GigaDevice's GD5F1GM9 Series High-Speed QSPI NAND Flash Sets New Benchmark with Breakthrough Read Speeds for Accelerated Application Startup
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GigaDevice's GD5F1GM9 Series High-Speed QSPI NAND Flash Sets New Benchmark with Breakthrough Read Speeds for Accelerated Application Startup

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announces the launch of its GD5F1GM9 high-speed QSPI NAND Flash, which features breakthrough read speeds and innovative Bad Block Management (BBM) functionality.　　The GD5F1GM9 series combines the high-speed read performance of NOR Flash with the large capacity and cost-effectiveness of NAND Flash. These innovations address key industry challenges of slow response times and vulnerability to bad block interference associated with traditional SPI NAND Flash. The GD51GM9 launch will open new growth opportunities for SPI NAND Flash, making it the ideal choice for fast-boot applications in sectors such as security, industrial, and IoT.　　The GD5F1GM9 series high-speed QSPI NAND Flash is built on a 24nm process node. The series supports both 3V and 1.8V operating voltages as well as high-speed read modes including Continuous Read, Cache Read, and Auto Load Next Page. Continuous Read and Auto Load Next Page modes are newer read features added on this series, offering users versatile read options to further accelerate code and data fetch. These read modes utilize the new parallel computation approach for its ECC (Error Correction Code) design, replacing the previous serial computation method. This innovation significantly reduces the calculation time for the built-in ECC.　　The 3V version of the series achieves a continuous read rate of up to 83MB/s in Continuous Read mode, operating at a maximum clock frequency of 166MHz. The 1.8V version has a continuous read rate of up to 66MB/s and supports a maximum clock frequency of 133MHz. The results in GD5F1GM9’s read speeds are up to 3 times faster than traditional SPI NAND products at the same frequency. These design advantages improve data access throughput, reduce system boot time, and lower overall system power consumption.　　As bad blocks from the factory are inherent issues in NAND Flash, the GD5F1GM9 incorporates an on-chip Advanced Bad Block Management (BBM) to ensure comprehensive functionality of Continuous Read mode. Continuous Read allows read access of the full memory array with a single Read command in aid of the executed BBM that link bad block addresses to good block addresses. Read access will then automatically skip the bad block due to the established link access to the remap and linked good physical block address.　　From the factory, the GD5F1GM9 series guarantees the first 256 blocks are good blocks. While there will be bad blocks from the factory and possible new bad blocks may arise during usage that needs to be managed, the BBM feature can create a logical block address to the physical block address link, allowing users to swap and replace bad blocks and the associated access will be on a good block once the BBM link is setup.　　The device can support up to 20 Look Up Table BBM Links to further compliment Continuous Read mode functionality. This not only significantly improves resource utilization but also simplifies system design.　　“Currently, the generally slow read speed of SPI NAND Flash has become a major bottleneck in enhancing boot performance of key applications,” said Ruwei Su, GigaDevice vice president and general manager of Flash BU, "The launch of GD5F1GM9 series high-speed QSPI NAND Flash sets a new performance benchmark in the market. This series effectively addresses the read speed limitations of traditional SPI NAND Flash and offers a new solution for bad block management, making it an ideal alternative for NOR Flash users with growing capacity needs. In the future, GigaDevice will continue to refine its underlying technologies to provide customers with more efficient and reliable storage solutions."　　The GD5F1GM9 series offers 1Gb capacity with 3V/1.8V voltage options and supports WSON8 8x6mm, WSON8 6x5mm, and BGA24 (5×5 ball array) 5x5 ball package options. For detailed information and product pricing, please contact your local sales representative.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com　　*GigaDevice and their logos are trademarks, or registered trademarks of GigaDevice Semiconductor Inc. Other names and brands are the property of their respective owners.
