Loongson Unveils 3A6000 CPU, Aims to Match Intel’s Advanced Process in Next Phase
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Loongson Unveils 3A6000 CPU, Aims to Match Intel’s Advanced Process in Next Phase

　　Loongson Technology Corp Ltd, unveiled its latest domestic CPU, Loongson 3A6000, on November 28th in Beijing, China. Notably, this CPU is entirely based on Chinese in-house design, free from reliance on any foreign licensed technology. During the product launch, Weiwu Hu, the chairman of Loongson, announced that next phase will utilize mature processes to achieve performance comparable to Intel’s advanced process, reported by CTEE.　　Loongson 3A6000 adopts a China domestic instruction set architecture(ISA), showcasing China’s capability to self-develop a new generation CPU, as reported by CCTV News. This CPU can run various cross-platform applications, catering to the needs of diverse large and complex desktop scenarios.　　The release of the Loongson 3A6000 signifies a pivotal milestone, highlighting China’s achievement in self sufficiency and product performance, bringing it on par with international mainstream products.　　According to Mydrivers.com, test results indicate that the overall performance of the Loongson 3A6000 processor is comparable to Intel’s 10th Gen Core quad-core processor launched in 2020. Notably, the Loongson 3A6000 is built on the self-developed ISA “LoongArch,” showcasing complete independence from foreign licensing, from top-level structure to ISA and application binary interface (ABI) standards.　　In terms of core performance, the Loongson 3A6000 boasts a main frequency of 2.5GHz, supports 128-bit vector extension (Loongson SIMD eXtension, LSX), and 256-bit advanced vector extension (Loongson Advanced SIMD eXtension, LASX). It also supports simultaneous multi-threading technology (SMT2), featuring a total of 8 logical cores on the entire chip.　　Hu highlighted that the 3A6000 has charted a path based on mature processes, optimizing performance through design. This achievement marks comparable performance with Intel and AMD under relatively weaker process conditions. The next step involves continuing to use mature processes to achieve performance levels on par with Intel’s advanced technology.　　Regarding the upcoming Loongson 3B6000, Hu mentioned during the third-quarter earnings briefing that Loongson is strategically focused on enhancing efficiency, aiming to reach or approach the performance level of Apple’s CPU for each GHz.
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Release time：2023-11-29 14:09 reading：1437 Continue reading>>
CP Technologies Aims for Deeper Engagement with Defense Market
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CP Technologies Aims for Deeper Engagement with Defense Market

With the new year, Chassis Plans is changing its name to CP Technologies. The company, which provides ruggedized computer hardware systems, servers, and LCD displays points to its defense market roots, which it intends to further grow. The moniker better represents the company’s focus on serving those in harsh military and industrial environments.“We wanted to communicate that our brand is combat proven, since that’s what we’ve been doing for 20 years, sending ruggedized computers into combat environments,” said Mike McCormack, president of CP Technologies.At the same time, the military and defense markets are offering more opportunity for suppliers hoping to grow a foothold with manufacturers in the sector. “For many years, defense primes were manufacturers of hardware, as well as service and integration,” McCormack explained. “That has become more difficult with the complexity of weapons platforms and the breadth of capability it takes to be everything from building aircraft technology, and servicing and support to manufacture that.” More and more these contractors have turned to commercial off the shelf (COTS) offerings, he added. CP Technologies is moving toward this new “complete solution” focus in order to meet the needs of its military customers. “We found a niche market in ruggedized COTS solutions,” said McCormack. “We want to provide complete, integrated portable solutions and complete rack solutions.” These customers are trying to address to high cost of customized products, as well as challenges with achieving cross-platform compatibility, he added.These systems will include Portable Computing Systems (PCS), Small Tactical Transit Case (STTC), Medium Tactical Transit Case (MTTC) and Complete Rack Solutions (CRS). CP will also continue to provide the separate components that it has offered in the past. Complete solutions offer a variety of benefits, especially reducing the cost and complexity of ongoing service and support of systems. “As the Department of Defense (DoD), you have a software system that is configured around hardware and that is continuously changing so there is continual ongoing cost to maintaining it,” said McCormack. “By maintaining stable revision control, they can greatly reduce the cost of maintaining systems.”In addition to ensuring that compatibility and revision control is maintained, CP Technologies will be certifying that its products comply with the Trade Agreements Act(TAA). “People are driving more to TAA compliance and the need for it because they are concerned with intellectual property (IP) theft by adversaries, both China and Russia,” McCormack said. “We are acutely aware of making sure our sources of supply are TAA compliant.”Late last year, CP Technologies (then Chassis Plans) was acquired by Aeronautics Ltd. of Israel, a move which started the company’s journey toward its latest evolution. “The acquisition of Chassis Plans by Aeronautics is allowing the natural evolution of the company into CP Technologies through investment that allows it to expand its R&D, product offering and marketing activities on worldwide basis,” McCormack said. “We will incorporate a broader offering of product, complete integrated solutions, and the addition of data links that give our customers a broader product choice as well as a complete solution instead of just components.”
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Release time：2018-12-25 00:00 reading：2588 Continue reading>>
DRAM Outlook Dims for 2019
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DRAM Outlook Dims for 2019

