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Renesas Adds Two New MCU Groups to Blazing Fast RA8 Series with 1GHz Performance and Embedded MRAM

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RA8M2 and RA8D2 microcontroller (MCU) groups. Based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm® Cortex®-M33 processor, the new MCUs are the latest Renesas offerings to deliver an unmatched 7300 Coremarks of raw compute performance, the industry benchmark for MCUs. The optional Cortex-M33 processor enables efficient system partitioning and task segregation.　　Both RA8D2 and RA8M2 devices are ultra-high performance MCUs as part of the second generation of the RA8 Series – the RA8M2 are general-purpose devices, and the RA8D2 MCUs are packed with a variety of high-end graphics peripherals. They are built on the same high-speed, low-power 22-nm ULL process used for the RA8P1 and RA8T2 devices introduced earlier this year. The devices include single and dual core options, and a specialized feature set to address the needs of a broad base of compute intensive applications. They take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium™ technology to offer a significant performance boost for digital signal processor (DSP) and machine learning (ML) implementations.　　The RA8M2 and RA8D2 devices offer embedded MRAM that has several advantages over Flash technology - high endurance & data retention, faster writes, no erase needed, and byte addressable with lower leakage and manufacturing costs. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding applications. Both the RA8M2 and RA8D2 MCUs include Gigabit Ethernet interfaces and a 2-port TSN switch to address industrial networking use cases.　　Both of the MCU Groups provide a combination of the high performance of the Cortex-M85 core, together with large memory and a rich peripheral set, making them particularly suitable for a wide range of IoT and industrial use cases. The lower power CM33 core can act as a housekeeping MCU, executing system tasks while the high performance CM85 core stays in sleep mode, to be woken up only as needed for high compute tasks, thus lowering the system power consumption.　　“The RA8M2 and RA8D2 complete Renesas’ new generation of RA8 MCUs, purpose-built for the high-performance microcontroller market,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “This portfolio empowers Renesas to deliver scalable, secure and AI-enabled embedded processing solutions that accelerate customer innovation and time-to-market across a broad spectrum of industrial, IoT and select automotive applications. Renesas’ commitment to innovation is reflected in the RA8 Series’ ability to address complex processing requirements while maintaining lower power consumption and minimizing total cost of ownership to future-proof customers’ designs.”　　RA8D2 Feature Set Optimized for Graphics and HMI Applications　　The RA8D2 MCUs provide a plethora of features and functions for graphics and HMI applications:　　High resolution Graphics LCD Controller supports up to 1280x800 displays with both parallel RGB and 2-lane MIPI DSI interfaces　　Two-Dimensional Drawing Engine offloads the graphics rendering tasks from the CPU and supports graphics primitives　　Multiple camera interface options enable camera and vision AI applications,　　16-bit camera interface (CEU) with support for image data fetch, processing and format conversion　　MIPI CSI-2 interface offers a low pin-count interface with 2 lanes, each up to 720Mbps　　A VIN module performs vertical and horizontal scaling and format and color space conversions of YUV and RGB data inputs received from the MIPI CSI-2 interface　　Audio interfaces such as I2S and PDM support digital microphone inputs for audio and voice AI applications　　Comprehensive graphics solution with industry-leading embedded graphics GUI packages from SEGGER emWin and Microsoft GUIX, integrated into Renesas’ FSP　　Software JPEG decoder optimized for Helium, available with both emWin and GUIX solutions, allows decode of JPEG images with up to 27fps end-to-end graphics performance with Helium acceleration　　Multiple graphics ecosystem partners such as Embedded Wizard, Envox, LVGL and SquareLine Studio are offering solutions that employ RA8D2 using Helium to accelerate graphics functions and JPEG decoding　　Key Features of the RA8M2 and RA8D2 Group MCUs　　Core: 1 GHz Arm Cortex-M85 with Helium; Optional 250 MHz Arm Cortex-M33　　Memory: Integrated 1MB high-speed MRAM and 2MB SRAM (including 256KB TCM for the Cortex-M85 and 128KB TCM for the M33). 4MB and 8MB SIP devices coming soon.　　Analog Peripherals: Two 16-bit ADC with 23 analog channels, two 3-channel S/H, 2-channel 12-bit DAC, 4-channel high-speed comparators　　Communications Peripherals: Dual Gigabit Ethernet MAC with DMA, USB2.0 FS Host/Device/OTG, CAN2.0 (1Mbps)/CAN FD (8Mbps), I3C (12.5Mbps), I2C (1Mbps), SPI, SCI, Octal serial peripheral I/F　　Advanced Security: RSIP-E50D Cryptographic engine, robust secure boot with FSBL in immutable storage on-chip, secure debug, secure factory programming, DLM support, tamper protection, DPA/SPA protection,　　The new RA8M2 and RA8D2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS (FreeRTOS and Azure RTOS) with FSP, thus providing full flexibility in application development. In addition, Zephyr support is now included. Using the FSP will ease migration of existing designs to the new RA8 Series devices.　　Winning Combinations　　Renesas has combined the new RA8 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including the Smart Glasses and Pet Camera Robot for the RA8M2, and both Ki Wireless Power Transceiver System (Tx) and Ki Wireless Power Receiver System (Rx) for the RA8D2. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. 　　Availability　　The RA8M2 and RA8D2 Group MCUs are available now, along with the FSP software. The RA8M2 devices are available in 176-pin LQFP, 224-pin and 289-pin BGA packages. The RTK7EKA8M2S00001BE Evaluation Kit is also available. The RA8D2 MCUs are offered in 224-pin and 289-pin BGA packages. The RTK7EKA8D2S01001BE Evaluation Kit supports the RA8D2 devices.