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Release time：2025-04-23 17:09 reading：183 Continue reading>>
ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and AI Servers
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ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and AI Servers

　　ROHM has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers.　　The advancement of high-level data processing technologies and the acceleration of digital transformation have increased the demand for data center servers. At the same time, the number of servers equipped with advanced computing capabilities for AI processing is on the rise and is expected to continue to grow. These servers operate 24 hours a day, 7 days a week – ensuring continuous operation. As a result, conduction losses caused by the ON-resistance of multiple MOSFETs in the power block have a significant impact on system performance and energy efficiency. This becomes particularly evident in AC-DC conversion circuits, where conduction losses make up a substantial portion of total power loss – driving the need for low ON-resistance MOSFETs.　　Additionally, servers equipped with a standard hot-swap function, which allow for the replacement and maintenance of internal boards and storage devices while powered ON, experience a high inrush current during component exchanges. Therefore, to protect server components and MOSFETs from damage, a wide Safe Operating Area (SOA) tolerance is essential.　　To address these challenges, ROHM has developed its new DFN5060-8S package that supports the packaging of a larger die compared to conventional designs, resulting in a lineup of power MOSFETs that achieve industry-leading* low ON-resistance along with wide SOA capability. These new products significantly contribute to improving efficiency and enhancing reliability in server power circuits.　　The new lineup includes three products. The RS7E200BG (30V) is optimized for both secondary-side AC-DC conversion circuits and hot-swap controller (HSC) circuits in 12V power supplies used in high-performance enterprise servers. The RS7N200BH (80V) and RS7N160BH (80V) are ideal for secondary AC-DC conversion circuits in 48V AI server power supplies.　　All three models feature the newly developed DFN5060-8S package (5.0mm × 6.0mm). The package increases the internal die size area by approximately 65% compared to the conventional HSOP8 package (5.0mm × 6.0mm). As a result, the RS7E200BG (30V) and RS7N200BH (80V) achieve ON-resistances of 0.53mΩ and 1.7mΩ (at VGS = 10V), respectively – both of which rank among the best in the industry in the 5.0mm × 6.0mm class, significantly contributing to higher efficiency in server power circuits.　　Moreover, ROHM has optimized the internal clip design to enhance heat dissipation, further improving SOA tolerance, which contributes to ensuring application reliability. Notably, the RS7E200BG (30V) achieves an SOA tolerance of over 70A at a pulse width of 1ms and VDS = 12V, which is twice that of the conventional HSOP8 package MOSFETs under the same conditions, ensuring industry-leading SOA performance in a 5.0mm × 6.0mm footprint.　　Going forward, ROHM plans to gradually begin mass production of power MOSFETs compatible with hot-swap controller circuits for AI servers in 2025, continuing to expand its lineup that contributes to greater efficiency and reliability across a wide range of applications.　　Product Lineup　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Application Examples　　・AC-DC conversion and HSC circuits for 12V high-performance enterprise server power supplies　　・AC-DC conversion circuits for 48V AI server power supplies　　・48V industrial equipment power supplies (i.e. fan motors)　　Terminology　　Low ON-Resistance (RDS(on))　　The resistance value between the Drain and Source of a MOSFET during operation. A smaller RDS(on) results in lower power loss during operation.　　SOA (Safe Operating Area) Tolerance　　The range of voltage and current within which a device can operate safely without damage. Exceeding this range can lead to thermal runaway or device failure, making SOA tolerance a critical factor, especially in applications prone to inrush current or overcurrent.　　Power MOSFET　　A type of MOSFET used for power conversion and switching applications. N-channel MOSFETs are the mainstream choice, as they become conductive when a positive voltage is applied to the gate relative to the source, offering lower ON-resistance and higher efficiency than P-channel variants. Due to their low loss and high-speed switching capabilities, power MOSFETs are widely used in power circuits, motor drive circuits, and inverters.　　Hot-Swap Controller (HSC)　　A specialized integrated circuit (IC) that enables hot-swap functionality, allowing components to be inserted or removed while the power supply system remains active. It plays a crucial role in managing inrush current that occurs during component insertion, protecting both the system and connected components from damage.　　Inrush Current　　A sudden surge of current that momentarily exceeds the rated value when an electronic device is powered ON. Proper control of this current reduces stress on power circuit components, helping to prevent device failure and stabilize the system.
