What are the uses of gallium and germanium as semiconductor materials
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What are the uses of gallium and germanium as semiconductor materials

　　On July 3, according to the latest news from the Ministry of Commerce, for the purpose of safeguarding national security and interests, with the approval of the State Council, China decided to implement export controls on two key metals, gallium and germanium, starting from August 1.　　As we all know, gallium and germanium are very important materials in semiconductor applications. But actually, what are the uses of gallium and germanium as semiconductor materials? In this article, we will focus on gallium and germanium.　　What is Gallium?　　Gallium is one of the members of the strategic mineral family. It is a gray-blue or silver-white metal with atomic number 31, element symbol Ga, and atomic weight of 69.723. Gallium has a low melting point but a high boiling point. Pure liquid gallium has a significant supercooling tendency, and is easily oxidized in air to form an oxide film.　　The atomic structure of gallium includes 31 protons and electrons, and a corresponding number of neutrons. In chemical reactions, gallium atoms usually exist in a trivalent state, that is, they lose three electrons to form Ga3+ ions.　　Industrial uses of galliumManufacturing semiconductor gallium nitride, gallium arsenide, gallium phosphide, germanium semiconductor doping element;　　Pure gallium and low melting alloy can be used as heat exchange medium for nuclear reaction;　　Filling material for high temperature thermometer;　　Catalyst for diesterization in organic reaction.　　Gallium’s industrial applications are primitive, although its unique properties may have many applications. Liquid gallium’s wide temperature range and its low vapor pressure make it useful in pyrometers and pyrometers. Gallium compounds, especially gallium arsenide, have attracted more and more attention in the electronics industry. Precise world gallium production data are not available, but production in neighboring regions is only 20 tons/year.　　Applications of gallium　　1.Semiconductor industry　　Gallium plays an important role in the semiconductor industry. It is used in the manufacture of high-speed electronic devices, optoelectronic devices and solar cells. Gallium-based semiconductor materials, such as gallium arsenide (GaAs) and gallium nitride (GaN), have excellent electrical properties and high-temperature characteristics, which are suitable for the manufacture of high-frequency electronic devices and high-power electronic devices.　　2. LED lighting　　Gallium compounds are widely used in the manufacture of LEDs (Light Emitting Diodes). Gallium-based LEDs have the advantages of high efficiency, long life, and energy saving, and are widely used in indoor and outdoor lighting, electronic displays, and automotive lighting.　　3.Alloy preparation　　Gallium can form alloys with other metals to improve its characteristics and performance. For example, gallium alloys are used to make low-melting alloys such as gallium-indium alloy (often used in thermometers) and gallium-bismuth alloy (often used in fire alarm devices).　　What is Germanium?　　Germanium, tin and lead belong to the same group in the periodic table of elements.　　Germanium is a chemical element with symbol Ge, atomic number 32, and atomic weight 72.64. It is located in the fourth period and group IVA of the periodic table of chemical elements.　　Germanium element is a gray-white metalloid, shiny, hard, belonging to the carbon group, chemical properties similar to tin and silicon of the same group, insoluble in water, hydrochloric acid, dilute caustic solution, soluble in aqua regia, concentrated nitric acid or sulfuric acid, so it is soluble in molten alkali, alkali peroxide, alkali metal nitrate or carbonate, and is relatively stable in the air.　　The atomic structure of germanium includes 32 protons and electrons, and a corresponding number of neutrons. In chemical reactions, germanium atoms usually exist in a tetravalent state, that is, they share or lose four electrons to form Ge4+ ions.　　