Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More
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Renesas Debuts Best-in-Class MCUs Optimized for Single-Motor Applications Including Power Tools, Home Appliances and More

　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions,introduced the RA2T1 microcontroller (MCU) group based on the Arm® Cortex®-M23 processor optimized for motor control systems in July9. RA2T1 devices are specifically designed for single-motor applications such as fans, power tools, vacuum cleaners, refrigerators, printers, hair dryers and many more.　　Feature Set Optimized for Motor Control　　The new RA2T1 devices include a number of features designed to enhance motor control function, specifically in single-motor systems. One of the notable features is a 3-channel S&H function that simultaneously detects the 3-phase current values of Brushless DC (BLDC) motors. This method provides superior control accuracy as opposed to sequential measurement methods. The RA2T1 MCUs also offer complementary Pulse Width Modulation (PWM) function of the timer, which enables automatic insertion of dead time and generation of an asymmetric PWM. This function is optimized for inverter drive, which facilitates control algorithm implementation.　　The RA2T1 devices offer safety features that are critical in motor control applications. They provide a Port Output Enable function and a high-speed comparator that work together to quickly shut off the PWM output when an overcurrent is detected. The shutdown state can be selected according to the inverter specifications.　　Renesas Leadership in Embedded Processing for Motor Control　　Renesas has shipped motor-control specific MCUs for over 20 years. The company ships over 230 million motor control embedded processors per year to thousands of customers worldwide. In addition to multiple RA MCU groups, Renesas offers motor-control specific devices in its 32-bit RX Family, its 16-bit RL78 MCUs and its 64-bit RZ MPUs.　　“Customers have trusted Renesas motor control solutions for many years across thousands of systems,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA2T1 MCUs enhance our leadership in this area with market-leading technology, low-power operation, and legendary Renesas quality and safety standards for single-motor systems.”　　Key Features of the RA2T1 Group MCUs　　Core: 64 MHz Arm Cortex-M23　　Memory: 64KB Flash, 8KB SRAM, 2KB Data Flash　　Analog Peripherals: 12-bit ADC with 3-channel Sample and Hold, temperature sensor, internal reference voltage, 2-channel high-speed comparators　　System: High-, mid- and low-speed On-chip Oscillators; clock output; power-on reset; voltage detection; data transfer, event link and interrupt controllers; low-power modes　　Safety: PWM forced shutdown, SRAM parity error check, ADC self-diagnosis, clock frequency accuracy measurement, illegal memory access detection　　Operating Temperature Range: Ta = -40°C to 125°C　　Operating Voltage: 1.6V to 5.5V　　Packages: 48LQFP, 32-LQFP, 48-QFN, 32-QFN, 24-QFN (4mm x 4mm)　　The new RA2T1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of motor control designs to other RA Series devices.　　Winning Combinations　　Renesas has combined the new RA2T1 Group MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations, including Portable Power Tools, Smart BLDC Ceiling Fan, Cordless Vacuum Cleaner, Cordless Leaf Blower. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.　　Availability　　The RA2T1 Group MCUs are available now, along with the FSP software. The new MCUs are supported in Renesas’ Flexible Motor Control development kit that enables easy evaluation of motor control using permanent magnet synchronous motors (brushless DC motors), and the Renesas Motor Workbench development tool. This development kit offers a common design platform with numerous Renesas motor control MCUs from the RA and RX families, enabling migration of IP across numerous devices. Information on all these offerings is available at renesas.com/RA2T1. Samples and kits can be ordered either on the Renesas website or through distributors.　　Renesas MCU Leadership　　A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners. For more information about Renesas MCUs, visit renesas.com/MCUs.
