Basic knowledge of electronic components purchasing -Ameya360 electronic components purchasing website

Trade news

ROHM selected for CDP’s A List for Climate Change and Water Security

　　ROHM Co., Ltd. has been recognized for leadership in corporate sustainability by CDP (Carbon Disclosure Project), an international environmental non-profit organization, securing a place on its prestigious ‘2024 A List’ for tackling both climate change and water security.　　This is the first time to be included in the Climate Change A list, the highest rating, for ROHM, as well as the fourth consecutive year to secure a position on the Water Security A list.　　CDP is an international environmental non-profit organization that operates a global environmental disclosure system for companies and municipalities. It conducts environmental information surveys and publishes data regarding Climate Change and Water Security. The survey is fully aligned with the TCFD, and its scores are widely used for decision-making regarding investments and purchasing in a sustainable and resilient net-zero economy. In 2024, more than 700 signatory financial institutions requested disclosure of data on environmental impacts, risks, and opportunities through the CDP platform, with a record number of nearly 24,800 companies responding. The survey employs an eight-tier evaluation scale with levels ranging from Leadership level (A, A-) to Management level (B, B-), Recognition level (C, C-), and Disclosure level (D, D-), based on criteria such as comprehensiveness of disclosure, identification and management of environmental risks, and ambitious target setting. Environmental Management at ROHM　　In the Environmental Vision 2050, ROHM has committed to achieving virtually zero greenhouse gas emissions and maximizing resource recycling to eliminate waste from all its business activities.　　・Water Resource Management　　ROHM has set a target to increase the proportion of water recovery and reuse by at least 5.5% by FY2030 (compared to FY2019), and is making efforts to reuse water resources and reduce factory wastewater by globally managing water withdrawal, wastewater, and water usage. In addition to addressing risks such as flooding, ROHM has implemented a business continuity management system, which predicts potential risks, and made production continuity plans for each site. ROHM is also taking ongoing measures, such as constructing new production buildings based on flood countermeasures.　　In 2024, ROHM received an independent verification of its water withdrawal and wastewater volume data in order to disclose information to society with higher transparency and reliability.　　・Climate Change Measures　　ROHM has set a target to reduce greenhouse gas emissions (Scope 1 and 2) by at least 50.5% byFY2030 (compared to FY2018), and is working globally to introduce environmentally-friendly equipment and reduce usage through energy conversion. In 2024, ROHM has expanded independent verification to achieve a 100% verification rate for its internally calculated greenhouse gas emissions (Scope 1 and 2). Additionally, ROHM has introduced an Internal Carbon Pricing (ICP) system to promote decarbonized management.　　Furthermore, ROHM has announced a plan to source 100% of the electricity used in all domestic and international business activities from renewable energy by FY2050. Several sites, including major overseas production plants, are already operating with 100% renewable energy. As of FY2023, ROHM has achieved a 43% adoption rate and plans to increase this to 65% by FY2030.　　Encouraged by the evaluation results, ROHM will continue promoting CSR activities and addressing social issues to achieve a sustainable society and become a company that meets the expectations of its stakeholders.

Key word：

ROHM

Release time：2025-03-21 13:52 reading：337 Continue reading>>

Trade news

ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year

　　ROHM Co., Ltd. was included for the second year in a row in the Sustainability Yearbook 2025, published by S&P Global on February 11, 2025, as a Sustainability Yearbook Member, one of the top 15% companies in the Semiconductor & Semiconductor Equipment industry.　　S&P Global annually evaluates the sustainability efforts of the world's leading companies from governance & economic, environmental, and social perspectives based on its proprietary Corporate Sustainability Assessment (CSA) methodology and selects companies with outstanding sustainability efforts in each industry for inclusion in the Sustainability Yearbook.　　This year, more than 7,690 companies worldwide from 60 industries were evaluated, and 780 companies (including 80 Japanese companies) were selected for this year's Yearbook.　　Encouraged by the results of this year's evaluation, ROHM will continue to promote sustainability activities and address social issues to create a sustainable society, aiming to be a company that meets the expectations of our stakeholders.

