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How Will BIWIN BGA <span style='color:red'>SSD</span> Break Through in the Intelligent Upgrade Path of Edge Devices?

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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.

Key word：

BIWIN

Release time：2025-03-20 14:01 reading：312 Continue reading>>

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BIWIN SPEC TGS20x Industrial-Grade SSD: Built for Extreme Conditions with High Reliability

　　Industrial equipment demands uninterrupted long-term operation while enduring extreme environmental conditions such as frequent vibrations, wide temperature and humidity variations, and unexpected power failures. These conditions impose stringent requirements on data processing reliability and durability to ensure continuous and stable system operation.　　BIWIN Spec has specifically designed the TGS20x and TGP20x series of wide-temperature industrial-grade SSDs to address these extreme environments. Compatible with SATA III, PCIe 3.0, and other interface standards, these solutions cover multiple form factors including 2.5", mSATA, and M.2 2280/2242, catering to diverse industrial scenarios. The TGS20x series SSDs have been widely adopted in industrial control, rail transit, data communications, and electric power sectors, providing highly reliable data storage support for various high-demand equipment.　　【Supporting Wide Temperature -40℃~85℃ to Ensure Stable Operation】　　Utilizes flash memory chips, controllers, and components that meet wide-temperature standards; supports operational temperatures from -40°C to 85°C and storage temperatures from -55°C to 95°C　　Rigorously tested with Mean Time Between Failures (MTBF) exceeding 3 million hours　　Enhanced through multiple firmware and hardware optimizations, including RAID, SRAM ECC, E2E, 4K LDPC, and power loss protection　　【Domestic Core Components with Customized Technical Support】　　Employs domestic NAND and controllers; leverages in-house firmware and hardware design with advanced packaging and testing; Achieves read/write speeds of up to 560MB/s and 510MB/s respectively; Supports capacities up to 2TB　　P/E cycles up to 3,000 times, featuring high durability　　Offers customized protective technologies including anti-sulfuration, protective coating, anddispensing reinforcement　　【5-Year Supply Cycle with Nationwide Efficient Service】　　Ensures high quality and consistency through fixed-BOM, automated production, rigorous testing, and comprehensive product lifecycle management　　Service centers located in major cities nationwide, including Beijing, Xi'an, Chengdu, Shanghai, Shenzhen, and Hangzhou, providingrapid response and FAE technical support

Key word：

BIWIN

Release time：2024-12-23 15:51 reading：903 Continue reading>>

Hiksemi Launches PCIe 4.0 <span style='color:red'>SSD</span> FUTURE Series, 7450MB/S Leads The Next Generation Of Gaming <span style='color:red'>SSD</span>s

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Hiksemi Launches PCIe 4.0 SSD FUTURE Series, 7450MB/S Leads The Next Generation Of Gaming SSDs

　　As a global provider of ultimate storage products and solutions,Hangzhou Hikstorage Technology Co.,Ltd.("Hiksemi") is committed to constantly exploring and inventing to meet the demand of consumers.　　Seeing that SSDs have emerged as the mainstream technology in digital data storage,Hiksemi has made full efforts in the field of PCIe 4.0 SSDs with the rich technical experience. Recently,Hiksemi has launched high-performance PCIe 4.0 SSD,FUTURE Series,designed for PC enthusiasts,gamers and content creators.　　Just as the name FUTURE,this series is born to break limits and embrace the future. With the ultimate performance and speed,it brings the ultimate experience to users. FUTURE SSD has faster speed,stronger performance,larger capacity,making users even more powerful in the world of game entertainment and content creation.　　Faster Speed　　The maximum sequential reading speed of up to 7450MB/S can significantly improve the speed and fluency of game startup,screen loading and file access.　　To demonstrate the capabilities of FUTURE SSD,Hiksemi benchmarked the 2TB model on CrystalDiskMark software. The test result is shown in the figure,the sequential read speed exceeds 7450MB/S. In addition,after loading it into PS5,the file transfer speed and game loading speed become significantly faster. It is enough to reflect excellent speed and performance.　　Stronger Performance　　It adopts customized main controller,advanced process technology and the DRAM-less design to bring high-performance bandwidth and throughput.　　In terms of heat dissipation,the new generation of graphene heat sink guarantees the better temperature control. In terms of durability,the MTBF(Mean Time Between Failures) can reach 2 million hours,and the 5-year long warranty service provides users with greater peace of mind.　　Larger Capacity　　The compact M.2 2280 single-sided PCB design,with a variety of capacity options,up to 4TB,can well meet the expansion needs of PS5,notebooks,desktops and other devices.　　With the continuous development of information technology and the increase of massive data,higher requirements are placed on the speed and capacity of storage devices. With the efforts of brands such as Hiksemi,consumers can purchase SSD products with better performance,faster speed,larger capacity,and better cost effectiveness. Hiksemi will continue to invest in R&D resources,improve the supply chain,and conduct technology and product iterations based on consumer demand,striving to become an emerging force leading the development of the storage industry.