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Release time：2025-04-10 13:10 reading：254 Continue reading>>
BIWIN Spec Industrial-Grade Wide-Temperature eMMC Wins the Industrial Core
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BIWIN Spec Industrial-Grade Wide-Temperature eMMC Wins the Industrial Core "New Quality" Award

　　Recently, the results of the 23rd Chinese Automation & Digitalization "New Quality Award" selection, hosted by gongkong®, were officially announced. BIWIN Spec, the industrial and automotive-grade storage brand under BIWIN, clinched the Industrial Core "New Quality" Award for its innovatively developed Industrial-Grade Wide-Temperature eMMC storage solution.　　Backed by BIWIN’s technological expertise and competitive advantages in embedded storage sector, the award-winning TGE208/TGE218 series industrial-grade eMMCs are featured with industrial-grade controllers and NAND Flash, along with proprietary firmware architectures and in-house advanced packaging/testing and manufacturing processes, delivering exceptional performance, ultimate stability, and industrial-grade reliability.　　Furthermore, the products are certified with over 200 rigorous validation tests through BIWIN’s automatic testing system, and also passed the HTOL and ELFR tests under JEDEC standards. Designed for consistent and stable operation in extreme environments, the products are widely applicable across diverse industrial scenarios, including smart security surveillance, data communication, industrial automation, rail transportation, smart power systems, smart healthcare, and IoT terminals.　　In terms of technical specifications, the products strictly follow the eMMC5.1 standards, support the HS400 high speed mode (with data transfer rates up to 400MB/s), and deliver outstanding performance under industrial wide-temperature conditions ranging from -40℃ to +85℃. In addition, the pSLC firmware technical support is also enabled to enhance the capability for data retention, so as to meet the high-frequency read/write needs in industrial scenarios.　　With aims to satisfy the 24/7 uninterrupted operation requirements of industrial equipment, the BIWIN eMMCs are also specifically built with five intelligent management functionalities: the Field Firmware Upgrade (FFU) for remote maintenance, Boot Partition for secure system loading, Replay Protected Memory Block (RPMB) for enhanced data security, idle data acceleration for optimized storage efficiency, and a health monitoring system equipped. Customers can monitor the storage unit’s operational status in real time through a customized interface and dynamically optimize adjustments based on specific application scenarios.　　BIWIN has established stable and close partnerships with supply chain collaborators, providing customers with reliable supply assurances and comprehensive after-sales support throughout the product lifecycle. With years of technical R&D accumulation and an intelligent production and testing system, combined with tiered BOM (Bill of Materials) control and manufacturing process management, the products achieve higher reliability and sustained operational stability.
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Release time：2025-04-07 13:20 reading：290 Continue reading>>
Commercialized high precision agricultural CO2 sensors with superior long-term stability
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Commercialized high precision agricultural CO2 sensors with superior long-term stability

　　Murata Manufacturing Co., Ltd. (hereinafter "Murata") has commercialized "IMG-CA0012-12" (hereinafter "this product"), a case and cable type CO2 sensor. This high precision product primarily connects to environment measurement equipment in agricultural greenhouses and stably measures CO2 concentration. Through linkage with photosynthesis accelerators, this product will contribute to improving crop quality and increasing yield. Additionally, it improves energy efficiency by injecting an optimal amount of CO2 at an optimal timing. Mass production and supply for this product has begun in Hakui Murata Manufacturing.　　In the field of agriculture, increased yield and quality improvement per unit area are required since there is a reduction in yield and decline in quality due to global warming as well as a drop in agricultural worker population. Technology for accelerating crop photosynthesis using CO2 application is an effective means of addressing these challenges. Furthermore, due to the recent increase in energy costs, effective CO2 application based on environmental data measurements is crucial. As a result, high-precision CO2 sensors, which offer long-term stability, require no calibration, and are resistant to malfunction, play a crucial role in photosynthesis accelerator technology.　　This product is equipped with an automatic calibration function that runs on our unique calibration curve algorithm and dual wavelength (for measurement and reference) NDIR*1. Therefore, atmospheric calibration is not required. This ensures high precision and long-term stability, making it maintenance-free. Furthermore, its case and cable type design enhances user handling and ease of installation.　　*1NDIR: Non-Dispersive Infrared Absorption　　Specifications　　CO2 sensors were installed in greenhouses and were used for a year for tomato cultivation and 2 years for rose cultivation. After use, CO2 concentration characteristics and temperature characteristics were evaluated.　　It was discovered that CO2 concentration differences were minimal even when they were used for a long period of time in actual fields.　　CO2 concentration characteristics　　Temperature characteristics
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Release time：2025-04-02 15:44 reading：296 Continue reading>>
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry
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ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