Key word：

ROHM

Release time：2025-03-20 10:11 reading：325 Continue reading>>

Trade news

SIMCom Achieves ISO/SAE 21434 Certification for Automotive Cybersecurity Management

　　SIMCom, a global leader in IoT communication, has proudly received the ISO/SAE 21434 certification for Automotive Cybersecurity Management from TÜV NORD, an international independent third-party testing, inspection, and certification organization. This certification marks a significant milestone in SIMCom’s commitment to advancing automotive cybersecurity and delivering top-tier solutions to the automotive industry.　　Importance of ISO/SAE 21434　　Achieving the ISO/SAE 21434 certification underscores SIMCom's ability to meet stringent cybersecurity risk management requirements across the entire product lifecycle—from conceptual design, development, and production to operation and maintenance. This critical achievement validates SIMCom's dedication to adhering to the highest standards of automotive cybersecurity. In an era of increasing vehicle connectivity, robust cybersecurity measures are paramount. The certification confirms that SIMCom’s products are designed to safeguard against evolving cyber threats, ensuring the safety and security of in-vehicle systems and communications.　　Comprehensive Automotive Solutions　　In alignment with automotive industry trends, SIMCom continues to expand its automotive product lineup, offering enhanced IoT solutions to car manufacturers and Tier 1 suppliers. This strategic expansion not only strengthens SIMCom's position in the connected vehicle industry but also underscores its commitment to providing secure and reliable products.　　SIMCom offers a complete range of automotive-grade cellular communication modules, including SIM7800X, SIM7805X, and SIM8800X and so on. Additionally, SIMCom provides smart modules, GNSS positioning modules, 5G modules and Wi-Fi & Bluetooth modules, delivering one-stop services to global car manufacturers and Tier 1 suppliers. These products are designed to meet diverse application scenarios, including in-vehicle communication, vehicle positioning, smart cockpits, and digital keys. The integration of various cybersecurity functions, such as encryption, authentication, and data integrity checks, ensures the security of in-vehicle systems and communications, preventing unauthorized access and data tampering.　　Future Outlook　　SIMCom will continue to align with market demands and industry standards, focusing on vehicle network and information security. By collaborating with industry partners, SIMCom aims to continually enrich its automotive product portfolio, offering compliant, reliable, and professional products and services. This commitment will drive the intelligent and secure development of the automotive industry chain.

Key word：

SIMCom

Release time：2024-08-23 13:13 reading：843 Continue reading>>

Trade news

GigaDevice Launches Advanced PC Fingerprint Solution, Promising Enhanced Security and User Experience

　　a leading provider of flash memory, 32-bit microcontrollers, sensors, and analog technology, introduces all-new PC fingerprint solutions, including GSL6186 MoC(Match-on-Chip) and GSL6150H0 MoH(Match-on-Host). Based on advanced biometric technology, the solutions allow users to effortlessly and securely access their Windows PC devices with a simple touch of fingerprint. The GSL6186 MoC solution has already received certification from Windows Hello Enhanced Sign-in Security (ESS) and Microsoft Windows Hardware Lab Kit (HLK), added to Microsoft Approved Vendor List (AVL).　　GigaDevice GSL6186 MoC fingerprint recognition solution utilizes System-in-package (SiP) technology, integrating fingerprint algorithm acceleration modules and storage modules within the chip. It combines excellent capacitive fingerprint hardware detection with proprietary algorithms, achieving an impressive high performance. The SiP system-level packaging ensures secure storage, minimizing privacy risks. Supporting POA and low latency, it enhances user experience and offers compatibility with USB, SPI interfaces, and various host platforms. Customizable in size and shape, it caters to diverse design preferences. Ideal for unlocking, system/APP software login, online payments, and various other scenarios, it delivers a convenient user experience.　　GigaDevice GSL6150H0 MoH fingerprint recognition solution also comes equipped with high-performance capacitive fingerprint sensors and proprietary biometric algorithms. Utilizing on-host fingerprint matching, it provides a cost-saving advantage.　　"We are committed to innovating in the next generation of intelligent terminal biometric sensing technology, delving into the research and development of human-machine interaction sensor chips and solutions", says Jun Zhi, Vice President and General Manager of Sensor BU in GigaDevice, "Our fingerprint products have become a popular selection in the smartphone market. The introduction of GSL6186 MoC and GSL6150H0 MoH signifies our further expansion into the PC domain. Regarding quality control, we are committed to delivering high-quality products and solutions to our customers, prioritizing comprehensive product lifecycle management and proactive risk control, alongside continuous process optimization. We have also established a stable and flexible supply chain system, which enables a quicker response to customer needs, enhancing the accuracy and timeliness of delivery. Furthermore, we offer integrated services and technical support, providing a convenient 'one-stop' solution to expedite customers' product launch process. We will accelerate product upgrades and continue to expand our presence in fields such as PC, smartphones, wearables, mobile health, IoT, etc., offering customers a broader array of innovative solutions."

