Basic knowledge of electronic components purchasing -Ameya360 electronic components purchasing website

Renesas Introduces Low-Power Bluetooth Low Energy <span style='color:red'>SoC</span> for Automotive Applications

Trade news

Renesas Introduces Low-Power Bluetooth Low Energy SoC for Automotive Applications

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new industry-leading Bluetooth chip that combines a radio transceiver, an Arm® M0+ microcontroller, memory, peripherals and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth® Low Energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can jump-start projects in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.　　Optimized Design to Deliver Unparalleled Power Efficiency　　Building on Renesas’ leadership in Bluetooth LE SoCs (SmartBond Tiny Family) with industry-leading low power consumption, the new DA14533 includes some of the most advanced power management features in the industry. The device includes an integrated DC-DC buck converter, which accurately adjusts the output voltage according to system requirements. Active system power consumption is lower than comparable devices in the market, requiring only 3.1mA during transmission and 2.5mA during reception. In hibernation mode, the current drops to 500nA. These power management and power-saving features help extend the operational life of small-capacity battery-powered systems and meet the stringent power requirements of tire pressure monitoring systems’ mission profile.　　Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features　　The DA14533 is an AEC-Q100 Grade 2 qualified device, which means the device has passed strict testing to sustain quality and reliability in harsh automotive environments. Moreover, the device’s extended temperature range (-40 to +105°C) ensures reliable performance in demanding conditions, making it ideal for automotive and industrial systems where stability and durability are essential. Qualified against Bluetooth Core 5.3 specifications, the device contains the latest security features to safeguard connected devices from various threats.　　“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”　　Lower Bill-of-Materials Reduces Costs and Simplifies Development　　Similar to other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM).　　A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. Its ultra-compact design – available in a WFFCQFN 22-pin 3.5 x 3.5 mm package – makes the device the smallest automotive Bluetooth LE SoC on the market. With its compact design and low eBOM, the device integrates seamlessly into space-constrained systems, reducing overall system costs and accelerating time-to-market for customers.　　Key Features of the DA14533　　Arm® Cortex®-M0+ microcontroller – Standalone application processor or data pump in hosted systems　　64KB RAM and 12KB One-Time Programmable (OTP) memory　　2.4 GHz radio transceiver　　Integrated low IQ buck DC-DC converter　　External SPI flash　　Single XTAL operation (single crystal oscillator)　　Software stack qualified against Bluetooth Core 5.3　　AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)　　WFFCQFN 22-pin 3.5 x 3.5 mm package

Key word：

Renesas

Release time：2025-04-08 14:06 reading：297 Continue reading>>

GigaDevice's Dual-Power Supply SPI NOR Flash for 1.2V <span style='color:red'>SoC</span>s Halves Read Power Consumption

Trade news

GigaDevice's Dual-Power Supply SPI NOR Flash for 1.2V SoCs Halves Read Power Consumption

　　GigaDevice, a leading semiconductor company specializing in flash Memory, 32-bit microcontrollers (MCUs), sensors, analog products and solutions, has unveiled the GD25NE series of dual-power supply SPI NOR Flash, designed specifically for 1.2 V system-on-chip (SoC) applications.　　The GD25NE series strengthens GigaDevice's strategic dual-power supply Flash roadmap, providing seamless compatibility with next-generation 1.2 V SoCs and eliminating the need for an external booster circuit. With its higher performance and lower power consumption, the GD25NE series addresses the growing demand for advanced embedded storage, making it an ideal choice for wearable devices, healthcare, IoT, data center and Edge AI applications.　　Combining a 1.8 V core voltage with a 1.2 V I/O interface voltage, GD25NE supports single, dual, quad STR (single transfer rate) and quad DTR (double transfer rate) operation. It achieves high-speed clock frequencies of up to 133 MHz in STR mode and 104 MHz in DTR mode.　　With a typical page program time of 0.15ms and sector erase time of 30ms, the GD25NE series significantly outperforms conventional 1.2 V-only Flash solutions—offering up to 20% faster read performance, over 60% faster program speed, and 30% reduction in erase time. Due to these advances, it makes the GD25NE series an outstanding choice for emerging embedded applications.　　The GD25NE series is engineered with ultra-low power consumption by design, making it ideal for energy-sensitive applications. It features a typical deep power-down current of just 0.2 µA, a Quad I/O DTR read current of 9mA at 104 MHz, and program/erase currents as low as 8 mA. Compared to conventional 1.8 V solutions, the 1.2 V design reduces power consumption by up to 50%. This optimized power architecture not only enhances power efficiency but also simplifies system design while maintaining higher performance.　　“The GD25NE series represents a new class of dual-supply SPI NOR Flash, delivering an optimal balance of high performance and ultra-low power consumption," said Ruwei Su, GigaDevice vice president and general manager of Flash BU, "With significantly reduced power usage, faster read speeds, and enhanced program/erase efficiency, this solution is designed to meet the evolving demands of next-generation 1.2 V SoCs. As part of our ongoing commitment to innovation, we continue to expand our portfolio, providing customers with more efficient, reliable, and future-ready Flash solutions for new leading-edge applications”

Key word：

GigaDevice

Release time：2025-03-12 10:59 reading：481 Continue reading>>

ROHM’s PMICs for <span style='color:red'>SoC</span>s have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

Trade news

ROHM’s PMICs for SoCs have been Adopted in Reference Designs for Telechips’ Next-Generation Cockpits