Key word：

Hiksemi

Release time：2023-12-13 14:12 reading：2899 Continue reading>>

BIWIN to Launch Wide-temperature <span style='color:red'>SSD</span>s for Industrial Storage

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BIWIN to Launch Wide-temperature SSDs for Industrial Storage

　　Recently, BIWIN introduced a series of wide-temperature SSDs for extreme environments, including GP303, GP304, GS301, GS302, GS303, and GS304. Crafted with high quality 3D NAND and controller, BIWIN wide-temperature SSDs have the advantages of performance, stability, reliability and security. This series is a strong choice for electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and more.　　Supported by self-developed firmware, sequential read / write speeds up to 3400 MB/s / 2700 MB/s and full-drive write speed remains at 1000 MB/s　　With BIWIN self-developed firmware, BIWIN products release their excellent performance. BIWIN GP30 Series SSDs adopt PCIe Gen3x4 and NVMe 1.4 to deliver sequential read / write speeds up to 3400 MB/s / 2700 MB/s and is armed with capacity of up to 2 TB. The GP30 / GS30 Series SSDs have optimized the firmware to provide stable performance. The speed of GP30 and GS30 reaches 1000 MB/s / 450 MB/s on FIO.　　Work faultlessly in -40℃ to 85℃, 3 million hour MTBF　　To ensure great reliability, wide-temperature SSDs adopt quality NAND and have undergone strict tests to bring excellent performance in extreme temperatures. They are rigorously tested to perform well in temperature ranging from -40℃ to 85℃ with a more than 3 million hours MTBF. In addition, this series adopts Corner Fill and Anti-sulfuration for better data integrity in extreme environments.　　Secure your data with power loss protection and end-to-end data protection　　BIWIN wide-temperature SSDs have made great optimization of firmware and hardware in terms of power-down data protection, data patrol, end-to-end data protection, and soft data destruction in terms of security, the series products have multiple optimizations of firmware and hardware in terms of PLP, data patrol, end-to-end data protection, and data erase, effectively guaranteeing data integrity and stability.　　Local service team offers quick response　　Other than its headquarters in Shenzhen, BIWIN has established its overseas headquarters in Miami, USA and local sales teams in Los Angeles, Mexico City, Bogotá, Buenos Aires, Amsterdam, Frankfurt, Istanbul, New Delhi, Taiwan and more territories. We have a strong local support team to make quick response to our clients' needs, providing customized service, real-time FAE technical support, and full supply. Also, we have a globally distributed network that connecting customers across the globe.　　BIWIN GP30 / GS30 SSDs provide wide temperature technology, stable performance, and high reliability, meeting the demanding requirement of industrial applications. BIWIN will make greater efforts to maintain its advantages in R&D, advanced manufacturing, and product quality, bringing our customers quality products and worry-free services.

Key word：

BIWIN

Release time：2023-09-04 16:02 reading：3369 Continue reading>>

Baiwei launched a number of industrial grade wide temperature <span style='color:red'>SSD</span>

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Baiwei launched a number of industrial grade wide temperature SSD