DRAM will once again finish the year with the highest growth rate of any semiconductor product, though 2019 is shaping up to be a very different story, according to market research firm IC Insights.DRAM is expected to finish 2018 with 39% growth, following up its 77% growth in 2017, IC Insights said. DRAM has once again benefited from a steady surge of rising average selling prices over the past two years amid a shortage in the market.But the historically cyclical DRAM market appears to be headed for tougher times in 2019. After two strong years of growth, the world's leading DRAM suppliers — South Korea's Samsung Electronics and SK Hynix and U.S.-based Micron Technology — have significantly expanded their manufacturing capacity and are beginning to ramp up production, bringing relief to strained supplies, especially for high-performance DRAM parts, IC Insights said. Meanwhile, shipments of large-scale datacenter servers — the primary catalyst for much of the recent DRAM market surge — have begun to ease amid uncertain economic and trade conditions, the firm said.IC Insights predicts that that DRAM will rank near the bottom of all semiconductor categories in terms of growth rate in 2019, with sales forecast to decline by 1%.DRAM has consistently been at the top or near the bottom of all semiconductor products in terms of growth rate over the past six years, a testament to its highly cyclical nature, according to IC Insights. DRAM was also the fastest growing semiconductor product in both 2013 and 2014, according to the firm.
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Release time：2018-12-19 00:00 reading：1367 Continue reading>>
DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019
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DRAM Growth Tops Industry Ranking in 2018; Outlook Dims for 2019

DRAM fastest growing market in four of past six years, demonstrating very cyclical market.IC Insights is in the process of revising its forecast and analysis of the IC industry and will present its new findings in The McClean Report 2019, which will be published in January 2019.  Among the revisions is a complete update of forecast growth rates of the 33 main product categories classified by the World Semiconductor Trade Statistics organization (WSTS) through the year 2023.Topping the chart of fastest-growing products for 2018 is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment over the past two years (Figure 1).  The 2018 DRAM market is expected to show an increase of 39%, a solid follow-up to the 77% growth in 2017. The number-one position is not unfamiliar territory for the DRAM market.  It was also the fastest-growing IC segment in 2013 and 2014.Figure 1Remarkably, DRAM has been at the top and near the bottom of this list over the past six years, demonstrating its very volatile and cyclical nature.  IC Insights forecasts that DRAM will rank nearly last in terms of market growth in 2019, with a 1% decrease in total sales.  After two strong years of growth, Samsung, SK Hynix, and Micron—the world’s three primary DRAM suppliers—have expanded their manufacturing capacity and are beginning to ramp up production, bringing some much needed relief to strained supplies, especially for high-performance DRAM devices. At the same time, shipments of large-scale datacenter servers, which were a primary catalyst for much of the recent DRAM market surge, have begun to ease as uncertain economic and trade conditions factor into decisions about continuing with the strong build out.NAND flash joins DRAM as another memory segment that has enjoyed very strong growth over the past two years (Figure 2).  Solid-state computing, particularly, has been a key driver for high-density, high-performance NAND flash even as mobile applications continue to be a significant driver. Meanwhile, automotive and computing special purpose logic devices have also been strong performers the past two years.  The top five IC markets listed for 2018 are the only product categories that are expected to surpasses the 17% growth rate of the total IC market this year.Figure 2The full list of IC product rankings and forecasts for the 2019-2023 timeperiod is included in The McClean Report 2019, which will be released in January 2019.
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Release time：2018-12-14 00:00 reading：1502 Continue reading>>
'No one can take us down,' China's state-run media claims as trade war heats up
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'No one can take us down,' China's state-run media claims as trade war heats up