Key word：

GigaDevice

Release time：2024-05-27 16:17 reading：1425 Continue reading>>

Trade news

Nidec Executes Naming Rights Contract on Kyoto Tower to Rename It Nidec Kyoto Tower

　　Nidec Corporation (TSE: 6594; OTC US: NJDCY) (“Nidec” or the “Company”) today announced that it has executed a naming rights contract with Keihan Hotels & Resorts Co., Ltd. (“Keihan Hotels & Resorts”), the operator of Kyoto Tower (Shimogyo-ku, Kyoto). Accordingly, the tower will start operating under a new name, Nidec Kyoto Tower, from April 1, 2024.　　Since its debut in December 1964 to serve as a primary facility for Kyoto’s industry, culture, and tourism, and contribute to its development, Kyoto Tower, the tallest building in the city, has long served as a “downtown lighthouse” to vitalize the former capital.　　Whereas Nidec, founded in July 1973 in Kyoto’s Sakyo-ku, has walked the path to growth with the city, aiming to become a Kyoto-born, world-leading company.　　Though obtaining naming rights was the first such opportunity for both Nidec and Kyoto Tower, Keihan Hotels & Resorts and the Company have successfully executed the contract based on the combination of Keihan Hotels & Resorts’ passion for regional contributions via Kyoto Tower, and Nidec’s enthusiasm to boost and support the city as a local company. Aiming to become familiar to the public like Kyoto Tower, Nidec stays committed to supplying socially indispensable products and supporting the sound development of society.

Key word：

Nidec

Release time：2024-03-20 11:32 reading：1624 Continue reading>>

Trade news

BIWIN Secures Fastest Growing Flash Storage & Manufacturer Brand Title at DT Awards 2023

　　BIWIN, a distinguished player in the flash storage industry, clinches the prestigious "Fastest Growing Flash Storage & Manufacturer Brand" award at the 15th Digital Terminal (DT) Awards 2023. The ceremony, held at Hotel The Suryaa in New Delhi, underscores BIWIN's pivotal role in the fiercely competitive Indian ICT sector.　　Accepting the award on behalf of BIWIN, Rajesh Khurana, Country Manager for Consumer Business in India, emphasized BIWIN's commitment to innovation, excellence, and utmost customer satisfaction.　　The DT Awards, recognized as India's premier tech honor, gathered over 250 industry leaders and celebrated achievements across more than 110 categories. BIWIN's triumph in this category is a testament to BIWIN's unwavering dedication to delivering cutting-edge and relevant flash storage solutions to the Indian market. This success is fueled by BIWIN's distinctive design and an unwavering commitment to quality.　　The award not only acknowledges BIWIN's current standing as a key player in the flash storage industry but also propels BIWIN forward as an innovator committed to shaping the digital landscape. BIWIN continues to push boundaries in the flash storage sector, fueled by the recognition bestowed upon them at the 15th DT Awards.　　BIWIN's vision extends beyond this award, focusing on advancing technology solutions to shape the digital future. As a recipient of this esteemed accolade, BIWIN remains dedicated to spearheading innovation and excellence in the dynamic realm of flash storage.　　The Digital Terminal Awards, recognized as a premier accolade in the Indian ICT industry, annually celebrates the contributions of tech brands to the digital landscape. It stands as a testament to BIWIN's commitment to driving innovation and excellence in the ever-evolving tech sector.

