Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification
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Apple Reportedly Eyes Samsung, Intel U.S. Foundry for Core Chips Amid TSMC Constraints, Supply Diversification

　　Apple is reportedly weighing the possibility of having some of its core device chips manufactured by Samsung and Intel. According to Bloomberg, citing sources, the company has held preliminary discussions on using the two as alternative production partners for its main processors—potentially providing a second sourcing option alongside its longstanding supplier, TSMC.　　Sources say the company has held early-stage discussions with Intel about leveraging its foundry services, while Apple executives have also visited a Samsung facility under construction in Texas that is expected to produce advanced chips.　　That said, the report notes that neither effort has led to any orders so far. Engagements with both suppliers remain at a preliminary stage, as Apple continues to have reservations about adopting non-TSMC manufacturing technologies.　　One of the key drivers behind Apple’s potential shift is supply constraints at TSMC, according to Bloomberg. As the report notes, Apple executives addressed the issue during the company’s quarterly earnings call last week, indicating that limited chip availability for iPhone and Mac devices is currently weighing on growth.　　In early 2026, Tim Cook identified access to advanced-node manufacturing as the main bottleneck for Apple’s iPhone output, according to CNBC. He noted that production is constrained by limited capacity for the company’s A-series and M-series system-on-chip (SoC) chips, which are fabricated on TSMC’s 3nm process.　　In addition, it also aims to maintain at least two suppliers for key components, allowing Apple to strengthen its negotiating leverage on pricing while reducing the risk of supply disruptions, Bloomberg adds.　　Apple’s Reported Supplier Talks May Open Door for Intel Comeback, Samsung Gains　　Apple’s talks with both companies reportedly began before the most recent supply constraints emerged. As Bloomberg notes, collaborating with Intel could offer an added advantage, potentially strengthening Apple’s ties with the Donald Trump administration. As for Samsung, the report indicates that it has already been working on supplying more peripheral components for Apple’s devices, including power management parts.　　In an August 2025 press release, Apple also announced a partnership with Samsung to co-develop a new chip manufacturing technology at Samsung’s Austin fab. Citing industry sources, Business Korea adds that the chip Samsung is expected to produce will likely be used as an image sensor in future iPhones and other Apple products.　　Separately, industry momentum appears to be building around Intel’s foundry push. According to Commercial Times, major tech firms including Google and Apple are weighing a shift to Intel’s foundry. The report adds that Apple’s M-series chips are evaluating Intel’s 18A-P node.　　Apple’s potential shift could provide a boost to both Samsung and Intel. As the report notes, securing external customers for its foundry business is central to Intel’s turnaround strategy under CEO Lip-Bu Tan. Winning Apple as a client would mark a major milestone for Tan and could help draw in additional business. Samsung, meanwhile, would also stand to gain significantly from an endorsement by Apple.
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Release time：2026-05-06 14:44 reading：138 Continue reading>>
ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables
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ROHM Launches an Ultra-Compact Wireless Power Chipset for Wearables

　　ROHM has developed a wireless power supply IC chipset consisting of the receiver - ML7670 - and transmitter - ML7671 - compatible with Near Field Communication (NFC) technology for compact wearables such as smart rings and smart bands as well as peripheral devices like smart pens.　　The smart ring market has seen rapid growth in recent years, primarily in healthcare and fitness applications. However, for extremely small ring-shaped devices worn on the finger, wired charging is impractical, while conventional Qi wireless charging standard is difficult to implement due to constraints such as coil size. This has driven increased demand for a proximity-based power transfer method capable of reliably charging ultra-compact devices.　　In response, NFC-based charging, which operates at the high-frequency 13.56MHz band that enables antenna miniaturization, is attracting increased attention, with adoption accelerating in next-generation wearables. Following the successful commercialization of the 1W ML7660/ML7661, ROHM has developed the ML7670/ML7671 chipset optimized for even smaller devices.　　This new chipset builds on the proven receiver - ML7660 - and transmitter - ML7661. The maximum power transfer is specified at 250mW, while peripheral components such as the switching MOSFETs required to supply power to the charging IC are built in. The result is a solution optimized for both mounting area and power transfer efficiency in the power class demanded by compact wearable devices, especially smart rings.　　