Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024
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Fibocom Launches a Series of On-device AI Solutions for Compute-intensive Applications powered by Qualcomm-based Platforms at Computex 2024

　　Inevitably, the adoption of generative AI and LLM (Large Language Model) has fueled more intelligence and efficiency in our lives and works than in the past decade. Moving forward, the demand for running AI and LLM at the edge devices is growing as it provides lower latency, higher privacy, and more flexibility, which is set to redefine the level of intelligence of smart devices as well as broaden the landscape of mobile scenarios.　　Taipei, Taiwan – June 7th 2024 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, launches a series of on-device AI solutions powered by Qualcomm® QCS8550 and QCM6490 processors from Qualcomm Technologies, Inc. The solutions are designed to satisfy compute-intensive application scenarios such as robotics, automated vehicles, video collaborations, smart retailing, etc., accelerating industrial digitalization and intelligent transformation.　　Flagship on-device AI solution powered by Qualcomm QCS8550 processor　　Utilizing the powerful Qualcomm QCS8550 processor, Fibocom’s flagship on-device AI solution is designed to deliver strong performance and unparalleled multimedia capabilities. Equipped with an octa-core CPU and an Adreno™ 740 GPU, the solution can support up to 4 concurrent displays, and 8K video encoding and decoding. It serves as a strong core for industries requiring high-definition video playing, fast data analytics and lower latency like automated vehicles, robotics, remote medical surgery, computer vision systems, live streaming, videoconference systems, and more.　　Premium on-device AI solution powered by Qualcomm QCM6490 processors, piloting the high-end AIoT market　　The solution developed using the Qualcomm QCM6490 processor, features an octa-core processor with high-speed HVX (Hexagon Vector Extension) technology, and a high-performance graphics engine to allow smooth 4K video playing and multi-channel camera inputs. In addition, the solution is capable of allowing a maximum of 5 ISPs (Image Signal Processing) and up to 5-8 camera streams simultaneously, helping customers to ease their concerns on multi-camera deployments as well as dual-screen display scenarios. The solution offers flexible wireless connections such as 5G, Wi-Fi, Bluetooth, and is equipped with a GNSS receiver for precise navigation both indoors and outdoors. In terms of software, the solution supports the mainstream operating systems: Android, Linux, and Windows. Leveraging the computing power of up to 13 TOPS, the solution efficiently helps customers handle data-intensive computation and processing, running various 1.3B/3B/7B open-source LLMs on the device, making it an ideal solution for smart retail, in-vehicle infotainment (IVI) and industrial inspection.　　“We are excited to see our powerful Qualcomm processors, the QCS8550 and QCM6490, being utilized in Fibocom's innovative on-device AI solutions,” stated Dev Singh, Vice President of Business Development and Head of building, enterprise & industrial automation at Qualcomm Technologies, Inc. “This collaboration is a testament to our commitment to advancing AI capabilities at the edge, enhancing performance and efficiency across a range of applications from industrial automation to smart retail.”　　"It is paramount to master the productivity of AI and create value-added solutions from the edge side for our customers that are in urgent need of building their smart devices based on our solutions. We are thrilled to develop these solutions based on the advanced and powerful chipsets from Qualcomm Technologies, as it not only provides the fundamental architecture of edge intelligence, also enriches flexibility in network connections such as 5G/Wi-Fi/Bluetooth," said Ralph Zhao, VP of MC BU at Fibocom. "In collaboration with Qualcomm Technologies, Fibocom is dedicated to injecting new versatility to the future of intelligence, and accelerating the implementation of our collaboration in robotics, industrial automation, live streaming, and more."
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Release time：2024-06-18 16:12 reading：843 Continue reading>>
Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades
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Tech Giants Launch AI Arms Race, Aiming to Spark a Wave of Smartphone and Computer Upgrades