Key word：

BIWIN

Release time：2024-01-26 13:50 reading：2204 Continue reading>>

Trade news

[News] Samsung Fails to Secure Qualcomm’s 3nm Orders for the Coming Year, Dual Foundry Strategy Postponed

　　According to TechNews’ report, TSMC and Samsung fiercely compete in the semiconductor foundry sector. Earlier market reports suggested that Qualcomm’s Snapdragon 8 Gen 4 mobile processor might adopt a dual-foundry strategy with TSMC and Samsung manufacturing simultaneously.　　However, according to the latest industry information, due to Samsung’s conservative expansion plan for next year’s 3nm production capacity and unstable yields, Qualcomm has officially canceled the plan to utilize Samsung for next year’s processors. The dual-sourcing model is now postponed until 2025.　　Samsung began mass production of its first-generation 3nm GAA (SF3E) process at the end of June last year, marking Samsung’s initial use of the innovative GAA architecture for transistor technology. The second-generation 3nm process, 3GAP (SF3), will utilize the second-generation MBCFET architecture, optimizing it based on the foundation of the first-generation 3nm SF3E. It is expected to enter mass production in 2024.　　The dual-foundry strategy for Qualcomm was initially leaked by the reputable source Revegnus via the X platform (formerly Twitter). It was mentioned that the Snapdragon 8 Gen 4 processor would adopt TSMC’s 3nm (N3E) process, while Samsung’s 3GAP process would be used for the Snapdragon 8 Gen 4 supplying Samsung’s Galaxy series smartphones. Other sources suggested that due to limited capacity at TSMC’s 3nm production, Qualcomm had to seek Samsung as an alternative chip foundry.　　As a result, Qualcomm originally anticipated dual-foundry production with both TSMC and Samsung in 2024, with hopes of being the first customer for the 3GAP process. However, considering Samsung’s conservative 3nm production capacity plan for next year and the instability in yields, Qualcomm decided to scrap the plan and exclusively rely on TSMC, pushing the dual-foundry strategy to 2025.　　Currently, TSMC’s 3nm process technology capacity is on the rise, with expectations that by the end of 2024, monthly production capacity will reach 100,000 wafers, and the revenue contribution will increase from the current 5% to 10%.

Key word：

Samsung

Release time：2023-12-01 14:48 reading：2268 Continue reading>>

Trade news

Nidec Instruments Launches High-security Card Reader that Meets International Standard PCI PTS*1

　　Nidec Instruments Corporation (“Nidec Instruments”), a wholly owned subsidiary of Nidec Corporation, today announced the launch of a card reader that meets the latest Ver. 6 of the PCI PTS POI (Payment Card Industry PIN Transaction Security Point Of Interaction) mandated by the PCI SSC (PCI Security Standards Council), the organization jointly established by five globally recognized credit card companies.　　Nidec Instruments’ PCI Ver. 6-certified Security Card Reader　　The global credit card payment market was US$521.8 billion in size as of 2022, and it is expected to continue to grow sustainably. On the other hand, however, the amount of damage caused by credit card misuse is increasing yearly, making safety measures a critical task for credit card companies. Nidec Instruments’ latest card reader, developed to read magnetic strip-attached credit cards and contact-type IC cards, is anticipated to be installed in POS systems at gas stations and kiosk terminals at airports, among many other locations.　　Credit card readers installed outdoors are required to meet the PCI PTS, a security standard for credit cards and their security code readers, and the aforementioned product not only meets the latest Version 6 of the standard, but is equipped with a durable magnetic head and a contact-type IC chip interface as well.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to creating a comfortable society.　　*1. PCI PTS: A security standard required of “venders” that develop mPOS payment terminals, and also a security requirement for PIN-entering payment terminals to meet.