The ML7670 power receiver IC achieves a maximum power transfer efficiency of 45% in the 250mW low output range – all in an industry-leading form factor of just 2.28 × 2.56 × 0.48mm. A key feature of the new chipset is superior performance that surpasses the efficiency of comparable products in the same class by optimizing elements such as coil matching, rectifier circuitry, and reduced losses in switching devices.　　What's more, all firmware required for wireless power delivery is embedded directly within the IC, eliminating the need for a host MCU. This significantly reduces board space along with development workload in device design.　　Compliance with NFC Forum (WLC 2.0) enables power transfer while maintaining compatibility with existing devices, positioning the chipset as a core element in the expanding NFC wireless power ecosystem.　　The new chipset is already in mass production. Furthermore, it has been adopted in SOXAI RING 2, the latest model launched on December 10th, 2025, by SOXAI, Inc. (“SOXAI” is pronounced “SOK-sai”.), the Japanese developer and distributor of the original sleep monitoring ring SOXAI RING. Evaluation boards and reference designs are also offered to facilitate integration. For more information, please contact a sales representative or submit an inquiry via the contact page on ROHM’s website.　　Going forward, ROHM will continue to promote device development that leverages miniaturization and low-power consumption technologies essential for wearable devices, contributing to improved user convenience and the continued growth of the wearable market.　　Specifications　　Case Study: SOXAI RING 2 Adoption Example SOXAI RING is the only smart ring for sleep management developed in Japan capable of accurately capturing and analyzing sleep data. It incorporates cutting-edge technologies such as an optical vital sensor, temperature sensor, accelerometer, Bluetooth® Low Energy communication, and NFC wireless charging functionality.　　The latest model, SOXAI RING 2, is equipped with Deep Sensing™, a proprietary photoplethysmography (PPG) sensor that significantly improves measurement accuracy, enabling the visualization of physical health changes with far greater depth and precision.　　Bluetooth® is a registered trademark of Bluetooth SIG, Inc. in the US.　　Deep Sensing™ is a trademark or registered trademark of SOXAI, Inc.
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Release time：2026-04-29 10:03 reading：267 Continue reading>>
Fullhan launches FH8626V300: 2M/3M <span style='color:red'>IP</span> Camera SoC
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Fullhan launches FH8626V300: 2M/3M IP Camera SoC

　　FH8626V300 is a cost-effective and easy to develop 2M/3M IP camera solution. The chip integrates a high-performance ISP module and H.264/JPEG encoder, delivering excellent image processing capability, high encoding quality, and low bitrates.It also incorporates 64MB DDR2 memory and provides a complete set of peripheral interfaces required for IP camera applications, including USB, SDIO, and Ethernet, making it suitable for a wide range of network camera products.FH8626V300 features a high-performance 0.5T NPU, enabling intelligent functions such as smart detection.
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Release time：2026-02-10 16:49 reading：3382 Continue reading>>
Murata expands lineup of high cutoff frequency chip common mode choke coils in 0504-inch size for automotive high-speed differential interfaces
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Murata expands lineup of high cutoff frequency chip common mode choke coils in 0504-inch size for automotive high-speed differential interfaces

　　Murata Manufacturing Co., Ltd. (hereinafter ‘Murata’) has added a high cutoff frequency*1 product to its lineup of noise suppression components, the 0504-inch size (1.25 x1.0mm) chip common mode choke coils ‘‘DLM11C_HH2 Series’’ (hereinafter, ‘the product’), suitable for automotive high-speed differential interfaces such as LVDS*2, SerDes*3, USB, and HDMI. Murata has already started mass production of this product.　　*1High cutoff frequency: Reduces high-frequency noise.　　*2LVDS (Low Voltage Differential Signaling): An interface used for LCD panels.　　*3SerDes (Serializer/Deserializer): Circuits that convert between the serial and parallel signals in each direction.　　In recent years, the automotive market has seen multiple USB ports installed in each vehicle seat as interfaces for connecting smartphones and PCs, and data transfer speeds have increased from conventional USB 2.0 to Gbps-class USB 3.2. For these differential interfaces, common mode noise suppression is essential, and small common mode choke coils that support high-speed signals are required. In response, Murata developed this product using proprietary lamination technology to reduce high-frequency noise above 7.5 GHz in a compact 0504-inch size.　　Specifications　　*4AEC-Q200: One of the standards defined by the Automotive Electronics Council (AEC).
