supports the DDR self-refresh function which allows to retain DRAM data, while also enabling fast Linux startup. The fast startup allows IoT devices, which frequently operate intermittently, to save power and significantly extend the runtime of battery-powered devices. Moreover, the device offers a standby mode that can maintain sub-CPU operation at a power level as low as 40 mW, offering the flexibility to optimize power consumption based on the specific operating requirements of each application.　　5G Connectivity Enabled by PCI Express　　The RZ/G3S is equipped with a wide range of peripheral functions including Gigabit Ethernet, CAN, USB, as well as the PCI Express interface. By connecting with 5G communication modules, the device can achieve high-speed communication at Gigahertz levels.　　High Reliability and Robust Security Functions　　Similar to other RZ/G devices, the RZ/G3S features an ECC (Error Correction Code) function in both internal memory and external DDR interface to maintain data integrity. The Verified Linux Package (VLP) based on the industrial-grade Linux software (Civil Infrastructure Platform™ (CIP) Linux) is available for the RZ/G3S. With VLP, developers receive over 10 years of maintenance support, ensuring long-term protection against security threats. The device also provides tamper detection along with secure boot, secure debug and more. RZ/G series products are already Level 2 PSA Certified from Arm and Renesas has plans to include the RZ/G3S in the future.　　“Our IAR Embedded Workbench for Arm inherently supports both MPUs and MCUs,” said Anders Holmberg, CTO at IAR. “By combining Renesas’ RZ/G3S MPU, which features a highly secure Root of Trust, with extensive security tool solutions from IAR, developers can rapidly develop high-performance, secure IoT devices and bring them to market faster."　　Winning Combinations　　Renesas has combined the new RZ/G3S MPU with optimized power management ICs and clock products to develop the “Single Board Computer Gateway”. The RZ/G3S's rich set of interfaces allows the device to connect with various sensors via USB, CAN, RS485, UART, and I2C. It also offers high performance wireless connectivity options to build a robust network for home automation or IoT applications. Its multicore design allows for real-time processing of data while being power efficient with its advanced sleep mode functions. The Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The RZ/G3S is available today. For more information on the product
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Release time：2024-01-19 11:14 reading：2114 Continue reading>>

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