Valeo & ROHM Semiconductor co-develop the next generation of power <span style='color:red'>electronics</span>
Trade news

Valeo & ROHM Semiconductor co-develop the next generation of power electronics

　　Valeo, a leading automotive technology company, and ROHM Semiconductor, a major semiconductor and electronic component manufacturer, collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack™ to Valeo for future powertrain solutions.　　Valeo is broadening access to efficient, electrified mobility across various vehicle types and markets from the smallest one (ebikes), through the mainstream (passenger cars) to the biggest one (eTrucks). By combining Valeo’s expertise in mechatronics, thermal management and software development with ROHM’s power modules, Valeo drives the power electronics solution forward, contributing to the performance, efficiency, and decarbonization of automotive systems worldwide.　　Valeo and ROHM have been collaborating since 2022, initially focusing on technical exchanges aimed at improving the performance and efficiency of the motor inverter – a key component in the propulsion systems of electric vehicles (EVs) and plug-in hybrids (PHEVs). By refining power electronics, both companies aim to offer optimized cost/performance by delivering higher energy efficiency, reducing heat generation thanks to an optimized cooling and mechatronic integration, and increasing overall reliability with a SiC packaging.　　“This partnership marks, for Valeo Power Division, a significant step forward in delivering advanced and high-efficient power electronics,” says Xavier DUPONT, Valeo Power Division CEO. “Together, we aim to set new industry standards for high voltage inverters and accelerate the transition towards more efficient and affordable electric mobility.”　　“We are pleased to support Valeo, a renowned automotive supplier, with our power semiconductors. ROHM’s TRCDRIVE pack™ provides high power density, leading to an improved power efficiency. Together, we contribute to the development of highly efficient powertrains by fostering the collaboration with Valeo,” says Wolfram HARNACK, President ROHM Semiconductor GmbH.　　These evolutions are all essential to supporting the growing demand for longer range, faster charging capabilities, and, overall a high-performance and an affordable inverter for BEVs and PHEVs.　　Valeo will start supplying a first series project in early 2026. Valeo and ROHM will contribute to the improvement of efficiency and downsizing of Valeo’s next generation of xEV inverters.　　Background on the TRCDRIVE pack™　　TRCDRIVE pack™ is a trademark for the SiC molded module developed for traction inverter drives. This product features high power density and a unique terminal configuration – solving the key challenges of traction inverters in terms of miniaturization, higher efficiency, and fewer person-hours. Because SiC enables low-loss power conversion under high voltage conditions, combining Valeo's component technology, casing design and thermal management expertise with ROHM's power module creates a synergistic effect. Through both companies’ collaboration in automotive power electronics, they contribute to achieving a decarbonized society by enhancing the performance and efficiency of the motor inverter.　　More information is available via:　　https://www.rohm.com/news-detail?news-title=2024-06-11_news_trcdrive-pack&defaultGroupId=false　　TRCDRIVE pack™ are trademarks or registered trademarks of ROHM Co., Ltd.　　About Valeo　　Valeo is a technology company and partner to all automakers and new mobility players worldwide. Valeo innovates to make mobility safer, smarter and more sustainable. Valeo enjoys technological and industrial leadership in electrification, driving assistance systems, reinvention of the interior experience and lighting everywhere. These four areas, vital to the transformation of mobility, are the Group's growth drivers.　　Valeo in figures: 22 billion euros in sales in 2023 | 109 600 employees, 28 countries, 159 plants, 64 research and development centers and 19 distribution platforms at June 30, 2024.　　https://www.valeo.com/　　Valeo is listed on the Paris stock Exchange.
Key word：
Release time：2024-11-29 10:49 reading：378 Continue reading>>
What are TVS diodes in safeguarding <span style='color:red'>electronics</span>
Trade news