Industrial Uses of GermaniumGermanium has special properties in many aspects, and has extensive and important applications in semiconductors, aerospace measurement and control, nuclear physics detection, optical fiber communication, infrared optics, solar cells, chemical catalysts, biomedicine and other fields. It is an important strategic resource as well. In the electronics industry, in alloy pretreatment, in the optical industry, it can also be used as a catalyst.　　High-purity germanium is a semiconductor material. It can be obtained by reducing high-purity germanium oxide and then extracting it by smelting. Single crystal germanium doped with a small amount of specific impurities can be used to make various transistors, rectifiers and other devices. Germanium compounds are used in the manufacture of fluorescent panels and various high refractive index glasses.　　Germanium single crystal can be used as transistor, which is the first generation of transistor material. Germanium is used in radiation detectors and thermoelectric materials. High-purity germanium single crystal has a high refractive index. It is transparent to infrared rays, and does not pass through visible light and ultraviolet rays. Besides, it can be used as a germanium window, prism or lens for infrared light.　　At the beginning of the 20th century, germanium was used to treat anemia, and then became the earliest semiconductor element used. The refractive index of elemental germanium is very high, and it is only transparent to infrared light, but opaque to visible light and ultraviolet light.　　Therefore, military observers such as infrared night vision devices use pure germanium to make lenses. Compounds of germanium and niobium are superconducting materials. Germanium dioxide is a catalyst for the polymerization reaction. The glass containing germanium dioxide has high refractive index and dispersion performance, and can be used as a wide-angle camera and microscope lens. Germanium trichloride is also a new type of optical fiber material additive.　　According to the data, since 2013, the development of the optical fiber communication industry, the continuous expansion of the application of infrared optics in the military and civilian fields, the use of solar cells in space, and the promotion of ground-based high-efficiency solar power plants have made the global demand for germanium continues to grow steadily.　　In the early 21st century, the recovery of the global optical fiber network market, especially the optical fiber market in North America and Japan, drove the rapid growth of the optical fiber market. The annual growth rate of global optical fiber demand has exceeded 20%.　　Applications of germanium1.Semiconductor industry　　Germanium is an important material in the semiconductor industry. It is used in the manufacture of high-speed electronic devices and optoelectronic devices, such as high-purity germanium wafers for the manufacture of solar cells and infrared detectors.　　Also read: The ultimate guide to high-speed PCB and housing materials　　2. Optical fiber communication　　Germanium optical fiber is an important material for optical fiber communication. It has a high refractive index and transparency, and can be used to manufacture optical fibers and optical fiber amplifiers in high-speed communications.　　3. Optical applications　　Due to the permeability of germanium to infrared radiation, it is widely used in infrared optical systems and infrared imaging technology. Germanium lenses and germanium windows are used in areas such as infrared sensors, thermal imagers and infrared laser systems.　　Also read: Optical module – A comprehensive exploration　　4. Chemical catalysts　　Germanium compounds are often used as catalysts and have important applications in the chemical industry. Germanium catalysts can promote chemical reactions and are used to produce polymers, prepare organic compounds, and more.　　ConclusionGallium and germanium, as rare metal elements, play an important role in high-tech fields, electronics industry, energy industry, etc. As technology continues to advance, so too does the demand for these two elements.