Key word：

Renesas

Release time：2025-10-30 15:45 reading：280 Continue reading>>

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TAIYO YUDEN Commercializes 1005M-Size Embeddable Multilayer Ceramic Capacitor with 22-μF Capacitance for AI Servers

　　TAIYO YUDEN CO., LTD. has commercialized and begun mass production of embeddable multilayer ceramic capacitor (MLCC) that achieves a capacitance of 22-μF in a 1005M size (1.0 x 0.5 mm).　　This ceramic capacitor is an MLCC designed for decoupling applications on IC power lines used in AI servers and other types of information devices.　　Components embedded in a board require high precision in terms of flatness of the external electrodes for connection to the circuit. With respect to this requirement, TAIYO YUDEN has commercialized an embeddable MLCC that achieves a 22-μF capacitance in a 1005M size by enhancing external electrode formation technology and other elemental technologies.　　Mass production of the capacitor began at our Tamamura Plant (Sawa District, Gunma Prefecture) in August 2025. Samples are available for 20 yen per unit.　　Technology Background　　AI servers and other types of devices with advanced information processing capabilities are equipped with ICs that consume extremely large amounts of power. For decoupling purposes in such power supply circuits, small, high-capacity MLCCs are required to handle large currents.　　Additionally, to minimize circuit loss and noise, it is important to route the power supply circuit close to the ICs. Traditional power supply circuits are routed around ICs. But, technological developments are progressing, allowing them to be placed closer, such as on the back of the board or directly under the ICs. Thus, embeddable MLCCs need to be equipped with high-precision external electrodes to connect to the lines.　　To satisfy this need, TAIYO YUDEN has improved its external electrode formation technology and commercialized 1005M-size embeddable MLCC with a capacitance of 22 μF.　　TAIYO YUDEN is continuing to develop new MLCCs with higher capacitance and other distinguishing features.　　■ Application　　Decoupling applications on IC power lines used in AI servers and other types of information devices

Key word：

TAIYO

Release time：2025-10-20 16:40 reading：340 Continue reading>>

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NOVOSENSE launches NSUC1612: Fully Integrated Embedded Motor Drive SoC for Smarter, Cost-Efficient Automotive Actuators

