Fibocom Releases 5G AI Mobile Hotspot Solution, Unlocking Intelligent Future for Mobile Broadband Devices
Trade news

Fibocom Releases 5G AI Mobile Hotspot Solution, Unlocking Intelligent Future for Mobile Broadband Devices

　　As 5G and AI technologies continue to converge, demand is growing for stable, high-speed, and intelligent mobile networks across various scenarios—from business travel and outdoor operations to global connectivity. Fibocom’s latest 5G AI Mobile Hotspot solution redefines the mobile broadband experience with cutting-edge technology and forward-thinking design.　　Powered by Qualcomm’s advanced 4nm QCM4490 platform, the solution combines smartphone-grade ultra-low power consumption with precision circuit design. This results in a powerful yet energy-efficient platform that balances high performance with cost optimization.　　In terms of connectivity, the solution supports 3GPP Release 16 and NR 2CC 120MHz. It delivers a downlink speed of up to 2.3 Gbps in SA mode and 2.5 Gbps in NSA mode. Customers can flexibly configure the solution with either AX3600-based Wi-Fi 6E or BE5800-based Wi-Fi 7 options. It supports dual-band simultaneous (DBS) modes of 2.4GHz+5GHz or 2.4GHz+6GHz, as well as high-band simultaneous (HBS) mode of 5GHz+6GHz.　　Tailored for Mobile Hotspot applications, the solution runs an optimized Android 13 OS, significantly boosting system performance while reducing power consumption. With USB 3.1 support and a theoretical data transfer rate of up to 5 Gbps, it’s well-suited not only for 5G Mobile Hotspot devices but also for other mobile broadband terminals such as USB dongles.　　Crucially, the solution leverages the QCM4490’s heterogeneous computing architecture, featuring a robust 8-core CPU (2x Cortex-A78 @ 2.4GHz + 6x Cortex-A55 @ 2.0GHz) and integrated Adreno 613 GPU (@ 1010MHz). Compared to GPU-less solutions, this powerful combination enables efficient on-device AI processing, expanding the possibilities for more edge intelligence applications. Internal tests have demonstrated the successful deployment of large-scale open-source AI models such as Qwen-1.8 B-Chat.　　From business office to global travel these mobile broadband applied scenarios, Fibocom’s cost-effective 5G AI Mobile Hotspot solution—with optional Wi-Fi 7 support—paves the way for a new era of AI-enhanced mobile broadband.
Key word：
Release time：2025-06-06 15:38 reading：271 Continue reading>>
NOVOSENSE introduces NSDA6934-Q1: Automotive-grade Class D audio amplifier with digital input
Trade news

NOVOSENSE introduces NSDA6934-Q1: Automotive-grade Class D audio amplifier with digital input

　　NOVOSENSE recently announced the launch of the NSDA6934-Q1, a digital-input automotive-grade Class D audio amplifier designed for vehicle audio systems. Featuring four-channel audio output with up to 75W per channel, it supports low-latency mode and sampling rates up to 192kHz. The amplifier offers flexible switching frequencies, multiple modulation options, and comprehensive protection features, making it highly adaptable to various automotive audio system designs.　　Class D amplifiers: Driving the evolution of automotive audio　　As automotive electronics continue to advance, Class D amplifiers have emerged as the preferred choice for vehicle audio systems due to their high efficiency, low heat dissipation, and compact form factor. These amplifiers not only meet modern vehicles’ stringent energy efficiency demands but also enhance audio quality and power output within limited space, playing a key role in the evolution of automotive audio technology.　　Optimized Low-Latency Mode: Reducing Path Delay by Over 70%　　In automotive audio systems, amplifiers boost signals from the DSP (Digital Signal Processor) before transmitting them to the speakers. Traditional amplifiers can contribute to over 30% of total signal transmission latency, impacting system performance.　　The NSDA6934-Q1 features a unique low-latency mode that reduces transmission path delay by more than 70%, granting the DSP additional time for signal processing. This reduces DSP resource demands and enhances the effectiveness of RNC (Road Noise Cancellation). Additionally, the amplifier supports up to 192kHz sampling rates, delivering high-resolution audio with enhanced clarity and detail for an immersive in-car listening experience.　　Flexible Configurations to Suit Various Designs　　The NSDA6934-Q1 provides a wide range of switching frequencies and modulation options, allowing system engineers to optimize efficiency and size.　　Adjustable Switching Frequency (384kHz – 2.1MHz)　　At 384kHz, the amplifier achieves up to 93% efficiency, ideal for applications prioritizing power savings, though it requires a 10μH inductor for operation.　　At 2.1MHz, the amplifier supports a compact 3.3μH inductor, making it suitable for space-constrained smart cockpit integration.　　Selectable Modulation Modes (BD Mode & 1SPW Mode)　　BD Mode (50% duty cycle) ensures superior linearity at high power levels, making it ideal for high-output applications.　　1SPW Mode (20% duty cycle) reduces conduction losses, improving efficiency in low-power scenarios　　Additionally, the NSDA6934-Q1 supports TDM16 data format, ensuring seamless integration with mainstream audio interfaces. With eight selectable I2C addresses, it prevents communication conflicts among peripheral devices. It also features integrated PVDD voltage monitoring, eliminating the need for external resistor dividers and simplifying system wiring and debugging.　　Enhanced EMC Performance & Comprehensive Protection　　The NSDA6934-Q1 incorporates multiple EMC optimization techniques, including slew rate control, phase control, and three spread-spectrum modes (triangular wave, random spread, hybrid spread), helping customers pass system-level EMC tests efficiently.For system reliability, the amplifier integrates multiple intelligent protection and diagnostic functions, including:　　• I2C watchdog for real-time bus monitoring.　　• Thermal protection, which automatically reduces gain under high-temperature conditions.　　• AC/DC diagnostics for real-time power supply monitoring.　　• Comprehensive protection suite, including temperature alarms, over-temperature shutdown, undervoltage, overvoltage, and overcurrent protection, ensuring robust system stability.
Key word：
Release time：2025-04-24 17:19 reading：436 Continue reading>>
Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications
Trade news

Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.　　Optimized Design to Deliver Unparalleled Power Efficiency　　Building on Renesas’ leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.　　Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features　　The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.　　“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”　　Lower Bill-of-Materials Reduces Costs and Simplifies Development　　Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).　　A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.　　Key Features of the DA14533　　Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems　　64KB RAM and 12KB One-Time Programmable (OTP) memory　　2.4 GHz radio transceiver　　Integrated low IQ buck DC-DC converter　　External SPI flash　　Single XTAL operation (single crystal oscillator)　　Software stack qualified against Bluetooth Core 5.3　　AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)　　WFFCQFN 22-pin 3.5 x 3.5 mm package
Key word：
Release time：2025-04-08 14:06 reading：527 Continue reading>>
Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems
Trade news

Renesas Introduces Highly Integrated LCD Video Processor that Enables Next-Generation ASIL B Automotive Display Systems

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA278830 Video Diagnostics Bridge IC, a highly integrated dual Low-Voltage Differential Signal (LVDS) LCD video processor. The new IC integrates many of the features necessary to design ISO 26262-compliant ASIL B automotive display systems such as heads-up-displays (HUD), digital instrument clusters, camera monitor systems (CMS), and electronic mirrors.　　As automotive safety systems are increasingly dependent on display systems, it has become more critical that clear, uncorrupted images be presented to the driver. Missing frames, frozen images, and even incorrect warning icons can seriously compromise driver safety. The RAA278830 addresses these concerns with Functional Safety features built into the device specifically to avoid any corruption of images through monitoring of the signal integrity as well as the video content itself. The internal diagnostics and measurement engines can detect frozen video, incorrect colors, broken or corrupt video images, as well as flashing, flickering, and video images that could obstruct the driver’s view of the road (in the case of HUD systems).　　Renesas’ Automotive Video Signal Processing Expertise　　Renesas has a long and successful track record of providing video signal processing solutions for the automotive market. In addition to standard analog video decoders, Renesas offers the award-winning Automotive HD-Link (AHL) family of products that enables high-resolution images to be transported over low-cost cables and connectors. The RAA278830 adds to Renesas’ leading line of integrated LCD controllers that have been implemented worldwide.　　Key Features of the RAA278830　　Dual Open-LDI Input/Output　　ISO 26262 Functional Safety ASIL B rating　　CRCs, parity, BIST, and redundancy safety mechanisms implemented throughout the entire data path　　Video Diagnostic Capabilities　　Input/Output monitoring of video timing, signal integrity, and content　　Flickering, flashing, occlusion, and glare detection　　Spread Spectrum for lower system level EMI profile　　Image enhancement engine for superior image quality　　Dual host interface: I2C & SPI (configurable)　　SPI-Flash based OSD as well as an embedded font based OSD　　SPI boot capability (boot from SPI Flash, no MCU needed)　　Supports multi-bank for fail-safe OTA updates　　Space-efficient 72SCQFN, 10mm x 10mm　　AEC-Q100 Grade 2 qualified　　“Our automotive customers have consistently asked us to add functional safety features to our industry-leading video processing technology,” said Jason Kim, Vice President and General Manager of the Configurable Mixed-Signal Division at Renesas. “The RAA278830 delivers all of the features needed to create safe, easy-to-implement and economical LCD display for all types of passenger vehicles.”
Key word：
Release time：2025-04-01 14:36 reading：473 Continue reading>>
How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?
Trade news

How Will BIWIN BGA SSD Break Through in the Intelligent Upgrade Path of Edge Devices?