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Release time：2023-09-26 14:49 reading：1911 Continue reading>>
Exploring new materials for future electronics
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Exploring new materials for future electronics

　　Imagine a world where our electronic devices are smarter and faster, lighter, more flexible, and capable of pushing the boundaries of what we thought was possible.　　Examining the research underway in electronics materials provides a keyhole view into what may be possible in future electronics design. Although some of this research will not end up in commercial products, it does provide an indication of the kinds of problems that are being addressed, how they are being approached, and where the research dollars are being spent.　　Designers and manufacturers from many industries are facing new challenges as they develop next-generation products while working to fulfill evolving consumer needs. With a broad portfolio of electronics materials and global technical expertise, we are ready to deliver on today’s needs and collaborate with you on tomorrow’s challenges. Together we can help you achieve faster processing, higher purity, higher conductivity and more sustainable solutions across the entire electronics value chain.　　· Semiconductor, novel display and printed circuit board applications: Providing high purity, low metal, consistent quality solvents, amines, chelants, and surfactants for photo resist, color resist, etchant, stripper and thinner applications　　· Silicone solutions for display applications: Offering optically clear silicone resins (OCRs), including UV cure and other cure systems for displays, silicone thermal conductives for heat management in displays, as well as materials for assembly and protection　　· Electronic and advanced modules/systems applications: Delivering solutions for electronic modules, sensors and components used across segments in the electronics industry – including silicone and polyurethane sealants, adhesives, thermal and electrical conductives, electromagnetic interference (EMI) conductives, conformal coatings, gels and encapsulants that protect against heat, moisture, contamination and vibration　　· Energy applications: Delivering heat transfer and cooling fluids to protect a wide variety of electronics from damaging heat　　· Printed circuit board assemblies: Delivering an industry leading line of gels and pottants, thermally conductive materials, optically clear materials, conformal coatings and encapsulants to enable compact devices and help draw heat away from sensitive components　　· Battery and e-mobility applications: Providing cathode, anode, slurry, coatings, electrolyte, thermally conductive interface materials, foams, gels, and assembly materials like adhesives or sealants for battery, inverter, electric motor, on-board charger and other applications　　While the prospect of technological use is still far off, this new material opens up new avenues in the exploration of very high-speed electromagnetic signal manipulation. These results can also be used to develop new sensors. The next step for the research team will be to further observe how this material reacts to high electromagnetic frequencies to determine more precisely its potential applications.
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Release time：2023-07-17 15:10 reading：2332 Continue reading>>
Tokyo Electron Closing in on Applied <span style='color:red'>Materials</span> as Semiconductor Equipment Leader
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Tokyo Electron Closing in on Applied Materials as Semiconductor Equipment Leader

Through the first three quarters of 2018, Tokyo Electron is poised to take over the lead of the semiconductor equipment market, according to the report “The Global Semiconductor Equipment: Markets, Market Shares, Market Forecasts,” recently published by The Information Network, (www.theinformationnet.com) a New Tripoli, PA-based market research company.Since the 1990s, Applied Materials has been the market leader in the semiconductor equipment space. Previously, Japan’s Tokyo Electron was the market leader going back to 1989.Chart 1 shows that Applied Materials share of the top eight equipment companies has dropped from 27.2% in Q1-Q3 2017 to 23.8% in Q1-Q3 2018. During the same period, Tokyo Electron’s share increased from 20.2% to 21.8%. Thus, Applied Materials’ lead over Tokyo Electron decreased from 6.0% to just 2.0%.Data are for semiconductor equipment only and do not include service or spare parts. Foreign currencies were converted to US dollars using exchange rates on a quarterly basis.
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Release time：2018-11-27 00:00 reading：1252 Continue reading>>
Prices of Lithium-ion Batteries to Increase by 5~15% in 3Q18 Due to Rising Costs of <span style='color:red'>Materials</span>
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Prices of Lithium-ion Batteries to Increase by 5~15% in 3Q18 Due to Rising Costs of Materials