　　ROHM has announced the adoption of its PMICs in power reference designs focused on the next-generation cockpit SoCs ‘Dolphin3’ (REF67003) and ‘Dolphin5’ (REF67005) by Telechips, a major fabless semiconductor manufacturer for automotive applications headquartered in Pangyo, South Korea. Intended for use inside the cockpits of European automakers, these designs are scheduled for mass production in 2025.　　ROHM and Telechips have been engaged in technical exchanges since 2021, fostering a close collaborative relationship from the early stages of SoC chip design. As a first step in achieving this goal, ROHM’s power supply solutions have been integrated into Telechips’ power supply reference designs. These solutions support diverse model development by combining sub-PMICs and DrMOS with the main PMIC for SoCs.　　For infotainment applications, the Dolphin3 application processor (AP) power reference design includes the BD96801Qxx-C main PMIC for SoCs. Similarly, the Dolphin5 AP power reference design developed for next-generation digital cockpits combines the BD96805Qxx-C and BD96811Fxx-C main PMICs for SoC with the BD96806Qxx-C sub-PMIC for SoC, improving overall system efficiency and reliability.　　Modern cockpits are equipped with multiple displays, such as instrument clusters and infotainment systems, with each automotive application becoming increasingly multifunctional. As the processing power required for automotive SoCs increases, power ICs like PMICs must be able to support high currents while maintaining high efficiency. At the same time, manufacturers require flexible solutions that can accommodate different vehicle types and model variations with minimal circuit modifications. ROHM SoC PMICs address these challenges with high efficiency operation and internal memory (One Time Programmable ROM) that allows for custom output voltage settings and sequence control, enabling compatibility with large currents when paired with a sub-PMIC or DrMOS.　　Moonsoo Kim,　　Senior Vice President and Head of System Semiconductor R&D Center, Telechips Inc.“Telechips offers reference designs and core technologies centered around automotive SoCs for next-generation ADAS and cockpit applications. We are pleased to have developed a power reference design that supports the advanced features and larger displays found in next-generation cockpits by utilizing power solutions from ROHM, a global semiconductor manufacturer. Leveraging ROHM’s power supply solutions allows these reference designs to achieve advanced functionality while maintaining low power consumption. ROHM power solutions are highly scalable, so we look forward to future model expansions and continued collaboration.”　　Sumihiro Takashima,　　Corporate Officer and Director of the LSI Business Unit, ROHM Co., Ltd.“We are pleased that our power reference designs have been adopted by Telechips, a company with a strong track record in automotive SoCs. As ADAS continues to evolve and cockpits become more multifunctional, power supply ICs must handle larger currents while minimizing current consumption. ROHM SoC PMICs meet the high current demands of next-generation cockpits by adding a DrMOS or sub-PMIC in the stage after the main PMIC. This setup achieves high efficiency operation that contributes to lower power consumption. Going forward, ROHM will continue our partnership with Telechips to deepen our understanding of next-generation cockpits and ADAS, driving further evolution in the automotive sector through rapid product development.”　　・ Telechips SoC [Dolphin Series]　　The Dolphin series consists of automotive SoCs tailored to In-Vehicle Infotainment (IVI), Advanced Driver Assistance Systems (ADAS), and Autonomous Driving (AD) applications. Dolphin3 supports up to four displays and eight in-vehicle cameras, while Dolphin5 enables up to five displays and eight cameras, making highly suited as SoCs for increasingly multifunctional next-generation cockpits. Telechips is focused on expanding the Dolphin series of APs (Application Processors) for car infotainment, with models like Dolphin+, Dolphin3, and Dolphin5, by leveraging its globally recognized technical expertise cultivated over many years.　　・ ROHM 's Reference Design Page　　Details of ROHM’s reference designs and information on equipped products are available on ROHM’s website, along with reference boards. Please contact a sales representative or visit ROHM’s website for more information.　　https://www.rohm.com/contactus　　■ Power Supply Reference Design [REF67003] (equipped with Dolphin3)　　Reference Board No. REF67003-EVK-001　　https://www.rohm.com/reference-designs/ref67003　　■ Power Supply Reference Design [REF67005] (equipped with Dolphin5)　　Reference Board No. REF67005-EVK-001　　https://www.rohm.com/reference-designs/ref67005　　About Telechips Inc.Telechips is a fabless company specialized in designing system semiconductors that serve as the “brains” of automotive electronic components. The South Korean firm offers reliable, high-performance automotive SoCs. In response to the industry’s transition toward SDVs (Software Defined Vehicles), Telechips is broadening its core portfolio beyond car infotainment application processors (APs) to include MCUs, ADAS, network solutions, and AI accelerators.　　As a global, comprehensive automotive semiconductor manufacturer, Telechips adheres to international standards such as ISO 26262, TISAX, and ASPICE, leveraging both hardware and software expertise for future mobility ecosystems, including not only automotive smart cockpits, but also E/E architectures. What’s more, Telechips provides optimal solutions for In-Vehicle Infotainment systems (IVI), digital clusters, and ADAS, all compliant with key automotive standards (AEC-Q100, ISO 26262). Telechips has established business relationships with major automakers both domestically and internationally, supported by a strong track record of shipments.　　One flagship product is the Dolphin5 automotive SoC that integrates an Arm®-based CPU, GPU, and NPU to meet high-performance requirements. As a fabless company, Telechips outsources the manufacturing of its SoCs to Samsung Electronics’ foundry, delivering high-quality semiconductor products to domestic and overseas manufacturers. For more information, please visit Telechips’ website:　　https://www.telechips.com/　　*Arm® is a trademark or registered trademark of Arm Limited.　　TerminologyPMIC (Power Management IC)　　An IC that contains multiple power supply systems and functions for power management and sequence control on a single chip. It is becoming more commonplace in applications with multiple power supply systems in both the automotive and consumer sectors by significantly reducing space and development load vs conventional circuit configurations using individual components (i.e. DC-DC converter ICs, LDOs, discretes).　　SoC (System-on-a-Chip)　　A type of integrated circuit that incorporates a CPU (Central Processing Unit), memory, interface, and other elements on a single substrate. Widely used in automotive, consumer, and industrial applications due to its high processing capacity, power efficiency, and space savings.　　AP (Application Processor)　　Responsible for processing applications and software in devices such as smartphones, tablets, and automotive infotainment systems. It includes components such as a CPU, GPU, and memory controller to efficiently run the Operating System (OS), process multimedia, and render graphics.　　DrMOS (Doctor MOS)　　A module that integrates a MOSFET and gate driver IC. The simple configuration is expected to reduce design person-hours along with mounting area and to achieve efficient power conversion. At the same time, the built-in gate driver ensures high reliability by stabilizing MOSFET drive.