　　In the wave of edge intelligence upgrades, as products are continuously evolving toward miniaturization and high integration, the device systems are confronted with dual challenges of physical space compression and surging computing power. Over the past years, BIWIN has invested significant effort in advancing research and development in storage technologies and advanced packaging and testing processes, providing it with competitive advantages in delivering tailored, miniaturized, and highly integrated storage solutions, including a diverse product portfolio, patented proprietary technologies, and a robust manufacturing and supply chain system.　　Notably, the BIWIN-launched EP410 BGA SSD, with its innovative architectural design, exemplifies a breakthrough solution for edge devices upgrades by offering three key capabilities: a compact and lightweight design, outstanding performance, and high reliability. While offering form factors as compact as those of embedded chips to meet the rigorous dimension requirements of portable devices, these SSDs are able to deliver superior performance and flexible capacity options compared to UFS/eMMC standards.　　Ultra-Thin, Compact Design to Maximize System Spatial Efficiency　　The increasing inference frequencies across smartphones and PCs have made the large capacity a fundamental configuration. Meanwhile, in order to deliver optimized user experience and robust operation under complicated environments, the terminal manufacturers are striving to achieve maximized hardware efficiency and capacity utilization within constrained system dimensions.　　Aligned with the trends in product iteration, BGA SSD EP410 is equipped with advanced packaging processes such as 16-layer die stacking and 40μm ultra-thin die, realizing the compact form factor measuring only 16×20×1.4mm—merely 1/14 the volume of conventional M.2 2280 SSDs (80×22×3.5mm). Surprisingly, it’s able to deliver uncompromising capacity up to 2TB, supporting the smooth image recognition and natural language processing in edge devices and free of capacity limitations. The adopted packaging processes not only reduces board footprint, providing more design flexibility for terminal manufacturers, but also enhances electrical performance to accommodate greater data throughput, enabling device manufacturers to develop more streamlined, competitively advantageous products.　　Uncompromised Performance, Establishing a Robust Foundation for Edge Intelligence Inference　　In terms of performance, BIWIN has harnessed its integrated R&D and packaging and testing business model, along with the optimization and tuning of firmware algorithm, to satisfy the critical demands for error correction, data security and integrity in storage products across various application scenarios.　　The BIWIN EP410 BGA SSD is compatible with PCIe 4.0 interface and NVMe protocol, with its sequential read/write speed reaching 7350MB/s and 6600MB/s respectively, far surpassing the theoretical bandwidth capability of UFS 4.0. Incorporated with self-developed flash memory management algorithm and dynamic bandwidth allocation technology, BIWIN BGA SSD has demonstrated excellent bandwidth stability, qualifying for edge intelligence devices’ access to high-speed data and transfers of high-load requirements with low latency, as well as the responsive handling of sophisticated intelligent tasks. From the application perspective, BIWIN BGA SSD has been included in the list of Google approved suppliers; on the compatibility front, it offers a cross-platform advantage, compatible with a variety of mainstream SoC solutions, which simplifies the design and introduction processes for clients.　　Intelligent Thermal Control and Reliability Design, Ensuring the Stable Operation of Critical Applications　　With the characteristics of chip miniaturization and high integration becoming more pronounced, the increases in power consumption and thermal output have presented challenges for devices’ operational stability and lifespan. Considering this, BIWIN EP410 BGA SSD has further strengthened its reliability design, verification, analysis and management processes. In order to ensure efficient heat dissipation, the product is engineered with DRAM-less architecture with intelligent thermal throttling, as well as in-house LDPC, dynamic and static wear leveling, bad block management and multi-environmental adaptability, contributing to significantly improving the data integrity and security, ensuring long-term stable operations and preventing disconnection during critical usage scenarios including gaming, productivity applications, and content creation.　　Having been subjected to BIWIN’s thorough testing procedures, including electrical performance, SI, application, compatibility, and reliability testings, the products have been validated with their MTBF exceeding 1,500,000 hours and operating temperature ranging from 0℃ to 70℃, enabling the flagship intelligent terminals, for example the 2-in-1 laptops, UAVs, automotive IVI, to catch the wave of edge intelligence upgrades.　　Conclusion　　From the successful mass production of its first PCIe BGA SSD in 2018 to the latest generation EP410 BGA SSD featuring the PCIe Gen4 x4 interface, BIWIN’s continuously evolving products demonstrate its deep expertise in miniaturization and high-integration technologies, while also highlighting its visionary foresight in the ecosystem of edge intelligence. As AI and storage technologies progress toward deeper ecological integration, BIWIN will further leverage its early-mover advantages in mobile terminal storage chips and extend this advantage into the edge intelligence era. Whether in hardware design, software optimization, or ecosystem construction, BIWIN remains committed to advancing industry progress and delivering increasingly intelligent, efficient, and reliable storage solutions to users.
Key word：
Release time：2025-03-20 14:01 reading：440 Continue reading>>
ROHM Offers the Industry’s Smallest* Terahertz Wave Oscillation and Detection Devices
Trade news