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Release time：2025-07-14 14:38 reading：375 Continue reading>>
GigaDevice GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential
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GigaDevice GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today officially launched the value-packed GD32C231 series of entry-level microcontrollers, further expanding its Arm® Cortex®-M23 core product lineup. As the leader in China's largest Arm® MCU market, GigaDevice positions the GD32C231 series as a "high-performance entry-level" solution designed to offer more competitive options for applications including small home appliances, BMS (Battery Management Systems), small-screen display devices, handheld consumer products, industrial auxiliary controls, and automotive aftermarket systems.　　With over 2 billion cumulative MCU shipments and a mature supply chain, GigaDevice's newly launched GD32C231 series overcomes the performance limitations of traditional entry-level chips through innovative design. The series not only integrates a rich set of peripherals but also adopts an industrial-grade wide-voltage process and offers a comprehensive ecosystem. While maintaining exceptional cost-effectiveness, this affordable MCU supports more complex application scenarios, redefining value standards in the entry-level MCU market and ushering in a new era of "affordable yet high-spec" solutions.　　GD32C231 Series MCUs: The Ultimate Choice for Cost-Effectiveness　　The GD32C231 series MCUs deliver a significant upgrade in computing performance and peripheral features while maintaining excellent price competitiveness, achieving an ultra-high cost-performance balance. Built on Arm's advanced Cortex®-M23 core architecture, the series offers up to 10% higher performance than Cortex®-M0+, with clock speeds reaching 48MHz. It supports efficient processing capabilities such as integer division, greatly enhancing software execution efficiency.　　In terms of memory configuration, the series features 32KB to 64KB of highly reliable embedded Flash and 12KB of low-power SRAM, with full memory areas equipped with ECC error correction. To meet the demands of diverse applications, multiple package options are available, including TSSOP20/LGA20, QFN28, LQFP32/QFN32, and LQFP48/QFN48. Thanks to its highly integrated chip design, the series effectively reduces the number of external components, providing users with a bill-of-materials (BOM) cost-optimized solution.　　The Perfect Balance of Wide Voltage Support, Low Power, and Fast Wake-up Time　　The GD32C231 series delivers exceptional power flexibility and energy efficiency, supporting a wide operating voltage range from 1.8V to 5.5V and a broad temperature range from -40°C to 105°C. This makes it highly adaptable for deployment in harsh and demanding environments. Featuring multiple power management modes, the device consumes as little as 5μA in deep sleep mode and offers ultra-fast 2.6μs wake-up time - achieving an optimal balance between low power consumption and real-time performance. These capabilities make the GD32C231 ideal for battery-powered and portable applications.　　Reliable Operation for Safety-Critical Applications　　Engineered for reliability, the GD32C231 provides robust ESD protection - meeting 8kV contact discharge and 15kV air discharge standards. Full ECC error correction is applied across Flash and SRAM memory, helping to prevent data corruption. An integrated hardware CRC module further enhances data transmission integrity. These features ensure the MCU performs reliably in safety-critical environments such as industrial automation and automotive electronics.　　Highly Integrated Peripherals for Flexible Design　　The GD32C231 series integrates a comprehensive set of peripherals, significantly enhancing system integration and design flexibility:　　A 12-bit ADC with 13 external channels and 2 internal comparators for precise analog signal measurement.　　Up to 4 general-purpose 16-bit timers and 1 advanced 16-bit timer for versatile time-based operations.　　2 high-speed SPI interfaces (including quad QSPI at 24Mbps), 2 I²C interfaces (supporting Fast Mode+ at 1Mbit/s), and 3 UARTs (up to 6Mbps) for robust serial communication.　　An integrated 3-channel DMA controller and 1 I²S interface for efficient peripheral data handling.　　With support for up to 45 GPIOs in a 48-pin package, the GD32C231 offers excellent expandability for complex designs. These rich peripheral resources empower the MCU to meet the demands of a wide range of applications - from consumer electronics to industrial control systems - with ease and reliability.　　Full-Stack Ecosystem Support for Efficient Development　　The GD32C231 series is backed by a comprehensive development ecosystem designed to accelerate product design and time-to-market. Standard software libraries and resources are readily available on GigaDevice's official website.　　To support developers throughout the entire development cycle, GigaDevice provides extensive documentation, including datasheets, user manuals, hardware design guidelines, application notes, and porting references - enabling rapid onboarding for both hardware and software development. A complete SDK firmware package is also offered, featuring rich sample code and development board resources that cover everything from low-level drivers to advanced applications.　　The GD32 MCU family natively supports FreeRTOS, offering developers a lightweight, open-source, and high-efficiency real-time operating system. To streamline development even further, GigaDevice offers the GD32 Embedded Builder IDE - its proprietary development environment that integrates graphical configuration and intelligent code generation, reducing design complexity. The GD32 All-In-One Programmer supports essential Flash operations such as programming, erasing, reading, and option byte configuration. Meanwhile, the GD-Link debugger provides dual-mode SWD/JTAG support with plug-and-play functionality for a seamless debugging experience. GigaDevice also collaborates closely with third-party programming tool providers to offer customers a wide range of programming and debugging options.　　Additionally, the GD32C231 series is fully compatible with major international toolchains including Arm® Keil, IAR Embedded Workbench, and SEGGER Embedded Studio, ensuring flexibility across various development platforms. For typical use cases, GigaDevice provides robust application solutions and reference designs - helping developers shorten design cycles, simplify product validation, and accelerate the path to mass production.