Key word：

ROHM

Release time：2024-12-20 13:56 reading：749 Continue reading>>

Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive <span style='color:red'>SoC</span>

Trade news

Renesas Introduces Power Management with Voltage Monitoring Solution for Space-Grade AMD Versal AI Edge Adaptive SoC

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a complete space-ready reference design for the AMD Versal™ AI Edge XQRVE2302 Adaptive SOC. Developed in collaboration with AMD, the ISLVERSALDEMO3Z power management reference design integrates key space-grade components for power management. It targets the cost-effective AI Edge with both rad-hard & rad-tolerant plastic solutions specifically designed to support a wide range of power rails for next-generation space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion.　　The new ISLVERSALDEMO3Z power management reference design is fully qualified, enabling easy integration into satellite payload architectures. It includes a PMBus interface, giving users control of fault behaviors, protection levels and output regulation voltage. The new reference design also offers telemetry readouts of internal signals for system diagnostics. It is the industry’s only space-qualified power management system with a digital wrapper to optimize information transmission. The core power solution of this reference design is easily scalable with regard to output power, optimizing customers’ investments in design and qualification over time.　　As the number of Low-Earth Orbit (LEO) satellites increases, the need for lower cost space-grade systems is growing rapidly. Customers traditionally concerned with minimizing SWaP (Size, Weight and Power consumption) are now interested in reducing cost as well (SWaP-C). Renesas’ new ISLVERSALDEMO3Z power management reference design optimally addresses all of these factors. Space-grade plastic components decrease size, weight and cost while wide-bandgap GaN FETs enable the highest efficiency power conversion.　　The new Versal AI Edge Adaptive SoC converts raw sensor data into useful information, making the XQRVE2302 ideal for anomaly and image detection applications. It has a nearly 75% smaller board area and power savings over the previous-generation XQRVC1902. It also integrates the enhanced AMD AI Engine (AIE) technology, known as AIE-ML, which has been optimized for machine learning (ML) applications. Unlike competitive offerings, it supports unlimited reprogramming.　　“We’re proud to team with AMD to deliver this advanced solution that addresses the most pressing concerns of space customers,” said Josh Broline, Sr. Director, Marketing and Applications of the HiRel Business Division at Renesas. “Along with our hallmark power management expertise, this reference design meets SWaP-C objectives, enables real-time system monitoring and control, and unlocks the power of AI.”　　“The Versal™ AI Edge XQRVE2302 Adaptive SOC delivers unprecedented features and performance for the rapidly growing space market,” said Minal Sawant, senior director, Aerospace & Defense Vertical Market, AMD. “We’re pleased that Renesas offers advanced power management functionality that enables our customers to take full advantage of this solution.”　　Renesas’ new ISLVERSALDEMO3Z power management reference design comes with power management devices that have been tested and verified to withstand exposure to high levels of radiation. These include Pulse Width Modulation (PWM) controllers, GaN FET half-bridge drivers, point-of-load (POL) regulators, and power sequencers. The devices come in small-footprint packages, so the core power rail components take up just 67 square centimeters of board area.　　Also, the ISLVERSALDEMO3Z mates seamlessly with the ISL71148VMREFEV1Z voltage monitor reference design with 14-bit resolution to accurately monitor all 11 core power rails of the Versal AI Edge Adaptive SOC. The high resolution enables reliable system health monitoring. It includes a “dual-footprint” to accommodate both space plastic and rad-hard hermetic solutions.

Key word：

Renesas

Release time：2024-07-19 14:24 reading：1148 Continue reading>>

Trade news

Renesas Debuts Its Lowest Power Consumption, Dual-core Bluetooth Low Energy SoC with Integrated Flash

　　Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the DA14592 Bluetooth® Low Energy (LE) System-on-Chip (SoC) representing Renesas’ lowest power consumption and smallest, multi-core (Cortex-M33, Cortex-M0+), Bluetooth LE device. By carefully balancing tradeoffs between on-chip memory (RAM/ROM/Flash) and SoC die size (for cost), the DA14592 is very well suited to a broad range of applications including connected medical, asset tracking, human interface devices, metering, PoS readers and ‘crowd-sourced location’ (CSL) tracking.　　Continuing Renesas’ Bluetooth LE SoC leadership in lowest radio power consumption, the DA14592 utilizes a new low-power mode to offer world-class, 2.3mA radio transmit current at 0dBm and 1.2mA radio receive current. Additionally, it supports an ultra-low hibernation current of only 90nA, extending shelf-life for end-products shipped with ‘battery connected’, and ultra-low active current at 34µA/MHz for products requiring significant application processing.　　From a solution cost perspective, the DA14592 typically only requires 6 external components, offering a best-in-class engineering bill of materials (eBOM). Operating from only a system clock and its highly accurate on-chip RCX, this device removes the need for a sleep mode crystal in the majority of applications. Its reduced eBOM, coupled with the DA14592’s small package (offered in WLCSP: 3.32mm x 2.48mm and FCQFN: 5.1mm x 4.3mm) also presents designers with an attractively small solution footprint. The DA14592 also includes a high-precision, sigma-delta ADC, up to 32 GPIOs and unlike other SoCs in its class, it offers a QSPI supporting external memory (Flash or RAM) expansion for applications requiring extra memory.　　Renesas has integrated all external components required to implement a Bluetooth LE solution into the DA14592MOD module. It offers customers the fastest time-to-market and reduced overall project cost. Emphasis has been placed in the design of this module to ensure maximum design flexibility by comprehensively routing the DA14592’s functions to the outside of the module and using castellated pins for easy/low-cost module attachment during development.　　One key application Renesas is showcasing with the DA14592 and DA14592MOD is ‘Crowd-Sourced’ Locationing, a market projected to reach over US$29B in North America alone by 20311 based on Apple’s AirTag sales alone. Google recently announced plans to offer a Find My Device crowd-sourced locationing network as well. Renesas is committed to providing best-in-class reference designs with industry-leading power, eBOM and solution footprint for both mobile operating systems as soon as Google’s Find My Device network becomes available. These reference designs will not only accelerate tag designs but will also enable manufacturers of products that may be lost or stolen to easily attach the DA14592 to their existing product to render their product globally locatable utilizing billions of smartphones, thereby differentiating their products and enhancing end-customer value. Using the DA14592MOD will also remove the need for worldwide regulatory certifications, reducing development costs and further accelerating time-to-market.　　“The DA14592 and DA14592MOD extend our leadership in Bluetooth LE SoCs with our trademark low power consumption and best-in-class eBOMs,” said Davin Lee, Sr. Vice President and General Manager of the Analog and Connectivity Product Group for Renesas. “In addition, we have listened to our customers and continue to expand our product support by offering reference designs for applications such as crowd-sourced locationing, helping our customers to more easily differentiate their products, delivering premium value while maintaining lowest costs.”　　Winning Combinations　　Renesas has combined the new DA14592 with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Instrument Panel for Light Electric Vehicles. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.　　Availability　　The DA14592 is in mass production today with the DA14592MOD targeted for world-wide regulatory certifications in 2Q24.