Key word：

Nidec

Release time：2023-11-29 14:26 reading：2061 Continue reading>>

Trade news

AMD Closes In on NVIDIA, Securing Major Deals with Oracle and IBM

　　As Jiwei reported, AMD, although trailing NVIDIA in AI, has recently clinched significant deals, earning the trust of two major clients, Oracle and IBM. Oracle plans to integrate AMD’s Instinct MI300X AI chips into their cloud services, complemented by HPC GPUs. Additionally, as per insights from Ming-Chi Kuo, TF International Securities analyst, IBM is set to leverage AMD’s Xilinx FPGA solutions to handle artificial intelligence workloads.　　Oracle’s extensive cloud computing infrastructure faces challenges due to a shortage of NVIDIA GPUs. Nonetheless, Oracle maintains an optimistic outlook. They aim to expand the deployment of the H100 chip by 2024 while considering AMD’s Instinct MI300X as a viable alternative. Oracle has decided to postpone the application of their in-house chips, a project with a multi-year timeline. Instead, they are shifting their focus to AMD’s high-performance AI chip, the MI300X, well-regarded for its impressive capabilities.　　Reports indicate that Oracle intends to introduce these processor chips into their infrastructure in early 2024.　　Similarly, IBM is exploring chip options beyond NVIDIA. Their new AI inference platform relies on NeuReality’s NR1 chip, manufactured on TSMC’s 7nm process. AMD plays a pivotal role in NeuReality’s AI solution by providing the essential FPGA chips. Foxconn is gearing up for AI server production using this technology in the Q4 2023.　　Guo also pointed out that, although Nvidia remains the dominant AI chip manufacturer in 2024, AMD strengthens partnerships with platform service providers/CSPs like Microsoft and Amazon while acquiring companies like Nod.ai. This positions AMD to potentially narrow the AI gap with Nvidia starting in 2025. This collaboration also affirms that AMD remains unaffected by the updated U.S. ban on shipping AI chips to China.

Key word：

AMD

Release time：2023-10-24 16:33 reading：2176 Continue reading>>

Trade news

novosns Digital isolators: Invisible guardians of system security and personal safety