　　NOVOSENSE has released the NSUC1612, a next-generation motor driver SoC designed to address the limitations of traditional discrete solutions in automotive smart actuators, such as system complexity, high cost, and limited reliability.　　With its fully integrated single-chip architecture, the NSUC1612 can simplify design, reduce cost, and enhance stability. It supports a wide range of applications, including automotive water valves, automotive air-conditioning vent, active grille shutters, as well as stepper motors, DC brushed motors, and DC brushless motors—delivering an efficient and scalable solution for automotive electronics.　　1.Fully Integrated Architecture: Simplified Design, Reduced Complexity　　Conventional actuator control systems often require multiple components, including MCU, motor drivers, communication interfaces, and protection circuits, leading to complex PCB layout, increased solder joints, and compatibility issues.The NSUC1612 integrates a 32-bit ARM® Cortex®-M3 MCU with 4- or 3-channel half-bridge drivers, LIN/CAN controller communication interfaces, a 12-bit ADC, temperature sensors, and other essential modules, all in a single-chip. This eliminates the need for additional companion ICs while covering the full motor control, communication, and protection process.By reducing external components and simplifying hardware design, the NSUC1612 shortens development cycles and minimizes EMI risk through optimized internal signal routing.　　2.Excellent EMC Performance: Reliable Operation in Harsh Environments　　Automotive electronics operate in complex electromagnetic conditions where EMC performance directly impacts actuator precision and system stability. The NSUC1612 provides simplified reference circuits and optimized PCB layout. In compliance with CISPR 25:2021 Class 5, it passes stringent automotive EMC/EMI tests, compliant with the automotive standardsSelected Test Results Based on CISPR 25:2021　　This ensures stable motor control signals and helps prevent malfunctions such as actuator stalls or misoperation caused by electromagnetic interference.　　3.Strong Performance: Balanced Drive Capability and Processing Power　　The NSUC1612 is designed to deliver both reliable motor driving capability and efficient computation: NSUC1612B: 4 half-bridge outputs, peak current up to 500 mA NSUC1612E: 3 half-bridge outputs, peak current up to 2.1 AThese options support brushed DC, BLDC, and stepper motors across diverse applications, from HVAC air vent adjustment to seat ventilation.　　The ARM® Cortex®-M3 core with Harvard architecture integrates 32 KB Flash, 2 KB SRAM, and 15 KB ROM with Bootloader, supporting OTA upgrades. A 32 MHz high-precision oscillator with PLL ensures stable computation, while low-power sleep mode consumes less than 50 μA across the full operation temperature range, balancing performance with energy efficiency.　　4.Automotive-Grade Reliability: Built for Demanding Conditions　　The NSUC1612 is designed with comprehensive reliability features to withstand harsh operating environments. It is compliant with AEC-Q100 Grade 1, supporting junction temperatures up to 150°C and ensuring stable operation across a wide temperature range from -40°C to +125°C. The device’s LIN port can tolerate up to ±40 V, while the BVDD pin supports -0.3 V to 40 V, enabling direct connection to 12V automotive batteries. In addition, integrated protection mechanisms such as over-voltage and over-temperature safeguards provide robust defense against voltage fluctuations and transient surges, delivering system-level reliability under real-world automotive conditions.　　The NSUC1612 extends its value through broad application compatibility, making it suitable for automotive actuator systems. It supports brushed DC, BLDC, and stepper motors, while integrated communication interfaces—including LIN PHY (compliant with LIN 2.x, ISO 17987, and SAE J2602), FlexCAN, and SPI—allow seamless integration into existing automotive network architectures.　　The NSUC1612 is ideal for a wide range of applications, including thermal management components (e.g., automotive water valves and expansion valves), cabin comfort modules (automotive air-conditioning vent), and smart body systems (active grille shutters and charging port actuators). By integrating these functions into a single device, it helps reduce design costs and simplify development.

Key word：

NOVOSENSE

Release time：2025-09-23 13:12 reading：586 Continue reading>>

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ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year

　　ROHM Co., Ltd. was included for the second year in a row in the Sustainability Yearbook 2025, published by S&P Global on February 11, 2025, as a Sustainability Yearbook Member, one of the top 15% companies in the Semiconductor & Semiconductor Equipment industry.　　S&P Global annually evaluates the sustainability efforts of the world's leading companies from governance & economic, environmental, and social perspectives based on its proprietary Corporate Sustainability Assessment (CSA) methodology and selects companies with outstanding sustainability efforts in each industry for inclusion in the Sustainability Yearbook.　　This year, more than 7,690 companies worldwide from 60 industries were evaluated, and 780 companies (including 80 Japanese companies) were selected for this year's Yearbook.　　Encouraged by the results of this year's evaluation, ROHM will continue to promote sustainability activities and address social issues to create a sustainable society, aiming to be a company that meets the expectations of our stakeholders.