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Release time：2025-11-10 17:12 reading：855 Continue reading>>
Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems
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Renesas Strengthens Power Leadership with New GaN FETs for High-Density Power Conversion in AI Data Centers, Industrial and Charging Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced three new high-voltage 650V GaN FETs for AI data centers and server power supply systems including the new 800V HVDC architecture, E-mobility charging, UPS battery backup devices, battery energy storage and solar inverters. Designed for multi-kilowatt-class applications, these 4th-generation plus (Gen IV Plus) devices combine high-efficiency GaN technology with a silicon-compatible gate drive input, significantly reducing switching power loss while retaining the operating simplicity of silicon FETs. Offered in TOLT, TO-247 and TOLL package options, the devices give engineers the flexibility to customize their thermal management and board design for specific power architectures.　　The new TP65H030G4PRS, TP65H030G4PWS and TP65H030G4PQS devices leverage the robust SuperGaN® platform, a field-proven depletion mode (d-mode) normally-off architecture pioneered by Transphorm, which was acquired by Renesas in June 2024. Based on low-loss d-mode technology, the devices offer superior efficiency over silicon, silicon carbide (SiC), and other GaN offerings. Moreover, they minimize power loss with lower gate charge, output capacitance, crossover loss, and dynamic resistance impact, with a higher 4V threshold voltage, which is not achievable with today’s enhancement mode (e-mode) GaN devices.　　Built on a die that is 14 percent smaller than the previous Gen IV platform, the new Gen IV Plus products achieve a lower RDS(on) of 30 milliohms (mΩ), reducing on-resistance by 14 percent and delivering a 20 percent improvement in on-resistance output-capacitance-product figure of merit (FOM). The smaller die size reduces system costs and lowers output capacitance, which results in higher efficiency and power density. These advantages make the Gen IV Plus devices ideal for cost-conscious, thermally demanding applications where high performance, efficiency and small footprint are critical. They are fully compatible with existing designs for easy upgrades, while preserving existing engineering investments.　　Available in compact TOLT, TO-247 and TOLL packages, they provide one of the broadest packaging options to accommodate thermal performance and layout optimization for power systems ranging from 1kW to 10kW, and even higher with paralleling. The new surface-mount packages include bottom side (TOLL) and top-side (TOLT) thermal conduction paths for cooler case temperatures, allowing easier device paralleling when higher conduction currents are needed. Further, the commonly used TO-247 package provides customers with higher thermal capability to achieve higher power.　　“The rollout of Gen IV Plus GaN devices marks the first major new product milestone since Renesas’ acquisition of Transphorm last year,” said Primit Parikh, Vice President of the GaN Business Division at Renesas. “Future versions will combine the field-proven SuperGaN technology with our drivers and controllers to deliver complete power solutions. Whether used as standalone FETs or integrated into complete system solution designs with Renesas controllers or drivers, these devices will provide a clear path to designing products with higher power density, reduced footprint and better efficiency at a lower total system cost.”　　Unique d-mode Normally-off Design for Reliability and Easy Integration　　Like previous d-mode GaN products, the new Renesas devices use an integrated low-voltage silicon MOSFET – a unique configuration that achieves seamless normally-off operation while fully capturing the low loss, high efficiency switching benefits of the high- voltage GaN. As they use silicon FETs for the input stage, the SuperGaN FETs are easy to drive with standard off-the-shelf gate drivers rather than specialized drivers that are normally required for e-mode GaN. This compatibility simplifies design and lowers the barrier to GaN adaptation for system developers.　　GaN-based switching devices are quickly growing as key technologies for next-generation power semiconductors, fueled by demand from electric vehicles (EVs), inverters, AI data center servers, renewable energy, and industrial power conversion. Compared to SiC and silicon-based semiconductor switching devices, they provide superior efficiency, higher switching frequency and smaller footprints.　　Renesas is uniquely positioned in the GaN market with its comprehensive solutions, offering both high- and low-power GaN FETs, unlike many providers whose success in the field has been primarily limited to lower power devices. This diverse portfolio enables Renesas to serve a broader range of applications and customer needs. To date, Renesas has shipped over 20 million GaN devices for high- and low-power applications, representing more than 300 billion hours of field usage.
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Release time：2025-07-04 15:04 reading：1160 Continue reading>>
Tumfei Valve Technology：The principle of common valves and their use
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Tumfei Valve Technology：The principle of common valves and their use

