TAIYO YUDEN Expands Lineup of Multilayer Metal Power Inductors for <span style='color:red'>Smartphones</span>
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TAIYO YUDEN Expands Lineup of Multilayer Metal Power Inductors for Smartphones

　　TAIYO YUDEN CO., LTD. has begun mass production of three products, including the LSCND1412FETR47ME (1.4 x 1.2 x 0.65 mm; maximum height shown), in its MCOIL™ LSCN series of multilayer metal power inductors.　　These power inductors are for use as choke coils in the power circuits of smartphones. Retaining the same form factor as our previous product "LSCND1412FETR47MC" (1.4 x 1.2 x 0.65 mm), the DC superposition allowable current of our new "LSCND1412FETR47ME" has been increased by 20% to 3.6 A (previously 3.0 A), and its DC resistance has been reduced by 10% to 38 mΩ (previously 42 mΩ). These improvements contribute to boosting the performance of power supply circuits in smartphones, which are becoming increasingly sophisticated and multifunctional.　　Mass production of these products commenced at our subsidiary WAKAYAMATAIYO YUDEN CO. LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture, Japan). Samples are available for 50 yen per unit.　　Technology Background　　Smartphones are becoming increasingly sophisticated, with capabilities such as AI-based image and video editing, as well as voice and text translation. At the same time, there is demand for greater efficiency in order to keep their body small, and achieve long operating times with limited battery capacity. To achieve both high performance and high efficiency, a smartphone’s processor operates at high speeds with low voltage and high current, and employs a multi-core configuration where each core is equipped with its own power supply circuit, allowing it to improve both its processing power and efficiency by switching the cores used depending on load. This trend in power supply circuits has become particularly pronounced in cutting-edge smartphones, which require both high performance and high efficiency, and in recent years has led to an increase in the adoption of small and thin low-inductance power inductors capable of handling large currents.　　To address these needs, at TAIYO YUDEN we have been using metallic magnetic materials with high DC superposition characteristics to optimize the design and other aspects of our MCOIL™ LSCN series multilayer metal power inductors—which have the advantage of allowing them to be made more compact and thinner—commercializing three products, including “LSCND1412FETR47ME,” which deliver 20% greater DC superposition allowable current and 10% smaller DC resistance compared to our previous products.　　In response to market needs, we will continue to expand and improve our product lineup with higher functionality and reliability, as well as smaller and thinner products.　　■ Application　　For use as a choke coil for power circuits in smartphones and other devices.　　■Characteristics　　*1 The saturation current value (Idc1) is the DC current value having inductance decrease down to 30%. (at 20℃)　　*2 The temperature rise current value(Idc2) is the DC current value having temperature increase up to 40℃. (at 20℃)　　*3 The rated current value is following either Idc1(max) or Idc2(max), which is the lower one.　　* “MCOIL” is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.
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Release time：2025-05-30 13:51 reading：396 Continue reading>>
Murata：Radisol Redefines Antenna Interference Countermeasures for <span style='color:red'>Smartphones</span> and Wearables
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Murata：Radisol Redefines Antenna Interference Countermeasures for Smartphones and Wearables

　　Murata Manufacturing Co. Ltd announces the launch of Radisol – an innovative product designed to suppress interference between nearby antennas with low insertion loss, improving isolation and antenna radiation efficiency. This world-first solution is specifically engineered to meet the demands of compact modern devices like smartphones and wearables, offering benefits such as reduced power consumption, miniaturized construction, and enhanced communication quality. In addition, Radisol has been adopted by Motorola Mobility LLC (Headquarters: Libertyville, Illinois, USA, President: Sergio Buniac), in the new Edge series of smartphones scheduled to be released in August 2024. Motorola has realized a method of improving the characteristics of Wi-Fi® antennas by using Radisol.　　As the demand for smaller smartphones and wearable devices grows, the number of antennas is also increasing to accommodate the expanding range of communication methods and bands. Additionally, MIMO technology to improve communication quality and speed is encouraging an increase in the number of antennas, while new designs such as foldable smartphones are encouraging antenna crowding. This has posed new difficulties, specifically the implications on antenna isolation and the decline in antenna effectiveness, as the interference of nearby antennas leads to a decrease in radiation efficiency.　　