ROHM Offers the Industry’s Smallest* Terahertz Wave Oscillation and Detection Devices

　　ROHM has begun offering samples of the industry’s smallest* terahertz (THz) wave oscillation and detection devices utilizing semiconductor elements known as Resonant Tunneling Diodes (RTDs). Terahertz waves are anticipated to be applied to non-destructive testing, imaging, and sensing in the medical and healthcare sectors, as well as potentially future ultra-fast communication technologies. Providing these devices contributes to the advancement of terahertz wave applications.　　ROHM has developed a 0.5mm × 0.5mm RTD chip for terahertz wave generation and detection, capable of oscillating and detecting terahertz waves at a frequency of 320GHz (typ.) with an output power ranging from 10 to 20µW. ROHM will begin offering samples of this RTD element mounted in a PLCC package (4.0mm × 4.3mm) commonly used for LEDs. With an extremely compact size, typically than one-thousandth that of conventional oscillators, this innovation enables easy development of terahertz wave applications, even in space-constrained environments.　　By positioning the antenna surfaces of the oscillation and detection devices facing each other 10mm apart, a dynamic range of 40dB (typ.) can be achieved. Both oscillator and detector maintain a drive power consumption of 10mW (typ.), while their ability to oscillate and detect terahertz waves at room temperature eliminates the need for cooling equipment required with some conventional methods. These compact, power-saving devices are almost unaffected by the operating environment, enabling use in a wide range of applications.　　ROHM offers samples of terahertz wave oscillation and detection devices at a sample price of $990.0/unit (excluding tax), which is less than one-tenth the price of conventional devices. ROHM also provides evaluation kits that include an evaluation board and other components, allowing users to easily integrate the devices into a research and development environment. For more information, please contact a sales representative or visit the contact page on ROHM’s website. The sale of sample products and evaluation kits requires the prior signing of a non-disclosure agreement (NDA) with ROHM.　　Professor Safumi Suzuki, Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Integrated Research, Institute of Science Tokyo      “Terahertz waves are expected to be applied to various fields such as imaging, sensing, and wireless communications due to their excellent characteristics and high degree of safety. However, research and development for commercialization has traditionally required large-scale equipment and substantial costs.　　In this context, the RTD terahertz wave device - developed through years of collaborative research with ROHM - is an ultra-small 4.0mm × 4.3mm device that challenges conventional norms while featuring astonishingly low power consumption and implementation costs. With the launch of device samples, we anticipate that many private companies and research institutions will begin exploring terahertz wave research.　　We hope that the use of terahertz waves in various fields will lead to the creation of new applications with functions that were previously difficult to achieve. Going forward, we will continue to contribute to society through the development of terahertz wave devices in partnership with ROHM.”　　Ken Nakahara, General Manager of Center, ROHM Research & Development Center, ROHM Co., Ltd.      “The terahertz (THz) R&D team and I are very excited and proud to have reached the point where we can bring this technology to market. We have dedicated ourselves to THz devices for about 15 years; the journey has not been easy. We gathered the forces of industry, academia, and government along the way, and have successfully established the position that ROHM holds today.　　The team understands that this announcement is just a small step toward the commercialization of THz technology, but at the same time, it is a giant leap for us. We believe that this small beginning will grow big and contribute to the well-being of our society.”　　Background and Development Summary        Occupying the frequency region between radio waves and light, terahertz waves exhibit a variety of distinctive characteristics, including excellent permeability similar to radio waves, straight-line propagation akin to laser beams, and unique absorption properties for materials such as polymers. As such, they are expected to be utilized for non-destructive testing, imaging of humans and materials without the use of dangerous radiation, high-speed communication as an alternative to conventional wireless transmission, and high-resolution radar sensing. However, conventional methods often require large equipment sizes and high implementation costs often ranging from tens of thousands to hundreds of thousands of dollars, making it challenging for private companies to actively pursue research or commercialize in the field of practical terahertz applications.　　Since the late 2000s, ROHM has engaged in joint research with numerous universities and research institutes, such as the Institute of Science Tokyo and Osaka University. The key aim: developing terahertz wave oscillation and detection devices using RTD technology. ROHM is also involved in several consortia, including national projects (government R&D initiatives) sponsored by the Ministry of Internal Affairs and Communications (MIC), the National Institute of Information and Communications Technology (NICT), and the Japan Science and Technology Agency (JST), as well as the XG Mobile Promotion Forum and the Terahertz System Application Promotion Council. ROHM will continue to focus on device development while contributing to the early industrialization and social integration of terahertz technology.　　Professor Safumi Suzuki Profile        Doctor of Engineering, Professor at the Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Integrated Research, Institute of Science Tokyo. His research targets the development of terahertz wave devices using resonant tunneling diodes (RTDs).　　• Career　　March 2009　: Completed a doctoral program at the Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology　　April 2009　: Assistant Professor, Interdisciplinary Graduate School of Science and Engineering, Tokyo Institute of Technology　　April 2014　: Associate Professor, Faculty of Engineering, Tokyo Institute of Technology　　August 2024　: Professor, Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Innovative Research, Tokyo Institute of Technology　　October 2024　: Professor, Laboratory for Future Interdisciplinary Research of Science and Technology, Institute of Integrated Research, Institute of Science Tokyo　　Terminology         Resonant Tunneling Diode (RTD)　　A terahertz wave light source that uses semiconductor elements to provide advantages such as small size, low power consumption, and the ability to oscillate at room temperature. Following extensive research and development with various universities and research institutions, ROHM has successfully achieved in-house production of RTD devices capable of efficient terahertz wave oscillation and detection.　　PLCC　　Short for Plastic Leaded Chip Carrier, a type of IC package used for semiconductor integrated circuits.　　Conventional THz Generation Methods　　Conventional methods for generating terahertz waves include the ‘frequency multiplication’ method, which converts the frequency of an electrical signal into an integer multiple for output, and the “photomixing” method that produces terahertz waves from the difference frequency created when two laser beams of different wavelengths are mixed in a photomixer. Both approaches necessitate large or medium sized costly equipment to generate terahertz waves.　　Dynamic Range　　A performance metric for analog devices indicating the difference or ratio between the maximum and minimum values of a signal that can be handled. Like for other radio frequency applications, for terahertz waves dynamic range usually expressed in decibels (dB).
Key word：
Release time：2025-03-14 09:40 reading：384 Continue reading>>
NOVOSENSE's NCA1044-Q1 CAN Transceiver Successfully Passes the IBEE/FTZ-Zwickau EMC Certification
Trade news