　　If there are anything requiring 100% attention in circuit design, they must include isolators.　　Isolators themselves do not have special computing, processing or conversion capabilities, but its evolution is inextricably linked to the development of industry, automotive, medical, and home electronics, etc. In view of the fact that their high reliability and performance soundly underpins system security, you should not brush aside isolators in your circuit design.　　Isolators as invisible guardians　　Some may see isolation a too-often-heard topic, but it actually plays an important role in protecting circuit and personal safety.　　In simple terms, the voltage of the execution system and the control system in electronic devices varies greatly – hundreds VAC vs. low VDC. In life, we isolate low-voltage and high-voltage systems, which also applies to circuit design. High-voltage systems often are more prone to electrostatic discharge, radio frequency, switching pulse and power disturbance, which can cause a voltage surge that is a thousand times higher than the voltage limit of many electronic components. Most importantly, these voltage surges are more likely to cause harm to human body, in addition to the noise and damages to electronic circuit.　　Here’s a simple example. The battery voltage in an electric vehicle (EV) can reach 400V, or even 800V, but the driver can calmly and safely operate all devices, instruments and knobs inside it. Behind this calmness and safety, various forms of isolation play a crucial role – they build a safe and reliable connection between high and low voltage systems.　　Considering such a profound effect, the selection of isolation type particularly matters.　　Since the day one of electricity use by human, people have longed for safe and reliable means of power control. In the 1830s, Joseph Henry, an American physicist, invented the electromagnetic relay using the theory of electromagnetic induction when he studied circuit control. Inspired by the phenomenon of magnetic force generation and disappearance in power-on and power-off conditions, he used a electromagnet to control the opening and closing of another circuit with high voltage and high current, enabling remote control and protection of the circuit.　　By controlling the electromagnet using a dry cell, a 220V AC electric circuit can be driven to enable safe control (or information transmission), which has a ring of “moving a thousand pounds with four ounces”. This simple procedure is the underlying principle of isolation, i.e. two unrelated circuits that are insulated from each other are connected in certain way.　　However, electromagnetic relay has obvious disadvantages, such as large footprint, high power consumption, and easy vulnerability.　　To overcome the aforesaid shortcomings, optocoupler came into being. It uses photovoltaic conversion to enable transmission and control, and implements a similar function at IC level. Opto-isolator, based on photoresistor, was launched in 1968. Compared with transformers, optocoupler that featured small footprint, light weight, low cost and high reliability, quickly became the mainstream in the market. The era of optocoupler development also saw the evolution of integrated circuit (IC) and information technology. With increasing interaction between low-voltage control and computing units and high-power motors and power supplies, optocouplers have been greatly improved.　　Undoubtedly, performance, power consumption and footprint are never-to-evade topics in the microelectronics world, and any strong technology cannot steer away from them. Optocouplers now meet the same challenges with electromagnetic relay – constrained by laser and photosensitive diode, optocouplers lose their edge in terms of footprint, power consumption, and reliability.　　Thanks to the advances of semiconductor technology, digital isolators have become rising stars.　　Merits and demerits of digital isolators　　It’s not difficult to understand digital isolators. They are similar to optocouplers, except that the photovoltaic conversion and modulation is changed to other technologies. However, it’s noted that optical attenuation will not occur in digital isolators. Unlike optocouplers, digital isolators provide many benefits, including good switching characteristic, low vulnerability to aging, high reliability, high voltage withstand ability, high speed, and energy transferability. All these are underpinned by semiconductor technology.　　By underlying principles, digital isolators can be divided into capacitive isolators and magnetic ones.　　Capacitive isolator, as its name suggests, uses the micro-capacitors inside the IC for high voltage isolation on the left and right sides, and adopts highly dielectric materials in the middle for voltage isolation. Capacitor is a device that can store charge, and comprises two conductor plates and medium. It allows high frequency to pass through, but blocks low frequency. The intermediate medium can isolate low frequency or DC high voltage signals.　　Using capacitor’s characteristic of allowing high frequency to pass through but blocking low frequency, modulation and transmission of signals can be performed. When a High-Low digital signal is input, the signal will be modulated inside the IC – the high frequency signal will be modulated into low frequency signal, allowing it to be transmitted to the other side of the IC. Typical OOK (On Off Key) modulation is as follows: “0, 1” signals will be modulated using different frequencies. For example, 1 represents high-frequency signal, and 0 represents unmodulated DC signal, and then two state switching signals are transmitted.　　Magnetic isolators are similar to capacitive ones, except that the former uses coils and electromagnetic conversion to implement data transmission.　　In a nutshell, digital isolators further address the disadvantages of optocouplers in terms of reliability, transmission rate, robustness, footprint, and service life.　　Perfection never exists in the realm of technology. Digital isolators boast visible advantages, but there are always trade-offs.　　First, digital isolators are relatively new, so their reliability is continuously being improved and demonstrated. With the successive introduction of related international and domestic standards, a complete range of approval processes and standards have been established, and customers from various industries have gradually given their recognition.　　Second, optocouplers still account for a dominant share in the industry, especially in some conventional applications. Therefore, the shift from optocoupler to digital isolator cannot be done overnight, because the pins and input type of digital isolators are not fully compatible. This requires changes of design. Sometimes customers are not willing to switch to digital isolator because of risk considerations. To this end, there is an Pin to Pin replacement alternative in the industry. In this solution, the optocoupler can be directly replaced and pins are compatible, and the built-in circuit is implemented in the input characteristics to simulate the diode characteristics. In this way, digital isolator can function exactly same with a optocoupler device in same application settings, and direct design replacement can be achieved.　　