Cobalt prices have reached another record high in 1Q18, according to the data from EnergyTrend, a division of TrendForce. As the result, the prices of lithium-ion battery cells are estimated to increase by 5~15% QoQ in 3Q18, but would have a chance to remain flat in the fourth quarter.According to Duff Lu, senior research manager of EnergyTrend, the overall prices of IT batteries have been growing since 2Q18 due to the rising costs of materials in 1Q18, but the growth was more moderate than expected as some battery makers had stocked up in advance. However, the price growth would be steeper in 3Q18. Particularly, prismatic cells, cylindrical cells, and polymer cells would witness a QoQ price growth of 6~8%, 7~9%, and 10~15% respectively. In addition to rising material costs, the increase of cylindrical cell prices is also due to the undersupply of this cell type as a result of decreasing production capacity of suppliers.Manufacturers of key battery system components have allocated increasing capacity to automotive components, which has squeezed capacity for capacitance. In addition to capacitance, the impact on production capacity has been expanded to passive components such as resistors and inductor. In 3Q18, resistors are expected to see a QoQ price rise of 5~10%, the highest among all the components. As for capacitance, it would see a small price increase of 3~5%, because automotive components have occupied some of the production capacity that is originally for IT applications.In terms of battery technology development, some manufacturers have introduced solutions with a higher ratio of nickel or higher voltage to increase the energy density. However, a higher ratio of nickel brings along higher requirements for material structure stability and better conditions for the battery cell manufacturing process. Therefore, suppliers of high-nickel cells are mainly based in Japan. As for high-voltage solutions, they are commonly used in digital products. Chinese battery cell manufacturers have begun to cut into this field.As for the market of cobalt, it previously experienced a price hike, because the market expected the rapid development of China's new energy vehicles to boost the cobalt demand. However, the demand from China is not expected to influence the global demand-supply situation of cobalt significantly in the near term. This is because the global demand for cobalt is around 110,000 to 120,000 tons per year currently, of which only about 7,000 to 8,000 tons come from new energy vehicles in China. EnergyTrend notes that the issue of illnesses related to cobalt mining in Congo may affect the production capacity of this metal. Meanwhile, the introduction of high-nickel solutions to the market in 3Q18 would also have certain impacts on cobalt demand. The two factors would jointly affect the future price trend of cobalt.
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Release time：2018-08-09 00:00 reading：1129 Continue reading>>
The Growing <span style='color:red'>Materials</span> Challenge
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The Growing Materials Challenge

Materials have emerged as a growing challenge across the semiconductor supply chain, as chips continue to scale, or as they are utilized in new devices such as sensors for AI or machine learning systems.Engineered materials are no longer optional at advanced nodes. They are now a requirement, and the amount of new material content in chips continues to grow along with density and increased functionality. This is obvious at 5nm and beyond, but the trend toward solving issues with materials is occurring in markets where not everything is being created at the latest process nodes. The need for longevity in safety-critical markets such as automotive, medical and avionics, as well as in industrial applications, has brought materials science to the forefront of the semiconductor industry.“One of the misconceptions in AI is that it’s all about the algorithms for training and inferencing,” said Dominic Miranda, business development manager at Brewer Science. “But the input of the data coming into those systems is equally important. There are multiple sensors in networks, factories and municipalities, and there is a vast volume of data. So the speed of the data is important, and so is the speed of the sensors to react to a variety of data. Materials have a big impact on the speed of the sensor to react to stimuli.”There is research currently underway, for example, in carbon-based technology using carbon nanotubes or graphene as an active layer.“The way you functionalize these devices with materials affects how a sensor behaves or what it can sense,” Miranda said. “The more complex the device, the more you have to deal with noise. That can be environmental noise, like the acoustic noise from machines running or vibration. What we’re finding is that the market is going in two directions. You can take sensors off the shelf and apply them to a system, or you can use a custom-design to get a cleaner signal.”Noise is a growing problem, particularly at advanced nodes where tolerances are much tighter than at older nodes. While this used to be a challenge primarily for analog circuitry in proximity of digital switching, thinner gate oxides and increased density at 10/7nm and below have made noise from power, electromagnetic interference, and heat an increasingly thorny issue even in digital circuits.The march to 2DOne of the challenges in shrinking devices is that silicon, like most materials, is inherently three-dimensional. Even if a silicon layer is only one atom thick, it still includes dangling bonds