NOVOSENSE introduces N<span style='color:red'>SD</span>A6934-Q1: Automotive-grade Class D audio amplifier with digital input
Trade news

NOVOSENSE introduces NSDA6934-Q1: Automotive-grade Class D audio amplifier with digital input

　　NOVOSENSE recently announced the launch of the NSDA6934-Q1, a digital-input automotive-grade Class D audio amplifier designed for vehicle audio systems. Featuring four-channel audio output with up to 75W per channel, it supports low-latency mode and sampling rates up to 192kHz. The amplifier offers flexible switching frequencies, multiple modulation options, and comprehensive protection features, making it highly adaptable to various automotive audio system designs.　　Class D amplifiers: Driving the evolution of automotive audio　　As automotive electronics continue to advance, Class D amplifiers have emerged as the preferred choice for vehicle audio systems due to their high efficiency, low heat dissipation, and compact form factor. These amplifiers not only meet modern vehicles’ stringent energy efficiency demands but also enhance audio quality and power output within limited space, playing a key role in the evolution of automotive audio technology.　　Optimized Low-Latency Mode: Reducing Path Delay by Over 70%　　In automotive audio systems, amplifiers boost signals from the DSP (Digital Signal Processor) before transmitting them to the speakers. Traditional amplifiers can contribute to over 30% of total signal transmission latency, impacting system performance.　　The NSDA6934-Q1 features a unique low-latency mode that reduces transmission path delay by more than 70%, granting the DSP additional time for signal processing. This reduces DSP resource demands and enhances the effectiveness of RNC (Road Noise Cancellation). Additionally, the amplifier supports up to 192kHz sampling rates, delivering high-resolution audio with enhanced clarity and detail for an immersive in-car listening experience.　　Flexible Configurations to Suit Various Designs　　The NSDA6934-Q1 provides a wide range of switching frequencies and modulation options, allowing system engineers to optimize efficiency and size.　　Adjustable Switching Frequency (384kHz – 2.1MHz)　　At 384kHz, the amplifier achieves up to 93% efficiency, ideal for applications prioritizing power savings, though it requires a 10μH inductor for operation.　　At 2.1MHz, the amplifier supports a compact 3.3μH inductor, making it suitable for space-constrained smart cockpit integration.　　Selectable Modulation Modes (BD Mode & 1SPW Mode)　　BD Mode (50% duty cycle) ensures superior linearity at high power levels, making it ideal for high-output applications.　　1SPW Mode (20% duty cycle) reduces conduction losses, improving efficiency in low-power scenarios　　Additionally, the NSDA6934-Q1 supports TDM16 data format, ensuring seamless integration with mainstream audio interfaces. With eight selectable I2C addresses, it prevents communication conflicts among peripheral devices. It also features integrated PVDD voltage monitoring, eliminating the need for external resistor dividers and simplifying system wiring and debugging.　　Enhanced EMC Performance & Comprehensive Protection　　The NSDA6934-Q1 incorporates multiple EMC optimization techniques, including slew rate control, phase control, and three spread-spectrum modes (triangular wave, random spread, hybrid spread), helping customers pass system-level EMC tests efficiently.For system reliability, the amplifier integrates multiple intelligent protection and diagnostic functions, including:　　• I2C watchdog for real-time bus monitoring.　　• Thermal protection, which automatically reduces gain under high-temperature conditions.　　• AC/DC diagnostics for real-time power supply monitoring.　　• Comprehensive protection suite, including temperature alarms, over-temperature shutdown, undervoltage, overvoltage, and overcurrent protection, ensuring robust system stability.
Key word：
Release time：2025-04-24 17:19 reading：223 Continue reading>>
How Will BIWIN BGA S<span style='color:red'>SD</span> Break Through in the Intelligent Upgrade Path of Edge Devices?
Trade news

How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
Key word：
Release time：2025-03-20 14:01 reading：312 Continue reading>>
BIWIN SPEC TGS20x Industrial-Grade S<span style='color:red'>SD</span>: Built for Extreme Conditions with High Reliability
Trade news

BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support
Key word：
Release time：2024-12-23 15:51 reading：903 Continue reading>>
BIWIN TF200 Series Micro<span style='color:red'>SD</span>: Enhanced Raspberry Pi 4B Compatibility
Trade news