What are TVS diodes in safeguarding electronics

　　In today’s interconnected world, electronic devices and systems are ubiquitous, powering our homes, workplaces, and communication networks. However, these devices are vulnerable to voltage transients—brief surges in voltage that can occur due to lightning strikes, electrostatic discharge (ESD), or switching transients in the electrical system.　　To protect sensitive electronic components from such transients, Transient Voltage Suppressor TVS diodes play a crucial role. This article explores the functionality, applications, and importance of TVS diodes in safeguarding electronics.　　What is a Transient Voltage Suppressor (TVS) Diode?A Transient Voltage Suppressor (TVS) diode is a semiconductor device used to protect sensitive electronic components from voltage spikes or transient voltages that could potentially damage them. These spikes can be caused by events such as lightning strikes, electrostatic discharge (ESD), or switching transients in the electrical system.　　The TVS diode operates by providing a low-impedance path to divert excess voltage away from the protected components, thus limiting the voltage across them. When a transient voltage exceeds the breakdown voltage (also known as the clamping voltage or avalanche voltage) of the TVS diode, it starts to conduct, effectively shunting the excess current away from the protected circuit.　　What are the features of TVS diodes?Fast Response Time: TVS diodes respond quickly to transient events, providing protection within nanoseconds to microseconds.　　Low Clamping Voltage: The clamping voltage is the maximum voltage that the TVS diode allows to pass through to the protected circuit. It is typically lower than the voltage tolerance of the protected components, ensuring they remain safe.　　High Surge Current Capability: TVS diodes are designed to handle high surge currents associated with transient events, protecting the circuit from damage.　　Low Leakage Current: When not conducting, TVS diodes have low leakage current, minimizing power consumption and ensuring minimal impact on the protected circuit during normal operation.　　Robustness: TVS diodes are robust devices, able to withstand multiple transient events without degradation in performance.　　What are the applications of TVS diode?TVS diodes are commonly used in various applications, including:　　Protection of integrated circuits (ICs), microcontrollers, and other semiconductor devices from ESD and voltage transients.　　Protection of communication ports (such as USB, Ethernet, HDMI) and data lines in electronic equipment.　　Surge protection for power supply lines, signal lines, and sensor inputs in industrial and automotive electronics.　　Protection of sensitive electronic equipment against lightning-induced surges in telecommunications, power distribution, and other infrastructure.　　What’s the difference between TVS Diodes and Zener Diodes?TVS (Transient Voltage Suppressor) diodes and Zener diodes are both semiconductor devices used for voltage regulation, but they serve different purposes and operate in different ways. Here are the key differences between TVS diodes and Zener diodes:　　Purpose:　　• TVS Diodes: TVS diodes are primarily used for transient voltage suppression, meaning they protect electronic circuits from voltage spikes or transients caused by events like lightning strikes, electrostatic discharge (ESD), or inductive switching. Their main function is to provide surge protection and prevent damage to sensitive components.　　• Zener Diodes: Zener diodes are used for voltage regulation and voltage reference. They operate in the breakdown region and maintain a constant voltage across their terminals when reverse biased. Zener diodes are commonly used in voltage regulation circuits, voltage clamping circuits, and voltage reference circuits.　　Operating Principle:　　• TVS Diodes: TVS diodes operate by avalanche breakdown or Zener breakdown. When the voltage across a TVS diode exceeds its breakdown voltage, it starts to conduct heavily, providing a low-impedance path for excess current and diverting it away from the protected circuit.　　• Zener Diodes: Zener diodes operate in the reverse-biased breakdown region, where they maintain a constant voltage (known as the Zener voltage) across their terminals. They regulate voltage by allowing current to flow in the reverse direction when the applied voltage exceeds the Zener voltage.　　Voltage Characteristics:　　• TVS Diodes: TVS diodes typically have a very low clamping voltage (Vc) and are designed to handle high surge currents associated with transient events. They are optimized for fast response times and high-energy absorption capabilities.　　• Zener Diodes: Zener diodes have a well-defined breakdown voltage (Vz) at which they operate. The voltage across a Zener diode remains relatively constant over a wide range of currents when reverse biased, making them suitable for voltage regulation applications.　　Applications:　　• TVS Diodes: TVS diodes are used in applications requiring protection against voltage transients, such as in power supplies, communication ports (USB, Ethernet), data lines, and electronic equipment exposed to harsh environments or prone to ESD.　　• Zener Diodes: Zener diodes find applications in voltage regulation circuits, voltage references, voltage clamping circuits, reverse voltage protection, and precision voltage measurement circuits.　　How do TVS diodes work?　　TVS diodes work by providing a low-impedance path for excess voltage, diverting it away from sensitive electronic components and limiting the voltage across them to safe levels. They operate based on two main mechanisms: avalanche breakdown and Zener breakdown. Here’s how TVS diodes work:　　Avalanche BreakdownTVS diodes are typically fabricated with a highly doped semiconductor material that has a narrow depletion region. When the diode is reverse-biased (i.e., the voltage applied across it is in the opposite direction of its normal operation), the electric field across the depletion region increases.　　If the applied reverse voltage exceeds a certain threshold known as the breakdown voltage (also called clamping voltage or avalanche voltage), the strong electric field can accelerate charge carriers (electrons and holes) to high energies.　　These high-energy charge carriers collide with other atoms in the semiconductor lattice, generating additional charge carriers through impact ionization. This process cascades, resulting in a sudden increase in current flow through the diode.　　As a result, the TVS diode effectively clamps the voltage across its terminals at the breakdown voltage, providing a low-impedance path for excess current and limiting the voltage seen by the protected circuit.　　Zener BreakdownIn addition to avalanche breakdown, some TVS diodes may also utilize Zener breakdown to provide transient voltage suppression. Zener breakdown occurs when the reverse-biased diode operates in its Zener breakdown region.　　In this region, the diode behaves as a voltage regulator, maintaining a relatively constant voltage (known as the Zener voltage) across its terminals. When the applied reverse voltage exceeds the Zener voltage, the diode starts conducting heavily, effectively clamping the voltage across it.　　What causes a TVS diode to fail?TVS diodes are designed to withstand high levels of transient voltage and provide protection to sensitive electronic components. However, like any electronic component, TVS diodes can fail under certain conditions. Here are some common causes of TVS diode failure:　　Overvoltage Conditions: If the transient voltage exceeds the maximum rated clamping voltage (avalanche or Zener breakdown voltage) of the TVS diode, it may fail to suppress the transient effectively. This can happen if the transient event is exceptionally severe or if the TVS diode is underspecified for the application.　　Overcurrent Conditions: Excessive current flowing through the TVS diode, either due to a high-energy transient event or a sustained fault condition, can cause the diode to fail. Overcurrent can lead to thermal overstress, causing the diode to overheat and potentially short or open circuit.　　Reverse Polarity: Applying a reverse voltage beyond the maximum reverse voltage rating of the TVS diode can cause it to fail. This can occur due to improper installation or incorrect wiring in the circuit.　　End-of-Life Wear-Out: Like all semiconductor devices, TVS diodes have a limited lifespan, and their performance may degrade over time due to factors such as aging, temperature cycling, and electrical stress. As the diode approaches the end of its life, its ability to suppress transients effectively may diminish, leading to failure.　　Excessive Power Dissipation: TVS diodes are specified with maximum power dissipation ratings. Exceeding these ratings, either due to sustained overvoltage conditions or prolonged exposure to transient events, can cause the diode to overheat and fail.　　Manufacturing Defects: Rarely, TVS diodes may fail due to manufacturing defects such as material impurities, processing errors, or incomplete encapsulation. These defects can compromise the electrical and thermal performance of the diode, leading to premature failure.　　Improper Handling or Installation: Mishandling or improper installation of TVS diodes, such as mechanical stress during assembly, soldering defects, or exposure to corrosive environments, can lead to physical damage or degradation of the diode, resulting in failure.　　ConclusionTVS diodes are essential components in protecting electronic devices and systems from voltage transients. Their ability to clamp voltages and divert excess current away from sensitive components plays a vital role in ensuring the reliability and durability of modern electronics. As the demand for high-performance and reliable electronic products continues to grow, the importance of TVS diodes in safeguarding electronics will only increase, making them indispensable in today’s interconnected world.
Key word：
Release time：2024-07-16 13:08 reading：588 Continue reading>>
ROHM Group Company SiCrystal and STMicro<span style='color:red'>electronics</span> Expand Silicon Carbide Wafer Supply Agreement
Trade news

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

　　Kyoto, Japan and Geneva, Switzerland, April 22, 2024 – ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million.　　Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented “This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions”.　　“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality”. said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.　　Energy-efficient SiC power semiconductors enable electrification in the automotive and industrial sectors in a more sustainable way. By facilitating more efficient energy generation, distribution and storage, SiC supports the transition to cleaner mobility solutions, lower emissions industrial processes and a greener energy future, as well as more reliable power supplies for resource-intensive infrastructure like data centers dedicated to AI applications.　　About STMicroelectronics　　At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.　　Further information can be found at www.st.com .　　About ROHM　　Founded in 1958, ROHM provides ICs and discrete semiconductor devices characterized by outstanding quality and reliability for a broad range of markets, including automotive, industrial equipment and consumer market via its global development and sales network.　　In the analog power field, ROHM proposes the suitable solution for each application with power devices such as SiC and driver ICs to maximize their performance, and peripheral components such as transistors, diodes, and resistors.　　Further information on ROHM can be found at www.rohm.com .　　About SiCrystal　　SiCrystal, a ROHM group company, is one of the global market leaders for monocrystalline silicon carbide wafers. SiCrystal’s advanced semiconductor substrates provide the basis for the highly efficient use of electrical energy in electric vehicles, fast charging stations, renewable energies and in various fields of industrial applications.　　Further information on SiCrystal can be found at www.sicrystal.de .
Key word：
Release time：2024-04-24 11:10 reading：1118 Continue reading>>
CG Power and Industrial Solutions Limited, Renesas and Stars Micro<span style='color:red'>electronics</span>, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India
Trade news