Key word：

ROHM

Release time：2025-03-20 10:11 reading：561 Continue reading>>

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Fibocom to Unveil a Series of Linux-based Edge AI Solutions Mastering the Peak Performance for Industrial Applications Powered by Qualcomm Technologies at Embedded World 2024

Key word：

Fibocom

Release time：2024-04-16 11:14 reading：1197 Continue reading>>

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3PEAK Partners with IAR to Build a New Embedded Development Ecosystem！

　　On January 18, 2024, 3PEAK and IAR jointly announced that IAR's flagship product, IAR Embedded Workbench for Arm, fully supports 3PEAK's mainstream TPS32 mixed-signal microcontrollers, giving developers a more complete and efficient development solution.　　Based in China, 3PEAK provides analog chips alongside embedded processors and solutions and has sales and technical support networks across the USA, Europe, Japan, South Korea, and Taiwan (China). After years of deep exploration in the signal chain and power management domains, 3PEAK ventured into the embedded processor sector and achieved notable success.　　Following two years of dedicated research and development, and through careful process selection and strict quality control efforts, 3PEAK successfully launched its first mixed-signal MCU platform. The TPS32 Series is the flagship brand of 3PEAK's independently developed mixed-signal microcontrollers. Through our deep understanding of vertical applications and continuous exploration of customer needs, 3PEAK introduced the TPS325M0 Series and TPS325M5 Series to serve a broad range of industrial applications, which have rapidly earned widespread adoption and praise from leading industry customers.　　The IAR Embedded Workbench remains the optimal solution for many embedded software developers worldwide. This powerful toolkit provides comprehensive and efficient support for millions of developers. It enables developers to fully utilize code optimization features and offers a range of powerful debugging functions, including code and data breakpoints, runtime stack analysis, and call stack visualization. Additionally, the IAR Embedded Workbench features C-STAT, a static code analysis tool, and C-RUN, a dynamic code analysis tool, to help developers identify potential issues early and improve code quality. Notably, IAR also offers a TÜV SÜD-certified functional safety version that meets functional safety certification standards like ISO 26262. This version is an important tool for developers of functional safety products.　　Ms. Chen Lihua, Senior Director of the 3PEAK MCU BU, said,　　"While we are focused on providing high-quality devices, 3PEAK is also committed to creating an easy-to-use, high-quality, comprehensive, and open hardware and software development ecosystem for users. We are honored to be able to establish a partnership with renowned toolchain provider IAR. Our relationship has just started, but we expect to make steady progress. IAR's comprehensive support for 3PEAK devices and 3PEAK's full TPS32 SDK software package based on the IAR Embedded Workbench for Arm are just the first results of our work together. We believe that soon we will expand our collaboration with IAR into more areas to build a new embedded development ecosystem and create genuine value and convenience for our customers.　　Kiyo Uemura, Vice President of IAR Asia-Pacific Region, expressed,　　We are delighted to partner with 3PEAK, and we look to the future with confidence and anticipation. We have long recognized China's key position in the global market, with its vast potential and endless opportunities. As both a listed and domestically influential semiconductor company, 3PEAK possesses powerful technical capabilities and persistently pursues innovation. Our collaboration with 3PEAK highlights our mutual trust. Both companies will leverage their technical strengths in their respective fields to build a vibrant embedded ecosystem, as well as provide developers with world-class development tools and original manufacturer technical support.