　　According to CNA’s news, the potential business opportunities in artificial intelligence have spurred major tech giants, with NVIDIA, AMD, Intel, MediaTek, and Qualcomm sequentially launching products featuring the latest AI capabilities.　　This AI arms race has expanded its battleground from servers to smartphones and laptops, as companies hope that the infusion of AI will inject vitality into mature markets.　　Generative AI is experiencing robust development, with MediaTek considering this year as the “Generative AI Year.” They anticipate a potential paradigm shift in the IC design industry, contributing to increased productivity and significantly impacting IC products.　　This not only brings forth new applications but also propels the demand for new algorithms and computational processors.　　MediaTek and Qualcomm recently introduced their flagship 5G generative AI mobile chips, the Dimensity 9300 and Snapdragon 8 Gen 3, respectively. The Dimensity 9300, integrated with the built-in APU 790, enables faster and more secure edge AI computing, capable of generating images within 1 second.　　MediaTek points out that the smartphone industry is experiencing a gradual growth slowdown, and generative AI is expected to provide new services, potentially stimulating a new wave of consumer demand growth. Smartphones equipped with the Dimensity 9300 and Snapdragon 8 Gen 3 are set to be released gradually by the end of this year.　　Targeting the AI personal computer (PC) market, Intel is set to launch the Meteor Lake processor on December 14. Two major computer brands, Acer and ASUS, are both customers for Intel’s AI PC.　　High-speed transmission interface chip manufacturer Parade and network communication chip manufacturer Realtek are optimistic. The integration of AI features into personal computers and laptops is expected to stimulate demand for upgrades, leading to a potential increase in PC shipments next year.　　In TrendForces’ report on November 8th, it has indicated that the emerging market for AI PCs does not have a clear definition at present, but due to the high costs of upgrading both software and hardware associated with AI PCs, early development will be focused on high-end business users and content creators.　　For consumers, current PCs offer a range of cloud AI applications sufficient for daily life and entertainment needs. However, without the emergence of a groundbreaking AI application in the short term to significantly enhance the AI experience, it will be challenging to rapidly boost the adoption of consumer AI PCs.　　For the average consumer, with disposable income becoming increasingly tight, the prospect of purchasing an expensive, non-essential computer is likely wishful thinking on the part of suppliers. Nevertheless, looking to the long term, the potential development of more diverse AI tools—along with a price reduction—may still lead to a higher adoption rate of consumer AI PCs.　　Read more　　Key Development Period for AI PCs in 2024; Global Notebook Market Set to Rebound to Healthy Supply-Demand Cycle with an Estimated Growth Rate of 3.2%, Says TrendForce。
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Release time：2023-11-21 10:41 reading：436 Continue reading>>
AMD Discusses Future of High-performance and Adaptive Computing at CES 2023
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AMD Discusses Future of High-performance and Adaptive Computing at CES 2023

　　AMD Chair and CEO Dr. Lisa Su detailed the significant role high-performance and adaptive computing plays in creating solutions to the world’s most important challenges during her live keynote at CES 2023.　　“It is an honor to kick off CES 2023 and highlight all the ways AMD is pushing the envelope in high-performance and adaptive computing to help solve the world’s most important challenges,” said Dr. Su. “Together with our partners, we highlighted how AMD technology is advancing what is possible in AI, hybrid work, gaming, healthcare, aerospace and sustainable computing. We also launched multiple new mobile, gaming and AI chips that will make 2023 an exciting year for AMD and the industry.”　　AMD Product Innovation at CES 2023　　AMD announced new mobile and desktop processors to serve every type of user, from casual gamers and content creators to professionals and hybrid workers, along with new graphics solutions to bring the power of high-performance gaming to mobile.　　The AMD Ryzen 7000X3D Series processors with AMD 3D V-Cache technology, the fastest gaming processors in the world2.　　AMD Radeon RX 7000 Series Graphics for Laptops based on the AMD RDNA 3 architecture offering exceptional energy efficiency and performance to power 1080p gaming at ultra settings and advanced content creation applications on next-generation premium laptops.　　Dr. Su also shared the company’s latest advances to enable pervasive AI, including previewing new products to broaden its AI product portfolio from edge to cloud.　　AMD adaptable computing and AI technology powers the world’s most important medical solutions, enabling faster diagnoses and drug discoveries and better patient care. At CES, AMD announced the AMD Vitis Medical Imaging libraries to bring premium medical imaging products to market faster by reducing development times. These software libraries accelerate premium medical imaging on AMD Versal SoC devices with AI Engines to deliver healthcare providers and their patients high-quality, low-latency imaging.　　Finally, AMD adaptive computing solutions help satellites and spacecraft compute data and leverage pervasive AI to derive insights. During the keynote, Dr. Su shared how AMD FPGAs and adaptive SoCs are helping to shape the future of space exploration, powering recent space missions from Mars Curiosity and Perseverance to the recently launched Artemis moon mission.
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Release time：2023-01-11 13:50 reading：3132 Continue reading>>
Imec, CEA-Leti Form AI and Quantum Computing Hub
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Imec, CEA-Leti Form AI and Quantum Computing Hub