CG Power and Industrial Solutions Limited, Renesas and Stars Microelectronics, to Jointly Build Outsourced Semiconductor Assembly and Test Facility in India

　　CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India. The Union Cabinet, chaired by Prime Minister Shri Narendra Modi, approved the project of the JV under India’s Semiconductor scheme on February 29, 2024.　　The JV brings together unique capabilities of the partners with a vision to “Make in India for the World.” CG, with around 86 years of manufacturing expertise, is keen to build semiconductor capabilities and ecosystem in India. Renesas, a leading semiconductor company headquartered in Japan, will provide advanced semiconductor technology and expertise. Stars Microelectronics, a Thai based OSAT, will provide both technology for legacy packages and training and enablement.　　The JV will be 92.3% owned by CG, with Renesas and Stars Microelectronics each holding equity capital of approximately 6.8% and 0.9%, respectively. The JV plans to invest INR 7,600 crores over a five-year period, which will be financed through a mix of subsidies, equity, and potential bank borrowings as required.　　The JV will set up a state-of-the-art manufacturing facility in Sanand, Gujarat, with a capacity that will ramp up to 15 million units per day. The JV will manufacture a wide range of products – ranging from legacy packages such as QFN and QFP to advanced packages such as FC BGA, and FC CSP. The JV will cater to industries such as automotive, consumer, industrial, 5G, to name a few.　　Commenting on this new venture, Mr. S. Vellayan, Chairman, CG Power and Industrial Solutions Limited, said, “CG’s entry into the semiconductor manufacturing marks a strategic diversification for us. Our partners, Renesas and Stars Microelectronics, will make our learning curves steeper and help us focus on innovation and excellence.　　This is a very exciting phase for the entire nation, and we are very keen to build out India’s semiconductor capability and ecosystem.”　　Mr. Natarajan Srinivasan, Managing Director, CG Power and Industrial Solutions Limited, added, “It is a matter of great pride for CG to implement this project of National importance.”　　Commenting on the partnership, Mr. Hidetoshi Shibata, CEO of Renesas said, “India is a critical part of Renesas’ business. We value its innovative landscape and robust potential growth and are committed to accelerating our investment in India. By partnering with the Murugappa Group and Stars Microelectronics, we will bolster India’s semiconductor ecosystem and address the growing semiconductor demand for the customers worldwide.”　　Mr. Prompong Chaikul, Chairman of Executive Committee of Stars Microelectronics (Thailand) Public Co., Ltd added, "We are deeply honored to join forces in this thrilling venture. Leveraging our expertise and experience in OSAT, we are committed to providing robust support to ensure the success of this project in India."　　About CG Power and Industrial Solutions Limited　　CG Power and Industrial Solutions Limited is an engineering conglomerate headquartered in Mumbai, India. The Company is a leader in the Electrical Engineering Industry and has two business lines—Industrial Systems and Power Systems. It manufactures Traction Motors, Propulsion systems, Signaling Relays etc., for the Indian Railways, and wide range of Induction Motors, Drives, Transformers, Switchgears, and other allied products for the Industrial and Power sectors. Recently, the Company also made a foray into the business of Consumer Appliances such as Fans, Pumps and Water Heaters.　　The Company has world-class manufacturing plants across 9 locations in India and one in Sweden, and a Pan India network of 4 Regional and 15 Branch offices, with around 3000 employees. The Company’s consolidated revenue for FY23 was Rs 6,973 crores (USD 838 million).　　The Company continues to excel and maintain its leadership position across its businesses, backed by its outstanding expertise, customer-centric approach, and enhanced focus on innovation and sustainability.　　Since November 2020, the Company has become a part of the renowned Murugappa Group.　　About Murugappa Group　　A 123-year-old conglomerate with presence across India and the world, the INR 742 billion Murugappa Group has diverse businesses in agriculture, engineering, financial services and more.　　The Group has 9 listed companies under its umbrella — Carborundum Universal Limited, CG Power & Industrial Solutions Limited, Cholamandalam Financial Holdings Limited, Cholamandalam Investment & Finance Company Limited, Cholamandalam MS General Insurance Company Limited, Coromandel International Limited, EID Parry (India) Limited, Shanthi Gears Limited, Tube Investments of India Limited and Wendt India Limited. Brands such as Ajax, Hercules, BSA, Montra, Montra Electric, Mach City, Gromor, Paramfos, Parry’s are part of the Group’s illustrious stable.　　Abrasives, technical ceramics, electro minerals, electric vehicles, auto components, fans, transformers, signaling equipment for railways, bicycles, fertilizers, sugar, tea and several other products make up the Group’s business interests.　　Guided by the five lights — integrity, passion, quality, respect and responsibility — and a culture of professionalism, the Group has a workforce of over 73,000 employees.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation  empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.
Key word：
Release time：2024-03-05 13:10 reading：2569 Continue reading>>
BIWIN Automotive Storage Solutions: Driving Innovation in Car Electronics
Trade news