Key word：

3PEAK

Release time：2024-03-22 14:51 reading：2459 Continue reading>>

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GigaDevice partners with SEGGER on Embedded Studio for RISC-V

　　GigaDevice and SEGGER jointly announced today that GigaDevice's customers can now use SEGGER's leading multi-platform IDE Embedded Studio free of charge across all GigaDevice RISC-V microcontrollers (MCUs) including the latest GD32VW553.　　GigaDevice officially launched the world's first RISC-V based GD32VF103 series of 32-bit general-purpose MCU products in 2019, and very recently introduced the dual-band wireless GD32VW553 series, based on a 160MHz RISC-V core. The device is equipped with 4MB of flash and 320KB of SRAM. GD32VW553 supports the latest Wi-Fi 6 and BLE 5.2 wireless communication protocols. It also integrates rich peripheral interfaces and hardware encryption functions to create a safe and reliable wireless connection solution. High performance and low energy consumption make it ideal for smart home appliances, industrial Internet, communication gateway and other wireless connection scenarios.　　Characterized by its flexibility of use, Embedded Studio has all the tools and features a developer needs for professional embedded C and C++ development, including a complete toolchain, optimized run-time library, core simulator and hardware debugging with the J-Link debug probes. Other SEGGER tools that also fully support GD32V RISC-V MCUs include: The market-leading J-Link debug probe, Ozone debugger, real-time operating system embOS and software libraries for communications, data storage, compression, and IoT, as well as the Flasher family of in-circuit programmers.　　“GigaDevice and SEGGER have a long history of cooperation”, says Eric Jin, GigaDevice's Product Marketing Director. “SEGGER was the first ecosystem partner to support the GD32V RISC-V core MCUs. Making SEGGER Embedded Studio available to our customers free of charge facilitates software development for our GD32V series. Embedded Studio fully supports and adapts to the GD32V family of RISC-V MCUs in terms of efficiency, performance, and ease of use, significantly accelerating the development and mass production of innovative applications.”　　“We have been partners with GigaDevice and have supported GigaDevice products for many years now,“ says Ivo Geilenbruegge, Managing Director of SEGGER. “We immediately added full tool support when they unveiled the first commercially available flash-based RISC-V microcontroller back in 2019. We are impressed by their speed of innovation, the many new devices they have brought to market, and the extent to which they’ve quickly become a key player in the industry.”　　For user registration and downloads, visit wiki.segger.com/GD32V now to get Embedded Studio available free of charge for commercial development on GD32V MCUs.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com.　　About SEGGER　　SEGGER Microcontroller, now in its fourth decade in the embedded system industry, produces cutting-edge RTOS and Software Libraries, the marketing-leading J-Link and J-Trace debug and trace probes, a fast, robust, reliable, and easy-to-use family of Flasher In-System Programmers and second-to-none software development tools.　　SEGGER's all-in-one solution emPower OS provides an RTOS plus a complete spectrum of software libraries including communication, security, data compression and storage, user interface software and more. Using emPower OS gives developers a head start, benefiting from decades of experience in the industry.　　SEGGER's professional embedded development software and tools are simple in design, optimized for embedded systems, and support the entire embedded system development process through affordable, high-quality, flexible, and easy-to-use tools.　　The company was founded by Rolf Segger in 1992, is privately held, and is growing steadily. SEGGER also has a U.S. office in the Boston area and branch operations in Silicon Valley, Shanghai, and the UK, plus distributors on most continents, making SEGGER’s full product range available worldwide.

Key word：

GigaDevice

Release time：2024-01-02 16:39 reading：2429 Continue reading>>

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Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