U.S. President Donald Trump, left, and Xi Jinping, China's president, shake hands during a news conference at the Great Hall of the People in Beijing, China, on Thursday, Nov. 9, 2017.China's state-run media outlets sounded a confident tone in Monday editorials and warned that U.S. trade pressure against the country would not only strain bilateral relations between the two nations but could negatively affect the American economy and wider global markets.Those reactions followed the latest round of mutual tariffs targeting U.S. and Chinese goods taking effect Monday, escalating trade tensions between the world's two largest economies.The U.S. levied tariffs of 10 percent on $200 billion of Chinese products with the rate set to increase to 25 percent by the end of the year. The Chinese government retaliated with taxes on 5,207 U.S. imports worth about $60 billion. Before Monday's penalties took effect, the U.S. and China had already applied tariffs to $50 billion of each other's goods.In Monday editorials, Chinese state-controlled newspapers such as Global Times and China Daily's editorial pages were quick to claim that Beijing had stayed calm and fair in the face of Washington's trade pressure.If the U.S. is using trade pressure as a negotiating tactic against Beijing, it would jeopardize both countries' economies and the effects would likely spill over to the larger global economy, an editorial published by China Daily on Monday said."The US' unilateral trade moves have not only damaged normal China-US trade activities, but also could stunt world economic growth," the state-controlled newspaper reported. "So if the Trumpadministration continues to stick to its unilateral and protectionist stance, and refuses to respect the fundamental norms of mutual respect and consultation, it would be difficult for the two sides to make substantial progress in any future trade talks."The editorial added that China has remained sincere in its efforts for a fair trading agreement, in contrast to U.S. "trade bullying."Other media editorials highlighted the broader erosion of U.S.-China relations as a result of Washington's accusations about unfair business and regulatory practices benefiting Beijing.For one, China Daily claimed in another editorial that America's accusations of China engaging in "theft" and forced transfer of intellectual property and other "unfair" trade practices may strain the longstanding consensus between both countries.As such, if U.S. trade measures against China were meant as a bargaining chip in negotiations "they may actually end up rendering further engagement even more difficult, if not completely impossible," the editorial said.For its part, the Global Times, China's hyper-nationalistic Communist Party-run tabloid, in a Monday editorial called for Americans to recognize China's strength in the trade disagreements."China is doing what it should. China is honest and principled and a major trade power with intensive strengths. No one can take us down," it said.
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Release time：2018-09-28 00:00 reading：1047 Continue reading>>
Intel Claims Progress on 10nm Yields
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Intel Claims Progress on 10nm Yields

Intel's stock value declined by more than 5 percent in after hours trading after the company reported better-than-expected overall sales for the second quarter, but came up short of analysts' targets for the closely watched data center product category.Intel also said it continues to make progress on yields of 10nm, with its interim CEO saying the company would have 10nm chips in PCs on store shelves in time for the 2019 holiday season.Bob Swan, Intel's chief financial officer who has been serving as the company's interim-CEO since Brian Krzanich resigned abruptly last month, told analysts on a conference call following the second quarter report Thursday that Intel thinks its 14nm product lineup for next year on both the client and server side "will deliver best-in-class performance as we continue to ramp 10nm."Intel has been dogged by yield issues at the 10nm node, causing the company in April to delay the launch of 10nm products until next year.  Venkata (Murthy) Renduchintala, president of Intel's Technology, Systems Architecture & Client Group, added that the 10nm yield difficulties are the result of very aggressive density scaling from the 14nm node."Really, the challenges that we're facing on 10nm are delivering on all the revolutionary modules that ultimately deliver on that program," Renduchintala said. "And while there's risk and a degree of delay in our timeline on that, we're very pleased with the resiliency of our 14nm roadmap, where in the last few years we've delivered in excess of 70% product performance improvement as we've moved through our 14nm generation of products."For the second quarter, Intel reported sales of $17 billion, up 15% from the year-ago quarter. The company reported a net income of $5 billion, up 78% from the year-ago quarter.But while the company's overall sales exceeded both its own target and consensus analysts' expectations for the quarter, data center sales of $550 million, up 27% year-over-year, but slightly below Wall Street's forecasts.But Intel said it now expects its data center sales to grow by 20% this year, up from the forecast issued in April.Intel said it now expects sales for 2018 to be between $68.5 billion and $70.5 million. The midpoint of this range, $69.5 billion, is up $2 billion compared to the forecast the company issued in April."Our biggest challenge in the second half will be meeting additional demand, and we are working intently with our customers and our factories to be prepared so we are not constraining our customers' growth," Swan said.
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Release time：2018-07-30 00:00 reading：1144 Continue reading>>
Altice, Huawei tie-up aims to make Portugal a European leader in 5G
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Altice, Huawei tie-up aims to make Portugal a European leader in 5G