BIWIN Automotive Storage Solutions: Driving Innovation in Car Electronics

　　BIWIN Storage Technology Co., Ltd. (referred to as BIWIN) focuses on the research and development, packaging and testing, and manufacturing of memory chips. It is recognized as a national high-tech enterprise and a national-level specialized and innovative Little Giants enterprise. The company has received strategic investments from the National Integrated Circuit Industry Investment Fund.　　BIWIN tightly integrates its operations around the semiconductor memory industry chain, establishing an integrated business model for research and development with packaging and testing. BIWIN possesses core competencies in storage medium characteristic research, firmware algorithm development, chip packaging and testing, test research and development, and global brand operations. BIWIN actively expands into technical domains such as IC design, advanced packaging and testing, and chip testing equipment development.　　In 2018, BIWIN achieved IATF 16949:2016 certification for automotive quality management systems--an affirmation of the company's prowess in standardized management, quality control, and technological ingenuity. Recently, BIWIN Huizhou Manufacturing Center of Advanced Packaging and Testing accomplished IATF 16949:2016 certification for the automotive industry quality management systems.　　Specializing in advanced packaging and testing, BIWIN demonstrates proficiency in automotive-grade chip testing, supporting both its parent company's automotive-grade chip business and its independent automotive-grade testing outsourcing ventures. The successful IATF 16949:2016 certification holds paramount significance for the company, symbolizing implementing an intelligent management system, establishing automotive-grade quality control and process capabilities, and delivering premium products and services to customers.　　Developed by the International Automotive Task Force (IATF) in collaboration with the International Organization for Standardization (ISO) based on ISO 9001:2015, IATF 16949:2016 aims to improve customer satisfaction by ensuring consistent production of high-quality automotive products. It is crucial for automotive companies, including manufacturers, suppliers, and service providers, as it not only indicates compliance with industry-specific quality standards but also encourages the adoption of best practices across the entire supply chain. Obtaining IATF 16949:2016 certification signifies a company's commitment to meeting the highest quality standards. Many globally renowned automotive manufacturers now mandate that their suppliers obtain IATF 16949:2016 certification　　Capitalizing on its integrated advantage in research and development, and packaging and testing, BIWIN is strategically expanding its presence in the automotive storage market. Starting from the definition phase, the company meticulously controls each stage of the process according to automotive-grade requirements, including IC design, storage algorithm and firmware development, hardware design, packaging manufacturing, product testing, and safety certification. Tailoring its approach to the specific demands of in-vehicle applications, BIWIN has introduced highly reliable, competitive, and secure automotive-grade storage solutions and services, ensuring a safe driving experience.　　Continued Research and Development　　Benefiting from years of technical accumulation and experience, BIWIN consistently increases its investment in the research and development of automotive-grade storage. In the field of automotive-grade NAND Flash medium analysis, the company has acquired the capability to analyze storage medium characteristics under automotive-grade conditions, including cross-temperature performance, data retention, read and write interference, and lifespan. In the realm of automotive-grade storage firmware development, BIWIN has mastered reliability protection algorithms such as data loss prevention and data recovery under automotive-grade scenarios, as well as lifespan extension algorithms like wear leveling and write amplification control.　　Advanced Packaging and Testing　　In the packaging domain, BIWIN excels in the design and simulation of packaging for automotive-grade storage products, along with automotive-grade packaging and testing process capabilities and quality control. In testing, leveraging the rich testing experience and self-developed chip testing equipment and algorithms, the company has established capabilities for high-temperature, ambient-temperature, and low-temperature testing of automotive-grade products, as well as dynamic aging testing. BIWIN can also conduct characteristic analysis and prediction of defective outlier samples based on big data, ensuring automotive-grade yield rates and PPM targets.　　Additionally, BIWIN has set up laboratories for design simulation, signal analysis, system verification, reliability testing, material analysis, failure analysis, and more, to comprehensively meet product design and validation needs, continuously forging high-reliability and superior-quality products.　　Comprehensive Layout　　Presently, the company has launched a series of automotive storage products, including eMMC, UFS, LPDDR, BGA SSD, and SSD, widely applied in automotive information and entertainment systems, advanced driver assistance systems, intelligent cockpit systems, dashcams, panoramic monitoring systems, automotive dashboards, in-vehicle wireless terminals, rail transportation, and more. These products have entered the supply chain systems of leading automotive manufacturers and Tier 1 automotive component suppliers.　　In the future, BIWIN will actively deploy and implement integrated R&D and testing 2.0, continuously advancing research and production in automotive-grade storage. Leveraging its profound technical expertise and practical experience in automotive-grade storage, BIWIN will actively deepen cooperation with renowned domestic and international automotive manufacturers. By fully harnessing the strengths and characteristics of all parties involved and achieving deep integration, BIWIN seeks to jointly promote and build a robust brand service, contributing to the rapid development of the automotive industry.
Key word：
Release time：2023-12-28 17:34 reading：2570 Continue reading>>
Aluminum-based PCB vs Ceramic-based PCB – A Comprehensive Comparison for Your Electronics
Trade news

Aluminum-based PCB vs Ceramic-based PCB – A Comprehensive Comparison for Your Electronics

　　In the realm of electronics, the choice of printed circuit board (PCB) material plays a pivotal role in determining the functionality, performance, and longevity of electronic devices. Two prominent contenders in this domain are aluminum-based PCBs and ceramic-based PCBs, each with its distinct advantages and specialized applications. Let’s delve deeper into the characteristics, pros, and cons of aluminum-based PCB vs ceramic-based PCB to aid in your decision-making process.　　Aluminum-based PCBsAluminum-based PCBs, also recognized as metal core PCBs (MCPCBs), boast a core constructed from an aluminum alloy. These boards have garnered attention for their exceptional thermal conductivity and find extensive usage in applications that demand efficient heat dissipation.　　Aluminum-based PCBs　　Advantages of Aluminum-based PCBs　　Thermal Conductivity: The standout feature of Aluminum-based PCBs is their remarkable thermal conductivity. This property makes them a preferred choice in applications where heat dissipation is critical, such as LED lighting systems, power converters, and automotive electronics. The ability to efficiently transfer heat away from sensitive components ensures enhanced reliability and longevity of the devices.　　Cost-Efficiency: Aluminum-based PCBs often present a more budget-friendly option compared to certain high-performance materials. This cost-effectiveness makes them attractive for projects where optimizing expenses without compromising quality is a priority.　　Lightweight Nature: Despite their robust construction, Aluminum-based PCBs maintain a relatively lightweight profile. This attribute proves advantageous in applications where weight considerations are pivotal, such as portable electronic devices or aerospace applications.　　Manufacturing Simplicity: The manufacturing process for Aluminum-based PCBs is often simpler and more straightforward compared to some other materials, leading to reduced production time and costs.　　However, these PCBs do come with their set of limitations, which might impact their suitability for specific applications.　　Limitations of Aluminum-based PCBs　　Electrical Insulation Requirements: Aluminum-based PCBs necessitate an insulating layer between the circuit and the metal base to prevent short circuits. This requirement adds complexity to the manufacturing process and design considerations, potentially increasing production costs.　　Mechanical Strength: While durable, Aluminum-based PCBs might not offer the same level of mechanical strength as Ceramic-based PCBs. This factor could limit their use in applications exposed to harsh physical environments or substantial mechanical stress.　　Ceramic-based PCBsCeramic-based PCBs, typically crafted from materials like aluminum oxide or aluminum nitride, have gained prominence owing to their outstanding electrical insulation properties and reliability in diverse applications.　　Ceramic-based PCBs　　Advantages of Ceramic-based PCBs　　Superior Electrical Insulation: The hallmark of Ceramic-based PCBs lies in their superior electrical insulation capabilities. These boards excel in preventing signal interference and short circuits, making them ideal for high-voltage applications where maintaining signal integrity is crucial.　　Enhanced Mechanical Strength: Ceramic-based PCBs exhibit greater mechanical strength compared to their Aluminum-based counterparts. This characteristic makes them well-suited for deployment in rugged environments or applications where resistance to mechanical stress is imperative.　　High-Frequency Applications: With low dielectric loss and excellent signal integrity properties, Ceramic-based PCBs are highly sought after for high-frequency circuits and radio frequency (RF) applications.　　Chemical Resistance: Ceramics demonstrate remarkable resistance to chemicals and corrosion, making Ceramic-based PCBs suitable for applications exposed to harsh and corrosive environments, such as in aerospace or industrial settings.　　However, these boards also come with certain limitations that might influence their suitability for specific projects.　　Limitations of Ceramic-based PCBs　　Cost Considerations: Ceramic-based PCBs typically entail higher manufacturing costs due to the expense of materials and the complexity involved in their production. This factor might limit their feasibility for projects with stringent budget constraints.　　Brittleness: Despite their mechanical strength, ceramics can be inherently brittle. Careful handling is required during production, assembly, and installation to prevent breakage, which can add to the overall project timeline and costs.　　ConclusionThe choice between Aluminum-based and Ceramic-based PCBs hinges on a comprehensive evaluation of your project’s requirements, budget considerations, and the specific environmental conditions the electronic device will encounter.　　For applications where thermal management and cost-effectiveness are paramount, Aluminum-based PCBs might prove more suitable. Conversely, if superior electrical insulation, mechanical robustness, and reliability in harsh conditions are essential, Ceramic-based PCBs could be the preferred option.　　Ultimately, consulting with experienced PCB manufacturers or engineers remains pivotal in making an informed decision aligned with the unique demands of your electronic project.
Key word：
Release time：2023-12-15 13:26 reading：1719 Continue reading>>
What are the different types of <span style='color:red'>electronics</span> components packages?
Trade news