that extend out of the plane of the surface. These bonds require passivation to avoid undesirable interactions, and introduce surface roughness that causes carrier scattering and degrades mobility.In contrast, there are no out-of-plane bonds in two-dimensional semiconductors. A single atomic layer is structurally “complete” and self-passivating, reducing or eliminating short-channel effects.Exploiting these promising structural properties in manufacturable devices has been challenging, though. Graphene, the first 2D semiconductor discovered, has no band gap. Black phosphorus is unstable at typical operating temperatures. Instead, much current research focuses on transition metal dichalcogenides like MoS2, WS2, and WSe2. Several papers at both the Materials Research Society Spring Meeting in April and last December’s IEEE Electron Device Meeting examined the physics and materials science of these compounds.Simply fabricating 2D materials is the first challenge for commercial applications. Abundant research samples can be obtained by exfoliation — graphene was isolated by using sticky tape to pull layers off of bulk graphite — but the precision and quality requirements of manufacturing demand a more controllable method.While CVD is an obvious choice for thin layer deposition, CVD of 2D materials is more complex than it might appear at first glance. For example, a 2D material may rest on a substrate, but is not bonded to it. Thus, growing a 2D semiconductor typically involves etching or ablating the nucleation layer out from underneath the semiconducting monolayer in order to isolate it. Xiangfeng Duan, professor of chemistry and biochemistry at UCLA, explained in an MRS presentation that the multilayer stacks needed for devices require careful attention to chemical compatibility with the substrate, between the components of the stack, and between process gases. Process conditions that are ideal for one layer can cause chemical or thermal degradation of the next layer.When 2D semiconductor heterostructures are successfully deposited, though, the results can be dramatic. Duan’s group made atomically thin lateral WSe2/WS2 p-n diodes, with the two materials interacting along a single quantum line. For vertical stacks, they are investigating intercalation of electrically passive materials into existing stacks. This approach can potentially isolate monolayers from each other without the added complexity of substrate removal.Simple isolation of individual layers is not enough, though. In a 2D material, defects can prevent the movement of carriers altogether: they can’t leave the plane to find an alternative path. Reporting on his optoelectronic device research, Ali Javey, professor of electrical engineering and computer science at UC Berkeley, observed that defects are non-radiative recombination centers. As a result, quantum yield gives a reasonable measure of defect levels.Once high quality semiconductor material is achieved, low-resistance contacts are the next challenge. A contact with good electron mobility may impede holes, and vice versa. Javey’s group demonstrated optoelectronic emitters by using alternating current to supply first holes, then electrons, which recombined in exfoliated MoS2 layers to emit light. In grown, rather than exfoliated materials, the substrate’s coefficient of thermal expansion can be used to control the amount of strain in the deposited film, shifting the band gap and emission characteristics.In work presented at IEDM, Ph.D. student Xuejun Xie and colleagues at UC Santa Barbara described the use of light-sensitive MoS2 FETs in an artificial retina device. Such a device is potentially useful for neuromorphic image recognition applications. While memristivecrossbar arrays are frequently proposed for use as artificial synapses, they cannot “see” an image directly.Capturing image information and writing it to the crossbar array is a potentially significant bottleneck that might be alleviated by combining image sensing and analysis in a single device. To this end, the Santa Barbara group created an array of metallic MoS2 quantum dots on the semiconducting MoS2 channel using e-beam patterning. The quantum dots attract abundant electrons from the conduction band of the semiconductor, moving the Fermi level toward the valence band. Holes are trapped, increasing resistance. As current flows, mobile electrons recombine with the holes, causing resistance decay over time. There are more carriers where the light is on, so the device “detects” and “remembers” bright parts of the image.Even 14 years after the discovery of graphene, devices based on 2D semiconductors are still in their infancy.Flexible materialsPart of the challenge in materials engineering these days is to reach beyond standard formats for chips. There is a whole new wave of flexible hybrid electronics that includes everything from thin-film temperature sensors to electronic ink, each with its own unique properties and challenges. And they are making it much more difficult to ensure that these materials will work as planned under a range of new and sometimes unexpected operating conditions.