Although discrete filters are a common solution for improving antenna isolation, they are not suitable when communication bands are closely situated, as insertion loss can impair antenna performance and occupy valuable board space. To address these challenges, Murata has created Radisol, a low-loss filter for antenna area that uses Murata’s unique ceramic multilayer technology and RF circuit design technology.　　Antenna engineers usually construct a filter circuit using discrete L and C chip components to implement effective countermeasures. Instead, Radisol is just a single 0603-sized component that resolves the persisting challenges of antenna performance and packaging constraints. It effectively suppresses antenna interference, without significantly impacting the passband, and results in enhanced radiation efficiency and reduced power consumption.　　Each Radisol component operates as a dedicated filter circuit designed specifically to mitigate the antenna interference associated with a specific communication band. The compact component integrates one capacitor and two inductors, providing band-stop filter characteristics within a single chip. Radisol features a unique design that utilizes the generation of lossless mutual inductance by two magnetically coupled coils. This setup forms a band-stop circuit with no notable insertion loss in the communication band. This specialized approach to antenna isolation enables Radisol to offer enhanced performance, with low insertion loss and high efficiency and system integration.　　Included in the Radisol family are variants designed to effectively address the needs of common bands, including 2G & 5G Wi-Fi® as well as GPS signals. This eliminates the necessity of designing discrete filter circuits, simplifying the implementation of countermeasures. Murata will continue to expand upon the initial product lineup to further meet market demands and drive further innovation in antenna technology.　　“By using Radisol engineers can address the challenges of modern communication devices without compromising signal integrity and radiation efficiency,” said Satoru Muto, General Manager of New Business Incubation Department at Murata. “By utilizing Murata's cutting-edge technology, this solution takes integration to a whole new level, eliminating the need for complex discrete filter circuits and saving valuable space.”　　Radisol samples are available for evaluation and mass production has already begun in June 2024. To learn more about Radisol or to request samples, please contact your local Murata representative or visit here.
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Release time：2024-08-14 13:39 reading：879 Continue reading>>
Industry Insiders Report Huawei’s Target of Shipping 100 Million <span style='color:red'>Smartphones</span> Next Year
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Industry Insiders Report Huawei’s Target of Shipping 100 Million Smartphones Next Year

　　According to IJIWEI’s report, industry insiders reveal that Huawei has set a goal of shipping 100 million smartphones next year. This target represents a 40% increase over earlier predictions, as various market research firms had previously estimated Huawei’s smartphone shipments for the next year to be around 70 million units.　　Huawei’s aggressive sales plan for the upcoming year is propelled by the favorable reception of its recently launched flagship smartphone series, the Mate 60. By the end of this year, Huawei aims to have shipped approximately 20 million units of the Mate 60 series, contributing to the projected annual smartphone shipments ranging between 40 million and 50 million units. This surpasses the previous year’s shipments of 30 million units by 30 to 70%.　　With the growing shipment volumes, the supply of Huawei Mate 60 series smartphones featuring organic light-emitting diode (OLED) panels has also seen an increase recently, with suppliers ramping up their production rates.　　The Huawei Mate 60 series has become a much-anticipated success in the consumer electronics market. During the Huawei Autumn Full-Scene New Product Launch event, Huawei’s Terminal BG CEO and Chairman of the Intelligent Automotive Solution BU, Richard Yu, expressed his delight with the positive response to the “Pioneer Program” products.　　Huawei is currently working around the clock to meet the surging demand for its products. The “Pioneer Program” includes the Mate 60 Pro, Mate 60 Pro+, and the foldable Mate X5.　　Several supply chain sources and analysts have indicated that since earlier this year, Huawei has been steadily increasing its stock of components such as lenses, cameras, printed circuit boards, and various other parts to meet its shipment targets. Huawei has also requested that its sole 4G mobile chip supplier in the U.S., Qualcomm, deliver the full-year orders before June.