Key word：

Renesas

Release time：2024-01-19 11:13 reading：1997 Continue reading>>

GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced <span style='color:red'>SoC</span>s' Need for ultra-Low Power and High Performance

Trade news

GigaDevice Introduces 1.2V SPI NOR Flash Product to Meet Advanced SoCs' Need for ultra-Low Power and High Performance

　　GD25UF series featuring single 1.2V supply offers industry's lowest Active Read power consumption　　GD25UF's 1.2V capability enables a direct interface to SoCs and processors produced on advanced process nodes, reducing their die size and simplifying their power supply architecture　　Nuremberg, Germany – 14 March 2023 – GigaDevice, a semiconductor industry leader in Flash memory and 32-bit microcontrollers serving a broad range of technology innovations, today introduced the GD25UF series of SPI NOR Flash in its strategic roadmap of 1.2V Flash products supporting systems-on-chip (SoCs) and applications processors built on advanced process nodes. The GD25UF SPI NOR Flash products are optimized for applications that require ultra-low power consumption or a small board footprint.　　The GD25UF products operate at a supply-voltage range of 1.14V-1.26V .This is ideal for devices built on advanced process nodes and operating at a core voltage of 1.2V, as it provides for a simpler power system architecture, and for direct interfacing between the I/O pins of the SoC or processor and the GD25UF device.　　With the GD25UF products, GigaDevice provides better specifications than other competing 1.2V products in the parameters that manufacturers of mobile communications devices, wireless modems and wearable devices care most about. In low-power mode at a frequency of up to 50MHz, Active Read current can be as low as 0.4mA at slower frequencies. Deep power-down current of 0.1µA makes the GD25UF ideal for any battery-powered or wearable application. In addition, industry-best program and erase times help increase device manufacturing throughput while reducing system power consumption.　　In Fast Read mode, these Flash devices operate at up to 120MHz and achieve a data-transfer rate of up to 640Mbits/s. In low EMI mode, operating at 80MHz over a double transfer-rate (DTR) quad I/O interface, the GD25UF products achieve the same data-transfer rate of 640Mbits/s while minimizing clock-generated noise, an ideal feature for noise-sensitive wireless applications.　　The 64Mbit GD25UF64E is in production now. It is supplied in SOP8, 3mm x 4mm or 4mm x 4mm USON8 and WLCSP packages, or as a known good die. The 128Mbit GD25UF128E is sampling. Products with memory capacity of 32Mbits and 256Mbits are in development.　　Syed S. Hussain, Flash BU Global Segment Marketing of GigaDevice said: 'Users of chips manufactured at advanced process nodes require a new generation of low-voltage Flash memory products that are optimized for the demanding applications that they support, such as IoT devices, mobile phones, PCs and laptops, and consumer devices, e.g. portable healthcare, smart watch and battery-based devices. Today’s launch of the GD25UF64E 1.2V Flash product marks the start of a comprehensive roadmap of low-voltage Flash products from GigaDevice, providing OEMs with the mix of memory capacities, serial interfaces and security functions that they need for the next generation of system designs. There is a Megatrend, where one shrinks SoCs down to lowest process geometry a must requirement is peripherals needs to support 1.2VIO also. GigaDevice is uniquely positioned to win Ultra-low power and performance megatrend in new designs.'　　GigaDevice will be exhibiting its portfolio of Flash memory and microcontroller products at Embedded World　　Come and visit GigaDevice in person or through LIVESTREAM:　　GigaDevice Booth Hall 3A – 527: Embedded World, March 14 – 16, 2023, Exhibition Center Nuremberg, Germany.　　Conference Presentations:　　Performance, Efficiency and Reliability: GigaDevice's Arm® Cortex®-M33-based MCU Family.　　GigaDevice Flash Journey in Automotive: Flashes Low Voltage Mega-Trend

Key word：

GigaDevice

Release time：2023-11-01 16:22 reading：1919 Continue reading>>

NOVOSENSE NSUC1610: Micro&Special Motor Driver <span style='color:red'>SoC</span> for Automotive-qualified Chips

Trade news

NOVOSENSE NSUC1610: Micro&Special Motor Driver SoC for Automotive-qualified Chips

　　As integrated thermal management technology continues its relentless evolution, the quest for enhanced model selection and the platformization of electronic valves and pump components has ushered in an era of single-chip integrated micro&special motor driver System-on-Chips (SoCs). This innovative solution takes the original components, including the MCU, power supply, MOS drive, and LIN communication module, and amalgamates them into a single cohesive package. This integration not only simplifies peripheral circuits but also significantly reduces the need for additional peripheral devices. Furthermore, it fosters standardization of interfaces and control algorithms while simultaneously slashing system costs and elevating reliability to new heights.　　NOVOSENSE NSUC1610 integrates a Cortex M3 processor, power MOSFET and DAC. It supports a 4-wire LIN bus and dual-channel temperature sensor which can be used for power-side over temperature shutdown and low-voltage-side temperature detection inside the chip.　　This highly integrated product NSUC1610 can be used to design small-sized, low power, high-efficiency motor intelligent actuator applications for automotive, include but are not limited to electronic water valves in thermal management systems, air conditioning electronic vents, active air intake grille system actuators (AGS/AGM), seat ventilation brushless direct current motor (BLDC) drives, with light steering headlights (AFS), and more. Rotating/lifting large screen control, automatic charging port and automatic door handle.