“There is a range of sensors for glucose, pH, humidity and temperature, said Norman Chang, chief technologist for the semiconductor business unit at ANSYS. “The problem is that we are exercising components with different thermal gradient solutions, which can have an impact on performance. You’re really looking at a 3D geometry input, and that requires co-simulation of the flexible substrate and the package because they can impact the electrical performance of these devices. It all has to be simulated together. If you look at printed RF, millimeter wave performance may be different in different areas.”One of the new approaches being developed is called geometry wrapping, whereby circuits can literally be wrapped around any device or even stretched across buildings. The U.S. Air Force Research Laboratory, for example, announced earlier this year that it is developing a flexible circuit system in conjunction with NextFlex for IoT sensor applications for military and commercial applications. The goal is to achieve stretchable electronics that can withstand extremely high G forces and temperatures.Flexible sensors are also being used for such applications as water and environmental testing. “With water testing, the challenge is to design a sensor to ignore everything but what you want to test for,” said Brewer’s Miranda. “This doesn’t work well with solid-state materials, but it does work with flexible sensors. You’ve probably heard the video on YouTube where some people hear Yanni and others hear Laurel, depending upon the wavelength they’re hearing. But materials can be used to make sure that you hear what you’re supposed to hear, and they can be used to detect only what you want to detect.”ConclusionThe emphasis on materials engineering in electronics is growing, and it will continue to become more pervasive. While device scaling is an obvious place for new materials, there are a bunch of new markets such as autonomous driving, AI, 5G, and industrial and medical applications where electronics have played a much more limited role in the past.Not all of those will use conventional chips, and many have specific requirements for flexibility, noise sensitivity and signal throughput.
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Release time：2018-06-12 00:00 reading：1382 Continue reading>>
Record Year for Semiconductor <span style='color:red'>Materials</span> Forecast
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Record Year for Semiconductor Materials Forecast

 After increasing by nearly 10 percent in 2017, the semiconductor materials market is expected to grow by an additional 4 percent in 2018 to reach a new all-time high of $48.7 billion, according to the SEMI trade association.The previous market high for materials was $47.1 billion set in 2011, SEMI said.Total wafer fabrication materials sales grew 12.7 percent last year to reach $27.8 billion, SEMI said, while packaging materials sales  increased by 5.4 percent to reach $19.1 billion.Taiwan was the largest consumer of semiconductor materials for the eighth straight year in 2017, with sales of $10.3 billion, SEMI said. Taiwan owes its lead to the island's large foundry and advanced packaging base, according to the trade group.SEMI also announced that the three month average for bookings of North American semiconductor equipment suppliers totaled $2.42 billion in March, up 0.4 percent from February and up 16.7 percent from March 2017."We are seeing sustained strength in the global semiconductor equipment market, aligning with our expectation for a fourth consecutive year of spending growth," said Ajit Manocha, SEMI's president and CEO, in a press statement.
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Release time：2018-04-26 00:00 reading：1294 Continue reading>>
Synopsys Buys <span style='color:red'>Materials</span> Modeling Tool Firm QuantumWise
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Synopsys Buys Materials Modeling Tool Firm QuantumWise

　　EDA and IP vendor Synopsys Inc. has acquired QuantumWise, a provider of simulation tools for materials modeling in early manufacturing process development. Financial terms of the deal were not disclosed.　　Synopsys (Mountain View, Calif.) said the deal would help it support chip makers, which are evaluating new materials to extend Moore's law and develop novel memories. Synopsys said the QuantumWise solution reduces time and cost by enabling earlier co-optimization of materials, processes, devices and circuits for 5nm and beyond.　　QuantumWise, founded in 2008, in based in Denkark. The company claims more than 400 commercial and academic customers worldwide for its tools for atomic-scale modeling of materials.　　The QuantumWise tools simulate the properties of materials based on fundamental quantum mechanical theories to improve product performance across many applications, including semiconductors and electronics.　　Howard Ko, general manager of Synopsys' Silicon Engineering Group, said through a press statement that the company has worked closely with customers over the past year to define links between Synopsys' Sentaurus TCAD tools and the atomistic modeling of materials with the QuantumWise tools. Integration between the two provides seamless flow from materials to transistor by creating models for TCAD process and device simulation, according to Synopsys.　　"This acquisition now gives us the opportunity to accelerate the application of this critical technology to address the challenges in technology development of advanced process nodes," Ko said.