NOVOSENSE's NCA1044-Q1 CAN Transceiver Successfully Passes the IBEE/FTZ-Zwickau EMC Certification

　　NOVOSENSE announced that its newly launched NCA1044-Q1, an automotive-grade CAN transceiver, had received the EMC certification test reports from IBEE/FTZ-Zwickau, a prestigious European testing organization. NCA1044-Q1 successfully passed all test items. NOVOSENSE now can provide the test report to support automakers in streamlining their system certification process and accelerating their product launches.　　CAN transceivers are commonly used in automotive CAN bus networks typically for critical control and diagnostics functions, such as battery, motor control, electronic control, braking, steering, and airbag systems. These applications are prone to various sources of electromagnetic interference (EMI), including battery, motor and electronic control systems for EVs, engine, frequency converter and wireless communication devices. Such disturbances can adversely affect data transmission, leading to signal errors or system failures, and even compromised system safety.　　In addition, due to the long distance of CAN bus wiring in automotive systems, CAN transceivers can easily radiate noise through the CAN bus acting as an antenna. This can result in radiated emission and conducted emission from modules or the entire system that exceed the requirements for vehicle. Therefore, CAN transceivers that provide good electromagnetic compatibility (EMC) performance are essential for ensuring system reliability.　　Full compliance with IBEE/FTZ-Zwickau certification　　Given the critical role of CAN transceiver's EMC performance in automotive safety, countries or regions have established stringent automotive EMC standards and certification procedures for automakers to follow. For example, both the SAE J2962 standard and the European IBEE/FTZ-Zwickau certification set clear requirements for the EMC performance of automotive electronics.　　The IBEE/FTZ-Zwickau certification is carried out according to the IEC 62228-3 standard. Compared with SAE J2962, IEC 62228-3 excludes the effects of peripheral circuits, focuses more on the EMC property of the CAN transceiver itself, and specifies higher performance level requirements. The IEC 62228-3 standard is also extensively adopted by automakers outside of Europe. The IBEE/FTZ-Zwickau certification includes four tests: Emission RF Disturbances, Immunity RF Disturbances, Immunity Transients, and Immunity ESD. NCA1044-Q1 from NOVOSENSE successfully passed all four tests.　　Industry-leading interference immunity　　NCA1044-Q1 features an ingenious circuit design that addresses the issue of output signal errors caused by abnormal high-voltage interference affecting its output circuit. This enhances its EMC performance, helping customers substantially reduce their EMC design complexity, simplify peripheral components, and lower costs.　　Furthermore, NCA1044-Q1 boasts industry-leading interference immunity. According to IEC 62228-3, when external RF noise at different frequency bands couples to the CAN bus, a higher pass-through power indicates stronger interference immunity. This means a lower risk of errors in the system.　　Even without the use of a common-mode inductor filter on the bus, NCA1044-Q1 from NOVOSENSE can still meet the highest power requirements specified in the standard (as shown in Figure-1 and Table-2). Although this test is typically not required at the application level, NCA1044-Q1 still successfully passed the test. This capability helps users reduce peripheral circuits, lower costs, and enhance system robustness.　　Packages and selection　　NCA1044-Q1 is now in mass production and is available in SOP8 and DFN8 packages. Compliant with the AEC-Q100 Grade 1 requirements, it operates in a wide temperature range from -40°C to 125°C, and provides over-temperature protection. NCA1044-Q1 also supports TXD dominant timeout function and remote wake-up in standby mode. 
Key word：
Release time：2024-12-16 17:06 reading：1178 Continue reading>>
Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger
Trade news

Renesas Introduces USB PD EPR Solution Featuring Type-C Port Controller and Buck-Boost Battery Charger