　　During MWC Shanghai 2023, Fibocom introduces the cutting-edge 5G FWA solution embedded with 3GPP Release 17 compliant modules FG190 and FG180, with the advanced and scalable configurations, the solution ensures the smooth escalation of 5G FWA applications towards 10 Gigabits era, especially crucial for CPE and mobile hot-spot use cases.　　a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.　　As 5G technology has improved, mobile broadband service providers are no longer limited to older technologies, mobile data subscriptions associated with mobile phones, dongles or even hot-spot devices are looking for agile and high data throughput network connectivity solutions. The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180. The 5G CPE solution is architected with a set of rich interfaces plus flexible dual-band/tri-band Wi-Fi 7 combinations. For example, an FG190 can simultaneously connect three PCIe and two USXGMII ports, in addition to the Wi-Fi 7 selections, CPE customers can adjust the combinations between QFW7114 and QFW7124 to utilize the band capacity from maximum BE21000 to BE5000. Regarding the wired configurations, either the10GbE+2.5GbE or 2.5GbE+2.5GbE could be the most recommendable and efficient options to unleash the full potential of cable access.　　However, the solution for 5G mobile hot spot offers a range of top-quality wireless performance to mobile scenarios. In the support of a highly integrated WCN7851 chip, the multi-channel options will be utilized efficiently to increase the data rate, depending on the requirements, the dual-band options can be switched to 2.4GHz/5GHz/6GHz to achieve maximum throughput up to BE5800. The seamless Wi-Fi 7 connectivity is also benefiting from the contribution of MLO (Multi-Link Operation) and 4K QAM modulation schemes, offering a highly reliable connectivity service, especially in congested environments like airport terminals, sports venues, and hospitals, etc.　　In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.　　Powered by the Snapdragon® X75 and X72 5G Modem-RF System, Fibocom FG190 and FG180 is compliant with 3GPP Release 17 and equipped with a quad-core A55 CPU to enable a lightning-fast and ultra-reliable 5G network experience. With Snapdragon®X75, Fibocom FG190 supports 5G Sub-6GHz and mmWave dual-connectivity, thus capable of NR 10CA with up to 1000MHz bandwidth in the mmWave spectrum, and NR5CA with up to 300MHz bandwidth in the Sub-6GHz, significantly elevating the maximum downlink speed to 10Gbps. Followed by the FG180, the module integrated with Snapdragon® X72, offers an agile solution for various 5G FWA customers by supporting up to 400MHz bandwidth of NR 4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz. Both FG190 and FG180 are adopting LGA form factors, therefore making both modules the ideal wireless solution for a diversified FWA market.

Key word：

Fibocom

Release time：2023-09-12 10:52 reading：3594 Continue reading>>

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BIWIN Embedded Storage for High-end Smart Watches

　　Trends in smart wearables head towards multi-functional integration, longer battery life, and smoother user experience, placing higher requirements on chips to deliver smaller size, better power consumption, improved performance, better application tuning, and more. ePOP storage chips are ideal for smart wearable devices for their small size, low power consumption, high performance, and high reliability. Now BIWIN brings the LPDDR4X 144-Ball ePOP for high-end smart watches, offering 128.6% higher frequency and 32% less chip size compared with LPDDR3.　　Having passed the Qualcomm 5100 SOC platform certification, BIWIN LPDDR4X ePOP integrates eMMC 5.1 and LPDDR4X in a compact dimension of 8 mm x 9.5 mm x 0.8 mm, delivering ROM sequential read and write speeds of up to 310 MB/s and 240 MB/s respectively. With RAM frequency up to 4266 Mpbs and capacity up to 32 GB + 16 Gb (with a 64 GB+16 Gb version coming soon), BIWIN ePOP is a flagship storage solution for high-end smart watches.　　BIWIN LPDDR4X 144-Ball ePOP Advantages:　　1. Complies with JEDEC standards, integrates eMMC 5.1 and LPDDR4X, and allows smart watches to have a more compact design (by mounting directly on the SoC chip).　　2. Low power consumption and high performance (with frequency up by 128.6%), powered by low-power LPDRAM and optimized firmware.　　3. Works faultlessly in extended temperature from -20 ℃ ~ 85 ℃, featuring Wear Leveling, LDPC (Low-Density Parity Check) codes, and FFU (Field Firmware Update).　　4. Simplifies system design and speed up your product’s time-to-market with Qualcomm 5100 SoC platform certification.　　With high performance, low power consumption and high reliability, BIWIN LPDDR4X 144-Ball ePOP significantly improves user experience for smart wearables. BIWIN ePOP provides high data storage efficiency, smooth switching on/off, APP start/shutdown, screen-off and lock. It efficiently deals with different loads of sensors and the demand for multi-threaded storage to ensure fast response to the user's operations and commands. Featuring low power consumption, BIWIN ePOP reduces heat dissipation in multi-threaded, high-load, and long-work time scenarios, preventing the overheating which can cause system collapse and bad user experience. In addition, BIWIN ePOP is highly reliable in dealing with abnormalities such as blue screen error, cold start, and reset.　　Compared with memory chips in cell phones, storage solutions for smart wearables require higher responsiveness and more customized service. BIWIN ePOP features high performance, low power consumption, small size, and high reliability, showing the advantages in BIWIN R&D, packaging and testing. BIWIN storage solutions for smart wearables already serve the supply chain system of world-class customers, capturing a dominant share of the market. BIWIN offers proven storage solutions that bring compatibility with their existing SOC platform, system, and application. Moving forward, BIWIN will continue to optimize user experience for different user scenarios, helping customers increase the competitiveness of their terminal products.