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Release time：2023-11-01 16:15 reading：1887 Continue reading>>
BIWIN Brings UFS 3.1 Flash Memory Hitting Read Speeds up to 2100 MB/s for Flagship <span style='color:red'>Smartphones</span>
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BIWIN Brings UFS 3.1 Flash Memory Hitting Read Speeds up to 2100 MB/s for Flagship Smartphones

　　Smartphones have become an essential part of our everyday lives. As 5G, innovative sensors, and AI are gathering momentum, the storage market puts higher requirements on smartphones in terms of high-resolution videos and images, apps, and real-time communications. BIWIN brings proven storage solutions for your smartphones, enabling improved responsiveness and smooth user experience.　　Mobile user experience is based on three main factors: SoC, RAM, and flash memory, with memory performance and capacity having a growing impact on user experience.　　To meet the needs of flagship smartphones, BIWIN UFS 3.1 offers write speeds up to 1800 MB/s (4x faster than the previous generation of Universal Flash Storage) and read speeds up to 2100 MB/s. With a capacity up to 256 GB (the 512 GB and 1 TB versions are coming soon), BIWIN UFS 3.1 comes in a dimension of 11.5 x 13.0 x 1.0 mm. In addition, BIWIN UFS 2.2 is compatible with mainstream SoC platforms including MediaTek and Spreadtrum. And BIWIN is the first storage solution provider in China to pass MediaTek certification. BIWIN provides UFS 3.1 + LPDDR4X/5 storage solutions, with the LPDDR5 running at speeds up to 6400 Mbps and boasting a capacity up to 64 Gb.　　Firmware algorithm is the very core of the memory’s high performance and low power consumption. Bolstered by JEDEC standards, BIWIN UFS 3.1 supports Write Booster, Deep Sleep, Performance Throttling Notification, and Host Performance Booster to ensure faster speed and less power consumption. BIWIN UFS 3.1 is engineered to offer better user experience in HD video decoding, program installation and startup, continuous shooting, image loading, large file copy, game loading and more.　　BIWIN storage products have entered the supply chain system of mainstream smart terminal manufacturers. In the future, we will continue to deepen the integration of R&D, packaging and testing, giving full play to our advantages in embedded storage in order to help customers increase the competitiveness of their terminal products.
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Release time：2023-09-01 13:11 reading：3875 Continue reading>>
Nearly 415 Million Used <span style='color:red'>Smartphones</span> to Be Shipped Worldwide in 2026
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Nearly 415 Million Used Smartphones to Be Shipped Worldwide in 2026

　　Worldwide shipments of used smartphones, including officially refurbished and used smartphones, will reach 282.6 million units in 2022, according to International Data Corp. (IDC) estimates. The unit growth represents an 11.5% increase over the 253.4 million units shipped in 2021. This growth is expected to continue as IDC forecasts used smartphone shipments will reach 413.3 million units in 2026 with a compound annual growth rate (CAGR) of 10.3% from 2021 to 2026.　　Trade-in programs continue to be the driving factor for the new and used smartphone market globally. IDC have witnessed new programs launch successfully across multiple regional markets where trade-in is still a new concept for local consumers. Additionally, in mature markets such as the U.S., Canada, and Western Europe, trade-in continues to play a significant role in speeding up refresh cycles through telco and retail-driven promotions. This has contributed to an increase in trade-in value (TIV), which is typical when demand for new devices is slow. The rise in TIV has pushed prices up in the secondary market due to consumers getting more for their old devices to help drive upgrades.　　The increased sale of higher-priced devices in the new market has also created a circular effect as many of these aggressive trade-in deals feature primarily on premium devices. How long these aggressive trade-in offers last remains a big question for buyers and sellers. Eventually, narrow margins will impact the overall profits of the channel, vendor, or perhaps both.　　“The used market was able to grow 11.5% in 2022 thanks to the 6.1% rebound we witnessed in the new market for 2021,” says Anthony Scarsella, research manager with IDC’s Worldwide Quarterly Mobile Phone Tracker. “Used devices demonstrate more resilience to market inhibitors than new smartphone sales as consumer appetite remains elevated in many regions. Attractive price points are critical for growth as cost savings remain the primary benefit. However, a high-end inventory struggle due to elongated refresh cycles in the new market has used prices growing over 11% in 2022.”　　According to IDC’s taxonomy, a refurbished smartphone is a device that has been used and disposed of at a collection point by its owner. Once the device has been examined and classified as suitable for refurbishment, it is sent off to a facility for reconditioning and is eventually sold via a secondary market channel. A refurbished smartphone is not a “hand-me-down” or gained due to a person-to-person sale or trade.