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Release time：2025-07-10 14:22 reading：432 Continue reading>>
Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration
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Renesas Sets New MCU Performance Bar with 1-GHz RA8P1 Devices with AI Acceleration

Unprecedented 7300+ CoreMarks1 with Dual Arm CPU coresTSMC 22ULL Process Delivers High Performance and Low Power ConsumptionEmbedded MRAM with Faster Write Speeds and Higher Endurance and RetentionDedicated Peripherals Optimized for Vision and Voice AI plus Real-Time AnalyticsNew AI Software Framework Eases Development and Enables Easy Migration with MPUsLeading-Edge Security Features Ensure Data Privacy　　Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, introduced the RA8P1 microcontroller (MCU) Group targeted at Artificial Intelligence (AI) and Machine Learning (ML) applications, as well as real-time analytics. The new MCUs establish a new performance level for MCUs by combining 1GHz Arm® Cortex®-M85 and 250MHz Cortex-M33 CPU cores with the Arm Ethos™-U55 Neural Processing Unit (NPU). This combination delivers the highest CPU performance of over 7300 CoreMarks and AI performance of 256 GOPS at 500 MHz.　　Designed for Edge/Endpoint AI　　The RA8P1 is optimized for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive operations in Convolutional and Recurrent Neural Networks (CNNs and RNNs) to deliver up to 256 MACs per cycle that yield 256 GOPS performance at 500 MHz. The new NPU supports most commonly used networks, including DS-CNN, ResNet, Mobilenet TinyYolo and more. Depending on the neural network used, the Ethos-U55 provides up to 35x more inferences per second than the Cortex-M85 processor on its own.　　Advanced Technology　　The RA8P1 MCUs are manufactured on the 22ULL (22nm ultra-low leakage) process from TSMC, enabling ultra-high performance with very low power consumption. This process also enables the use of embedded Magnetoresistive RAM (MRAM) in the new MCUs. MRAM offers faster write speeds along with higher endurance and retention compared with Flash.　　“There is explosive growth in demand for high-performance edge AIoT applications. We are thrilled to introduce what we believe are the best MCUs to address this trend,” said Daryl Khoo, Vice President of Embedded Processing Marketing Division at Renesas. “The RA8P1 devices showcase our technology and market expertise and highlight the strong partnerships we have built across the industry. Customers are eager to employ these new MCUs in multiple AI applications.”　　“The pace of innovation in the age of AI is faster than ever, and new edge use cases demand ever-improving performance and machine learning on-device,” said Paul Williamson, Senior Vice President and General Manager, IoT Line of Business at Arm. “By building on the advanced AI capabilities of the Arm compute platform, Renesas’ RA8P1 MCUs meet the demands of next generation voice and vision applications, helping to scale intelligent, context-aware AI experiences.”　　“It is gratifying to see Renesas harness the performance and reliability of TSMC 22ULL embedded MRAM technology to deliver outstanding results for its RA8P1 devices,” said Chien-Hsin Lee, Senior Director of Specialty Technology Business Development at TSMC. “As TSMC continues to advance our embedded non-volatile memory (eNVM) technologies, we look forward to strengthening our long-standing collaboration with Renesas to drive innovation in future groundbreaking devices.”　　Robust, Optimized Peripheral Set for AI　　Renesas has integrated dedicated peripherals, ample memory and advanced security to address Voice and Vision AI and Real-time Analytics applications. For vision AI, a 16-bit camera interface (CEU) is included that supports sensors up to 5 megapixels, enabling camera and demanding Vision AI applications. A separate MIPI CSI-2 interface offers a low pin-count interface with two lanes, each up to 720Mbps. In addition, multiple audio interfaces including I2S and PDM support microphone inputs for voice AI applications.　　The RA8P1 offers both on-chip and external memory options for efficient, low latency neural network processing. The MCU includes 2MB SRAM for storing intermediate activations or graphics framebuffers. 1MB of on-chip MRAM is also available for application code and storage of model weights or graphics assets. High-speed external memory interfaces are available for larger models. SIP options with 4 or 8 MB of external flash in a single package are also available for more demanding AI applications.　　