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost battery charger and the RAA489400 USB Type-C® port controller. The two new ICs combine to provide a premier Extended Power Range (EPR) USB Power Delivery (PD) solution.　　Renesas is a worldwide leader in USB-PD solutions, offering a comprehensive range of products including turnkey solutions for various applications. Renesas helps customers shorten their time-to-market with an extensive development environment and pre-certified USB-IF reference designs, Renesas USB-PD solutions offer superior quality and safety, along with high efficiency and power density.　　The RAA489118 functions as either a battery charger supporting two to seven battery cells in series or as a voltage regulator supporting 30V input and 30V output. It employs Renesas’ patented R3™ (Robust Ripple Regulator) technology, which combines the best features of fixed-frequency and hysteretic Pulse-Width Modulation (PWM) technologies. R3 modulation technology delivers acoustic noise-free operation, fast dynamic response, and best-in-class light-load efficiency for longer battery life.　　The RAA489118 includes an SMBus (System Management Bus) interface that is widely employed in power tools, home appliances and light industrial products. The SMBus interface, combined with the buck-boost and bidirectional features, allows the RAA489118 to work seamlessly with the RAA489400 and other components in USB-C PD implementations. Its input and output voltage levels also match mainstream solar power voltage levels, making it an ideal fit for solar portable power station applications.　　The RAA489400 port controller supports USB-PD VBUS power up to 48V/5A. It features an integrated PHY, both Sink and Source Power Path Gate Drivers with external NFETs, short-circuit protection, VBUS discharge, a VCONN MUX and dead battery support.　　“Renesas has been a worldwide leader in battery charging for many years based on advanced technology, adaptability, and exceptional value,” said Chris Allexandre, Senior Vice President and General Manager of Power at Renesas. “The RAA489118 and RAA489400 bring those strengths along with Renesas’ strong legacy of safety and reliability to new applications such as power tools and light industrial products. We expect to see strong demand from customers across multiple markets.”　　Key Features of the Renesas USB EPR PD Solution　　Battery charger supporting two to seven battery cells in series　　Buck-boost voltage regulator supporting 30V input and 30V output　　Renesas R3™ technology ensures minimal power loss and improved efficiency　　Advanced control scheme delivers fast transient response and system performance　　Robust thermal management and protection features for safety and reliability　　Adaptable configurations support a wide range of applications　　Built-in protection against overcharging, overheating, and voltage anomalies　　Bidirectional power flow　　USB-IF certified reference design reduces compliance testing time and effort　　Comprehensive design support and tools　　Winning Combinations　　Along with other USB-PD controllers, battery management ICs, and Type-C port management products, Renesas offers a turnkey USB-PD Charger Winning Combination that minimizes the effort required for customers to integrate USB-PD and battery management system features into their products. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Device Availability　　The RAA489118 comes in a 4×4 mm 32-lead TQFN package, and the RAA489400 is packaged in a 32-Ld 3x5 mm FCQFN. Both products are available today from Renesas. Comprehensive design support and tools, including VIDWriter configuration tools and battery charger GUI software to configure designs, are also available.　　Renesas Power Management Leadership　　A world leader in power management ICs, Renesas ships more than 1.5 billion units per year, with increased shipments serving the computing industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of power management devices, delivering unmatched quality and efficiency with exceptional battery life. As a trusted supplier, Renesas has decades of experience designing power management ICs, backed by a dual-source production model, the industry’s most advanced process technology, and a vast network of more than 250 ecosystem partners.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.　　(Remarks). USB Type-C® and USB-C® are registered trademarks of USB Implementers Forum. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.
Key word：
Release time：2024-12-10 14:06 reading：1140 Continue reading>>
Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs
Trade news

Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

　　Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).　　The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment of the new MRDIMMs, collaborating with industry leaders including CPU and memory providers, along with end customers.　　Renesas has designed and executed three new critical components: the RRG50120 second-generation Multiplexed Registered Clock Driver (MRCD), the RRG51020 second-generation Multiplexed Data Buffer (MDB), and the RRG53220 second-generation Power Management Integrated Circuit (PMIC). Renesas also offers temperature sensor (TS), and serial presence detect (SPD) hub solutions in mass production, making it the only memory interface company that offers the complete chipset solutions for industry standard next-generation MRDIMMs as well as all other server and client DIMMs.　　“The demand for higher performance systems driven by AI and HPC applications is relentless,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. “Renesas is at the forefront of this trend, working with industry leaders to develop next-generation technology and specifications. These companies depend on Renesas to deliver the technical know-how and the production capabilities they require to meet unprecedented demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs showcase our leadership in this market.”　　Renesas’ RRG50120 second-generation MRCD is used on the MRDIMMs to buffer the Command/Address (CA) bus, chip selects and the clocks between the host controller and DRAMs. It consumes 45% less power compared to the first-generation device, a critical specification for heat management in very high-speed systems. The RRG51020 Gen2 MDB is the other key device used in the MRDIMMs to buffer data from the host CPU to DRAMs. Both the new Renesas MRCD and MDB support speeds up to 12.8 Gigabytes per Second (GB/s). Additionally, Renesas’ RRG53220 next-generation PMIC offers best-in-class electrical-over-stress protection and superior power efficiency and is optimized for high-current and low-voltage operation.　　Availability　　Renesas is sampling the RRG50120 MRCD, the RRG51020 MDB, and the RRG53220 PMIC now, and expects the new products to be available for production in the first half of 2025. More information on these new products is available at www.renesas.com/DDR5.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.　　The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.
Key word：
Release time：2024-12-03 14:43 reading：797 Continue reading>>
Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor
Trade news

Renesas Extends Line-up For Industrial Ethernet and Multi-Axis Motor Control Solutions with High Performance Quad-Core Application Processor