Key word：

BIWIN

Release time：2023-09-01 13:16 reading：3770 Continue reading>>

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Quicker, More Advanced GUI as TARA Systems' Embedded Wizard Partners with GigaDevice

　　Created by TARA Systems GmbH, Embedded Wizard is the market-leader for embedded GUI technology. The company has announced a new partnership with GigaDevice Semiconductor, a leading supplier of high-performance memory and microcontrollers.　　The partnership represents a groundbreaking update to Embedded Wizard's popular graphical user interfaces, making embedded GUI software development faster and more cost-effective for customers.　　According to Mr. Eric Jin, Product Marketing Director at GigaDevice, "This collaboration is set to bring advanced solutions to our clients, providing customers with exceptional user experiences and faster time-to-market for their products."　　Manuel Melic, Product Manager at Embedded Wizard and Managing Director of TARA Systems, says: "We are excited to work with GigaDevice and provide software engineers with a more comprehensive, quicker method for developing custom GUIs."　　The exciting combination of leading microcontroller hardware plus powerful embedded GUI software means customers can effectively reduce the system resource footprint of advanced graphic displays and simplify the human-machine interface (HMI) development process.　　Customers can be confident that the hardware will work flawlessly with all Embedded Wizard software. From idea to production, with the expertise of Embedded Wizard and GigaDevice, customers can get their GUI products to market and deploy them in less time, manage their budgets more easily.　　The advantages of the partnership are easily demonstrated in the recent integration of GigaDevice's GD32 family of microcontrollers to the range of Embedded Wizard’s platform partners. Through this collaboration, customers will be treated to faster performance, lower power consumption, a richer set of peripherals and a more user-friendly graphical interface.　　For a free trial of Embedded Wizard GUI software, download now at embedded-wizard.de/download.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a leading global fabless supplier. The company was founded in April 2005 with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor, and power as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking, and communications. GigaDevice management system has achieved ISO 9001:2015 and ISO 14001:2015 certifications. Constantly looking to expand the technology offering to customers, GigaDevice has also formed multiple strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management.　　About TARA Systems' Embedded Wizard　　Embedded Wizard is a market-leading solution for creating Graphical User Interfaces (GUIs) for embedded systems with more than 30 years of experience in the industry. Its mission is to provide developers with the most convenient and efficient tool for programming embedded GUIs by simplifying development efforts. Developers use this versatile tool to create complex user interfaces in the shortest possible time and stand out from their competitors due to the numerous highly sophisticated features of the tool. Additionally, Embedded Wizard's GUI Services team offers their customers a portfolio of different services. These range from Embedded Wizard trainings, via GUI prototyping and implementation of dedicated GUI controls up to holistic GUI application development. Under the patronage of the independent software company TARA Systems, Embedded Wizard is constantly improving and entering more industries and markets worldwide. Embedded Wizard is driven by the idea of providing a comfortable workflow for embedded systems in consumer electronics, industrial, automotive, medical, home appliances and mobile devices. GUIs created with Embedded Wizard are already used on over 100 million devices worldwide.

Key word：

GigaDevice

Release time：2023-08-29 11:18 reading：3766 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
IPZ40N04S5L4R8ATMA1	Infineon Technologies
TPS63050YFFR	Texas Instruments
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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