　　Li Zhenhua, vice general manager of Marketing Department of Baiwei Storage, said: Based on the company's rich development experience in the field of industrial storage, Baiwei industrial wide temperature SSD products adopted optimized and upgraded hardware design, advanced flash memory management firmware algorithm, after more than 3000 test cases, combined with the company's advanced manufacturing capabilities, products have high reliability, long life, stable performance and other characteristics. It is especially suitable for system operation and data saving in harsh environments such as high and low temperatures, abnormal power failure, humidity, vibration, and shock.　　Recently, Baiwei launched a number of industrial wide temperature SSD products for extreme temperature and other working environments, including GP303, GP304, GS301, GS302, GS303, GS304 and so on. Series products adopt domestic brand 3D NAND wafers and master control, while relying on the company's storage solution development endowment of media characteristics research and screening, firmware algorithm development, hardware design, advanced manufacturing capabilities, making products with high performance, high stability, high reliability and more secure and other advantages. It is widely used in electric power, Internet of Things, 5G, intelligent manufacturing, rail transit, industrial control and other fields.　　1, fully self-developed firmware, sequential read/write speed up to 3400MB/s, 2700MB/s, overall write speed maintained at 1000MB/s　　Equipped with self-developed firmware, the GP30 SSD series has excellent performance. The SSD series uses PCIe Gen3.0x4 interface and NVMe1.4 protocol, with the maximum sequential read/write speed of 3400MB/s and 2700MB/s, respectively, and the maximum capacity of 2TB. In addition, based on multiple optimization of firmware, GP30/GS30 series SSDS have stable data reading and writing performance. In FIO test, the overall write speed of GP30 series SSDS is maintained at about 1000MB/s, while that of GS30 series SSDS is maintained at about 450MB/s.　　2, support -40℃~85℃ wide temperature work, MTBF>3 million hours　　In terms of reliability, the series of products adopt high-specification wide-temperature flash particles, and the company abandons the traditional component screening method to ensure that all components in the products meet the requirements of wide-temperature. At the same time, the series of products have been tested in high and low temperature, functional testing, hardware testing, performance testing, stability testing, reliability testing, compatibility testing and other strict testing verification, support -40℃~85℃ operating temperature, MTBF(mean time to failure) is more than 3 million hours. The products are reinforced with Corner Fill, anti-vulcanization and other technologies to ensure reliable storage of data in extreme temperature and other harsh environments.　　3. Support power failure protection, end to end data protection and other functions and features　　In terms of security, multiple firmware and hardware optimizations are implemented for power failure data protection, data inspection, end-to-end data protection, and data soft destruction, effectively ensuring the security and integrity of SSD data transmission.　　Baiwei GP30/GS30 series SSDS feature wide temperature resistance, stable read/write, and high reliability, fully meeting the strict requirements of industrial applications for data storage. Relying on the integrated layout of research and development, encapsulation and testing, Baiwei will continue to deepen the company's important advantages in technology research and development, advanced manufacturing, quality assurance and other aspects, continue to deepen industrial storage, vehicle gauge storage and other fields, to provide customers with more professional, higher quality customized storage products and services.

Key word：

Baiwei

Release time：2023-05-22 14:25 reading：2548 Continue reading>>

Diodes’ Power Switch Enhances Power-rail Management in <span style='color:red'>SSD</span>s

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Diodes’ Power Switch Enhances Power-rail Management in SSDs

　　Diodes' new single-channel high-side power switch features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down.　　Diodes Inc. has launched a new versatile single-channel high-side power switch that features three different selectable slew rates so that wider capacitance loads can be handled while keeping inrush currents down, ensuring system stability. The DIODES AP22980 power switch is targeted at the solid-state data storage systems used in portable electronic equipment, computer hardware, and edge-based data center deployments.　　The N-channel MOSFET, with a built-in charge pump inside the AP22980, has an extremely low Rds(ON) of 5.1m? enabling loads reaching 6A while minimizing voltage drops and power losses in high current loading applications. By having a separate VBIAS pin, the minimum input voltage that it is capable of supporting is significantly lower, resulting in a wider input voltage range that can be covered—from 0.285V to 5.5V—enabling greater application flexibility.　　With 60?A (typical) quiescent supply current, the AP22980 is highly optimized for situations where keeping standby power consumption down is a priority. This device has an operational temperature range of -40°C to 105°C. If the junction temperature exceeds 150°C, an overtemperature protection mechanism is triggered.　　The AP22980 three-level selectable slew rate power switches are supplied in the compact W-QFN1520 package that takes up little board space and eases integration.

Key word：

Diodes

Release time：2022-12-27 13:27 reading：2176 Continue reading>>

Global Ranking of Branded <span style='color:red'>SSD</span> Module Makers for 2017; Kingston, ADATA, and Tigo Took Top 3 Positions

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Global Ranking of Branded SSD Module Makers for 2017; Kingston, ADATA, and Tigo Took Top 3 Positions