New RUHMI Framework　　Along with the RA8P1 MCUs, Renesas has introduced RUHMI (Renesas Unified Heterogenous Model Integration), a comprehensive framework for MCUs and MPUs. RUHMI offers efficient AI deployment of the latest neural network models in a framework agnostic manner. It enables model optimization, quantization, graph compilation and conversion, and generates efficient source code. RUHMI provides native support for machine-learning AI frameworks such as TensorFlow Lite, Pytorch & ONNX. It also provides the necessary tools, APIs, code-generator, and runtime needed to deploy a pre-trained neural network, including ready-to-use application examples and models optimized for RA8P1. RUHMI is integrated with Renesas’s own e2Studio IDE to allow seamless AI development. This integration will facilitate a common development platform for MCUs and MPUs.　　Advanced Security Features　　The RA8P1 MCUs provide leading-edge security for critical applications. The new Renesas Security IP (RSIP-E50D) includes numerous cryptographic accelerators, including CHACHA20, Ed25519, NIST ECC curves up to 521 bits, enhanced RSA up to 4K, SHA2 and SHA3. In concert with Arm TrustZone®, this provides a comprehensive and fully integrated secure element-like functionality. The new MCUs also provides strong hardware Root-of-Trust and Secure Boot with First Stage Bootloader (FSBL) in immutable storage. XSPI interfaces with decryption-on-the-fly (DOTF) allow encrypted code images to be stored in external flash and decrypted on the fly as it is securely transferred to the MCU for execution.　　Ready to Use Solutions　　Renesas provides a wide range of easy-to-use tools and solutions for the RA8P1 MCUs, including the Flexible Software Package (FSP), evaluation kits and development tools. FreeRTOS and Azure RTOS are supported, as is Zephyr. Several Renesas software example projects and application notes are available to enable faster time to market. In addition, numerous partner solutions are available to support development with the RA8P1 MCUs, including a driver monitoring solution from Nota.AI and a traffic/pedestrian monitoring solution from Irida Labs. Other solutions can be found at the Renesas RA Partner Ecosystem Solutions Page.　　Key Features of the RA8P1 MCUs　　Processors: 1GHz Arm Cortex-M85, 500MHz Ethos-U55, 250 MHz Arm Cortex-M33 (Optional)　　Memory: 1MB/512KB On-chip MRAM, 4MB/8MB External Flash SIP Options, 2MB SRAM fully ECC protected, 32KB I/D caches per core　　Graphics Peripherals: Graphics LCD controller supporting resolutions up to WXGA (1280x800), parallel RGB and MIPI-DSI display interfaces, powerful 2D Drawing engine, parallel 16bit CEU and MIPI CSI-2 camera interfaces, 32bit external memory bus (SDRAM and CSC) interface　　Other Peripherals: Gigabit Ethernet and TSN Switch, XSPI (Octal SPI) with XIP and DOTF, SPI, I2C/I3C, SDHI, USBFS/HS, CAN-FD, PDM and SSI audio interfaces, 16bit ADC with S/H circuits, DAC, comparators, temperature sensor, timers　　Security: Advanced RSIP-E50D cryptographic engine, TrustZone, Immutable storage, secure boot, tamper resistance, DPA/SPA attack protection, secure debug, secure factory programming, Device Lifecycle management　　Packages: 224BGA, 289BGA
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Release time：2025-07-04 14:56 reading：412 Continue reading>>
GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential
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GD32C231 Series MCU — Redefining Cost-Performance, Unleashing New Potential

　　GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today officially launched the value-packed GD32C231 series of entry-level microcontrollers, further expanding its Arm® Cortex®-M23 core product lineup. As the leader in China's largest Arm® MCU market, GigaDevice positions the GD32C231 series as a "high-performance entry-level" solution designed to offer more competitive options for applications including small home appliances, BMS (Battery Management Systems), small-screen display devices, handheld consumer products, industrial auxiliary controls, and automotive aftermarket systems.　　With over 2 billion cumulative MCU shipments and a mature supply chain, GigaDevice's newly launched GD32C231 series overcomes the performance limitations of traditional entry-level chips through innovative design. The series not only integrates a rich set of peripherals but also adopts an industrial-grade wide-voltage process and offers a comprehensive ecosystem. While maintaining exceptional cost-effectiveness, this affordable MCU supports more complex application scenarios, redefining value standards in the entry-level MCU market and ushering in a new era of "affordable yet high-spec" solutions.　　