What are the different types of electronics components packages?

　　In the realm of electronics, various packaging technologies cater to the diverse needs of components, ensuring functionality, compactness, and performance. These packaging methods are crucial in determining a component’s size, compatibility, and usage in different applications. Here, we delve into some of the most prevalent component packaging technologies shaping the electronic landscape:　　1. Through-Hole Technology (THT)Through-Hole Technology (THT): DIP (Dual In-line Package), SIP (Single In-line Package), TO (Transistor Outline), etc.　　Through-Hole Technology (THT) is a method used to mount and connect electronic components to a printed circuit board (PCB). In THT, leads (metal wires) extend from the electronic component and are inserted into pre-drilled holes on the PCB. Once inserted, the leads are soldered to pads on the opposite side of the board, forming a secure electrical and mechanical connection.　　Components suitable for THT include resistors, capacitors, diodes, and integrated circuit sockets, among others. THT was one of the primary assembly methods for electronic components before the rise of Surface Mount Technology (SMT), which introduced smaller and more densely packed components suitable for automated assembly.　　2. Surface Mount Technology (SMT)Surface Mount Technology (SMT): SOIC (Small Outline Integrated Circuit), QFP (Quad Flat Package), LGA (Land Grid Array), BGA (Ball Grid Array), etc.　　Surface Mount Technology (SMT) is a method used in electronic assembly to mount and solder components directly onto the surface of a printed circuit board (PCB). In contrast to Through-Hole Technology (THT), which involves inserting component leads through holes in the PCB, SMT components have small metallic contacts or leads that sit directly on the board’s surface. SMT components are generally smaller and more compact than their through-hole counterparts, allowing for higher component densities and smaller PCB designs.　　SMT components include resistors, capacitors, integrated circuits (ICs), diodes, and other semiconductor devices. The process involves soldering the components to the PCB’s surface using reflow soldering, where solder paste is applied to the board, and then the components are placed on the paste. The entire assembly is heated, causing the solder to melt and create a secure connection between the component leads and the PCB pads.　　Surface Mount Technology has become the dominant method in modern electronics manufacturing due to its efficiency, miniaturization capabilities, and suitability for automated assembly processes.　　3. Ball Grid Array (BGA)　　Ball Grid Array (BGA): μBGA (Micro Ball Grid Array), CCGA (Ceramic Column Grid Array), PBGA (Plastic Ball Grid Array), etc.　　Ball Grid Array (BGA) is a type of surface mount packaging used for integrated circuits (ICs) and other semiconductor devices. It’s characterized by an array of solder balls arranged in a grid formation on the underside of the component. These solder balls serve as the connection points to the PCB.　　However, working with BGAs requires specialized equipment and techniques for both assembly and rework due to the complexity of soldering the numerous small solder balls. Nonetheless, they are widely used in various applications, especially in high-performance computing, gaming consoles, networking hardware, and consumer electronics, where space and performance are critical considerations.　　4. Chip Scale Packaging (CSP)　　Chip Scale Packaging (CSP): mCSP (micro Chip Scale Package), WLP (Wafer-Level Package), FC-CSP (Flip Chip Chip Scale Package), etc.　　Chip Scale Packaging (CSP) refers to a packaging technology for integrated circuits (ICs) where the package size closely matches the dimensions of the silicon die or chip itself. In essence, CSPs aim to minimize the footprint of the package while providing the necessary protection and connections for the chip.　　CSPs are commonly used in portable electronic devices such as smartphones, tablets, wearables, and other miniaturized gadgets. Their small form factor and efficient use of space make them ideal for applications demanding high-performance chips in constrained areas.　　5. Quad Flat Packages (QFP)　　Quad Flat Packages (QFP): TQFP (Thin Quad Flat Package), PQFP (Plastic Quad Flat Package), LQFP (Low-profile Quad Flat Package), etc.　　Quad Flat Packages (QFP) are a type of surface mount integrated circuit package characterized by a flat body and leads extending from all four sides of the component. The leads are arranged in a grid pattern, allowing for easy soldering to the printed circuit board (PCB).　　QFPs were a popular choice for integrating moderate-to-high pin counts in a compact form factor before more miniaturized packages, such as Ball Grid Arrays (BGAs) and Chip Scale Packages (CSPs), gained prominence in the electronics industry.　　6. Plastic Leaded Chip Carrier (PLCC)　　Plastic Leaded Chip Carrier (PLCC): PQFP (Plastic Quad Flat Package), LQFP (Low-profile Quad Flat Package), etc.　　A Plastic Leaded Chip Carrier (PLCC) is a type of integrated circuit (IC) package used for surface-mounted devices. It’s a square or rectangular package made of plastic with metal leads extending from the sides. PLCC packages typically contain a semiconductor chip and have leads or pins on all four sides, which are used for connection to a circuit board.　　PLCCs have largely been replaced by smaller and more efficient packages like quad flat no-leads (QFN) and ball grid arrays (BGAs) in many modern electronic devices due to their higher pin density, smaller footprint, and improved electrical performance.　　7. Transistor Outline (TO) Packages　　Transistor Outline (TO) Packages: TO-92, TO-220, TO-263, TO-220AB, etc.　　Transistor Outline (TO) packages are a standardized type of packaging used for discrete semiconductor components like transistors and some integrated circuits. These packages are designed to provide a standardized form factor for easy handling, mounting, and heat dissipation.　　The TO packages are convenient for manual or automated assembly onto circuit boards, and their standardized dimensions make them easily interchangeable in various electronic designs. However, due to advancements in technology, smaller and more efficient packages like surface-mount devices (SMDs) are becoming more prevalent in modern electronic designs, reducing the use of TO packages in some applications.　　8. Dual Flat No-Lead (DFN) Packages　　Dual Flat No-Lead (DFN) Packages: WDFN (Thin Dual Flat No-Lead), SON (Small Outline No-Lead), QFN (Quad Flat No-Lead), etc.　　