BIWIN TF200 Series MicroSD: Enhanced Raspberry Pi 4B Compatibility

　　BIWIN's TF200 series microSD cards have passed the Raspberry Pi 4B AVL certification, ensuring compatibility and adaptability with Raspberry Pi microcomputers.　　The TF200 microSD cards underwent rigorous tests on the Raspberry Pi 4 Model B/4GB platform. These tests included loading each test card with a custom image (including the latest Bullseye image), an automated stress test script, and a locally accessible website using Google Puppeteer for automated testing. After over 15,000 power-off tests and over 2.7 million seconds of continuous operation, the product demonstrated a continuous write speed of over 26 MB/s, a random write speed of up to 717 IOPS, and a random read speed of up to 3525 IOPS. These results meet the testing benchmarks required by Raspberry Pi, ensuring efficient and stable operation of the Raspberry Pi devices.　　The TF200 series microSD cards feature firmware functionalities such as garbage collection and bad block management to ensure stable data recording without frame loss. The product reaches the U3 speed class and V30 video speed class, with sequential read and write speeds of up to 158 MB/s and 113 MB/s respectively, supporting 4K RAW ultra-high-definition video capture and high-speed continuous shooting. Leveraging the company's advanced packaging technologies like multi-layer stacking and ultra-thin Die, the product offers capacities up to 256 GB (with future releases of 512 GB and 1 TB). It also supports flash wear leveling technology with a P/E Cycle of 3000 times. With operational temperature ranges from -25 °C to 85 °C and features such as waterproofing, shock resistance, and temperature shock resistance, the product is well-equipped to handle various complex environmental challenges.　　The TF200 series microSD cards combine high stability, reliability, and durability, making them compatible with mainstream terminal devices. They are suitable for fields like video surveillance, digital education, industrial tablets, and dashcams. Leveraging its expertise in storage solution development and advanced testing, BIWIN can tailor storage device performance, reliability, and power consumption to meet the testing and certification requirements of SoC chips and system platforms. This adaptability ensures a high degree of compatibility with different platforms, effectively meeting the diverse storage needs of various terminal applications.
Key word：
Release time：2024-01-26 13:44 reading：2168 Continue reading>>
Hiksemi Launches PCIe 4.0 S<span style='color:red'>SD</span> FUTURE Series, 7450MB/S Leads The Next Generation Of Gaming S<span style='color:red'>SD</span>s
Trade news

Hiksemi Launches PCIe 4.0 SSD FUTURE Series, 7450MB/S Leads The Next Generation Of Gaming SSDs

　　As a global provider of ultimate storage products and solutions,Hangzhou Hikstorage Technology Co.,Ltd.("Hiksemi") is committed to constantly exploring and inventing to meet the demand of consumers.　　Seeing that SSDs have emerged as the mainstream technology in digital data storage,Hiksemi has made full efforts in the field of PCIe 4.0 SSDs with the rich technical experience. Recently,Hiksemi has launched high-performance PCIe 4.0 SSD,FUTURE Series,designed for PC enthusiasts,gamers and content creators.　　Just as the name FUTURE,this series is born to break limits and embrace the future. With the ultimate performance and speed,it brings the ultimate experience to users. FUTURE SSD has faster speed,stronger performance,larger capacity,making users even more powerful in the world of game entertainment and content creation.　　Faster Speed　　The maximum sequential reading speed of up to 7450MB/S can significantly improve the speed and fluency of game startup,screen loading and file access.　　To demonstrate the capabilities of FUTURE SSD,Hiksemi benchmarked the 2TB model on CrystalDiskMark software. The test result is shown in the figure,the sequential read speed exceeds 7450MB/S. In addition,after loading it into PS5,the file transfer speed and game loading speed become significantly faster. It is enough to reflect excellent speed and performance.　　Stronger Performance　　It adopts customized main controller,advanced process technology and the DRAM-less design to bring high-performance bandwidth and throughput.　　In terms of heat dissipation,the new generation of graphene heat sink guarantees the better temperature control. In terms of durability,the MTBF(Mean Time Between Failures) can reach 2 million hours,and the 5-year long warranty service provides users with greater peace of mind.　　Larger Capacity　　The compact M.2 2280 single-sided PCB design,with a variety of capacity options,up to 4TB,can well meet the expansion needs of PS5,notebooks,desktops and other devices.　　With the continuous development of information technology and the increase of massive data,higher requirements are placed on the speed and capacity of storage devices. With the efforts of brands such as Hiksemi,consumers can purchase SSD products with better performance,faster speed,larger capacity,and better cost effectiveness. Hiksemi will continue to invest in R&D resources,improve the supply chain,and conduct technology and product iterations based on consumer demand,striving to become an emerging force leading the development of the storage industry.
Key word：
Release time：2023-12-13 14:12 reading：2901 Continue reading>>
BIWIN to Launch Wide-temperature S<span style='color:red'>SD</span>s for Industrial Storage
Trade news