GD32C231 Series MCUs: The Ultimate Choice for Cost-Effectiveness　　The GD32C231 series MCUs deliver a significant upgrade in computing performance and peripheral features while maintaining excellent price competitiveness, achieving an ultra-high cost-performance balance. Built on Arm's advanced Cortex®-M23 core architecture, the series offers up to 10% higher performance than Cortex®-M0+, with clock speeds reaching 48MHz. It supports efficient processing capabilities such as integer division, greatly enhancing software execution efficiency.　　In terms of memory configuration, the series features 32KB to 64KB of highly reliable embedded Flash and 12KB of low-power SRAM, with full memory areas equipped with ECC error correction. To meet the demands of diverse applications, multiple package options are available, including TSSOP20/LGA20, QFN28, LQFP32/QFN32, and LQFP48/QFN48. Thanks to its highly integrated chip design, the series effectively reduces the number of external components, providing users with a bill-of-materials (BOM) cost-optimized solution.GD32C231 Product Portfolio　　The Perfect Balance of Wide Voltage Support, Low Power, and Fast Wake-up Time　　The GD32C231 series delivers exceptional power flexibility and energy efficiency, supporting a wide operating voltage range from 1.8V to 5.5V and a broad temperature range from -40°C to 105°C. This makes it highly adaptable for deployment in harsh and demanding environments. Featuring multiple power management modes, the device consumes as little as 5μA in deep sleep mode and offers ultra-fast 2.6μs wake-up time - achieving an optimal balance between low power consumption and real-time performance. These capabilities make the GD32C231 ideal for battery-powered and portable applications.　　Reliable Operation for Safety-Critical Applications　　Engineered for reliability, the GD32C231 provides robust ESD protection - meeting 8kV contact discharge and 15kV air discharge standards. Full ECC error correction is applied across Flash and SRAM memory, helping to prevent data corruption. An integrated hardware CRC module further enhances data transmission integrity. These features ensure the MCU performs reliably in safety-critical environments such as industrial automation and automotive electronics.　　Highly Integrated Peripherals for Flexible Design　　The GD32C231 series integrates a comprehensive set of peripherals, significantly enhancing system integration and design flexibility:　　A 12-bit ADC with 13 external channels and 2 internal comparators for precise analog signal measurement.　　Up to 4 general-purpose 16-bit timers and 1 advanced 16-bit timer for versatile time-based operations.　　2 high-speed SPI interfaces (including quad QSPI at 24Mbps), 2 I²C interfaces (supporting Fast Mode+ at 1Mbit/s), and 3 UARTs (up to 6Mbps) for robust serial communication.　　An integrated 3-channel DMA controller and 1 I²S interface for efficient peripheral data handling.　　With support for up to 45 GPIOs in a 48-pin package, the GD32C231 offers excellent expandability for complex designs. These rich peripheral resources empower the MCU to meet the demands of a wide range of applications - from consumer electronics to industrial control systems - with ease and reliability.GD32C231 block diagram　　Full-Stack Ecosystem Support for Efficient Development　　The GD32C231 series is backed by a comprehensive development ecosystem designed to accelerate product design and time-to-market. Standard software libraries and resources are readily available on GigaDevice's official website.　　To support developers throughout the entire development cycle, GigaDevice provides extensive documentation, including datasheets, user manuals, hardware design guidelines, application notes, and porting references - enabling rapid onboarding for both hardware and software development. A complete SDK firmware package is also offered, featuring rich sample code and development board resources that cover everything from low-level drivers to advanced applications.　　The GD32 MCU family natively supports FreeRTOS, offering developers a lightweight, open-source, and high-efficiency real-time operating system. To streamline development even further, GigaDevice offers the GD32 Embedded Builder IDE - its proprietary development environment that integrates graphical configuration and intelligent code generation, reducing design complexity. The GD32 All-In-One Programmer supports essential Flash operations such as programming, erasing, reading, and option byte configuration. Meanwhile, the GD-Link debugger provides dual-mode SWD/JTAG support with plug-and-play functionality for a seamless debugging experience. GigaDevice also collaborates closely with third-party programming tool providers to offer customers a wide range of programming and debugging options.　　