Two of Europe’s key electronics and nanotechnologies research institutes — imec in Belgium and CEA-Leti in France — will collaborate to develop a European hub for artificial intelligence and quantum computing.As security and privacy issues rise up the agenda in almost every organization, the race is on to process more at the edge and put more intelligence at endpoints. For electronics systems design, most of the major chip companies now offer or are developing deep learning and edge AI devices or intellectual property. The edge AI devices are often complete computer sub-systems displaying intelligent behavior locally on the hardware devices (chips), analyzing their environment and taking required actions to achieve specific goals.Edge AI is considered now to hold the promise of solving many societal challenges — from treating diseases that cannot yet be cured today, to minimizing the environmental impact of farming. Decentralization from the cloud to the edge is a key challenge of AI technologies applied to large heterogeneous systems. This requires innovation in the components industry with powerful, energy-guzzling processors.This is where imec and CEA-Leti hope to develop a European center of excellence. The two organizations signed a memorandum of understanding during the state visit of French president Emmanuel Macron to Belgium, laying the foundation for a strategic partnership in AI and quantum computing, two key strategic value chains for European industry, to strengthen European strategic and economic sovereignty.The joint efforts of imec and CEA-Leti underline Europe’s ambition to take a leading role in the development of these technologies. The research centers’ increased collaboration will focus on developing, testing and experimenting neuromorphic and quantum computing — and should result in the delivery of a digital hardware computing toolbox that can be used by European industry partners to innovate in a wide variety of application domains — from personalized healthcare and smart mobility to the new manufacturing industry and smart energy sectors."The ability to develop technologies such as AI and quantum computing — and put them into industrial use across a wide spectrum of applications —  is one of Europe’s major challenges," said Luc Van den hove, president and CEO of imec, in a press statement. "Both quantum and neuromorphic computing (to enable artificial intelligence) are very promising areas of innovation, as they hold a huge industrialization potential.”  Van den hove said a stronger collaboration in these domains between imec and CEA-Leti would help to speed up the technologies’ development time, providing them with the critical mass needed to create faster impact.Emmanuel Sabonnadière, CEA-Leti CEO, said the collaboration with imec as well as previous innovation-collaboration agreements with Germany's the Fraunhofer Group for Microelectronics "will focus all three institutes to the task of keeping Europe at the forefront of new digital hardware for AI, HPC and cyber-security applications.”Imec and CEA-Leti are inviting partners from industry as well as academia to join them and benefit from access to the research centers’ technology —  enabling a much higher degree of device complexity, reproducibility and material perfection while sharing the costs of precompetitive research.
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Release time：2018-11-22 00:00 reading：1205 Continue reading>>
Imec and CEA-Leti join forces on Artificial Intelligence and Quantum Computing
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Imec and CEA-Leti join forces on Artificial Intelligence and Quantum Computing