Dual Flat No-Lead (DFN) packages are a type of surface-mount semiconductor package used for integrated circuits (ICs), such as microcontrollers, integrated power devices, and sensors. The DFN package is characterized by its small size, low profile, and absence of leads or pins extending from the package sides.　　DFN packages have a flat bottom with exposed metal pads arranged in a grid pattern. The electrical connections are made by soldering these pads directly onto corresponding pads on the surface of a printed circuit board (PCB). The absence of leads makes DFN packages suitable for high-density mounting, as they occupy less space and offer improved electrical performance due to shorter interconnection paths.　　DFN packages are popular in modern electronic devices where miniaturization and efficient use of space are crucial design considerations. Their compact size, good thermal performance, and ability to accommodate higher pin counts make them favored choices in many consumer electronics, telecommunications, and portable devices.　　9. Small Outline Package (SOP)　　Small Outline Package (SOP): TSOP (Thin Small Outline Package), SSOP (Shrink Small Outline Package), HSOP (Heatsink Small Outline Package), etc.　　The Small Outline Package (SOP) is a type of surface-mount technology used for integrated circuits. SOP packages are characterized by their rectangular shape with gull-wing or “J”-bend leads extending from the sides.　　These packages come in different variants, such as SOP, SOP-8, SOP-16, etc., indicating the number of leads (pins) present on the package. For instance, SOP-8 has 8 leads, while SOP-16 has 16 leads.　　SOP packages were popular in the 1980s and 1990s and remain in use for various applications, including memory chips, microcontrollers, and other ICs. They were widely adopted due to their ease of handling, small size, and compatibility with automated assembly processes.　　The gull-wing leads of SOP packages make them suitable for mounting onto the surface of a printed circuit board (PCB), allowing for more efficient use of board space and facilitating high-density mounting. The leads are usually spaced in a standardized pattern to ensure compatibility and ease of design across different manufacturers.　　10. Dual In-Line Package (DIP)　　Dual In-Line Package (DIP): PDIP (Plastic Dual In-line Package), CDIP (Ceramic Dual In-line Package), etc.　　The Dual In-Line Package (DIP) is a type of electronic component package used primarily for integrated circuits (ICs) and other similar semiconductor devices. DIPs were widely used in the earlier days of electronics and computing but have become less common with advancements in surface-mount technology.　　DIPs were prevalent in early computers, microcontrollers, memory chips, and other integrated circuits. However, as technology progressed, smaller and more efficient surface-mount packages like quad flat packages (QFP), small outline packages (SOP), and ball grid arrays (BGAs) gained popularity due to their smaller footprint, higher pin density, and better electrical performance.　　11. Chip on Board (COB)　　Chip on Board (COB): The semiconductor chip is mounted directly onto the PCB.　　Chip on Board (COB) refers to a packaging technology in which semiconductor chips are mounted directly onto a substrate or circuit board and then covered with a protective layer of epoxy resin or other encapsulation materials. Instead of using traditional individual packages for each chip, COB involves placing bare semiconductor chips directly onto the substrate and connecting them through wire bonding or flip-chip bonding techniques.　　COB technology finds applications in various electronic devices, including LED lighting, RFID tags, sensor modules, and certain types of microcontrollers. Its advantages in size, cost, and durability make it suitable for specific applications where space constraints and reliability are critical factors.　　12. Metal Can Packages　　Metal Can Packages: TO-CAN, FET CAN, etc.　　Metal can packages refer to a type of packaging used for semiconductor devices, particularly in the early days of integrated circuits and discrete electronic components. These packages are made of metal and are designed to protect the semiconductor chip or component from environmental factors and provide mechanical stability.　　Metal can packages were widely used in the past for diodes, transistors, operational amplifiers, and other electronic components. However, with advancements in semiconductor packaging technology, newer packaging formats like surface-mount packages (SMDs), plastic packages, and ceramic packages have become more prevalent due to their smaller size, lighter weight, and better thermal performance.　　Despite their declining use in modern electronics, metal can packages are still employed in specialized applications where their specific properties, such as hermetic sealing or high-reliability requirements, are crucial, such as in certain military, aerospace, or high-reliability industrial applications.　　13. Flip Chip　　Flip Chip: The die is flipped onto the substrate and bonded without packaging.　　Flip chip is an advanced packaging technique used in semiconductor manufacturing where the active surface of a microchip is inverted and directly connected to the substrate or carrier using tiny solder bumps or metal bumps. Instead of traditional wire bonding, where wires connect the chip to the substrate, flip chip technology directly attaches the active side of the chip to the carrier.　　Flip chip technology is widely used in various applications, including microprocessors, memory chips, graphic processors, and high-performance integrated circuits found in computers, smartphones, networking devices, and other electronic devices. Its advantages in terms of performance, size, and reliability have made it a preferred packaging method in the semiconductor industry for many high-performance applications.　　14. Wafer-Level Chip Scale Package (WLCSP)　　Wafer-Level Chip Scale Package (WLCSP): Direct chip attachment on the wafer level.　　Wafer-Level Chip Scale Package (WLCSP) is an advanced semiconductor packaging technology used to create extremely compact and miniaturized packages for integrated circuits (ICs). WLCSP is designed to minimize the package footprint, making it almost the same size as the actual semiconductor die, resulting in an ultra-small and thin package.　　WLCSP technology involves the packaging process occurring directly on the wafer during the semiconductor manufacturing process. The individual ICs are packaged at the wafer level before they are separated into individual chips (dies). This approach reduces manufacturing steps and cost compared to traditional packaging methods.　　