The Portuguese unit of telecoms firm Altice, the country's largest operator, is working with Chinese electronics giant Huawei to make Portugal a leader within Europe in the development and roll-out of next-generation 5G networks."I believe that the Portuguese market will be one of the first globally to be able to use this (5G) technology," said Alexandre Fonseca, CEO of Altice Portugal, after the first demonstration of the technology on Wednesday using a prototype Huawei router with a top speed of 1.5 gygabytes per second.Fonseca expects the first commercial devices to crop up in Portugal in 2019 or 2020, although regular users are unlikely to have access to the technology before 2021 or 2022, "because various questions need answers, such as investment versus profitability of the business".At a global level, the first commercial 5G projects are expected to launch in the United States this year, followed by Japan and South Korea in 2019 and China in 2020.Providers across Europe are also working to roll out services. Vodafone, whose Portuguese unit competes with Altice Portugal, said last month it will begin testing 5G mobile networks in seven of Britain's 10 largest cities later in 2018, before starting limited deployments in some markets next year.In Italy, communications regulator AGCOM said the government would auction frequencies for 5G mobile services in September.Portugal is no stranger to world-class technological innovation. The world's first prepaid mobile phones were launched here, as were single, country-wide electronic motorway tolls. It has a dense fiber network, which makes it a fertile ground for the development of the new telecoms standard.Wednesday's demonstration followed two years of research and testing, which Fonseca says puts the partners ahead of their competition in Portugal.When implemented on a larger scale, with a denser network of smaller antennae than the current 4G standard, the 5G technology will allow data transfer speeds 50 to 100 times faster than now.Dutch-based Altice bought the assets of former telecoms monopoly Portugal Telecom in 2015. Altice's fiber networks, which will help deliver the 5G service, cover 4.3 million homes in Portugal out of the total of 5.3 million, and Altice expects to cover the remainder by early 2020."This is extraordinary and does not happen in other European countries, such as Germany," said Chris Lu, head of Huawei in Portugal. He projects that his company will develop a 5G smartphone prototype by next year or in 2020.Industry analysts expect 5G upgrades to kick in next decade for faster phones, fixed wireless video and new industrial business uses. So far, there has been no clear game-changing device or service to emerge to drive 5G network demand. 
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Release time：2018-07-06 00:00 reading：1393 Continue reading>>
ST Offers eSIMs at Wafer Level
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ST Offers eSIMs at Wafer Level