　　ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.　　The partnership will integrate ROHM's device development technology with TSMC's industry-leading GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon for power devices.　　GaN power devices are currently used in consumer and industrial applications such as AC adapters and server power supplies. TSMC, a leader in sustainability and green manufacturing, supports GaN technology for its potential environmental benefits in automotive applications, such as on-board chargers and inverters for electric vehicles (EVs).　　The partnership builds on ROHM and TSMC’s history of collaboration in GaN power devices. In 2023, ROHM adopted TSMC’s 650V GaN high-electron mobility transistors (HEMT), whose process is increasingly being used in consumer and industrial devices as part of ROHM's EcoGaN™ series, including the 45W AC adapter (fast charger) "C4 Duo" produced by Innergie, a brand of Delta Electronics, Inc.　　"GaN devices, capable of high-frequency operation, are highly anticipated for their contribution to miniaturization and energy savings, which can help achieve a decarbonized society. Reliable partners are crucial for implementing these innovations in society, and we are pleased to collaborate with TSMC, which possesses world-leading advanced manufacturing technology" said Katsumi Azuma, Member of the Board and Senior Managing Executive Officer at ROHM. “In addition to this partnership, by providing user-friendly GaN solutions that include control ICs to maximize GaN performance, we aim to promote the adoption of GaN in the automotive industry."　　“As we move forward with the next generations of our GaN process technology, TSMC and ROHM are extending our partnership to the development and production of GaN power devices for automotive applications,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “By combining TSMC's expertise in semiconductor manufacturing with ROHM's proficiency in power device design, we strive to push the boundaries of GaN technology and its implementation for EVs.”　　About TSMC　　TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.　　        TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan.　　EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.
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Release time：2025-04-02 15:36 reading：309 Continue reading>>
Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems
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Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.　　As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).　　Renesas’ Automotive Video Signal Processing Expertise　　Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.　　Key Features of the RAA278830　　Dual Open-LDI Input/Output　　ISO 26262 Functional Safety ASIL B rating　　CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path　　Video Diagnostic Capabilities　　Input/Output monitoring of video timing, signal integrity, and content　　Flickering, flashing, occlusion, and glare detection　　Spread Spectrum for lower system level EMI profile　　Image enhancement engine for superior image quality　　Dual host interface: I2C & SPI (configurable)　　SPI-Flash based OSD as well as an embedded font based OSD　　SPI boot capability (boot from SPI Flash, no MCU needed)　　Supports multi-bank for fail-safe OTA updates　　Space-efficient 72SCQFN, 10mm x 10mm　　AEC-Q100 Grade 2 qualified　　“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
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Release time：2025-04-01 14:36 reading：325 Continue reading>>
ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers
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ROHM Develops a New Compact Thermal Printhead for A4-Sized Mobile Printers

　　ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.　　In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.　　A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.　　The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.　　While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.　　Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.　　Key Specifications　　For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers　　Sales Information        Pricing: $14.50/unit (excluding tax)　　Availability: Now (OEM quantities)　　Application Examples        • A4-sized mobile printers　　• Industrial control label printers　　• Tattoo stencil printers, etc.　　Terminology        dpi (dots per inch)　　A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).　　Thermal Printing Method　　A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.　　Thermal Transfer Printing Method　　A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
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Release time：2025-03-31 15:36 reading：270 Continue reading>>
ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory
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ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory

　　ROHM Apollo Co., Ltd. (Headquarters: Fukuoka Prefecture, hereafter ROHM Apollo) Yukuhashi Plant received “the Japan Greenery Research and Development Center Chairperson's Award“ in the 2024 Factory Greening Award Program (commonly called the National Green Factory Award) sponsored by the Ministry of Economy, Trade and Industry, and at the award ceremony held on January 22, Yukuhashi Plant was awarded the certificate of commendation.　　Toshiyuki Hashimoto, General Manager, LSI Engineering Department, ROHM Apollo Yukuhashi Plant(left)　　Masatoshi Kaku, Chairperson, Japan Greenery Research and Development Center(right)　　The Awards Program has been organized annually since 1982, sponsored by the Ministry of Economy, Trade and Industry and operated by the Japan Greenery Research and Development Center, with the aim of further promoting factory greening. The Awards program recognizes factories, organizations, and individuals for their outstanding achievements in promoting factory greening and improving the environment inside and outside their factories.　　Yukuhashi Plant has been focusing on the creation of a “greenery factory” that takes the ecosystem into consideration and was recognized for the maintenance of cherry blossom trees along the road on the plant premises and the completion of a vast green space and a multipurpose ground on the site in 2023. This is the first time that a plant which is based on Yukuhashi City has received this award.　　In ROHM Group, The ROHM Head Office and Plant received the “Japan Greenery Research and Development Center Chairperson's Award” in 2021 and “Kinki Bureau of Economy, Trade and Industry Director General's Award” in 2022.　　ROHM Group formulated “Environmental Vision 2050” in April 2021. Based on its three themes - “Climate change," "Resource recycling," and "Coexistence with nature", we aim to achieve Net Zero greenhouse gas emissions by 2050 and conduct business activities in harmony with the natural cycle to protect biodiversity. Based on our company mission of "contribute to the advancement and progress of culture" and our Environmental Vision, we will continue to work to conserve the environment and biodiversity toward the realization of a sustainable society while promoting sound cooperation with society by contributing to the local environment and appropriately disclosing environmental information.