Key word：

NOVOSENSE

Release time：2023-09-20 13:49 reading：4138 Continue reading>>

Ameya360:How to Select Wireless <span style='color:red'>SoC</span>s for Your IoT Designs

Trade news

Ameya360:How to Select Wireless SoCs for Your IoT Designs

　　Selecting a wireless system-on-chip (SoC) for your design isn’t easy. It requires careful consideration around several factors, including power consumption, size and cost. The SoC also needs to support the right wireless protocols for the IoT application and network, which then entails factors like range, latency and throughput.　　Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors.　　One way to ensure that your IoT design is optimized for the application is by carefully considering your choice of wireless SoCs. It also requires a careful evaluation of the key requirements of your design—including battery life, compute and memory resources, and footprint—because there will be performance tradeoffs, depending on the application.　　Designers have many factors to consider when selecting wireless SoCs for their products, said Max Palumbo, product marketing manager for wireless connectivity, secure connected edge, at NXP Semiconductors. “There is no right answer in terms of what device or architecture to choose, as this depends on the series of engineering tradeoffs that the product designer is willing to make to satisfy the needs of their end customer.”　　There is also industry agreement that a strong development ecosystem with comprehensive support tools and service is paramount. These product and prototyping tools and services can help designers reduce their time to market and cost.　　So let’s address some of the top-of-mind design issues that engineers should consider when selecting wireless SoCs for their IoT designs, as well as some of the biggest challenges and tradeoffs.　　Use cases dictate design　　Most wireless SoC manufacturers agree that the application requirements determine the selection of the wireless SoC and help narrow down the options for the IoT design. One of the most critical factors is power consumption, they said, followed by a host of other considerations, such as wireless protocols, performance, cost, size, tool support and ease of integration.　　While power consumption is tapped as one of the most critical factors in selecting wireless SoCs, choice of the wireless protocol is governed by the application.　　The end application determines the priorities, said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated.　　He cited a few application examples in which design priorities define the selection of the wireless SoC.　　“For example, if it’s a battery-powered device, such as a wearable with a single Bluetooth connection, they may choose our SYN20703P [single-chip Bluetooth transceiver and baseband processor],” Bae explained. “If it’s a drone, they may need our SYN43400 Wi-Fi SoC, as power consumption and size—and weight—are very important and developers have to make the decision based on their go-to-market strategy.　　“A drone may also need both Wi-Fi and Bluetooth,” he added. “At that point, the number of wireless interfaces required for the application becomes important, and an integrated SoC with both is typically the best approach. Our SYN43756 [single-chip IEEE 802.11ax 2 × 2 MAC/baseband/radio with integrated Bluetooth 5.2] is a good solution for that.”　　Bae also noted that “application dependency can be extrapolated to include aggregation points or gateways for the IoT where multiple heterogeneous wireless networks come together.” This would benefit from a higher level of integration, with Bluetooth, Wi-Fi and Zigbee/Thread (IEEE 802.15.4 PHY), such as that provided by the Triple Combo SYN4381 wireless SoC, he said.　　Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs, agreed: “Every wireless protocol is playing a different role, and the end-application use cases are the most important in deciding one or more of these protocols for an IoT device.”　　Sogani said there are several key factors in selecting a wireless SoC for an IoT device, which vary by the application. His top five considerations, which are important for all kinds of IoT devices, include wireless protocols; security; battery life; hardware and software support, including peripherals, GPIOs, IDE support, cloud support and networking/wireless stack integration; and compute and memory resources available for the application after the OS, networking stacks and the wireless stacks have been integrated into the wireless SoC.　　For wireless protocols, requirements include application throughput, latency, number of network nodes and range, he said. “IoT devices are becoming more complicated every day as more functionality is getting integrated into the devices. Adding wireless to the IoT devices increases the complexity manifold. There are many wireless protocols being used in IoT devices, including Wi-Fi, BT, BLE, Zigbee, Thread, Z-Wave and cellular. The choice of wireless communication protocols for a particular device depends upon the application, size, cost, power and several other factors.”　　Sogani cited several examples in which the application, together with the performance requirements, are key to the decision-making.　　“BLE is a good protocol to use for a home-temperature sensor, as it consumes low power, it is lower in cost than some other protocols and it provides the necessary range in a typical home environment,” he said. “NFC provides the lowest throughput and the shortest range, making it ideal for contactless-payment–like applications. Wi-Fi provides higher application throughput needed for several applications, such as security cameras.”　　Design challenges　　Most chipmakers agree that wireless SoCs can simplify designs by integrating the different wireless protocols and handling the coexistence challenges between multiple protocols. They also deliver space savings, a key concern in many IoT designs. However, there are use cases where discrete solutions could offer the best value in terms of both performance and cost.　　“The benefits of a wireless SoC are many and include the assurance of a proven design, shorter time to market, smaller overall footprint, lower bill of materials [BOM] and lower inventory management costs,” said Synaptics’ Bae. “These advantages apply to mostly all end applications, but there may be instances where a discrete solution may work better if the customer has specific requirements and has the RF design skills and resources to implement in that direction.”　　NXP’s Palumbo said that when determining how to architect an end product that includes wireless connectivity, “one of the first decisions a product designer must make is whether they will use a single, integrated wireless SoC or separate the wireless from the processor. An equally important decision that needs to be made is which operating system will be used. The decision of the operating system will quickly shift designers either to lower-cost, RTOS-based microcontrollers or toward larger, more scalable, Linux-based processors.”　　Integrated wireless SoCs are physically smaller and may be lower-cost due to the integration, enabling the end-product designer to deliver a smaller product or a more innovative form factor, said Palumbo.　　“However, the challenge with an integrated wireless SoC is that the designer lacks flexibility to optimize the compute performance or the wireless performance independently and the capabilities of the wireless SoC itself are invariant, so there is not as much ability to optimize individual components of the product,” he said.　　