　　Tumfei Valve Technology has summarized the principle of common valves and their use. Let's learn about them together.　　First, the role of the valve　　1, opening and closing action - cut off or communicate the flow of fluid in the tube;　　2, regulating effect - regulating tube flow, flow rate;　　3, throttling effect - make the fluid through the valve to produce a large pressure drop;　　4. Other functions -a. Automatic opening and closing b. Maintain a certain pressure c, prevent steam drainage.　　Second, the type of valve　　1, according to the use of: cut-off valves, regulating valves, diverting valves, check valves, safety valves;　　2, according to the force points: he action with the valve, automatic action valve.　　Three, the main parameters of the valve　　PN nominal pressure (the maximum pressure that allows fluid to pass through);　　DN nominal diameter;　　TN Temperature range (permissible fluid temperature range).　　Forth， Check the valve before use　　Check items include:　　1, the internal and external surfaces of the valve body have sand holes, cracks and other defects;　　2. Whether the valve seat is firmly engaged with the valve body, whether the spool is consistent with the valve seat, and whether the sealing surface is defective;　　3, whether the valve stem and the spool connection is flexible and reliable, whether the valve stem is bent, whether the thread is damaged or corroded;　　4, packing, gasket is aging damage;　　5, the valve open is flexible, etc.　　Fifth，Problems often occur in the use of valves　　1, flange and thread leakage at the connection of the pipeline;　　2, packing culvert leakage, waist pad leakage and valve stem can not move;　　3, between the valve core and the seat is not tightly closed to form internal leakage.　　Sixth, the characteristics of commonly used valves and their use precautions　　(1) Plug Valve (Cock)　　Features: TN less than 150 degrees PN less than 1.6Mpa its simple structure, quick opening and closing, easy operation, low fluid resistance and other advantages　　Precautions for use:　　1, the outer end of the valve stem is square, the straight line marked by the diagonal is vertical and the direction of the valve body is closed, and the direction of the valve body is consistent with the open state;　　2, the normal switch valve with cock special wrench, to avoid sliding with the valve stem caused by safety accidents; Try not to use an adjustable wrench to cause slippage;　　3, open the valve according to the previous check item check, slowly open the valve after the check, try not to stand in the direction of the sealing surface when opening, encounter acid and alkali fluid must wear acid mask;　　4, if the pipeline has a sight mirror see the fluid in the sight mirror can be checked and left.　　(2) Ball valve:　　Ball valve and plug valve are the same type of valve, but the opening and closing part is a ball with a hole, and the center line of the ball valve stem rotates to achieve the purpose of opening and closing.　　Insulated ball valve with jacket　　Stainless steel ball valve　　Stainless steel ball valve quick opening ball valve　　Features: Valve structure is simple, reliable, used for two-way flow medium pipeline, fluid resistance is small, good sealing; Disadvantages; The medium is easy to leak from the stem.　　Precautions for use:　　Same as a plug valve;　　With a handle valve, the handle perpendicular to the medium flow direction for the closed state, consistent with the direction for the open state; If the ball valve with jacket insulation should pay attention to the following matters:　　The jacket insulation steam should be opened to melt the crystallizing medium in the valve before opening and closing the valve, do not forcibly open and close the valve before the medium is completely melted;　　When the valve cannot be opened, the method of lengthening the lever cannot be used to forcibly open the valve, because this will cause the valve stem to be resisted and the spool to fall off, causing damage to the valve or causing damage to the wrench, resulting in unsafe factors.　　(3) Butterfly valve　　The butterfly valve uses a rotating disc with a flexible shaft to control the opening and cosing of the pipeline, and the Angle size reflects the opening degree of the valve.　　According to the different transmission methods, the butterfly valve is split, pneumatic and electric three, commonly used for manual, rotating handle through the gear drive valve stem to open and close the valve.　　Features: Butterfly valve has the advantages of simple structure, rapid opening and closing, small fluid resistance, easy maintenance, etc., but it can not be used for high temperature and high pressure occasions, PN less than 1.6Mpa, t less than 120 degrees of large diameter water, steam, air, oil and other pipelines.　　Precautions for use:　　1, the spool can only be rotated 90 degrees, generally the valve body will indicate the direction of the CLOSE and OPEN arrows, the hand wheel clockwise rotation is closed, and the reverse is open;　　2, if sometimes there is a certain resistance to opening and closing, you can use a special P wrench to open the valve. But it can not be forced to open and close, otherwise the male will stir the thin rod gear:　　3. It is forbidden to remove the handwheel and report the hand vibration valve sample with activity; (Same goes for lower waist)　　4. Gradually open and close when opening and closing, observe whether there is any abnormal situation, and prevent leakage.　　(4) Stop valve　　The globe valve is the most widely used cut-off valve in chemical production. Compared with the above three cut-off valves, it is not the use of the rotation of its closing parts to open and close the valve, but the use of the valve stem to drive the circular valve disc (valve head) connected with it, and change the distance between the valve disc and the seat to control the valve opening and closing.　　Streamline type stop valve American standard stop valve　　Features: The upper part of the globe valve has a handwheel, valve stem, the middle has a thread and packing culvert sealing section, the small valve stem on the thread in the valve body, its compact structure, but the valve stem and the medium contact part, especially the thread part is easy to corroded, from the height of the valve stem exposed to the valve cover can be judged　　The globe valve structure is more complex, but the operation is simple, not very laborious, easy to adjust the flow rate and truncate the channel, slow closing without water hammer phenomenon, so it is more widely used.　　