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Release time：2023-01-11 13:54 reading：1991 Continue reading>>
Foldable <span style='color:red'>Smartphones</span> to Be Launched in 2019 with Penetration Rate of 0.1%
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Foldable Smartphones to Be Launched in 2019 with Penetration Rate of 0.1%

According to The Future of Smartphone Era Webinar by WitsView, a division of TrendForce, the global smartphone market has been approaching saturation, with less room for product differentiation. Thus, smartphone makers have shifted their focus to next-generation foldable models. WitsView expects the first foldable smartphone to be launched in 2019, accounting for only 0.1% in the global smartphone market. The penetration rate is estimated to reach 1.5% in 2021.According to Boyce Fan, the research director of WitsView, a few manufacturers tried to develop foldable models in the past using a dual-screen design, but most of them failed. However, as breakthroughs continue to be made during the development of flexible AMOLED panels, single-screen foldable smartphones gradually emerge. Among the makers, Samsung takes a leading role with its advanced display technology.Product differentiation is harder with a more saturated market, impacting Samsung’s smartphone business in recent years. Its AMOLED models can no longer trigger strong demand as before. Together with increasing competition from Chinese smartphone brands in the emerging markets, Samsung’s smartphone business has come to a bottleneck and needs new demand momentum for growth. Therefore, WitsView believes that Samsung is highly like to release the first foldable smartphone in the market next year as an attempt not only to define a new concept for smartphone hardware, but to consolidate its leading position in the global smartphone market.Although foldable phones have become the focus of the market, they still remain in the early stage of product development, so manufacturers are bound to improve the designs continuously, says Fan. Samsung’s current concept foldable phone adopts an inward folding design, which requires an extra display outside for the front cover. Thus a key to good user experience will be the interface optimization for the transition between the display inside and outside. Meanwhile, there is also room for improvement in terms of the thickness of the phone and the border, as well as the battery life.The design of outward folding is an alternative considered by many manufacturers, but it involves additional challenges like how to balance the strength, thickness and flexibility of the protective CPI films or protective cover glass, and how to increase the display materials’ ductility, malleability, and credibility when folded. Therefore, the time needed for developing outward folding phones would be even longer.In addition to Samsung, other smartphone vendors like Huawei, LG, Google and Lenovo have started to plan for launching foldable models, but even longer time is needed because they are still constrained by the lack of alternative panel suppliers other than Samsung. WitsView believes that the initial demand for foldable smartphones will not be very strong, considering the need for product optimization, lack of flexible AMOLED panel suppliers other than Samsung, and the looming demand in the market. The segment of foldable smartphones will not have a chance to expand until the second half of 2019 or after 2020, when more manufacturers follow suit to launch foldable models and get more feedback from the market.
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Release time：2018-12-17 00:00 reading：1295 Continue reading>>
Qualcomm unveils new chip to power 5G smartphones
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Qualcomm unveils new chip to power 5G smartphones

Chip supplier Qualcomm Inc on Tuesday unveiled a new generation of mobile phone processor chips that will power 5G smartphones in the United States as soon as next year.The key feature of the Snapdragon 855 chip, launched at an event in Hawaii, is a so-called modem for phones to connect to 5G wireless data networks with mobile data speeds of up to 50 or 100 times faster than current 4G networks.Mobile carriers are investing in 5G networks and are eager to sell 5G phones and data plans to recoup investment costs.Qualcomm, the largest supplier of mobile phone chips, said Snapdragon 855 would power Samsung 5G smartphones that Verizon Communications Inc and Samsung Electronics Co Ltd said on Monday would be released in the United States in the first half of 2019.The modem would also enable "computer vision" to help phones recognise objects and faces, and support a new Qualcomm fingerprint sensor that can read a user's fingerprint through the glass screen of a smartphone.The Samsung phone would be a major challenge for Apple Inc , its biggest rival in the premium handset market in the United States as the iPhone maker is locked in a legal battle with Qualcomm. Citing sources familiar with the matter, Bloomberg reported on Monday that Apple would wait until at least 2020 to release its first 5G iPhones.