Whether using an integrated or discrete solution, power consumption is still a key factor that is influenced by the system architecture and use cases. “This means in some cases, multi-chip solutions involving separate radio and processor chips may be easier to optimize,” said Palumbo. “In other cases, wireless processors may provide all the necessary flexibility needed for specific applications and use cases.”　　Palumbo provided some key examples in which power consumption plays a critical role. “For example, simple end applications like a sensor or actuator that have a low communications duty cycle and do not perform any ancillary networking functionality, such as routing, designers will see the lowest power consumption when using an integrated wireless SoC.” This type of application can be addressed with devices like NXP’s K32W148 wireless microcontroller.　　“However, for more complex devices—a thermostat, for example—where packet routing is an important feature for the overall user experience of the end device and the target ecosystem, a discrete solution may be lower power,” he said. “If a network co-processor [NCP] is included alongside the primary compute SoC, then this allows the networking stacks to be offloaded so that only the co-processor itself is required to wake up to route packets.”　　In this example, an NXP i.MX microprocessor like the i.MX 8M Mini can be used as the compute SoC, the NXP RW612 wireless MCU can be used as an NCP and the IW612 tri-radio solution can be used as a radio co-processor. “This can help reduce the power consumption of the system significantly—especially when an NCP is used with a Linux-based microprocessor as the primary compute platform,” said Palumbo.　　The product designer has to analyze these tradeoffs and select the architecture that makes the most sense for the value they are trying to bring to their customers, he added.　　Design tradeoffs　　Wireless integration can be quite challenging especially as it relates to RF circuitry, according to manufacturers of wireless SoCs, and all tradeoffs are driven by the use cases.　　The challenge is often about the radio-integration part of the solution to deliver good-quality product performance and to meet regulatory and protocol certification requirements, said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Nathalie Vallespin, wireless product line marketing manager, STMicroelectronics.　　“A wireless SoC simplifies the integration phase, as most customers first moving to wireless solutions are not RF experts, so integration simplifies and accelerates their development and production,” she said. “Product sourcing for end customers is also simplified by an integrated solution [SoC] and can be even further simplified using a module, which includes the whole reference design.”　　In addition, Vallespin said that “an SoC also ensures more efficient power and performance levels of the radio protocol and application, while a multi-chip solution creates connection interface constraints and complexity for software management. A discrete/multi-chip approach can also potentially lead to overconsumption to keep both host and radio running to communicate properly.”　　Synaptics’ Bae said there are many challenges with RF, but “they can be addressed through careful consideration of board layout, grounding, relative positioning of other digital ICs in the design to avoid interference, and antenna placement and routing. Aside from layout, the designers or developers need to be cognizant of the impact on the SoC from power-source switching, other sources of electromagnetic interference and materials choice for enclosures.”　　Wireless SoC integration can become challenging, depending on the number of wireless protocols it supports and the use cases, said Silicon Labs’ Sogani.　　He cited several challenges, including hardware integration (antenna placement, RF design, etc.), software development (wireless stacks, networking stacks, cloud connectivity, application development), RF testing (including extreme conditions), interoperability testing (with other devices it is supposed to connect to), wireless coexistence (multiple protocols need to co-exist), production testing (minimizing the test time and yield), regulatory certifications (for countries to be supported), protocol compliance (for protocols integrated in the device), power optimization (based on the battery requirements), system security (to ensure device and data security) and solution cost (based on the target).　　Designers need to make a tradeoff at every step to optimize between various parameters, and all of these tradeoffs are eventually drive by the application use cases, said Sogani.　　“With IoT devices needing to support multiple protocols, wireless SoCs provide an integrated solution that simplifies designs by integrating these protocols and handling the coexistence challenges between multiple protocols on the same ISM band internally, as well as not having to worry about managing and worrying about RF design for multiple devices,” he added. “This helps in faster development cycles and more seamless functionality between the various protocols. End applications do play a role, as it may be possible to use discrete chips for simpler applications, but as applications become complicated, it makes more sense to use integrated solutions.”　　Vallespin said understanding and selecting the right technology that will be the best fit for the application and market demand is a key challenge. Another challenge is understanding the chosen radio protocols and picking the right hardware (antenna, routing, BOM selection) and matching software, which can be specific to each technology, she said.　　The key tradeoffs are balancing price versus features as well as choosing the architecture—a host + co-processor approach or a single application processor, Vallespin added.　　Support and availability　　In addition to performance concerns, development and design support along with supply-chain issues like continued availability are priorities for many IoT designers.　　Key concerns include how effectively the product and its development ecosystem can reduce their time to market and cost, the availability of the product and prototyping tools and the long-term availability of the product, said Vallespin.　　There are also several questions that designers need to ask, such as if there are guarantees that the SoC will be available as long as their product is in the market, what the roadmap of the SoC is and if it aligns with their product development plan, and if there is sufficient support availability, including for documentation, ecosystem and contact to ensure success, she added.　　NXP’s Palumbo believes longevity requirements are part of the tradeoff equation.　　“Once a product has shipped, the hardware itself is unchanging; however, there is an expectation from the end customer that the product will continue to be supported and receive updates for some time after their purchase,” said Palumbo. “Selecting a device—and a product architecture—that enables product designers to provide updates for the lifetime of the product is a criterion that is gaining importance.”　　The software architecture is also another critical consideration when selecting a wireless SoC, said Palumbo. “Regardless of the product architecture—be it integrated wireless SoC or discrete—the software tools and environment for these SoCs are equally important components to the hardware. Whether a device is Linux-based, Android-based, or RTOS-based—even without considering the wrinkle of which RTOS to use from the myriad of solutions available—makes a massive impact on the end product.”