STMicroelectronics has become the first chip maker to be accredited by the GSMA for loading embedded SIM (eSIM) chips with connection credentials such as certificates and operator profiles before shipping.The eSIMs, customized with connection credentials, enable smaller form factors, greater security, and increased flexibility. Chip-scale, permanently embedded, and electronically reprogrammable, eSIMs save space inside smartphones for extra features or battery capacity, while enabling different types of connected devices in tiny form factors for an expanding range of markets and applications, such as smart watches and internet-of-things (IoT) devices including smart meters, remote sensors, or gateways.The GSMA, an association representing nearly 800 operators and more than 300 companies in the broader mobile ecosystem, including handset and device makers, software companies, equipment providers and internet companies, has a secure accreditation scheme for UICC (universal integrated circuit card) production (GSMA SAS-UP). The accreditation categories range from any form factor UICC, to embedded form factor and wafer level chip scale packaging. It lists STMicro in Caserta, Italy, being accredited for embedded form factor eSIMs, and STMicro in Rousset, France being accredited for wafer level.ST says it can now deliver personalized eSIMs, built around the ST33 secure microcontroller, directly to customers’ production facilities, ready to use with no further programming required. Equipment OEMs, mobile network operators, and SIM operating-system (OS) vendors can therefore streamline the eSIM supply chain to save handling overheads and reduce time to market.“The SAS-UP accreditation of ST’s Rousset (France) production site for the personalization of WLCSP SIMs and eSIMs is a significant move in driving widespread adoption of trusted eSIM devices by enabling consumer and IoT device manufacturers to implement eSIM in very small form factors,” says Jean-Christophe Tisseuil, GSMA’s head of SIM and eSIM. “SAS-UP is a first and essential step towards a secure and trusted eSIM market deployment.”“The GSMA’s certification scheme governing production and personalization is critical for its success,” said Marie-France Florentin, group vice president, general manager, secure microcontroller division, STMicroelectronics. “Now that ST is accredited to produce and personalize eSIMs before shipping, our customers can benefit from greater efficiency and security throughout the entire supply chain, with all the safeguards and assurances provided by the GSMA’s ecosystem.”eSIM marketThe overall eSIM market is estimated to grow from USD 253.8 million in 2018 to USD 978.3 million by 2023, at a CAGR of 31.0% between 2018 and 2023, according to ResearchAndMarkets. The report says the global eSIM market is in its nascent phase, but with more emphasis likely on remote SIM provisioning for M2M, favorable government regulations boosting M2M communication, and high adoption of IoT technology, this will drive the demand for eSIM solutions.The M2M market is the current lead application for eSIMs, with rising adoption of IoT across verticals such as automotive, consumer electronics, energy & utilities, manufacturing, retail, and transportation & logistics primarily driving eSIM adoption.Europe is estimated to hold the largest share of the eSIM market in 2018, followed by North America and Asia Pacific. However, by 2023, North America is likely to hold the largest market share globally. The increasing focus on the linking and digitization of future products and services is boosting the growth of the semiconductor industry for this market. eSIM cards allow remote provisioning of SIM profiles and enable interoperability between connectivity platforms and multiple SIM operator profiles.The report says major players operating in the eSIM market include Deutsche Telekom AG (Germany), Gemalto NV (Netherlands), Giesecke & Devrient GmbH (Germany), Infineon Technologies AG (Germany), NTT DOCOMO, INC. (Japan), NXP Semiconductors N.V. (Netherlands), Sierra Wireless, Inc. (Canada), Singapore Telecommunications Limited (Singapore), STMicroelectronics (Switzerland), and Telefonica, S.A. (Spain).
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Release time：2018-06-28 00:00 reading：1188 Continue reading>>
Startup Claims AI Design Wins
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Startup Claims AI Design Wins