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Release time：2018-12-06 00:00 reading：2349 Continue reading>>
fter overtaking Apple in smartphones, Huawei is aiming for No. 1 by 2020
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fter overtaking Apple in smartphones, Huawei is aiming for No. 1 by 2020

Huawei Consumer Business Group's CEO, Richard Yu, attends the launch of the new Huawei P20 smartphone, the new generation smartphones of the Chinese brand Huawei at Le Grand Palais on March 27, 2018 in Paris, France. Walk around any major city in China, and you'll see Huawei stores and ads everywhere. That's because it's the number one player in the world's biggest smartphone market, and has become a major contender on the world stage.The Chinese technology firm overtook Apple to become the world's second-largest smartphone vendor by market share at the end of the second quarter of the year and has set its sights on the number one spot — currently held by Samsung — by 2020."Next year, we will be very close to number one, maybe we will be on par with Samsung. And at least the year after, maybe we have a chance (to be number one), the year 2020," Richard Yu, the CEO of Huawei's consumer division, told CNBC in an exclusive interview.Rapid riseThese days, the company is talking about foldable phones, 5G mobile technology and augmented reality glasses. But it wasn't always like this. In fact, Huawei didn't even have any own-brand smartphones of its own until 2010, three years after Apple debuted the first iPhone.The company became one of China's biggest technology firms thanks to the growth of mobile networking equipment, and is now one of the largest suppliers in the world for that market. It was also an original design manufacturer (ODM), which meant it designed and made devices for other firms.In 2010, Huawei launched its first own-brand smartphone called IDEOS running Google's Android mobile operating system and costing around 60 euros ($67.50). Fast forward to 2018 and the company is releasing handsets that have original artificial intelligence chips and world-first features, costing over $1,000.The move from ODM to smartphone giant was spearheaded by Yu, who previously worked in Huawei's business-to-business (B2B) division and became CEO of the consumer group in 2012. At the time, a few trends got Yu excited about the potential for Huawei in the smartphone space including the switch from feature phones to smartphones and the arrival of 4G mobile internet.He decided that Huawei would stop making feature phones and focus on high-end smartphones with larger batteries and bigger screens that consumers were asking for.Clash with the boardYu has been the face of Huawei's consumer division, often fronting their product launches which have become huge marketing events for the company. He's perhaps unknown outside technology circles but is an outspoken figure.The CEO says he encourages risk-taking, which has helped Huawei grow quickly."I encourage the team to have this innovation capability, to make bold innovations, to do something which some guy feels is a little bit crazy, to challenge ourselves and the industry," Yu told CNBC."I am very simple guy. I hate bureaucracy."-Richard Yu, CEO of Huawei's consumer divisionHuawei has historically had a business-to-business focus and this often meant Yu clashed with senior management as he tried to push the consumer business."The big challenge for me is I'm working for a company, the whole company runs on B2B, our managers, all our guys, executives, are B2B heads, but with this B2B head we are running a B2C business. So there are a lot of arguments, a lot of obstacles because people say, 'you are doing this the wrong way.' Actually we are doing this the right way. This is the biggest barrier," Yu said in a very frank part of the interview.AI, foldable screensStill, Huawei has pushed ahead with consumer products. Much of its success so far has been down to putting out smartphones with new technologies but at affordable price points. It has been pushing the barrier with prices and also bringing in cutting-edge features. For example, the P20 Pro was launched earlier this year, boasting a triple-lens camera that retailed for just over $1,000.Huawei also designs its own artificial intelligence