When installing the globe valve, pay attention to the direction of the fluid, the pipeline fluid should flow through the valve seat from the bottom up, and the so-called "low into high", the purpose is to reduce the fluid resistance, so that the valve stem and packing culvert are not in contact with the medium under the opening and closing state, to ensure that the valve stem and packing culvert are not damaged and leaked.　　The globe valve is mainly used for the pipeline of water, steam, compressed air and various materials, which can adjust the flow rate more accurately and strictly cut off the channel, but can not be used for materials with large viscosity and easy crystallization.　　Precautions for use:　　1, before opening to check the valve for defects, especially the filler culvert leakage:　　2, in the valve stem can not be directly rotated by hand, the special F wrench can be used to open and close, when it is still unable to open and close, please do not extend the wrench lever to force open and close, resulting in damage to the valve or cause safety accidents:　　3, when used for medium pressure steam pipeline valve, the condensate in the pipe should be drained first when opened. Then slowly open the valve with 0.2 to 0.3Mpa steam to preheat the pipeline, to avoid the sudden opening of pressure caused by damage to the sealing surface, called the normal inspection after the pressure to adjust the required state　　(5) Gate valve　　Gate valve, also known as gate valve or gate valve, it is through the lift of the gate to control the valve opening and closing, the gate is straight to the direction of the fluid, change the relative position between the gate and the seat can change the size of the channel.　　Open stem gate valve Dark stem gate valve　　According to the different movement of the valve stem when the gate valve is opened and closed, the gate valve has two kinds of distinct rod type and dark rod type.　　Open rod gate valve stem thread strike outside the valve body, open the valve stem out of the handwheel, its advantage is that according to the length of the valve stem to determine the size of the valve open, the valve stem and the medium contact length is small, the thread part is basically not affected by the medium corrosion, the disadvantage is that the height of the overhang space.　　The valve stem thread inside the valve stem and the internal thread on the gate plate want to match, open the valve stem only rotation without up and down, the gate rises along the valve stem thread. The advantage of dark rod gate valve is that the overhang space is small, the disadvantage is that the opening of the valve can not be judged according to the condition of the valve stem, and the valve stem thread is easily corroded by long-term contact with the medium.　　Gate valve has the advantages of small fluid resistance, constant medium flow direction, slow opening without water hammer phenomenon, easy to adjust the flow rate, etc. The disadvantages are complex structure, large size, long opening and closing time, and difficult maintenance of sealing surface. Due to the large bore feed pipe　　1, when the valve stem is opened and closed in place, it can not be forced to force, otherwise it will break the internal thread or latch screw, so that the valve is damaged;　　2, open and close the valve when the hand can not be directly started, F wrench can be used to open and close;　　3. When opening and closing the valve, pay attention to the sealing surface of the valve, especially the packing gland to prevent leakage.　　(6) Throttle valve　　Throttle valve, also known as needle valve, its shape is similar to the globe valve, its valve core shape is different, back to the base or parabola, often used in the instrument, often bundle connection.　　Precautions for use:　　1, because of the threaded connection, first check whether the threaded connection is loose when opening and closing;　　2, open and close the valve slowly, because the flow area is small, the flow rate is large, may cause corrosion of the sealing surface, should pay attention to observe, pay attention to the change of pressure.　　(7) Check valve　　Check valve is a valve that automatically opens and closes by using the pressure difference between the medium before and after the valve to control the one-way flow of the medium, also known as check valve or check valve.　　Check valves are divided into two types according to different structures: lifting type (jumping type) and swinging type (shaking pole type).　　Lift type swing type　　Precautions for use:　　Pay attention to the direction of the valve, the arrow is consistent with the flow direction of the medium, such as the medium easy crystallization may cause the valve disc can not be pressed down to play the role of command and check.　　(8) Safety valve　　The safety valve is a kind of valve that automatically opens and closes according to the medium pressure. When the medium pressure exceeds a certain value, it can automatically open the valve to discharge pressure relief, so that the equipment pipeline is free from the danger of damage, and can automatically close after the pressure returns to normal.　　According to the way of balancing the internal pressure, the safety valve is divided into two categories: lever weight type and spring type.　　Precautions for use:　　1, the safety valve must be used within the validity period;　　2, the safety valve control valve installed on the pipeline and equipment is usually the globe valve must be opened to ensure that the safety valve can work effectively;　　3. Periodically lift the valve disc slightly and use the medium to blow the impurities in the valve.　　4, if the safety valve can not work within the setting pressure, it must be re-validated or replaced　　(9) Steam trap　　Steam trap is a kind of valve that can automatically and intermittently remove condensate and prevent steam from leaking out in steam pipeline, heater and other equipment systems. Commonly used are bell-shaped float type, thermal power type and pulse type.　　