　　Startup Gyrfalcon is moving fast with a chip for inferencing on deep neural networks, but it faces an increasingly crowded market in AI silicon. A year after it got its first funding, the company is showing a working chip and claiming design wins in smartphones, security cameras, and industrial automation equipment.　　Data centers typically train deep neural networks and run inference tasks on them using banks of servers. Increasingly, client and embedded systems from cars to handsets are adopting accelerators to speed the inferencing jobs.　　Apple, Google, and Huawei are already shipping smartphones with inferencing blocks in their custom SoCs. Google and Microsoft built inference accelerators for their data centers.　　Among merchant suppliers, Movidius, now part of Intel, is shipping inference chips while Cadence, Ceva, and Synopsis are supplying IP blocks and Imagination and ARM have announced plans. At least a dozen other startups are still in stealth mode with AI siliconincluding Groq, founded by a group of former Google chip developers to build an inference chip.　　“Most of the action in inference is from the IP suppliers; largely, this will be a market for integrated chips,” said Linley Gwennap, principal of market watcher The Linley Group.　　For its part, Gyrfalcon has been showing since late last fall working silicon for its Lightspeeur SPR2801 processor for convolutional neural nets (CNNs). The 28-nm TSMC chip fits in a 7 x 7-mm package and packs tens of thousands of proprietary cores and embedded SRAM to crank out 9.3 TOPS/watt without external DRAM. The cores are mainly ALUs with associated memory and logic for controlling dataflows.　　The chip uses ideas that one of its co-founders, chief scientist Lin Yang, articulated in a 1988 Ph.D. paper about CNNs while he was at UC Berkeley. The chip only accelerates CNNs, one of the most popular of a wide variety of neural nets in use.　　A top-five smartphone maker will use the chip in a future flagship phone, said Frank Lin, co-founder and president of the startup. In China, a large insurance company will design it into surveillance cameras and a steelmaker in Shanghai will use it in inspection systems.　　“We moved very fast from getting our first funding in February last year to having an FPGA verified in April and a chip back from TSMC in mid-September,” said Lin.　　Gyrfalcon announced in December that its chip will be used next to a parallel processor from Socionext of Japan in a platform for video analysis. The joint product should be available in March, with Bilkon Ltd., a surveillance systems maker in Turkey, as its first customer.　　QuickLogic is evaluating the Gyrfalcon chip for possible use along with a future generation of its sensor hub for detecting wake words in a variety of “hearable” products. Of a dozen companies building inference chips and a handful that QuickLogic has evaluated, “they are targeting our market more closely than others we’ve seen,” said Timothy Saxe, QuickLogic’s CTO.　　AI agents such as Amazon’s “Alexa will drive people to want more natural-language processing over broader vocabularies, so we need to partner with someone who can accelerate that,” said Saxe.　　Gyrfalcon has ambitious plans to field a second product by June, with increased performance and a whole new family of chips by the end of the year. It also is exploring the possibility of custom versions consuming as little as 50 milliwatts for high-volume customers.　　The startup designed a PCI Express card for using its chip in servers. It will follow in the footsteps of Movidius, releasing by April a $69 USB dongle with its chip, aimed to attract a broader set of CNN software developers.　　“We don’t want only Ph.D.s to do this work — the dongle has several neural network models preloaded and it’s very easy to use,” said Lin, who helped China Mobile launch its international business before joining the startup.　　Lin would not say how much money the startup has raised from investors in China, Korea, Japan, and the U.S. in two rounds so far. “For 2018, the money we raised can support us, and with our design-ins and potential orders, we’ll have revenue this year and even hope to break even,” he said.　　So far, the company has 41 employees, most of them based in Silicon Valley.
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Release time：2018-01-26 00:00 reading：386 Continue reading>>
MediaTek Claims First Health Biosensor for Smartphones
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MediaTek Claims First Health Biosensor for Smartphones

　　Claiming an industry first, MediaTek announced a biosensor that monitors six types of health functions — including tracking heart-rate information, blood-pressure trends, peripheral oxygen-saturation levels and more — from a smartphone.　　The MediaTek Sensio MT6381 is a software and module package designed to deliver health data via optical, electrical and processing components. The customizable device will allow smartphone manufacturers to make handsets with health-monitoring functions while eliminating the need for multiple sensors, according to MediaTek.　　The Sensio will also provide manufacturers the flexibility to develop proprietary applications or leverage third-party applications and developer add-ons, the company said in a press statement.　　“With our MediaTek Sensio biosensor module and software, developers and device makers have a powerful, embedded health-monitoring solution that delivers heart and fitness information in around 60 seconds,” said Yenchi Lee, senior director of product marketing for MediaTek’s wireless business.　　The module uses LEDs together with a light-sensitive sensor to measure the absorption of red and infrared light from a phone user’s fingertips. By the touch of a device’s sensors and electrodes, the Sensio creates a closed loop between a user’s heart and the biosensor to measure electrocardiogram and photoplethysmogram (PPG) waveforms, according to MediaTek.　　The company said Sensio provides the following six health data points in about 60 seconds:Heartrate – heartbeats per minute.Heartrate Variability – variation in the time between heartbeats.Blood Pressure Trends – a range of data over a period of time.Peripheral Oxygen Saturation – the amount of oxygen in the blood.Electrocardiography (ECG) – the electrical activity of the heart over a period of time displayed as a graph.Photoplethysmography (PPG) – the change in volume of blood.　　The Sensio MT6381 package will include integrated red and infrared LEDs for reflective PPG measurement plus a 1-channel ECG analog front-end. The device will come in a 6.8 mm x 4.93 mm x 1.2 mm OLGA 22-pin package with a I2C /SPI digital interface.
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Release time：2017-12-18 00:00 reading：1286 Continue reading>>

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