chips which appear in its smartphones, much like Apple does.For Yu, AI will be a key technology that will take smartphones to the next level and help the company grow in the future."AI is coming. AI will be the engine for all the future services. AI will be elementary to working on many devices, it will connect all the apps, you can get all the services from this AI capability. The biggest changes in the next 10 years will be AI-enabled phones capability," Yu told CNBC.For Huawei, it will be a tough battle, especially if it looks to internationalize any services, given the strength of companies like Spotify and Netflix outside China."Currently Huawei is primarily synonymous with being a hardware provider and it may find it needs to get its brand more established in consumer consciousness before it can make the transition to offering services too," Ben Wood, chief of research at CCS Insight, told CNBC by email."With so many well-recognized services such as Spotify for music and Netflix for films and TV already established with such a large number of consumers, it is doubly difficult for Huawei to grab share in these areas," he added."However, history shows that Huawei can be incredibly tenacious so I would not rule out the company slowly getting consumers outside China to embrace its service over time. That said, it's going to be a long tough journey," Wood said.Politics and competitionHuawei faces some headwinds in its global ambitions.The company has been caught up in politics over the past few years with its consumer division being dragged into it as well. In 2012, Huawei was effectively blocked from the U.S. network equipment market after the government cited it as a national security risk that could provide backdoor access to leak sensitive information to China. The company denies this claim.Huawei CEO Richard Yu gives a press conference to present the new Huawei Balong 5G01, a 3GPP 5G commercial chipset on February 25, 2018 in Barcelona, on the eve of the inauguration of the Mobile World Congress (MWC).Earlier this year, six top U.S. intelligence officials warned American consumers not to buy Huawei phones.Yu addressed the tough conditions in the U.S., saying it's not necessary to be in the market in order to grow."China and U.S. trade war is creating a higher barrier for us. Because the consumer business is so big, I think we can focus on other market rather than U.S. market," he said."The market is so big, we don't need to wait for the U.S. market. Instead we can put more energy on the global market," Yu said, adding that Huawei hopes to return to the U.S. but will "have to be patient."Beyond politics, Huawei is facing stiff competition in the ever-evolving smartphone market.Chinese vendors like Xiaomi, Oppo and Vivo are its key rivals, while Samsung won't be dislodged from the number one spot easily.Samsung Mobile's CEO DJ Koh told CNBC in an interview in September that the company was switching its mid-tier smartphone strategy to bring more innovative features to its lower-priced phones, a move which could help it fend off the threat of Huawei. That strategy was seen with the Galaxy A9, the world's first smartphone with a quad lens rear camera, which was released in October.And Samsung will not be easy to beat. It has only slipped from the pole position in the smartphone market three times in the last five years, usually just for one quarter, according to data from Counterpoint Research.Neil Shah, a research director at Counterpoint estimates Huawei would need to shop around 30 million to 40 million more smartphones per quarter to overtake Samsung."The markets where Samsung is strong – USA, Europe, India — has to be conquered by Huawei to make this happen," Shah said, adding that India will be tough because of Samsung's manufacturing, distribution and brand, while the U.S. is "out of the question near-to-mid-term."But Shah said that Samsung could see its shipments dwindle because of fierce competition which could help push Huawei to number one.Yu's ambitions are bigger than smartphones, however. With new products like its speaker and wearable devices, Yu is aiming to create an ecosystem of smart devices."We want to take a leading role in the next ten years to become a whole solution smart life provider," Yu told CNBC.