Precautions for use:　　1, use the pipeline bypass valve to remove condensate before use, when there is steam to close the bypass, start the trap path, otherwise the valve will be closed water can not play the role of drainage;　　2. Be careful not to be scalded by steam when opening and closing the valve.　　(10) All kinds of sampling valves　　As the name suggests, the sampling valve is a valve used to obtain media samples so that chemical analysis can be performed, generally installed in equipment or pipelines are roughly divided into the following categories:　　Double opening valves, flanged clip valves, and sampling valves with insulated jacket:　　Use note method:　　1, the double opening valve is generally composed of two ball valves, to sample safety and achieve the purpose of sampling through linkage in the negative pressure device; When sampling, close the second valve near the equipment and pipeline and open the first valve. Let the medium flow into the space between the two valves; Then close the first valve, open the second valve, and place the sampling vessel into the sampling port to contain the medium;　　2. The flange clip valve is generally sealed through the top cone of the valve stem and the cone hole of the seat, and the valve stem is separated from the cone hole by turning the hand wheel during sampling, so that the medium can flow from the cone hole to the external sampling vessel;　　3, with jacket insulation sampling valve should pay attention to the following matters:　　I should open the jacket insulation steam to melt the crystallizable medium in the valve before opening and closing the valve, do not forcibly open and close the valve before the medium is completely melted;　　When the valve cannot be opened, the method of lengthening the lever cannot be used to forcibly open the valve, because this will cause the valve stem to suffer greater resistance and the valve core to fall off, or cause the valve stem and the cone hole sealing surface to be damaged. from　　And cause damage to the valve or cause damage to the wrench, resulting in unsafe factors.　　(11) Fluorine plastic lined rubber valve　　Fluorine plastic lined rubber valve is mainly used in acid and alkali and other corrosive media, its structure principle is similar to the unlined fluorine plastic valve, but its stem, valve core, valve seat are used fluorine plastic substrate, its use method is similar.　　Classification of valves　　There are many kinds of valves. With the continuous improvement of the process flow and performance of various complete sets of equipment, the types of valves are still increasing, and there are a variety of classification methods.　　According to the automatic and drive classification, can be divided into:　　1) Automatic valves rely on the ability of the medium (liquid, air, steam, etc.) to operate by itself. Such as safety valves, check valves, pressure reducing valves, steam traps, solenoid valves, air traps, emergency cut-off valves, etc.　　2) Drive valves Valves that are operated manually, electrically, hydraulically or pneumatic. Such as gate valve, globe valve, throttle valve, butterfly valve, ball valve, plug valve and so on.　　According to the use and function classification, can be divided into:　　1) The cut-off valve is mainly used to cut off or connect the medium flow in the pipeline. Such as globe valve, gate valve, ball valve, plug valve, butterfly valve, diaphragm valve and so on.　　2) Check valves are used to prevent the backflow of the medium. Such as a variety of different structures of the check valve.　　3) Regulating valves are mainly used to regulate the pressure and flow of the pipeline medium. Such as regulating valve, throttle valve, pressure reducing valve and so on.　　4) The diverter valve is used to change the direction of the flow of the medium in the pipeline, and plays the role of distributing, diverting or mixing the medium.　　Such as various structures of distribution valves, three-way or four-way plug valves, three-way or four-way ball valves, various types of traps and so on.　　5) Safety valves are used for overpressure safety protection, discharge of excess media, and prevent pressure from exceeding the specified value. Such as various types of safety valves.　　6) Multi-purpose valves are used to replace two, three or even more types of valves. Such as stop check valve, check ball valve, stop check safety valve, etc.　　7) Other special valves such as blowdown valve, blowdown valve, coke valve, pigging valve, etc.
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Release time：2025-06-17 14:09 reading：1298 Continue reading>>
GigaDevice Launches New EtherCAT® SubDevice Controller Chip An Excellent Choice for Industrial Automation
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GigaDevice Launches New EtherCAT® SubDevice Controller Chip An Excellent Choice for Industrial Automation

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, announced today the official launch of its EtherCAT® SubDevice Controller chip.　　GigaDevice has received official authorization from Beckhoff and launched its first EtherCAT® SubDevice Controller, GDSCN832, along with the ultra-high performance industrial automation MCU series GD32H75E, which incorporates the EtherCAT® SubDevice Controller. These new products are tailored to meet the demands of the industrial automation market, providing optimal solutions for applications such as servo control, variable frequency drives, industrial PLCs, and communication modules, thanks to their exceptional processing power and extensive interface resources. Samples and development boards are now available, with mass production scheduled for 2nd quarter of 2025.　　GigaDevice EtherCAT® SubDevice Controller Chip　　EtherCAT® SubDevice Controller: Achieving Ultra-Fast Response Time　　The GDSCN832 series is a 2/3-port EtherCAT® SubDevice Controller integrating two internal PHYs and one MII extension interface. It has a dual-channel integrated Ethernet physical layer device, with each channel offering a full-duplex 100BASE-TX transceiver supporting 100 Mbps operation. This series supports eight Fieldbus Memory Management Units (FMMU), enhancing data processing performance and security while effectively reducing memory access latency to improve system response time and real-time performance, providing users with high flexibility in data mapping. Additionally, it supports eight Sync Manager entities for efficient memory management.　　