DRAMeXchange, a division of TrendForce, announces the global ranking of SSD module makers (NAND Flash manufacturers excluded) for 2017 based on the shipments of their own-branded SSD products in the channel market. Kingston, ADATA, and Tigo took the top three positions in the ranking, with market shares of 23%, 8%, and 7% respectively.According to DRAMeXchange, the global shipments of SSD products in the channel market recorded a total of 55 million units in 2017, which represented a decrease of 3-4% compared with 2016 shipments. The total annual SSD shipments from all branded NAND Flash manufacturers (including Samsung, Toshiba, WDC, Micron, SK Hynix, Intel and so on) fell by nearly 10% YoY in 2017, whereas the total annual SSD shipments from all memory module makers grew by 2-3% YoY for the same year. Branded NAND Flash manufacturers jointly accounted for 40% of the global SSD shipments for 2017, while the other 60% was contributed by memory module makers.The changing landscape in the SSD market is due to the undersupply of NAND Flash in 1H17, which was not eased until 2H17. Faced with the tight supply, the NAND Flash manufacturers made adjustments to their SSD product mixes and allocated more capacity to PC OEM and Server/Data Center OEM sectors, where the gross margins are higher.In terms of the 2017 raking, Kingston secured the first place with a remarkable market share of 23%. As one of the top suppliers of flash drives and memory cards, Kingston manages to retain its advantages in the SSD sector. As for the other nine SSD module makers in the top 10 ranking, their shares were very close to each other, which indicated that the ranking may change significantly from time to time. The top 10 SSD module makers in the ranking accounted for 67% of the total SSD shipment worldwide.ADATA Technology took the second place as it managed to expand its market share by actively exploring the potential markets other than Europe, the United States, and China. In addition, ADATA has increased the retail prices of its products together with the rising costs of NAND Flash.Tigo’s SSD business mainly focuses on the fast-growing Chinese market, where the company deploys comprehensive product lines to expand its share and to build the brand image. Therefore, Tigo managed to take third place in the ranking despite the rising costs and undersupply of NAND Flash.Taiwan-based manufacturers attach importance to product mix and profitability, while Chinese manufacturers focus on expanding market share and gaining popularityPositions in the ranking from the fourth to the tenth place were taken by manufacturers from China and Taiwan. Specifically, Transcend Information and Apacer Technology put the most focus on the Industrial SSD market with high profitability and stable orders, while Lite-On Technology has shifted its business to Enterprise SSD market to make full use of its advantages. All the three companies adopted relatively conservative sales strategies in the channel market in 2017, and took profitability as the priority in sales.In comparison, Chinese companies tend to be more aggressive. Teclast, Galaxy, Colorful, and Sunspeed retained their advantages in the gaming sector and continued to explore the channel market in China. In addition, they have outsourced SSD assembly to reduce the production costs. With the price decline and sufficient supply of NAND Flash in 2018, these Chinese manufacturers will have a chance to improve their rankings.It should be noted that BIWIN, the leading module maker in China, was not in the top 10 ranking because it puts more focuses on the OEM and industrial SSD sectors rather than the channel market. Longsys was not included in this ranking either, because its business is mainly OEM orders from branded Chinese memory companies, which does not meet the criteria of this ranking. Nevertheless, its OEM shipments are comparable to the top 10 SSD module makers.Chinese module makers show great potential; SSD controller chip makers continue to optimize their solutionsDRAMeXchange notes that Chinese module makers show great potential in the channel market, motivating SSD controller chip manufacturers to optimize their solutions in order to obtain orders from these module makers. According to DRAMeXchange, products in demand include master controller chips that fully support 64/72L 256/512Gb Flash and 64L QLC 1Tb Flash which may enter mass production in 4Q18. The product lines are expected to include SATA DRAMless as well as mid- and low-end PCIe G3 solutions.DRAMeXchange notes that some leading module makers in China have extra specs requirements for gaming. SMI SM2258XT, Phison S11 and Marvell 88SS1120 used to be the mainstream controller chip solutions adopted by Chinese module factories in 2017. However, more competitive solutions have emerged in 2018, including Realtek RT5732DL, Maxiotek MAS0902, SAGE INIC6081 and ASolid AS2258. Particularly, ASolid aims to catch up with its major competitors, so the specs of AS2258 are almost the same as solutions by other leading module makers. This controller chip not only features SATAIII DRAMless, LDPC of Error Correction Code and Die RAID for better performance and data protection, but also supports 64/72L TLC 256Gb/512Gb Flash and 64L QLC 1Tb Flash. In addition, to meet the demand for gaming SSD, ASolid also provides the total solution of M.2 and 2.5-inch SSD, with programmable RGB-LED to realize different lighting patterns.