The Belgian research centre imec and the French research institute CEA-Leti, two leading research and innovation hubs in nanotechnologies for industry, have signed a memorandum of understanding (MoU) that lays the foundation of a strategic partnership in the domains of Artificial Intelligence and quantum computing.The joint efforts of imec and CEA-LETI underline Europe’s ambition to take a leading role in the development of these technologies and this increased collaboration will focus on developing, testing and experimenting neuromorphic and quantum computing – and should result in the delivery of a digital hardware computing toolbox that can be used by European industry partners to innovate in a wide variety of application domains – from personalised healthcare and smart mobility to the new manufacturing industry and smart energy sectors.Edge Artificial Intelligence (eAI) commonly refers to computer systems that display intelligent behavior locally on the hardware devices (e.g chips). They analyse their environment and take the required actions to achieve specific goals.Edge AI is poised to become a key driver of economic development. And, even more importantly perhaps, it holds the promise of solving many societal challenges – from treating diseases that cannot yet be cured today, to minimising the environmental impact of farming.Decentralisation from the cloud to the edge is a key challenge of AI technologies applied to large heterogeneous systems. This requires innovation in the components industry with powerful, energy-guzzling processors.“The ability to develop technologies such as AI and quantum computing – and put them into industrial use across a wide spectrum of applications – is one of Europe’s major challenges. Both quantum and neuromorphic computing (to enable artificial intelligence) are very promising areas of innovation, as they hold a huge industrialisation potential,” said Luc Van den hove, president and CEO of imec.“A stronger collaboration in these domains between imec and CEA-Leti, two of Europe’s leading research centers, will undoubtedly help to speed up the technologies’ development time: it will provide us with the critical mass that is required to create more – and faster – impact, and will result in plenty of new business opportunities for our European industry partners.”“Two European microelectronics pioneers today are joining forces to raise the game in both high-performance computing and trusted AI at the edge, and ultimately to fuel European industry success through innovations in aeronautics, defence, automobiles, Industry 4.0 and health care,” said Emmanuel Sabonnadière, Leti CEO. “This collaboration with imec following earlier innovation-collaboration agreements with the Fraunhofer Group for Microelectronics of the Fraunhofer-Gesellschaft, the largest organization for applied research, will focus all three institutes to the task of keeping Europe at the forefront of new digital hardware for AI, HPC and Cyber-security applications.”Imec and CEA-Leti are inviting partners from industry as well as academia to join them and benefit from access to the research centers’ state-of-the-art technology with proven reproducibility – enabling a much higher degree of device complexity, reproducibility and material perfection while sharing the costs of precompetitive research.
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Release time：2018-11-21 00:00 reading：1039 Continue reading>>
Apple announces new iPad Pro and Mac computers at its Brooklyn launch event
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Apple announces new iPad Pro and Mac computers at its Brooklyn launch event

Apple unveiled its latest iPad Pro models and Mac computers at an event in Brooklyn on Tuesday, offering long-awaited updates to some of its most popular devices.The new iPad Pros eliminate the home button and incorporate Apple's facial recognition technology, Face ID, that was introduced with the company's iPhone X product line last year.The tablets feature the same edge-to-edge LCD display that Apple introduced with the recently released iPhone XR, and they come with 11- and 12.9-inch displays. The Pro is thinner than ever and comes with sharper edges.The iPads run on A12X bionic chips, a notch more powerful than Apple's high-end iPhone XS and XS Max smartphones. They ship with up to 1 terabyte of storage, and trade out Apple's typical Lightning port for a USB-C port, similar to high-end computers. The USB-C port will also let users connect accessories like digital cameras and high-resolution desktop displays to the iPad Pro. It does not have a traditional headphone jack, which means you will need an adapter to plug in your headphones.The new iPad Pro starts at $799 for the 11-inch model and $999 for the 12.9-inch model. Both models are available to order Tuesday and will arrive on Nov. 7.Apple updated its high-tech stylus, the Apple Pencil, as well. It now magnetically attaches to the tablet to charge wirelessly. It also has touch gestures for switching between digital drawing tools on the iPad.MacBook AirThe new MacBook Air comes with a 13.3-inch, edge-to-edge retina display, as well as Touch ID that allows users to unlock the device with the scan of a fingerprint. The sensor sits in the keyboard and enables touch-based Apple Pay.Apple revamped the keyboard and track pad, too, and upgraded the microphones and speakers for better audio. The new MacBook Air offers up to 16GB of storage — double the memory capacity of its predecessor.Apple said it has made the computer lighter and reduced its overall volume by 17 percent. Every new MacBook Air is made entirely from recycled aluminum, the company said.The new MacBook Air starts at $1,199, about $100 cheaper than the baseline MacBook computer, but more expensive than the last generation of MacBook Air, which started at $999. It's available to order Tuesday, and will be available for pickup Nov. 7.Apple shows off new MacBook Air in Brooklyn.Mac miniApple also introduced a new Mac mini Tuesday, in the first update to the smaller Mac model in four years.The Mac mini is a desktop computer that connects to an external monitor. It comes with up to 64GB of memory and works five times faster than its predecessor, Apple said. Like the new Air, it's made entirely of recycled aluminum.It starts at $799, and it too is available to order Tuesday. It will be available for pickup Nov. 7.Finally on Tuesday, Apple announced its latest operating system, iOS 12.1 is available to install for iPhone and iPad users.
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Release time：2018-10-31 00:00 reading：1092 Continue reading>>
TSMC says computer virus will slow shipments and cause additional costs
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TSMC says computer virus will slow shipments and cause additional costs