The GDSCN832 series includes up to 8 KB of Dual-Port RAM (DPRAM), facilitating large data processing capabilities for complex control systems. It incorporates a 64-bit distributed clock with a host bus interface that achieves equivalent functionality through high-speed synchronous/asynchronous device interfaces, with a precision below 1 µs. This product series supports 8/16-bit serial/parallel port communication, SPI/QSPI/OSPI device interfaces with communication speeds up to 100 MHz, and EXMC synchronous mode. Its diverse interface options provide users with greater flexibility in interface configuration. An integrated 1.1V core regulator supports operation with a single 3.3V power supply and allows for variable voltage I/O from 1.8V to 3.3V. The GDSCN832 supports HP Auto-MDIX, enabling direct or crossover LAN cable connections. Four low-power modes are available to balance energy efficiency and power consumption.　　With its high integration, flexibility, and stability, the GDSCN832 is ideal for applications such as motor motion control, data acquisition, industrial automation, communication modules, and sensors. The series comes in a compact QFN64 package, along with a development and evaluation board, providing a cost-effective EtherCAT® SubDevice Controller device solution for developers.　　GD32H75E Series EtherCAT® Industrial Automation MCUs: Combining Superior Control and Efficient Communication Capabilities　　GigaDevice has launched the GD32H75E series, its first high-performance MCU product authorized by Beckhoff to integrate the EtherCAT® SubDevice Controller. Combining the GDSCN832 series chip with a high-performance MCU, this product offers a seamless solution for diverse industrial automation applications, including servo motor control, variable frequency drives, industrial PLCs, and communication modules.　　Building on the exceptional features of the GD32H7 series, the GD32H75E series uses an Arm® Cortex®-M7 high-performance core with a frequency of up to 600 MHz. It includes an advanced DSP hardware accelerator, a double-precision floating-point unit (FPU), a hardware trigonometric accelerator (TMU), and a filter algorithm accelerator (FAC). The series offers on-chip Flash memory ranging from 1024 KB to 3840 KB and 1024 KB of SRAM, with 512 KB configurable tightly coupled memory (ITCM, DTCM) for zero-wait execution of critical instructions and data. All Flash and SRAM regions support ECC verification, enhancing system reliability. Additionally, it features a 64 KB L1-Cache (I-Cache, D-Cache) to further improve CPU efficiency and real-time performance.　　The GD32H75E provides a wealth of peripheral resources, including 8 USARTs, 4 I2Cs, 6 SPIs, 4 I2S, and an 8-line OSPI (backward compatible with 4-line QSPI). It supports 2 USB 2.0 OTG interfaces with Full Speed and High Speed modes and includes 3 CAN-FD controllers. The series also features four 32-bit general-purpose timers, twelve 16-bit general-purpose timers, four 64-bit/32-bit basic timers, and two advanced PWM timers. Two 14-bit ADCs provide sampling rates up to 4 MSPS, with one 12-bit ADC reaching 5.3 MSPS, along with a fast comparator (COMP) and DAC for high-precision analog functions. A high-performance digital filter module (HPDF) for external Σ-Δ modulators and an encoder divide output controller (EDOUT) are also integrated, making it ideal for high-precision motion control systems.
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Release time：2025-05-21 16:53 reading：1648 Continue reading>>
EMC components: TDK offers multilayer chip beads with the industry's highest rated current of 8 A for power supply lines
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EMC components: TDK offers multilayer chip beads with the industry's highest rated current of 8 A for power supply lines

　　TDK Corporation (TSE: 6762) has expanded its MPZ1608-PH series of large-current multilayer chip beads for automotive and commercial power supply lines (1.6 x 0.8 x 0.6 mm – L x W x H). Mass production of the product series began in May 2025.　　These 1608-size chip beads for power supply lines achieve a rated current of 8 A, the industry’s highest value*. Chip beads are used as noise suppression components in power and signal circuits. In a circuit with a current of 8 A or more, usually two or more chip beads must be used in parallel. This has the disadvantage that the current is not evenly distributed between the ferrite beads. TDK’s new product simplifies the circuit structure because fewer components are required compared to conventional methods, and it improves the quality of power circuits.　　The MPZ1608-PH series of products halves the component footprint in comparison with circuits using two conventional 1608-sized chip beads. Moreover, the highly reliable components with a specified operating temperature of up to +125 °C are designed to be used in high-temperature environments like automotive and industrial equipment applications.　　With TDK’s proprietary materials and structural designs adapted to market needs, the company is committed to expanding its lineup of high rated current products in the automotive, industrial equipment, and consumer equipment areas. These chip beads will serve as EMC components contributing to the enhancement of the quality of power circuits.　　Glossary　　EMC: electromagnetic compatibility　　Main applications　　Power circuit for different pieces of equipment: in-vehicle ECUs, power train, vehicle body control, automotive multimedia (telematics), base stations, PCs, servers, set-top box, smart grids, robots, smartphones, tablet devices, etc.　　Main features and benefits　　Compatible with large currents as high as 8 A　　Reduces components and footprint　　Highly reliable; can be used in high-temperature environments like automotive applications　　Key data