Key word：

SSD

Release time：2018-10-16 00:00 reading：1207 Continue reading>>

Marvell Demonstrates AI <span style='color:red'>SSD</span> Controller Architecture Solution

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Marvell Demonstrates AI SSD Controller Architecture Solution

Marvell demonstrated at the Flash Memory Summit how it will provide artificial intelligence capabilities to a broad range of industries by incorporating NVIDIA's Deep Learning Accelerator (NVDLA) technology in its family of data center and client SSD controllers.Marvell's AI SSD controller proof-of-concept architecture solution will highlight how machine learning can help applications accelerate with minimal network bandwidth and no host CPU processing, delivering a significant reduction in overall total cost of ownership. The architecture is anticipated to enable a new era of storage SSD solutions in areas such as cloud and edge data centers, automotive, industrial, communications networking, environmental monitoring, banking and client, among others.Big data analytics systems require enormous amounts of information to be processed to gain important insights. Metadata tagging is required for this processing to run efficiently and effectively. Storage solutions must become more intelligent to enable the generation of this metadata at the storage end points to help optimize overall efficiencies while increasing user experiences and business productivities.By adding NVDLA to its SSD controllers, Marvell is bringing deep learning inference to forms of SSDs, improving efficiency, reducing power consumption, maximizing scalability and optimizing distribution of resources. Even large-scale datasets can be fully supported, while still reducing hardware investment and operational expenditure. The scalability of this solution will also allow enterprises and cloud service providers to add more offerings and capabilities to their product portfolios leveraging AI technologies. This programmable architecture will enable AI models to be quickly updated, so that new use cases can be addressed as they emerge."As greater and greater amounts of data get generated at edge and end points, it is critical new end-to-end architecture solutions are developed to increase overall productivity while addressing the pain points of application response time and total cost of delivery," said Nigel Alvares, VP of SSD and Data Center Storage Products, Marvell."Our AI SSD controller proof-of-concept architecture solution leveraging NVIDIA's NVDLA technology offers our customers and ecosystem partners a framework to collaborate and develop the next generation of SSD and client-to-cloud infrastructure architecture solutions needed to enable and deliver tomorrow's applications.""It is access to data that will fuel big data analytics," added Noam Mizrahi, VP of Technology and Architecture at Marvell. "Systems will need to be able to analyze large quantities of data - of different types and from different locations. The proper generation of metadata to represent all of this data will be key to efficient processing. AI technology running right at the storage device may be used to effectively generate this metadata, preparing it for further analytics by higher processing layers. Our advanced AI SSD controller proof of concept solution sets a new paradigm in utilizing available system resources more efficiently, resulting in the scalable, cost-effective data storage expected for all kinds of machine learning tasks.""NVIDIA and Marvell share the goals of making AI more accessible and creating exciting new AI-based solutions," said Deepu Talla, vice president and general manager of Autonomous Machines at NVIDIA. "Our open NVDLA architecture, based on advanced Xavier technology, achieves this by providing partners with state-of-the-art deep learning capabilities."

Key word：

AI,Marvell

Release time：2018-08-10 00:00 reading：3103 Continue reading>>

Intel QLC NAND Updates: Up to 20TB In 2.5-inch <span style='color:red'>SSD</span>

Trade news

Intel QLC NAND Updates: Up to 20TB In 2.5-inch SSD

While today's Intel event was mostly focused on the announcement of their Optane DIMMs, they have also provided updates on their plans for using their new QLC NAND flash memory. Intel and Micron jointly announced their 64-layer 4 bit per cell (QLC) 3D NAND flash memory earlier this month, but at that time only Micron announced a specific product: the 5210 ION enterprise SATA SSD. Intel still hasn't officially launched any QLC-based SSDs, but they have now confirmed two different QLC SSDs in development.For the client market, Intel will introduce a QLC-based SSD in the second half of this year. While still officially unnamed, we expect this to be the Intel SSD 660p that has shown up on several leaked roadmaps and a few unofficial online retailer product listings. Those leaks point to a low-end M.2 SSD with a PCIe x2 interface and capacities up to 2TB.On the enterprise side, Intel has put up to 20TB of QLC NAND into a 2.5-inch drive. During today's discussions about Optane at Intel HQ, one of Intel's partners accidentally disclosed that they were working with 20 TB sized QLC drives in a 2.5-inch form factor - this is most likely a 15mm thick U.2 NVMe SSD. That would be positioned below the Intel SSD DC P4510 TLC-based SSD family that currently offers up to 8TB in a 2.5" 15mm U.2 form factor. Intel is currently sampling enterprise QLC drives to select cloud service providers and OEMs, and production availability is planned for the second half of this year. It is not confirmed whether the 20TB capacity will be available for that initial launch, but it seems likely. Even higher capacities may be available in Intel's Ruler form factor.At the event, Intel was presenting with a laptop using a QLC, so there are engineering samples around. We were unable to determine if this was a 2.5-inch drive or an M.2 drive.Intel is currently manufacturing all of their 3D NAND at Fab 68 in Dalian, China. A major expansion to this fab is coming online soon that will increase its capacity by 75%. The joint Intel/Micron Fab 2 in Utah is no longer producing 3D NAND and has been converted entirely to producing 3D XPoint memory. With Intel and Micron's NAND flash partnership coming to an end as Micron prepares to switch to a charge-trap memory cell design after the 96-layer generation, the IM Flash Technologies joint venture could use a renaming to reflect its 3D XPoint future.