Key word：

Wireless,SoC,IoT

Release time：2023-02-24 15:30 reading：1809 Continue reading>>

Ameya360:Renesas <span style='color:red'>SoC</span> Technologies Targeted at In-vehicle Communication Gateways

Trade news

Ameya360:Renesas SoC Technologies Targeted at In-vehicle Communication Gateways

　　Renesas Electronics Corp. has developed four technologies for system-on-chip (SoC) devices for in-vehicle communication gateways. These SoCs are expected to play a crucial role in defining the next-generation electrical/electronic (E/E) architecture in automotive systems.　　SoCs for automotive gateways must provide both high performance to implement new applications such as cloud services, and low power consumption when they are not in use. They also need to deliver fast CAN response to support instant start-up. Additionally, these SoCs need to provide power-efficient communication technology that enables network functions as a gateway using limited power and security technology to enable safe communication outside the vehicle.　　To meet these requirements, Renesas has developed: (1) an architecture that dynamically changes the circuit operation timing to match the vehicle conditions with optimized performance and power consumption; (2) fast start-up technology by partitioning and powering essential programs only, (3) a network accelerator that achieves a power efficiency of 10Gbps/W; and (4) security technology that prevents communication interference by recognizing and protecting vital in-vehicle communication related to vehicle control.　　Renesas announced these achievements at the International Solid-State Circuits Conference 2023 (ISSCC 2023), February 19 – 23 in San Francisco, California. Details of the new technologies include:　　1. Architecture that optimizes processing performance and power consumption depending on vehicle conditions　　Communication gateway SoCs need to deliver processing performance exceeding 30,000 Dhrystone million instructions per second (DMIPS) when running, while also keeping standby power consumption to 2mW or less in order to maintain battery life. Typically, high-performance SoCs also have high power consumption in standby mode, while low-power SoCs with small standby power consumption have performance issues. To resolve this tradeoff, Renesas combined in a single chip a high-performance application system and a control system optimized for ultralow standby power consumption. The new architecture controls the power supplies of these two subsystems and changes the timing of circuit operation to achieve an optimal balance between performance and power efficiency. This results in higher performance during operation and lower power consumption during standby.　　Fast start-up technology with external flash memory achieving the same fast speed as embedded flash memory　　Since communication gateway SoCs manage processing of critical functions related to vehicle control, they must be able to respond to CAN within 50m of start-up. However, if the SoC uses a process that does not support embedded flash memory, the start-up program must be encrypted and stored in external flash memory. This means that it takes additional time to load program data and decrypt it. To solve this issue, Renesas developed technology that splits the program into sections and initially loads and decrypts only an essential portion for start-up, while continuing to load the rest of the program in parallel. This enables a fast response to CAN (50ms or less), even when using external flash memory.　　Highly efficient network accelerator with 10Gbps/W communication efficiency　　To allow air cooling and heat dissipation for electronic control units (ECUs), communication gateway SoCs must keep power consumption to 7W or less. Since computing processing performance of 30,000 DMIPS or higher requires approximately 6 watts of power, only around 1W can be used for network processing. This presents a challenge as the total communication of 10Gbps must be achieved using 1 watt of power, with a processing efficiency of only around 3Gbps/W when processed by the CPU. To work around this issue, Renesas offloaded processing from the CPU to a custom network accelerator, achieving higher efficiency at 9.4Gbps/W. Additionally, Renesas boosted efficiency to 11.5Gbps/W by switching the routing method from a conventional TCAM approach to a hash table in SRAM.　　Security technology to prevent interference with communication requiring high reliability　　A communication gateway SoC performs a mixed set of tasks such as data processing related to vehicle control that requires a high level of reliability, and large amounts of random data communication with cloud services and others. Since vehicle control is essential to ensuring safety, protecting and separating mission-critical data is important. However, despite the differences in data types, all data is transmitted through the same in-vehicle network, leading to physical intersections and raising security issues. To address this challenge, Renesas developed security technology that analyzes incoming packets to the SoC. It determines whether or not they contain essential data, and assigns them to different pathways and control functions within the network accelerator. This prevents interference with data that requires high reliability and safeguards in-vehicle data communication from a variety of security threats.

Key word：

Renesas,SoC

Release time：2023-02-23 16:10 reading：2101 Continue reading>>

Ameya360:Wireless <span style='color:red'>SoC</span>s Solve Connectivity Challenges