TSMC anticipates that a recent computer virus outbreak, which occurred due to misoperation during the software installation process for a new tool and affected a number of computer systems and fab tools in Taiwan, will cause shipment delays and additional costs. The degree of infection varied by fab, according to TSMC, who said it has since contained the problem and found a solution. About 80% of the company’s impacted tools have been recovered, and the company expects full recovery on August 6.In a statement, TSMC said: “We estimate the impact to third quarter revenue to be about three per cent, and impact to gross margin to be about one percentage point. The company is confident shipments delayed in third quarter will be recovered in the fourth quarter 2018, and maintains its forecast of high single-digit revenue growth for 2018 in U.S. dollars given on July 19, 2018.”TSMC has said data integrity and confidential information was not compromised during the breach and it has now taken actions to close this security gap and further strengthen security measures.
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Release time：2018-08-08 00:00 reading：1146 Continue reading>>
Edge Computing Will Drive the Growth of Micro Server, Boosting the Demand for Server DRAM
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Edge Computing Will Drive the Growth of Micro Server, Boosting the Demand for Server DRAM

DRAMeXchange, a division of TrendForce, estimates that x86-based solutions will continue to be the market mainstream in 2018, with a global shipment share of 97%. Intel and AMD will continue to lead the development of server. Particularly, in the sector of Internet Datacenter, solutions based on the x86 architecture will still dominate the market due to its wide product range.According to Mark Liu, senior analyst at DRAMeXchange, enterprise servers contribute to around 60% of the global server shipments, while hyperscale server applications account for around 30%. The demand for micro servers used in edge computing is projected to see significant growth in the next 3 to 5 years due to the construction of data center and the implementation of 5G after 2020. This trend is also expected to drive the demand for related components and DRAM products considerably.The average content per box continues to see 20% annual growth in 2019 as Intel and AMD promote new platformsCurrently, x86-based solutions are still the market mainstream, while the penetration rate of Intel’s Purley platform has reached about 50%. Meanwhile, AMD has been migrating to products based on 14nm process. Previous product lines will be phased out as the wafer starts of 14nm process gradually increase. As for ARMv8 and RISC architecture, products are built to order at this stage with small production volume, mainly for the data center market. These two architectures are not able to compete with x86 servers until 2020, but may be adopted in more applications after that as the penetration rate of micro servers increases.In terms of the product roadmap, Intel's Cascade Lake will still be based on the third-generation 14nm process, but would not become the mainstream until the second half of 2019. AMD's new solution will migrate to the 7nm process, with its EPYC Series becoming the main product line this year. The AMD Rome platform server processor will also have a chance to come onto the market in the second half of next year.DRAMeXchange notes that, the penetration of new platforms may drive the average content per box. The average density of DRAM in servers will continue to see 20% annual growth in 2019.
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Release time：2018-07-26 00:00 reading：1043 Continue reading>>
Cloud Service Providers to Put More Emphasis on Edge Computing
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Cloud Service Providers to Put More Emphasis on Edge Computing