Additionally, the GD32C231 series is fully compatible with major international toolchains including Arm® Keil, IAR Embedded Workbench, and SEGGER Embedded Studio, ensuring flexibility across various development platforms. For typical use cases, GigaDevice provides robust application solutions and reference designs - helping developers shorten design cycles, simplify product validation, and accelerate the path to mass production.　　About GigaDevice　　GigaDevice Semiconductor Inc. is a global leading fabless supplier. Founded in April 2005, the company has continuously expanded its international footprint and established its global headquarters in Singapore in 2025. Today, GigaDevice operates branch offices across numerous countries and regions, providing localized support at customers' fingertips. Committed to building a complete ecosystem with major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.GigaDevice.com　　*GigaDevice, GD32, and their logos are trademarks, or registered trademarks of GigaDevice Semiconductor Inc. Other names and brands are the property of their respective owners.
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Release time：2025-06-30 14:52 reading：447 Continue reading>>
GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications
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GigaDevice launches the GD32G5 series high-performance MCUs with Cortex®-M33 core, unleashing innovation potential in industrial applications

　　GigaDevice (Stock Code: 603986), a leading semiconductor supplier, today officially announced the launch of the GD32G5 series high-performance microcontrollers, based on the Arm® Cortex®-M33 core.　　The GD32G5 series MCUs, featuring exceptional processing performance, a wide range of digital and analog interface resources, and enhanced security capabilities, can be widely applied across diverse scenarios such as digital power systems, charging stations, energy storage inverters, frequency converters, servo motors, and optical communication. This new product lineup offers 14 models across 7 package types, including LQFP, QFN, and WLCSP. 　　Powerful Performance Empowering the Industrial Market　　The GD32G5 series MCUs are powered by the high-performance Arm® Cortex®-M33 core, with a clock frequency of up to 216 MHz. These MCUs feature an advanced DSP hardware accelerator and a single-precision floating-point unit (FPU). They also integrate a hardware trigonometric function accelerator (TMU), supporting 10 types of function calculations, along with various other hardware acceleration units, including filter algorithms (FAC) and Fast Fourier Transform (FFT), which significantly enhance processing efficiency. At maximum frequency, the GD32G5 series MCUs deliver performance of up to 316 DMIPS, achieving an impressive CoreMark® score of 694.　　The GD32G5 series MCUs are equipped with 256KB to 512KB of embedded Flash memory, supporting the dual-bank Flash feature, and 128KB of SRAM, which includes 32KB Tightly Coupled Memory RAM (TCMRAM) for zero-wait execution of critical instructions and data. Additionally, they feature high-speed cache memory, with up to 2KB I-Cache and 512B D-Cache, further boosting core processing performance.　　Extensive Peripherals Enable Development Innovation　　The GD32G5 series MCUs integrate a comprehensive range of peripheral resources. They support four 12-bit ADCs with a sampling rate of up to 5.3 MSPS and up to 42 channels, as well as four 12-bit DACs, two of which offer sampling rates as high as 15 MSPS. Additionally, the series includes eight high-speed comparators (COMPs) and a suite of high-precision analog peripherals designed to meet the demands of motor and power control applications. The GD32G5 series also features a 16-channel high-precision timer (HRTimer) with accuracy reaching 145 ps, along with three advanced 8-channel timers, two 32-bit general-purpose timers, five 16-bit general-purpose timers, two 16-bit basic timers, and one low-power timer.　　In terms of communication interfaces, the GD32G5 series offers five U(S)ARTs, four I2Cs, three SPIs, and one QSPI supporting up to 200 MHz DDR/SDR interfaces. The MCUs are equipped with three CAN-FD modules, ideal for high-speed communication applications. Additionally, they integrate one HPDF (high-performance digital filter) supporting 8 channels and 4 filters, with external Σ-Δ modulator support. The series also includes four configurable logic modules (CLAs) and the Trigsel module, which allows flexible configuration of trigger sources. Designed to operate in a wide temperature range from -40°C to 105°C, the GD32G5 series is well-suited for demanding applications such as optical modules, industrial power supplies, and high-speed motor control, where stringent temperature requirements must be met.