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Release time：2025-03-24 11:32 reading：289 Continue reading>>
ROHM selected for CDP’s A List for Climate Change and Water Security
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ROHM selected for CDP’s A List for Climate Change and Water Security

　　ROHM Co., Ltd. has been recognized for leadership in corporate sustainability by CDP (Carbon Disclosure Project), an international environmental non-profit organization, securing a place on its prestigious ‘2024 A List’ for tackling both climate change and water security.　　This is the first time to be included in the Climate Change A list, the highest rating, for ROHM, as well as the fourth consecutive year to secure a position on the Water Security A list.　　CDP is an international environmental non-profit organization that operates a global environmental disclosure system for companies and municipalities. It conducts environmental information surveys and publishes data regarding Climate Change and Water Security. The survey is fully aligned with the TCFD, and its scores are widely used for decision-making regarding investments and purchasing in a sustainable and resilient net-zero economy. In 2024, more than 700 signatory financial institutions requested disclosure of data on environmental impacts, risks, and opportunities through the CDP platform, with a record number of nearly 24,800 companies responding. The survey employs an eight-tier evaluation scale with levels ranging from Leadership level (A, A-) to Management level (B, B-), Recognition level (C, C-), and Disclosure level (D, D-), based on criteria such as comprehensiveness of disclosure, identification and management of environmental risks, and ambitious target setting.        Environmental Management at ROHM　　In the Environmental Vision 2050, ROHM has committed to achieving virtually zero greenhouse gas emissions and maximizing resource recycling to eliminate waste from all its business activities.　　・Water Resource Management　　ROHM has set a target to increase the proportion of water recovery and reuse by at least 5.5% by FY2030 (compared to FY2019), and is making efforts to reuse water resources and reduce factory wastewater by globally managing water withdrawal, wastewater, and water usage. In addition to addressing risks such as flooding, ROHM has implemented a business continuity management system, which predicts potential risks, and made production continuity plans for each site. ROHM is also taking ongoing measures, such as constructing new production buildings based on flood countermeasures.　　In 2024, ROHM received an independent verification of its water withdrawal and wastewater volume data in order to disclose information to society with higher transparency and reliability.　　・Climate Change Measures　　ROHM has set a target to reduce greenhouse gas emissions (Scope 1 and 2) by at least 50.5% byFY2030 (compared to FY2018), and is working globally to introduce environmentally-friendly equipment and reduce usage through energy conversion. In 2024, ROHM has expanded independent verification to achieve a 100% verification rate for its internally calculated greenhouse gas emissions (Scope 1 and 2). Additionally, ROHM has introduced an Internal Carbon Pricing (ICP) system to promote decarbonized management.　　Furthermore, ROHM has announced a plan to source 100% of the electricity used in all domestic and international business activities from renewable energy by FY2050. Several sites, including major overseas production plants, are already operating with 100% renewable energy. As of FY2023, ROHM has achieved a 43% adoption rate and plans to increase this to 65% by FY2030.　　Encouraged by the evaluation results, ROHM will continue promoting CSR activities and addressing social issues to achieve a sustainable society and become a company that meets the expectations of its stakeholders.
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Release time：2025-03-21 13:52 reading：332 Continue reading>>
How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?
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How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
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