BIWIN to Launch Wide-temperature SSDs for Industrial Storage

　　Recently, BIWIN introduced a series of wide-temperature SSDs for extreme environments, including GP303, GP304, GS301, GS302, GS303, and GS304. Crafted with high quality 3D NAND and controller, BIWIN wide-temperature SSDs have the advantages of performance, stability, reliability and security. This series is a strong choice for electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and more.　　Supported by self-developed firmware, sequential read / write speeds up to 3400 MB/s / 2700 MB/s and full-drive write speed remains at 1000 MB/s　　With BIWIN self-developed firmware, BIWIN products release their excellent performance. BIWIN GP30 Series SSDs adopt PCIe Gen3x4 and NVMe 1.4 to deliver sequential read / write speeds up to 3400 MB/s / 2700 MB/s and is armed with capacity of up to 2 TB. The GP30 / GS30 Series SSDs have optimized the firmware to provide stable performance. The speed of GP30 and GS30 reaches 1000 MB/s / 450 MB/s on FIO.　　Work faultlessly in -40℃ to 85℃, 3 million hour MTBF　　To ensure great reliability, wide-temperature SSDs adopt quality NAND and have undergone strict tests to bring excellent performance in extreme temperatures. They are rigorously tested to perform well in temperature ranging from -40℃ to 85℃ with a more than 3 million hours MTBF. In addition, this series adopts Corner Fill and Anti-sulfuration for better data integrity in extreme environments.　　Secure your data with power loss protection and end-to-end data protection　　BIWIN wide-temperature SSDs have made great optimization of firmware and hardware in terms of power-down data protection, data patrol, end-to-end data protection, and soft data destruction in terms of security, the series products have multiple optimizations of firmware and hardware in terms of PLP, data patrol, end-to-end data protection, and data erase, effectively guaranteeing data integrity and stability.　　Local service team offers quick response　　Other than its headquarters in Shenzhen, BIWIN has established its overseas headquarters in Miami, USA and local sales teams in Los Angeles, Mexico City, Bogotá, Buenos Aires, Amsterdam, Frankfurt, Istanbul, New Delhi, Taiwan and more territories. We have a strong local support team to make quick response to our clients' needs, providing customized service, real-time FAE technical support, and full supply. Also, we have a globally distributed network that connecting customers across the globe.　　BIWIN GP30 / GS30 SSDs provide wide temperature technology, stable performance, and high reliability, meeting the demanding requirement of industrial applications. BIWIN will make greater efforts to maintain its advantages in R&D, advanced manufacturing, and product quality, bringing our customers quality products and worry-free services.
Key word：
Release time：2023-09-04 16:02 reading：3370 Continue reading>>
NOVOSENSE launched new 120V half-bridge driver N<span style='color:red'>SD</span>1224 series
Trade news