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Release time：2025-05-21 16:47 reading：515 Continue reading>>
GigaDevice Launches New Low-power MCU products of GD32L235 series
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GigaDevice Launches New Low-power MCU products of GD32L235 series

　　Beijing, China (Thursday, May 14, 2024) - GigaDevice (stock code 603986), a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, and Power Management technologies, has officially launched the GD32L235 series MCU, further enriching the selection of low-power products and reinforcing its presence in this market segment. The brand-new GD32L235 product series is designed to meet the needs of the low-power market segment. With enhanced power consumption efficiency, rich interface resources, and superior cost performance, it is ideal for applications including industrial metering, smart door locks, portable devices, IoT, e-cigarettes, and BMS. Offering a total of 16 model options across seven packages, including LQFP64/48/32, QFN64/48/32, and WLCSP25, the GD32L235 series MCUs have commenced official mass production and distribution.　　The GD32L235 series MCUs have optimized and improved power consumption efficiency and support six low-power modes, including Deep-sleep, Sleep, Standby, etc. In Deep-sleep mode, the current drops to 1.8uA, and the wakeup time is less than 2uS; in Standby mode, the current is as low as 0.26uA. Even under full-speed operating mode with maximum clock frequency, power consumption is only at 66uA/MHz, achieving an excellent balance between performance and power consumption.　　The GD32L235 series MCUs use the Arm® Cortex®-M23 core with a clock frequency of 64MHz. In addition, they are equipped with 64KB to 128KB embedded flash memory and 12KB to 24KB SRAM. These MCUs are divided into two models based on storage capacity to cater to the varied requirements of users across different application scenarios. This series integrates two 16-bit low-power timers, six general-purpose 16-bit timers, one advanced timer, two basic timers, two low-power LPUARTs, two USARTs, two UARTs, three I2Cs, two SPIs, and other general peripheral interfaces, as well as standard communication interfaces such as one CAN2.0 controller and one USB2.0 FS controller. In terms of analog peripherals, this series is equipped with one 12-bit ADC supporting both differential and single-ended input modes, improving the accuracy and performance of the ADC module. Additionally, it integrates one 12-bit DAC and two comparators. The GD32L235 series offers the option of WLCSP25 ultra-small package, making it suitable for wearable consumer electronics, portable devices, and other application scenarios with limited hardware space.　　The supporting documents, manuals, and software resources of the GD32L235 series are available in GD32MCU.com for users to download and utilize. Development tools tailored for various packages and pin configurations of the GD32L235 series have also been released. These include the GD32L235R-EVAL full-featured evaluation board and entry-level learning kits such as GD32L235O-START, GD32L235Q-START, and GD32L235E-START, providing users with convenient development and debugging experiences.