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Release time：2018-11-19 00:00 reading：1351 Continue reading>>
High Screen-to-Body Ratio to Become Mainstream, Penetration Rate of <span style='color:red'>Smartphones</span> Based on COF Packaging Would Reach 35% in 2019
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High Screen-to-Body Ratio to Become Mainstream, Penetration Rate of Smartphones Based on COF Packaging Would Reach 35% in 2019

According to WitsView, a division of TrendForce, the market has witnessed stronger demand for full-screen smartphones while higher screen-to-body ratio has become a major trend of this year. In order to make bezels narrower, drive ICs for mid- and high-end phones have been switching from solutions based on Chip-on-Glass (COG) packaging to those on Chip-on-Film (COF) packaging. With major smartphone vendors actively adopting COF solutions, the percentage of models using COF packaging would account for 35% of the global smartphone market in 2019, a significant increase from 16.5% in 2018.“In the past, most driver ICs used in smartphones adopted COG packaging, which requires more room at the bottom of display panel for chip bonding, so the bottom bezel is normally larger than side bezels and top bezel”, says Boyce Fan, research director of WitsView. However, the recent bezel-less trend on smartphones has shaped the design of panels. High-end models have started to use COF package, in which driver IC is moved to the back of display panel, thus enabling a narrower bottom bezel. WitsView notes that COF package is only used in flexible AMOLED panels previously, but will see higher penetration this year after Apple adopted this packaging technology in its 2018 new models. Other brands are expected to follow suit for their high-end models.However, the stronger demand for COF package has resulted in a tight supply of tape, a necessary material for this packaging technology. The tapes have also seen rising quotes, which are rare in recent years. In the past, tapes are only used in large size COF panels, thus remaining in oversupply for a long time. Despite the rising number of high-end smartphones using COF packaging, WitsView does not discount the possibility that smartphone designers return to COG packaging because COF will increase the material costs for smartphones. For example, FHD+ 6MUX TDDI IC, which is currently in development, adopts COG packaging rather than COF. Considering the demand uncertainty, tape manufacturers may not be very active to expand production capacity.With little production expansion yet higher demand for COF package from smartphone vendors, WitsView expects the COF substrates to see a tight supply. As the result, large size panel makers and smartphone makers may need to compete to secure the supply of COF substrates.
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Release time：2018-11-12 00:00 reading：1521 Continue reading>>
Share of TDDI In-Cell Solutions for <span style='color:red'>Smartphones</span> Will Double Since the Tight Supply is Gradually Eased
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Share of TDDI In-Cell Solutions for Smartphones Will Double Since the Tight Supply is Gradually Eased

The share of In-Cell solutions in the global smartphone market is estimated to reach 27.1% in 2018, marginal up from 26.2% of last year, according to the latest research on touch display solutions by WitsView, a division of TrendForce. This is due to the rapid adoption by Android smartphones, despite the fact that the new iPhones this year will not adopt In-Cell solutions. Particularly, the share of TDDI (Touch with Display Driver Integration) In-Cell solutions is likely to grow significantly to 17.3%, although the IC products for TDDI In-Cell products experience a tight supply.“Branded smartphone vendors are now more willing to adopt TDDI In-Cell solutions, thanks to the maturation of IC products for TDDI and more IC suppliers’ entrance into the market”, says Boyce Fan, research director of WitsView. Despite the tight supply of wafer in the first half of 2018, smartphone vendors have actively searched for alternatives from second-tier IC manufacturers or foundries, or switched to Out-Cell design, so the overall supply and demand of TDDI IC has returned to a rational level in the second half of the year. Although the new iPhone models this year will adopt Out-Cell solutions, the share of TDDI In-Cell solutions is likely to grow significantly to 17.3%, up from 8.9% of last year driven by the promotion of IC manufacturers and panel makers.“Right now, smartphones makers have been constantly optimizing the design of full-screen models, while pursuing narrower borders, which will jointly drive the development of TDDI IC products,” says Fan. For example, the adoption of Dual Gate in HD+ products and MUX6 in FHD+ products is aimed to narrow the border at the side of IC Bonding. Moreover, in order to cope with the tight supply, IC design houses have been exploring new capacity of wafer supply and may also consider the transition into more advanced processes, smaller IC sizes and new specs.WitsView notes that the demand remains strong, and the tight supply of TDDI IC will be gradually eased with the new capacity. Therefore, the share of TDDI In-Cell solutions in the global smartphone market would continue to grow to 24.3% in 2019.
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Release time：2018-09-07 00:00 reading：1191 Continue reading>>

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