Cloud computing platforms have fueled the digital transformation of enterprises in recent years. Public cloud has been playing a key role during the process. While applications of IoT and AI grow increasingly popular, the ecosystem of cloud services and the integration of cloud and edge have emerged as weak points of the market, says TrendForce. Cloud service providers have started to put more emphasis on the edge computing market, which has a CAGR of more than 30% from 2018 to 2022.TrendForce analyst Jimmy Liu points out that the digital transformation has become a must for many enterprises, who have realized the challenges brought by massive data to their current information system architectures. Cloud services like storage, data transmission and computing are on the rise, changing the mindsets of enterprises. Major cloud service providers have made eye-catching achievements in recent years, such as Amazon, Microsoft, Google, IBM, and Alibaba Cloud.However, with increasing growth momentum, the competition among cloud service providers has also become fierce. Before incorporating cloud systems into daily business operations, enterprises are bound to consider the stability, cost-effectiveness, scalability, and sustainability of cloud services, urging service providers to make the functions more integrated and prices more competitive.In addition, the rise of the Internet of Things has brought dynamic development needs. Users not only upload their systems to the cloud, but also use the cloud platforms for development and testing of IoT applications, further optimizing development costs and shortening the time for product development.Faced with existing price competition and the emerging diverse needs, cloud service providers started to extend their existing businesses and expand towards IoT platforms and edge computing. Liu notes that, most cloud service providers have established their own IoT platforms and edge computing software, such as AWS IoT Core and AWS Greengrass of Amazon, Azure IoT Solutions and Azure IoT Edge of Microsoft, etc. Based on cloud ecosystems, complete architecture and functions, as well as corresponding development tools for users, the cloud service providers have been shifting to the edge, trying to deliver more comprehensive cloud-to-end solutions on the advantages of the cloud.Cloud-to-end solutions also assist in data analysis by service providers, who used to collect existing data from applications passively. Together with a large amount of messy data, the analysis was time- and effort-consuming. However, as the cloud-to-edge development tools and ecosystems are built, they can cooperate with edge device makers more actively and have better control of these devices closer to the sources of data such as sensors, end devices, and gateways.In addition, the enhancement of edge devices will also enable cloud service providers to deploy artificial intelligence, machine learning and other technologies to the edge, and to upgrade vertical fields through various algorithms. The integration of cloud computing, edge computing and professional domain knowledge will also drive the loop of automation, autonomous training, and self-optimization. In this way, cloud service providers and edge device makers will jointly develop new forms of operation in the future to realize the digital transformation.
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Release time：2018-07-24 00:00 reading：1084 Continue reading>>
Semiconductor quantum transistor opens the door for photon-based computing
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Semiconductor quantum transistor opens the door for photon-based computing

Researchers from the University of Maryland claim to have demonstrated the first single-photon transistor using a semiconductor chip.Making a quantum transistor triggered by light has been a previous challenge because it requires that the photons interact with each other, the researchers explain.According to the team, the device is compact: roughly one million of these new transistors could fit inside a single grain of salt. It is also fast and able to process 10billion photonic qubits every second."Using our transistor, we should be able to perform quantum gates between photons," says Professor Edo Waks of the University of Maryland's A. James Clark School of Engineering and Joint Quantum Institute. "Software running on a quantum computer would use a series of such operations to attain exponential speedup for certain computational problems.The photonic chip is made from a semiconductor with numerous holes in it. Light entering the chip bounces around and gets trapped by the hole pattern; a quantum dot sits inside the area where the light intensity is strongest.Analogous to conventional computer memory, the dot stores information about photons as they enter the device. The dot can effectively tap into that memory to mediate photon interactions, meaning that the actions of one photon affect others that later arrive at the chip."In a single-photon transistor the quantum dot memory must persist long enough to interact with each photonic qubit," says Shuo Sun, lead author of the new work. "This allows a single photon to switch a bigger stream of photons, which is essential for our device to be considered a transistor."To test that the chip operated like a transistor, the researchers examined how the device responded to weak light pulses that usually contained only one photon. In a normal environment, such dim light might barely register, however, in this device, a single photon gets trapped for a long time, registering its presence in the nearby dot.The team observed that a single photon could, by interacting with the dot, control the transmission of a second light pulse through the device. The first light pulse acts like a key, opening the door for the second photon to enter the chip. If the first pulse didn't contain any photons, the dot blocked subsequent photons from getting through. This behaviour is similar to a conventional transistor where a small voltage controls the passage of current through its terminals. Here, the researchers successfully replaced the voltage with a single photon and demonstrated that their quantum transistor could switch a light pulse containing around 30 photons before the quantum dot's memory ran out.Prof Waks says that his team had to test different aspects of the device's performance prior to getting the transistor to work. "Until now, we had the individual components necessary to make a single photon transistor, but here we combined all of the steps into a single chip.”Sun says that with realistic engineering improvements their approach could allow many quantum light transistors to be linked together. The team hopes that such speedy, highly connected devices will eventually lead to compact quantum computers that process large numbers of photonic qubits.
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Release time：2018-07-10 00:00 reading：1137 Continue reading>>

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