Trade news

Ameya360:Wireless SoCs Solve Connectivity Challenges

　　Wireless systems-on-chip (SoCs) are favored by IoT system designers for their high functionality, low power consumption and space savings. These devices are comprised of a number of key components, including the processors, radios, power management, memory, interfaces and peripherals.　　One of the biggest drivers in wireless SoCs is the growing need for multi-protocol support to meet the requirements of different IoT devices. Chipmakers need to keep up with existing standards that continue to evolve as well as new wireless standards. These include Wi-Fi, Bluetooth LE, Bluetooth classic, 802.15.4, ZigBee, Thread, Z-Wave, Matter, cellular and other proprietary wireless protocols.　　Through this integration and multi-protocol support, wireless SoCs are solving some of the biggest technical challenges around wireless design while simplifying development by providing all of the necessary functionality, along with the connectivity and security in one device. But designers aren’t on their own; SoC makers also provide complete ecosystems and reference designs that can lower design risk and shorten the design cycle.　　“A wireless SoC typically comprises the radio itself—one or more, depending on the application—a MAC/PHY for the Wi-Fi and PHY for Bluetooth, along with a power management unit, memory, various I/O ports, a debug port, possibly an analog-to-digital converter and bus management IP,” said Brandon Bae, senior director of product marketing for wireless connectivity at Synaptics Incorporated. “Interfaces for external power amplifier and low-noise amplifier options, with associated switches, are also good to have.”　　Brandon Bae, senior director, product marketing, wireless connectivity at Synaptics Incorporated.　　Depending on the protocols supported and the end applications, the components in a wireless SoC could be different, said Dhiraj Sogani, senior director of wireless product marketing at Silicon Labs. “Power optimization, longer range, robust connectivity, higher processing power, more peripherals and higher memory will continue to be the driving trends in wireless SoCs, and we will see continuous improvement in these.”　　Wireless SoCs are also packed with security features, making them suited for a range of embedded IoT systems, such as smart homes, smart metering, building automation and fitness devices.　　“Security is increasingly a concern to protect personal data and to protect IP, and many SoCs are adding features to address security at multiple hardware and software levels,” said Nathalie Vallespin, wireless product line marketing manager at STMicroelectronics.　　Highly integrated wireless SoCs　　As demand grows for wireless SoCs, chipmakers continue to meet requirements for better security and greater interoperability and are adding advanced features for sensors, graphics, artificial intelligence and machine learning. There is also a drive toward multi-protocol connectivity support with options for Wi-Fi, Bluetooth, LoRa, Zigbee, Matter and other protocols.　　“There is always a requirement for a higher level of integration in the wireless SoCs to meet the application use cases, simplify IoT device development and reduce cost,” Sogani said.　　One of the key areas is a higher level of hardware and software integration, which includes the integrated applications processor, integrated networking stacks, cloud connectivity, digital and analog peripherals, additional GPIOs and higher memory, along with support for new protocols like Matter, Amazon Sidewalk and Wi-SUN, he added.　　“Integration of multiple protocols is becoming critical,” Sogani said. These include the combinations of Wi-Fi and BLE and 802.15.4 and BLE, as well as Wi-Fi, BLE, 802.15.4 and even sub-gigahertz integration.　　“Bluetooth classic integration is also needed to support legacy headsets,” he added. “These protocols need to operate concurrently, which needs significant hardware and software work.”　　Dhiraj Sogani, senior director, wireless product marketing, at Silicon Labs.　　In addition, “Matter over Thread and Matter over Wi-Fi is gaining significant momentum, as it enables interoperability of different ecosystems, such as Google, Amazon and Samsung,” Sogani said. “Wi-SUN is becoming more critical for smart-city deployments. Amazon Sidewalk shows significant promise to become a leading protocol for neighborhood connectivity.”　　Vallespin noted that the evolution in standards is also enabling new use cases: “In Bluetooth Low Energy, audio is creating many new use cases to manage new user experiences and is replacing the Bluetooth classic technology. Matter technology, just announced late last year, is a new standard for connected-home applications, and ultra-wideband is increasingly being used for car access control.”　　STMicroelectronics offers a wireless roadmap based on its popular STM32 family of microcontrollers and ecosystem. These include the STM32WB series for Bluetooth LE, Thread, Matter and Zigbee and the STM32WL for LoRa and other sub-gigahertz protocols. “STM32 wireless products add best-in-class IPs to smoothly migrate to wireless platforms,” Vallespin said.　　Sogani noted two other key trends, including the integration of machine learning for IoT edge devices for simple audio, vision and data applications like keyword spotting, motion detection and glass-break detection, as well as security integration at the hardware and software level for improving IoT device security.　　Synaptics’ Bae agreed that there is a higher degree of integration coming: “We’re looking at advancing to finer nodes to not only shrink the die size, but it also frees up space to integrate more memory for more features for a given package size. The drivers tend to be functionality, size, power and cost, so if we can provide greater functionality for a given footprint while also improving power consumption, our customers like that.　　“It’s not always good to move to a smaller package, even when that’s possible, as that requires board redesigns,” Bae said. “More functionality is often preferred.”　　Similarly, Vallespin said the process node is a key factor in delivering new degrees of integration. “Smaller geometries allow greater integration.”　　Latest advances　　Wireless SoC vendors agreed that new product development is driven by wireless standards and the need for higher functionality, more integration and lower power consumption.　　For example, Silicon Labs’ wireless SoC roadmap focuses on “intelligent wireless connectivity for IoT devices.” The company offers a wide range of wireless solutions, including Wi-Fi, Bluetooth, 802.15.4, ZigBee, Thread, Z-Wave and proprietary wireless.　　Silicon Labs’ latest advances include its 2.4-GHz wireless MG24 SoC for Bluetooth and multiple-protocol operations. The MG24 supports Matter over Thread as a single-chip solution—with a range of up to 200 meters indoors for OpenThread—while also enabling Bluetooth commissioning of new devices on the same chip, Sogani said. “The MG24, combined with the ultra-low–power Silicon Labs RS9116 or Silicon Labs WF200 Wi-Fi products, enables development of Matter over Wi-Fi 4.”　　Silicon Labs also offers the FG25, the company’s new flagship SoC for Wi-SUN, which is one of the world’s first open protocols for smart-city and smart-utility applications. “The EFF01 is the FG25’s corresponding amplifier that boosts signal range by 2× when used together,” Sogani said.　　He said the FG25 “will be the world’s most secure smart-city solution, with long range, the largest memory capacity of any SoC in the Silicon Labs portfolio and the ability to operate for up to 10 years on a coin-cell battery.”　　In addition, Silicon Labs’ first Wi-Fi 6 and Bluetooth LE SoC, the fully integrated SiWx917, is designed to be the lowest-power Wi-Fi 6 and Bluetooth LE SoC in the industry, Sogani said. “The SiWx917 is a single-chip solution that is Matter-ready, includes an integrated applications processor and offers industry-leading energy efficiency, making it ideal for battery-powered or energy-efficient IoT devices with always-on cloud connectivity.”　　Synaptics is focusing on two major industry trends: connecting sensors that are gathering data to the AI systems or devices that are doing the analysis, and making wireless devices easier to use, Bae said.　　“First, we’re simplifying the integration of AI and wireless through KatanaConnect, which combines our Katana low-power edge AI SoC with our SYN430132 1 × 1 Wi-Fi/Bluetooth combo chip on a tiny module measuring 32 × 32 mm,” he said. “Second, our mix of Bluetooth, ULE, Wi-Fi, 802.15.4 and GNSS solutions is unique in the industry. They are proven solutions that simplify the cost-effective and rapid development of IoT connectivity devices. This has clear single-source benefits of both product and design expertise, so we know how to connect IoT devices.”　　However, Bae said there is more to it than having the silicon and track record. “We’re also either already Matter-compliant or are working on it across all our solution stacks so we can ensure users benefit from Matter’s promise of a seamless user experience across platforms and interfaces.”　　A good example of Synaptics’ Matter support and high integration is the SYN4381 Triple Combo SoC, which the company claims as the first to combine Wi-Fi 6/6E (802.11ax with extended 6-GHz operation), Bluetooth 5.2 (BT 5.2) with BLE audio and high-accuracy distance measurement, and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer. The SoC and its SynFi software simplify product development by providing secure and scalable connectivity between devices across heterogeneous IoT networks, regardless of platform, OEM or brand, the company said. For end users, they get a simplified setup and seamless control across their smart-home devices.　　Key differentiators for Synaptics include its robust connectivity and the ability to balance cost and performance, Bae said. “For example, while many offer Wi-Fi/Bluetooth combo solutions, they haven’t fully controlled the signaling, and that shows up as glitches in both audio and video.”　　To solve the problem, Synaptics has developed a proprietary mechanism, which it calls Smart Coexistence, in the 2.45-GHz band. It “carefully manages the Wi-Fi and Bluetooth transmission and reception to avoid lost packets and the inefficiencies of retransmissions,” Bae said.　　Bae added it is baked into all of its combo chips, including the SYN4381 Triple Combo, as well as the SYN43756 Bluetooth/Wi-Fi combo chip, an IEEE 802.11ax 2 × 2 MAC/baseband/radio IC with integrated Bluetooth 5.2 (with LE Audio).

Key word：

Wireless,SoC,IoT

Release time：2023-02-23 15:59 reading：1919 Continue reading>>

model	brand	Quote
MC33074DR2G	onsemi
BD71847AMWV-E2	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor
TL431ACLPR	Texas Instruments
CDZVT2R20B	ROHM Semiconductor

model	brand	To snap up
IPZ40N04S5L4R8ATMA1	Infineon Technologies
ESR03EZPJ151	ROHM Semiconductor
TPS63050YFFR	Texas Instruments
BU33JA2MNVX-CTL	ROHM Semiconductor
BP3621	ROHM Semiconductor
STM32F429IGT6	STMicroelectronics

PART	Quantity*	Target Price
	Quantity MOQ: 1	Target Price $ If not sure, you may skip this
remark

Telephone *	Name
Company
Email