WLCSPs are commonly used in various electronic devices where space savings, high performance, and miniaturization are essential, such as in mobile devices (smartphones, wearables), medical devices, and portable electronics.　　15. Ceramic Packages　　Ceramic Packages: Cerdip (Ceramic Dual In-line Package), CQFP (Ceramic Quad Flat Package), etc.　　Ceramic packages are a type of semiconductor packaging made primarily from ceramic materials. These packages are used to encapsulate and protect integrated circuits (ICs), transistors, and other semiconductor devices.　　Ceramic packages have been widely used in applications where high reliability, ruggedness, and thermal management are critical, such as in aerospace, automotive electronics, military applications, and certain industrial settings.　　However, ceramic packaging tends to be more expensive compared to plastic or other materials, which has led to the development of alternative packaging technologies for consumer electronics. Nevertheless, for applications requiring superior thermal performance, reliability, and resilience to extreme conditions, ceramic packages remain a preferred choice.　　16. Ceramic Ball Grid Array (CBGA)　　Ceramic Ball Grid Array (CBGA): Ceramic package with a grid array of solder balls.　　A Ceramic Ball Grid Array (CBGA) is a type of packaging used for integrated circuits (ICs) and semiconductor devices. It’s a variation of the ball grid array (BGA) packaging, where the package substrate is made of ceramic material instead of organic material (like fiberglass-reinforced epoxy resin).　　CBGA packages are commonly used in applications that demand high reliability, ruggedness, and superior thermal management. These include aerospace, military, automotive, and certain industrial applications where extreme temperatures, mechanical stress, or harsh environments are encountered.　　However, CBGA packages tend to be more expensive to manufacture compared to their organic substrate counterparts (like plastic BGAs), which has led to their more limited use in certain consumer electronics applications. Nevertheless, their exceptional thermal performance and reliability make them a preferred choice for specific high-end applications.　　17. Hermetic Sealed Packages　　Hermetic Sealed Packages: Complete seal for protection against environmental factors.　　Hermetic sealed packages refer to electronic packaging that provides an airtight and moisture-proof enclosure for semiconductor devices, integrated circuits (ICs), sensors, or other sensitive electronic components. The term “hermetic” implies a complete seal that prevents the ingress of gases or moisture into the package.　　Hermetic sealing ensures the long-term integrity and reliability of sensitive electronic components, especially in environments where exposure to moisture, gases, or contaminants could compromise their functionality. This level of protection is essential for maintaining the performance and longevity of electronic devices in demanding and critical applications.　　18. Molded Packages　　Molded Packages: Enclosed in a protective mold to shield against moisture and contaminants.　　Molded packages, in the context of semiconductor manufacturing, refer to packaging technology where semiconductor devices or integrated circuits (ICs) are encapsulated within a molded plastic or resin material. This process involves molding the semiconductor chip and connecting wires within a protective casing made of plastic or resin.　　These packages are not limited to a single type but encompass various packaging styles, such as Dual In-Line Packages (DIPs), Small Outline Packages (SOPs), Quad Flat Packages (QFPs), and many others. Molded plastic or resin packaging has been widely used due to its versatility, cost-effectiveness, and ability to meet the needs of various electronic applications.　　19. Hybrid Packages　　Hybrid Packages: Combines different packaging types into a single component.　　Hybrid packages refer to semiconductor packaging that combines multiple semiconductor or electronic components in a single package, typically integrating different technologies or types of components onto a common substrate. These packages are called “hybrid” because they merge diverse technologies or functionalities within one enclosure.　　The manufacturing of hybrid packages involves assembling different components onto a common substrate, which can be ceramic, organic, or other materials suitable for accommodating the diverse technologies being integrated. Assembly methods may involve wire bonding, die attach, flip chip bonding, or other advanced packaging techniques.　　Hybrid packages offer a versatile solution for combining different electronic components to achieve desired functionalities, making them valuable in various industries where specific and specialized applications demand tailored solutions.　　20. System-in-Package (SiP)　　System-in-Package (SiP): Integrates multiple chips or devices into a single package.　　System-in-Package (SiP) is an advanced packaging technology that integrates multiple chips, dies, or diverse components into a single package, forming a complete functional system. It differs from traditional multi-chip modules or single-chip ICs by combining various functionalities or entire subsystems into a compact and integrated package.　　SiP technology finds applications in various fields, including mobile devices, Internet of Things (IoT) devices, wearables, telecommunications, automotive electronics, and more. Its ability to combine multiple functions or subsystems into a single package makes SiP an efficient and space-saving solution for complex electronic systems.　　The manufacturing process for SiP involves assembling and interconnecting various chips or components onto a common substrate using advanced packaging techniques. Design considerations include thermal management, signal integrity, power distribution, and overall system optimization to ensure optimal performance of the integrated system.　　Each of these packaging technologies serves specific purposes, balancing factors like size, performance, thermal management, and environmental protection for various electronic components and devices.　　These packaging technologies, with their unique designs and functionalities, enable the creation of intricate electronic systems across diverse industries. Their evolution continues to meet the demands of miniaturization, performance enhancement, and innovation in modern electronics.
Key word：
Release time：2023-12-14 13:40 reading：1595 Continue reading>>
STMicro<span style='color:red'>electronics</span> to Invest EUR 5 Billion in New SiC Wafer Fab
Trade news