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the RZ/T2H, the highest performance microprocessor (MPU) offered by Renesas for industrial equipment. Thanks to its powerful application processing and real-time performance, the RZ/T2H is capable of high-speed, high-precision control of industrial robot motors for up to 9 axes. It supports a variety of network communications including Industrial Ethernet on a single chip. The MPU targets industrial controller equipment such as programmable logic controllers (PLCs), motion controllers, distributed control systems (DCSs), and computerized numerical controls (CNCs).　　With the growing demand for unmanned and labor-saving manufacturing, industrial robots such as vertically articulated robots, and industrial controller equipment are being deployed to accelerate automated production. The Renesas RZ/T2H MPU combines all the functionality and performance required for developing these applications. While industrial systems traditionally required multiple MPUs or a combination of field programmable gate arrays (FPGAs) to control these applications, the RZ/T2H MPU can now meet all the requirements on a single chip. This reduces the number of components and saves time and costs of FPGA program development.　　“We have enjoyed outstanding market success with RZ/T2M and RZ/T2L,” said Daryl Khoo, Vice President of Embedded Processing 1st Business Division at Renesas. “The RZ/T2H builds on that momentum, allowing our industrial customers to leverage their existing design assets while addressing even more innovative, demanding industrial motor control and Linux applications. Our customers have been particularly impressed that the RZ/T2H enables them to implement a 9-axis motor control all on just one chip!”　　High-Performance Application Processing and Fast Real-Time Control on a Single Chip　　The RZ/T2H is equipped with four Arm® Cortex®-A55 application CPUs with a maximum operating frequency of 1.2 GHz. For external memory, it supports 32-bit LPDDR4-3200 SDRAM. Two Cortex-R52 CPUs with a maximum operating frequency of 1 GHz handle the real-time processing, with each core equipped with a total of 576 KB of high-capacity tightly coupled memory (TCM). This allows high CPU- and memory-intensive tasks such as running Linux applications, robot trajectory generation, and PLC sequence processing, to be executed on a single chip. At the same time, the RZ/T2H can handle fast and precise real-time control such as motor control and Industrial Ethernet protocol processing.　　Motor control of up to 9 axes reduces component costs and development time　　The Renesas RZ/T2H controls up to 9-axis servo motors in industrial robots with high-speed and accurate operation. The RZ/T2H comes with everything required for up to 9 axes of motor control including 3-phase PWM timers, delta-sigma interfaces for measuring current values, and encoder interfaces (A-format™, EnDat, BiSS®, Hyperface DSL, and FA-CODER are all supported). Furthermore, peripheral functions for motor control are placed on a Low Latency Peripheral Port (LLPP) bus of the Cortex-R52 real-time CPU core, allowing high-speed access from the CPU.　　Flexible support for network communications including Industrial Ethernet　　The RZ/T2H has four Ethernet ports, three Gigabit Ethernet MAC (GMAC), plus an Ethernet switch. It also supports EtherCAT, PROFINET, EtherNet/IP, OPC UA, and the next-generation Time-Sensitive Networking (TSN) standard. The combination of these Ethernet switches and GMAC allows the MPU to support multiple Industrial Ethernet controllers and devices, providing flexibility to adapt to a wide range of controller requirements, such as upper-layer Ethernet communications.　　Specialized boards and software available for industrial robots and controllers　　The RZ/T2H comes with the Renesas Flexible Software Package (FSP), as with all Renesas MPUs, together with a Linux package that comes with long term support. An out-of-the-box multi-axis motor control evaluation solution is available including inverter boards for driving 9-axis motors, a multi-axis motor control software package, and Motion Utility Tool (a motor control software tool). Sample protocols for industrial Ethernet and software PLC package are also included to kick-start system development.　　“As industrial equipment continues to evolve, these systems increasingly require more complex functions and performance,” said Micael Borgefeldt, Product Manager at IAR Systems. “Including the latest RZ/T2H MPU from Renesas, we empower the developers to unlock flexible application configurations across 32-bit MCUs and 64-bit high-end MPUs multi-core environments. Our IAR development solution enables engineers to accelerate next-generation industrial innovation, streamlining development and boosting efficiency like never before.”　　Winning Combinations　　Renesas also offers “9-axis Industrial Motor Control with Ethernet” solution that combined the RZ/T2H with numerous compatible devices such as the RV1S9231A IGBT Drive Photocoupler and RV1S9353A Optically Isolated Delta-Sigma Modulator to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio: renesas.com/win.　　Availability　　The RZ/T2H is available today. Renesas plans to release the new RZ/N2H device in Q1/2025, which offers the same performance as the RZ/T2H in a smaller package. This is ideal for industrial controller equipment such as PLCs and motion controllers.　　The RZ/T2H is managed under the Product Longevity Program (PLP) for industrial equipment that requires long life cycles. For more information on the RZ/T2H, visit: https://www.renesas.com/rzt2h.　　About Renesas Electronics Corporation　　Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, X, YouTube, and Instagram.　　(Remarks) Arm and Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. All names of products and services mentioned in this release are trademarks or registered trademarks of their respective owners.
Key word：
Release time：2024-12-02 14:31 reading：1200 Continue reading>>

Turn to

/ 20

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
RB751G-40T2R ROHM Semiconductor
TL431ACLPR Texas Instruments
BD71847AMWV-E2 ROHM Semiconductor
CDZVT2R20B ROHM Semiconductor
MC33074DR2G onsemi
model brand To snap up
STM32F429IGT6 STMicroelectronics
BP3621 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
ESR03EZPJ151 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code