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Release time：2017-09-20 00:00 reading：2799 Continue reading>>
Domain structure controlled in ferroelectric materials
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Domain structure controlled in ferroelectric materials

　　A new approach to advanced sensor and energy harvesting devices based on controlling domain alignment in nanostructured ferroelectric materials has been developed by a team from Nagoya University.　　According the team, the crystal structures of ferroelectric materials have regions in their lattice, or domains, that behave like molecular switches.　　The alignment of a domain can be toggled by an electric field, which changes the position of atoms in the crystal and switches the polarisation direction. These crystals are typically grown on supporting substrates that help to define and organise the behaviour of domains.　　“We grew lead zirconate titanate films on different substrate types to induce different kinds of physical strain, and then selectively etched parts of the films to create nanorods,” said lead author Tomoaki Yamada.　　The team then used synchrotron X-ray radiation to probe the domain structure of individual rods.　　The contact area of the rods with the substrate was greatly reduced which meant domain properties and structure were influenced by the surrounding environment. The researchers found that coating the rods with a metal could screen the effects of the air and that they tended to recover the original domain structure.　　“There are few effective ways of manipulating the domain structure of ferroelectric materials, and this becomes more difficult when the material is nanostructured and the contact area with the substrate is small.” says collaborator Nava Setter.　　“We have learned that it’s possible to nanostructure these materials with control over their domains, which is an essential step towards new electronic and electro-mechanical nanoscale devices.”
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Release time：2017-08-30 00:00 reading：1085 Continue reading>>
Researchers Print Transistors on 2D Thin-Film <span style='color:red'>Materials</span>
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Researchers Print Transistors on 2D Thin-Film Materials

　　While video display manufacturers are furiously trying to devise a practical means to manufacture thin-film transistors (TFTs) with the goal of reducing the cost of monitors, TVs, smartphone screens, and the like, a group of researchers in Ireland have just announced a printing process for creating two-dimensional transistors on thin-film materials that could make displays so cheap that they would be literally disposable.　　A possible application might be packaging for perishables (e.g., a container of yogurt) that displays an expiration-date countdown. Or white wine labels that alert you when the contents are the optimum temperature for drinking. Or imagine if the wrapping for your 7-Eleven breakfast burrito could alert you when your bus or your Lyft is about to arrive.　　The development of the new thin-film transistors was done at Advanced Materials and BioEngineering Research (AMBER), an organization that focuses on materials sciences; it’s funded by Science Foundation Ireland.　　AMBER researchers believe that they’re the first to actually print 2D transistors — they say that they are using a “standard” printing process. They said it was important to show that it was possible to make transistors this way, which is why they did that first, but they seem certain that they’ll be able to use the same process to build solar cells, LEDs, and other devices.　　They described their transistors as vertically stacked, with graphene source, drain, and gate electrodes, a transition metal dichalcogenide channel, and a boron nitride separator. The description comes from the summary of a paper recently published in the journal Science.　　The specific chalcogenide that AMBER said it’s using is tungsten diselenide. It was selected because it has a high charge-carrier mobility.　　The transistors rely on electrolytic gating with ionic liquids, which the AMBER researchers said leads to higher operating currents than achieved with comparable organic TFTs. Electrolytic gating has only recently been proposed for oxide thin films. (Selenium is a chalcogen — chalcogens are also known as the oxygen family).　　The upshot is that the materials that AMBER has chosen for its printed TFT devices carry higher currents than most other TFTs at relatively low drive voltages.　　There are a number of other potential applications for TFT-based displays that may end up as cheap as AMBER promises. AMBER imagines printing interactive smart food and drug labels or using them in next-generation banknote security and e-passports.　　The future is arriving fast.
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Release time：2017-04-21 00:00 reading：1276 Continue reading>>

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