Key word：

Intel

Release time：2018-05-31 00:00 reading：1047 Continue reading>>

Price Decline Will Drive the Adoption Rate of <span style='color:red'>SSD</span> and PCIe <span style='color:red'>SSD</span> to over 50% this year

Trade news

Price Decline Will Drive the Adoption Rate of SSD and PCIe SSD to over 50% this year

DRAMeXchange, a division of TrendForce, reports that the oversupply in the NAND Flash market has resulted in price decline of Client SSD, which in turn drives the demand. DRAMeXchange expects that the SSD adoption rate in the notebook market will exceed 50% this year. In particular, PCIe SSDs will gradually replace SATA III SSDs, the current mainstream product, at a faster pace. The penetration rate of PCIe in the client-SSD market will also have a chance to reach over 50% this year.On the demand side, DRAMeXchange points out that PCIe SSD has a significant edge over SATA SSD when it comes to read/write performance. In the highly competitive PC market, specification upgrade will certainly be a selling point. As the price difference between PCIe SSD and SATA III SSD has a chance to narrow considerably during this year, major PC OEMs and modules makers are expected to actively increase the PCIe SSD adoption rate in their products.On the supply side, the oversupply in the NAND Flash market has put most SSD suppliers under the pressure of capacity consumption. Together with most SSD suppliers’ promotion of their new 64- and 72-layer 3D SSDs at lower prices, contract prices of mainstream Client-SSDs for PC-OEMs are on a slide during 2Q18. By interface, the average contract price of SATA Client-SSDs falls by 6-11% QoQ, while that of the PCIe counterparts drops by 3-10% QoQ. For both SATA-SSD and PCIe-SSD, contract prices have been falling for two consecutive quarters.The average contract price of PCIe products is still about 10% higher compared with that of the SATA III products during 2Q18. Nevertheless, the price difference has a chance to narrow considerably during this year. This is attributed to the decreasing prices of Client SSD in general, as well as the release of entry- and mid-level controller chips for PCIe SSDs, which narrows down the price difference gradually.New entrants to the SSD controller chip market will first secure a place in SATA sector, while actively deploying in PCIe sector at the same timeDRAMeXchange notes that, in addition to existing suppliers like Marvell, SMI and Phison, some promising new players like ASolid, Maxiotek, Realtek, SAGE, etc. have also entered the market of SSD controller chip. Marvell, SMI, and Phison have complete product lines, ranging from entry-level SATA to high-end PCIe, with the most extensive customer base.On the other hand, new entrants currently focus on SATA DRAMless controller chip solutions. They aim to first secure a place in the SATA sector, before expanding their research and development to more challenging PCIe products. For example, ASolid’s new AS2258 SSD SATA 6Gbps Controller is designed for new-generation 3D NAND Flash with high performance-price ratio and dual-channel architecture. It integrates SDRAM, supports LDPC (Low-Density Parity-Check Code) and Die RAID for better performance and data protection. These new entrants are also actively deploying in PCIe controller chip product lines. Realtek's existing PCIe products have entered mass production, while ASolid, SAGE, and Maxiotek all plan to send their PCIe products to clients for test in the second half of this year, adding new growth momentum to PCIe SSD market.

Key word：

SSD

Release time：2018-05-31 00:00 reading：1213 Continue reading>>

model	brand	Quote
CDZVT2R20B	ROHM Semiconductor
TL431ACLPR	Texas Instruments
MC33074DR2G	onsemi
RB751G-40T2R	ROHM Semiconductor
BD71847AMWV-E2	ROHM Semiconductor

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

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