At last, common mode interference may occur in capacitive isolators, which needs to be suppressed.　　A typical OOK technology is simple and clear, i.e. the input signal is directly and correspondingly modulated and then demodulated on the other side. After high-frequency modulation, the signal and high-frequency common mode circuit are transmitted through one same path, so there will be common mode interference. This is also a shortcoming of ordinary capacitive isolators.　　Considering the above-mentioned problems, particular attention should be paid to the selection of devices. There are several methods to significantly enhance the immunity to common-mode interference. Taking the Chinese isolator manufacturer NOVOSENSE as an example, it has developed the Adaptive OOK® proprietary modulation technology on the basis of OOK, which improves the capability of digital isolators to resist common-mode interference.　　The so-called Adaptive OOK® technology uses the common mode detection circuit inside the IC to detect the state of common mode signals, and then depending on the signals detected, dynamically and adaptively modulates the internal key circuit characteristics or gains. When the common mode noise is large, it can better suppress the noise, so as to provide higher robustness and enhanced immunity to common mode interference.　　Another benefit of adaptive modulation is that high common-mode interference resistance does not need to be guaranteed at full operation state. Only when the instantaneous interference is relatively high, the circuit needs to perform more functions to suppress interference. In most cases where there is no harsh conditions and a low requirement for common-mode interference resistance, Adaptive OOK® technology can strike a good balance between system properties and power consumption to optimize the overall performance.　　Bring isolators further　　In the digital isolator market segment, only a few companies provide magnetic isolators, and capacitive isolators are the preferred choice of more manufacturers. What’s more, the number of capacitive isolators sold is growing very fast. In addition to patent related reasons, the overall manufacturing process of capacitive isolators is relatively simple, and does not differ greatly from general non-isolated devices in terms of wafer production. This allows capacitive isolators to deliver a big cost advantage.　　Furthermore, the process capability and performance of capacitive isolators are constantly improved. Particularly, their voltage withstand and surge resistance capabilities have been basically comparable to magnetic isolators, allowing capacitive isolators to meet the requirements of a wide range of applications.　　The products from NOVOSENSE can prove the above-mentioned trend. For example, the first-generation NSI81xx series meets the basic isolation requirements. The second-generation NSI82xx series answers the requirements of enhanced isolation, and provides enhanced resistance to common-mode interference, EMC performance and other electrical properties. According to NOVOSENSE, its third-generation products will further improve the voltage withstand capability and robustness.　　When it comes to the design of a capacitive isolator, the theory is simple, but the optimization and innovation of some processes and microarchitectures will have highly great effects on the overall performance. A case in point, from OOK to Adaptive OOK®, NOVOSENSE has done a lot to realize this “one-step-further” effort.　　Performance. Process capability and microarchitecture optimization contribute to continuous improvement of voltage withstand capability. For example, assuming that highly dielectric SiO2 is filled, different elements are also needed to further improve the voltage withstand capability. In addition, the electric field strength distribution of the capacitor can greatly affect the voltage withstand capability of isolator. Therefore, the design of capacitor structure, shape and other micro-architectures of each manufacturer, will affect the performance.　　Robustness. Isolator products are more widely used in industry, automotive and other high-voltage applications. Isolators are required to meet safety specifications. In applications involving safety, the selection of isolators having safety approvals is mandatory.　　To match specific requirements of analog, interfaces and signal chains, manufacturers need to introduce different product families for more applications. Isolator makes no exception. By combining the basic isolation function with other interfaces, drives or sampling knowledge, isolator technology can have wider applications.　　Backward derivation of product definition from applications is the main idea of product development, and also the greatest challenge. The definition of “isolation+” product around applications is not exactly same with that of pure digital isolators.　　Take isolated driver for example, in addition to the digital signal processing capability, manufacturers are required to be familiar with the power knowledge related to the driver in specific applications and ensure compatibility with power tubes from different manufacturers. Furthermore, SiC and other third generation wide band gap semiconductor applications pose more security and data transmission requirements for isolated drivers.　　For isolated interface products, the ESD and anti-interference capabilities need to be considered. Isolated sampling also requires a good expertise in high-precision signal chain.　　In addition, isolators sometimes need to be used together with power supply. In this setting, isolators that integrate the isolated power supply were launched.　　According to our knowledge, NOVOSENSE and other Chinese and global manufacturers coincidentally plan more isolation product categories – shifting from single category to “isolation+” expansion strategy, so as to provide isolation capability for more products.　　An increasing number of new applications and new markets push digital isolators to the same starting line with optocouplers. More and more niche applications, including EV, photovoltaics, and energy storage, are emerging, and the demand for digital isolators is rocketing. Customers are more willing to select digital isolators in the design of these new applications.

Key word：

novosns

Release time：2023-10-09 13:42 reading：2220 Continue reading>>

model	brand	Quote
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor
MC33074DR2G	onsemi

model	brand	To snap up
BU33JA2MNVX-CTL	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics
IPZ40N04S5L4R8ATMA1	Infineon Technologies
BP3621	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
ESR03EZPJ151	ROHM Semiconductor

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email