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Release time：2025-05-16 13:45 reading：842 Continue reading>>
DENSO and ROHM Reach Basic Agreement to Establish a Strategic Partnership in the Semiconductor Field
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DENSO and ROHM Reach Basic Agreement to Establish a Strategic Partnership in the Semiconductor Field

　　DENSO CORPORATION and ROHM Co., Ltd. are pleased to announce that the two companies have reached a basic agreement to establish a strategic partnership in the semiconductor field. This agreement follows discussions and considerations that began in September 2024.　　Recently, the importance of semiconductors that support the electrification and intelligence of vehicles has been increasing significantly. This is driven by the development and spread of electric vehicles aimed at achieving carbon neutrality, as well as the realization of automated driving, which is expected to contribute to zero fatalities in traffic accidents.　　DENSO and ROHM have a long-standing collaboration in the trade and development of automotive semiconductors. Going forward, both companies will integrate DENSO's advanced system construction capabilities in the automotive sector with ROHM's cutting-edge semiconductor technology, cultivated in the consumer market. This partnership will focus on enhancing the lineup of high-quality devices, particularly analog ICs, that support vehicle electrification and intelligence, and deepening collaboration in development. Additionally, in highly compatible fields within their semiconductor businesses, both companies will discuss broad collaboration. By globally supplying products created through this co-creation, both companies aim to contribute to technological innovation in the automotive field and realize a sustainable mobility society.　　To further solidify this partnership, DENSO and ROHM will continue to consider strengthening their capital relationship.　　DENSO CORPORATION President & CEO, Shinnosuke Hayashi　　DENSO positions semiconductors as key devices to realize next-generation vehicle systems and has been deepening its cooperative relationships with semiconductor manufacturers that possess rich experience and knowledge. ROHM has a wide range of semiconductor lineups that are crucial for automotive electronics products, essential for vehicle intelligence and electrification. We are very pleased that the partnership with ROHM is progressing smoothly. By further deepening the collaboration between both companies and integrating DENSO's accumulated automotive technology and expertise, we believe we can contribute to the development of the mobility society through stable supply and enhanced product value.　　ROHM Co., Ltd. President (Representative Director), Katsumi Azuma　　We are very pleased to deepen our collaborative relationship with DENSO, a leader in technological innovation for the mobility society. This partnership not only strengthens our relationship as suppliers but also envisions broad collaboration in the semiconductor business of both companies. Initially, we will focus on the development of analog ICs related to next-generation systems such as electrification, automated driving, and connected vehicles. Furthermore, without narrowing the scope, we will integrate our respective technologies, knowledge, and assets across a wide range of fields to contribute to technological innovation and stable supply in the automotive industry.
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Release time：2025-05-13 15:12 reading：844 Continue reading>>
ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs
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ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs

　　ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.　　In recent years, the rapid electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technological breakthroughs to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.　　The HSDIP20 features an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.　　Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.　　Product Lineup　　*1: Tc=25°C VGS=18V *2: Combines chips with different ON resistances　　*3: Q1, Q4 pins *4: Q2, Q3, Q5, Q6 pins　　Application Examples　　Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.　　◇ Automotive systems　　Onboard chargers, electric compressors and more.　　◇ Industrial equipment　　EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.　　Sales Information　　Pricing: $100/unit (samples, excluding tax)　　Availability: OEM quantities (April 2025)　　Supporting Information　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation under close to actual circuit conditions.　　For more information, please contact AMEYA360 or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　・EcoSIC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Power Factor Correction (PFC)　　A circuit that enhances the power factor by shaping the waveform of input power in the power supply circuit. By using a PFC circuit, the input power is made closer to a sine wave (power factor = 1), improving power conversion efficiency. While PFC circuits typically rely on diode rectification, OBCs often employ active bridge rectification using MOSFETs or bridgeless PFC. This approach is favored because MOSFETs offer lower switching losses, and especially in high power PFCs, using SiC MOSFETs reduces heat generation and power losses.　　LLC Converter　　A type of resonant DC-DC converter known for its high efficiency with low noise power conversion. The name LLC comes from its basic configuration, which combines two inductors (L) and a capacitor (C) in the circuit. By forming a resonant circuit, switching losses are significantly reduced, making it ideal for applications requiring high efficiency, such as OBCs, power supplies for industrial equipment, and server power supplies.
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Release time：2025-04-24 17:23 reading：872 Continue reading>>

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