NOVOSENSE launched new 120V half-bridge driver NSD1224 series

　　NOVOSENSE has launched 120V half-bridge driver NSD1224 series, which have 3A/-4A peak driver current capability, are integrated with high-voltage bootstrap diode, and are available in different versions including enabling, interlock and undervoltage protection, as well as various packages including SOP8, HSOP8, DFN10 and DFN8. It is widely used in micro inverter, power optimizer, power module, new energy vehicle and other application scenarios.　　I NSD1224 features:　　l Withstand voltage of VDD power of 20V　　l Withstand voltage at HSpin of -10V to 115V　　l Negative withstand voltage of input pin of -10V　　l HS pin withstand dv/dt up to 50V/nsPeak driver current 3A/-4A　　l Compatible with CMOS/TTL level input　　l Input interlock function　　l Independent UVLO protection for high-side and low-side output　　l Integrated high voltage bootstrap diode　　l Input/output delay of less than 16ns　　l transmission delay matching between high and low sides is less than 1ns　　l DFN10 package with enabling pin for static power consumption as low as 7uA in standby mode　　l Package available in SOP8, HSOP8, DFN10 and DFN8　　l Junction temperature range of -40°C to 150°C　　II NSD1224 performance advantage:　　1. NSD1224 has interlock function, which can effectively avoid shoot through of power satgedue to input interference.　　In the power supply application, the input pin of the half-bridge driver chip is susceptible to interference due to the influence of high-frequency switching noise, which may cause input high at both the high and low sides, resulting in output high at both the high and low sides of the driver chip, cause shoot through of power stage , and damage to the power supply equipment.　　The NSD1224 triggers an interlock mode when both inputs are high levels at the same time, in which case both the high-side and low-side output low at the same time, and only when either input becomes low level will the output return to the normal state following the input. The interlock function of NSD1224 effectively avoids shoot through caused by input signal interference, and improves the reliability of the system.　　2. The input pin of NSD1224 can withstand a negative voltage of -10V, which solves the problem of negative voltage peak in the input of the driver chip.　　In power applications, due to the influence of MOSFET high frequency switches, transient current will be generated in the GND circuit, and there will be parasitic inductance due to the PCB wiring between the controller and the driver. The interaction between the transient current and the parasitic inductance will produce a negative voltage peak in the input pin of the driver chip, resulting in the logic error or even damage of the driver chip. The NSD1224 input pin is improved in respect of the negative withstand voltage, which can be of -10V (recommended working value: -5V), thereby improving the reliability of the chip and lowering the requirements for system design.　　3. NSD1224 with HS pin with a negative withstand voltage of -10V and dv/dt immunity of 50V/ns, applicable for high-frequency and efficient switching power supply applications.　　With the continuous improvement of power efficiency requirements, the switching speed of MOSFET is becoming faster and faster, so as to reduce switching losses. The di/dt and parasitic inductance caused by high-speed switching will generate transient negative voltage in the HS pin, which is likely to cause the driver chip to be locked or even damaged. The HS pin of NSD1224 can withstand negative voltage of -10V (recommended working value: -8V), which effectively solves the application problem of high-frequency and efficient switching power supply. In addition, the HS pin of the NSD1224 can withstand 50V/ns common-mode transients and has strong resistance to common-mode interference.　　NSD1224 is available for sample. For sample application or order, please email to amall@ameya360.com. For more information, click www.ameya360.com
Key word：
Release time：2023-08-24 13:30 reading：3747 Continue reading>>
Baiwei launched a number of industrial grade wide temperature S<span style='color:red'>SD</span>
Trade news

Baiwei launched a number of industrial grade wide temperature SSD

　　Li Zhenhua, vice general manager of Marketing Department of Baiwei Storage, said: Based on the company's rich development experience in the field of industrial storage, Baiwei industrial wide temperature SSD products adopted optimized and upgraded hardware design, advanced flash memory management firmware algorithm, after more than 3000 test cases, combined with the company's advanced manufacturing capabilities, products have high reliability, long life, stable performance and other characteristics. It is especially suitable for system operation and data saving in harsh environments such as high and low temperatures, abnormal power failure, humidity, vibration, and shock.　　Recently, Baiwei launched a number of industrial wide temperature SSD products for extreme temperature and other working environments, including GP303, GP304, GS301, GS302, GS303, GS304 and so on. Series products adopt domestic brand 3D NAND wafers and master control, while relying on the company's storage solution development endowment of media characteristics research and screening, firmware algorithm development, hardware design, advanced manufacturing capabilities, making products with high performance, high stability, high reliability and more secure and other advantages. It is widely used in electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and other fields.　　1, fully self-developed firmware, sequential read/write speed up to 3400MB/s, 2700MB/s, overall write speed maintained at 1000MB/s　　Equipped with self-developed firmware, the GP30 SSD series has excellent performance. The SSD series uses PCIe Gen3.0x4 interface and NVMe1.4 protocol, with the maximum sequential read/write speed of 3400MB/s and 2700MB/s, respectively, and the maximum capacity of 2TB. In addition, based on multiple optimization of firmware, GP30/GS30 series SSDS have stable data reading and writing performance. In FIO test, the overall write speed of GP30 series SSDS is maintained at about 1000MB/s, while that of GS30 series SSDS is maintained at about 450MB/s.　　2, support -40℃~85℃ wide temperature work, MTBF>3 million hours　　In terms of reliability, the series of products adopt high-specification wide-temperature flash particles, and the company abandons the traditional component screening method to ensure that all components in the products meet the requirements of wide-temperature. At the same time, the series of products have been tested in high and low temperature, functional testing, hardware testing, performance testing, stability testing, reliability testing, compatibility testing and other strict testing verification, support -40℃~85℃ operating temperature, MTBF(mean time to failure) is more than 3 million hours. The products are reinforced with Corner Fill, anti-vulcanization and other technologies to ensure reliable storage of data in extreme temperature and other harsh environments.　　3. Support power failure protection, end to end data protection and other functions and features　　In terms of security, multiple firmware and hardware optimizations are implemented for power failure data protection, data inspection, end-to-end data protection, and data soft destruction, effectively ensuring the security and integrity of SSD data transmission.　　Baiwei GP30/GS30 series SSDS feature wide temperature resistance, stable read/write, and high reliability, fully meeting the strict requirements of industrial applications for data storage. Relying on the integrated layout of research and development, encapsulation and testing, Baiwei will continue to deepen the company's important advantages in technology research and development, advanced manufacturing, quality assurance and other aspects, continue to deepen industrial storage, vehicle gauge storage and other fields, to provide customers with more professional, higher quality customized storage products and services.
Key word：
Release time：2023-05-22 14:25 reading：2548 Continue reading>>
Ameya360:Genesys Logic Memory Card Reader Controller Supports <span style='color:red'>SD</span> 4.0 UHS-II Speed Mode
Trade news