STMicroelectronics to Invest EUR 5 Billion in New SiC Wafer Fab

　　STMicroelectronics, following its EUR 7.5 billion wafer fab project with GlobalFoundries in Crolles, France. is set to invest EUR 5 billion in building a new SiC super semiconductor wafer fab in Catania, Sicily, Italy. The fab in Italy will specialize in producing SiC chips, a pivotal technology for electric vehicles with substantial growth potential, according to French media L’Usine Nouvelle on November 26th,　　STMicroelectronics competitively plans to transition to 8-inch wafers starting from 2024. The company will integrate Soitec’s SmartSiC technology to enhance efficiency and reduce carbon emissions. Simultaneously, STMicroelectronics aims to increase capacity, achieve internal manufacturing, and collaborate with Chinese firm Sanan Optoelectronics to raise SiC chip-related revenue from the expected USD 1.2 billion in 2023 to USD 5 billion by 2030.　　On June 7th earlier this year, STMicroelectronics and Sanan Optoelectronics announced a joint venture to establish a new 8-inch SiC device fab in Chongqing, China, with an anticipated total investment of USD 3.2 billion.　　To ensure the successful implementation of this extensive investment plan, Sanan Optoelectronics said to utilize its self-developed SiC substrate process to construct and operate a new 8-inch SiC substrate fab independently.　　TrendForce: over 90% SiC market share by major global players　　According to TrendForce, the SiC industry is currently dominated by 6-inch substrates, holding up to 80% market share, while 8-inch substrates only account for 1%. Transitioning to larger 8-inch substrates is a key strategy for further reducing SiC device costs.　　8-inch SiC substrates offer significant cost advantages than 6-inch substrates. The industry’s major players in China, including SEMISiC, Jingsheng Mechanical & Electrical Co., Ltd. (JSG), Summit Crystal, Synlight Semiconductor, KY Semiconductor, and IV-SemiteC, are advancing the development of 8-inch SiC substrates. This shift from the approximately 45% of total production costs associated with substrates is expected to facilitate the broader adoption of SiC devices and create a positive cycle for major companies.　　Not only Chinese companies but also international semiconductor giants like Infineon Technologies and Onsemi are actively vying for a share of the market. Infineon has already prepared the first batch of 8-inch wafer samples in its fab and plans to convert them into electronic samples soon, with mass production applications scheduled before 2030. International device companies like Onsemi and ROHM have also outlined development plans for 8-inch SiC wafers.　　Currently, major companies hold over 90% of the market share, intensifying competition. A slowdown in progress could provide opportunities for followers. According to TrendForce, the market share of the top 5 SiC power semiconductor players in 2022 was dominated by STMicroelectronics (36.5%), Infineon (17.9%), Wolfspeed (16.3%), Onsemi (11.6%), and ROHM (8.1%), leaving the remaining companies with only 9.6%.
Key word：
Release time：2023-11-30 10:53 reading：2511 Continue reading>>
Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers
Trade news

Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers

　　Renesas Electronics RA8M1 Arm® Cortex®-M85 Microcontrollers (MCUs) are a high-performance MCUs based on the Arm® Cortex®-M85 core with Helium for compute-intensive DSP and AI/ML tasks. Leading performance of 480MHz with up to 2MB code flash memory, 1MB SRAM, and advanced peripherals that support a broad range of IoT applications. Octal SPI interface with decryption-on-the-fly for highly secure interface to external memory. High integration with 16-bit CEU camera interface, 12-bit A/D converter, 12-bit D/A converter, PWM timers, High-Speed Analog Comparators, Ethernet MAC with DMA, CAN-FD, USB HS/FS, SCI, SPI, I2C/I3C and safety features. Advanced security with TrustZone®, next-gen cryptography, immutable storage for FSBL, secure boot and tamper protection, including DPA/SPA side-channel attack protection.      The Renesas Electronics RA8M1 is built on a highly efficient 40nm process and supports a wide operating voltage range of 1.68V-3.6V. To ease application development, the RA8M1 is supported by the Flexible Software package (FSP), evaluation kits, software development tools, and Cloud solutions.      FEATURES　　》480MHz Arm Cortex-M85 core with Helium　　*M-Profile vector extension for AI/ML　　*High-performance core featuring Armv8.1m architecture with Helium for DSP/ML acceleration　　*Up to 2MB Flash memory and 1MB SRAM included TCM; 384KB user SRAM and 128KB TCM are ECC-protected　　*32KB I/D caches (ECC protected), 12KB data Flash　　*Advanced security with TrustZone, RSIP Cryptographic engine, immutable storage, and tamper protection　　*Scalable from 100-pin to 224-pin packages　　*Octal SPI interface with decryption-on-the-fly, Ethernet MAC with DMA, CAN-FD, and USB HS/FS (host and device) connectivity options　　*CEU Camera i/f, 12-bit ADCs, 12-bit DACs, high-speed analog comparators, and 3x sample and hold circuits　　*SCI (UART, simple SPI, simple I2C), SPI, I2C, I3C　　*High-performance MCUs @ 480MHz for a broad base of compute-intensive IoT applications　　*High integration for lower costs and simplified design　　*Octal SPI interface with a secure interface to external memory for storage of code and data　　*Advanced security for highly secure IoT　　*Open Arm Ecosystem, easy-to-use Flexible Software Package and comprehensive solutions to enable fast development　　*S/H enable motor control applications　　APPLICATIONS　　*Broad-based IoT applications　　*Industrial automation　　*IoT gateways/hubs　　*Smart home/home automation products　　*Thermostats　　*Home appliances (refrigerators, ovens, washing machines, etc.)　　*Security cameras　　*Building automation (HVAC, access)
Key word：
Release time：2023-11-27 14:40 reading：1869 Continue reading>>
Renesas Electronics CK-RA6M5 V2 Cloud Kit
Trade news

Renesas Electronics CK-RA6M5 V2 Cloud Kit

　　Renesas Electronics CK-RA6M5 V2 Cloud Kit enables secure connection to the cloud and explores the features of the Cortex®-M33 based RA6M5 MCUs and cloud services. With Renesas’ RYZ014A LTE Cellular CAT-M1 module and ethernet network connectivity options, the kit provides a seamless cloud connectivity platform to most global cloud service providers. With a Flexible Software Package (FSP), the kit has complete software stack support using FreeRTOS, Azure RTOS, and other middleware stacks. These stacks make the kit an ideal platform for efficiently developing cloud solutions and significantly reducing time-to-market.　　APPLICATIONS　　*IoT Cloud solutions　　*Edge Impulse Studio　　*Home and building automation　　*Smart cities　　*Healthcare　　*Industrial monitoring and sensing　　*Voice command　　*Smart metering　　*Asset tracking and location-based services　　KIT CONTENTS　　*CK-RA6M5 v2 board　　*RYZ014A PMOD (CAT-M1 cellular module)　　*Micro USB to A cable　　*Micro USB A/B to A adapter cable　　*SIM card　　*Antenna
Key word：
Release time：2023-10-24 11:57 reading：2514 Continue reading>>

Turn to

/ 7

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
BD71847AMWV-E2 ROHM Semiconductor
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
model brand To snap up
IPZ40N04S5L4R8ATMA1 Infineon Technologies
ESR03EZPJ151 ROHM Semiconductor
TPS63050YFFR Texas Instruments
BU33JA2MNVX-CTL ROHM Semiconductor
BP3621 ROHM Semiconductor
STM32F429IGT6 STMicroelectronics
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code