Ameya360:Genesys Logic Memory Card Reader Controller Supports SD 4.0 UHS-II Speed Mode

　　Genesys Logic Inc.’s GL9767 PCI Express to SD Express memory card reader controller supports 1-Lane 2.5/5.0/8.0 GTps PCI Express bus connect to the PCI Express host.　　The support for SD Express interface can be up to SD 8.0 SD Express (PCIe Gen.3 x 2) by a specific system design and a bandwidth of 1,970MBps. GL9767 also supports SD 7.1 SD Express (PCIe Gen. 3 x 1), with a bandwidth of 985MBps. GL9767 can work with the new SDUC card featuring capacities of up to 128TB.　　The GL9767 memory card reader controller is suitable for internal SD Express card reader applications in laptops, mini PCs, server systems, professional cameras, game consoles, and drone devices that demand the high speed of the SD storage or the second SSD-like storage for the real memory expansion.　　GL9767 is the first SD Express card reader controller that can backward support SD 4.0 UHS-II speed mode. The existing devices support UHS-II card slot use GL9767 in the next generation product not only upgrade the speed of SD storage also retain the fully support of UHS-II card. GL9767 also support SanDisk high-performance UHS-I card up to 200MB/s of reading speed.　　For power saving, GL9767 supports PCI Express ASPM, L1 sub-states (L1.1 and L1.2) and RTD3 (Runtime D3 Hot/pold), Modern Standby and S0ix.　　GL9767 will be entering mass production in the second quarter of 2023. The design kit and the IC sample are available now.　　Genesys Logic showcased its USB4, USB 3.2 Gen2/Gen1 family of products, USB Type-C solution and PCI Express products at the recent Consumer Electronics Show (CES) 2023 in Las Vegas, Nevada.
Key word：
Release time：2023-01-18 11:21 reading：3315 Continue reading>>
Diodes’ Power Switch Enhances Power-rail Management in S<span style='color:red'>SD</span>s
Trade news

Diodes’ Power Switch Enhances Power-rail Management in SSDs

　　Diodes' new single-channel high-side power switch features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down.　　Diodes Inc. has launched a new versatile single-channel high-side power switch that features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability. The DIODES AP22980 power switch is targeted at the solid-state data storage systems used in portable electronic equipment, computer hardware, and edge-based data center deployments.　　The N-channel MOSFET, with a built-in charge pump inside the AP22980, has an extremely low Rds(ON) of 5.1m? enabling loads reaching 6A while minimizing voltage drops and power losses in high current loading applications. By having a separate VBIAS pin, the minimum input voltage that it is capable of supporting is significantly lower, resulting in a wider input voltage range that can be covered—from 0.285V to 5.5V—enabling greater application flexibility.　　With 60?A (typical) quiescent supply current, the AP22980 is highly optimized for situations where keeping standby power consumption down is a priority. This device has an operational temperature range of -40°C to 105°C. If the junction temperature exceeds 150°C, an overtemperature protection mechanism is triggered.　　The AP22980 three-level selectable slew rate power switches are supplied in the compact W-QFN1520 package that takes up little board space and eases integration.
Key word：
Release time：2022-12-27 13:27 reading：2177 Continue reading>>

Turn to

/ 3

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
MC33074DR2G onsemi
CDZVT2R20B ROHM Semiconductor
model brand To snap up
TPS63050YFFR Texas Instruments
IPZ40N04S5L4R8ATMA1 Infineon Technologies
BP3621 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
ESR03EZPJ151 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code