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Release time：2024-05-15 11:37 reading：1963 Continue reading>>
A solution for automotive gear shift switch based on Hangshun chip automotive grade MCU HK32A040C8T3
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A solution for automotive gear shift switch based on Hangshun chip automotive grade MCU HK32A040C8T3

　　Throughout the global development of passenger cars, automatic transmission has been widely adopted. Its simple and easy to learn, convenient and intelligent characteristics bring drivers a more comfortable driving experience, and also better adapt to urban traffic.　　The implementation of the automatic shift function actually uses a gear shift switch instead of manual operation. The gear shift switch will control the shift fork and gear shift based on different engine speeds, vehicle speeds, and the driver's intention to press the accelerator. To achieve these automated operations, a shift switch requires a brain.　　The Hangshun chip M0 series automotive grade MCU HK32A040C8T3 is such a "brain", applied in gear shift switch schemes. Its main function is to receive signals from the gear shift switch and convert these signals into electrical signals that can control the car's engine, transmission, and other parts, thereby simplifying driving operations and providing great convenience for the driver.　　In the process of developing its new generation of electric vehicles, in order to ensure that the vehicle's performance, reliability, and safety reach the optimal level, after in-depth technical evaluation and multiple rounds of screening, Selis New Energy Vehicles finally chose a gear shift switch scheme based on the Hangshun chip HK32A040C8T3.　　The Selis engineering team has conducted a rigorous review of the functional characteristics, processing speed, power consumption performance, environmental adaptability, and cost-effectiveness of the Hangshun HK32A040C8T3 MCU in multiple dimensions. Hangshun's MCU has successfully conquered the engineering team with its outstanding performance, especially in high reliability and strong anti-interference ability. In addition, HK32A040C8T3 has high integration and flexible peripheral interfaces, providing engineers with greater design freedom and optimization space, making the entire electronic control system more compact and efficient.　　HK32A040 using ARM ® Cortex ®- M0 core, with a maximum operating frequency of 96MHz, built-in up to 124 Kbyte Flash and 10 Kbyte SRAM. By configuring the Flash controller registers, the remapping of interrupt vectors within the main Flash area can be achieved. And it supports traditional Flash Level 0/1/2 read-write protection and Flash code encryption (patented by Hangshun).　　Strong scalability　　32-bit ARM CPU architecture, good ecological environment　　Rich peripheral resources to meet platform expansion　　Multiple packaging options available for LQFP64, LQFP48, QFN32, and QFN28　　high reliability　　Car specification quality, compliant with AEC-Q100 Grade 1　　Complies with ISO 9001 and IATFT 16949 quality management systems　　Supports -40 ℃~125 ℃　　High cost performance ratio　　Equal performance/resources, with higher cost-effectiveness　　Quality service　　Complete ecological supporting facilities　　15 years of design life, with a supply chain guarantee of over 15 years　　The gear shift switch scheme based on the Hangshun Vehicle Class MCU HK32A040C8T3 has been successfully applied in the Sailis new energy vehicle, which not only improves the electronic control efficiency of the entire vehicle, but also achieves lower energy consumption and better user experience.　　The Hangshun chip series vehicle grade MCU HK32A040 can be widely used in vehicle domain controllers, such as doors and windows, tail lights, wipers, anti-theft alarms, car keys, air conditioning, electric seats, etc.　　Hangshun Chip adheres to the strategy of SoC+32-bit high-end MCU in automotive standards. In recent years, it has invested a large amount of research and development resources in the field of automotive electronics, committed to providing the market with higher reliability and more cost-effective automotive chip solutions, helping customers achieve a win-win situation in cost control and user experience.
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Release time：2024-05-09 11:48 reading：1484 Continue reading>>
GigaDevice Launches GD32F5 Series Cortex®-M33 Core MCUs for High-Performance Applications
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GigaDevice Launches GD32F5 Series Cortex®-M33 Core MCUs for High-Performance Applications

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, and Power Management technologies, announced today the official launch of the GD32F5 series high-performance microcontroller units (MCUs) based on the Arm®Cortex®-M33 core. The product is fully adapted for applications in energy and power management, photovoltaic energy storage, industrial automation, Programmable Logic Controllers (PLC), network communication devices, and graphic displays.　　The GD32F5 series high-performance MCUs offer significantly expanded storage space, excellent processing efficiency, and a wide array of interface options. Compliant with the system-level IEC61508 SIL2 functional safety standard, they provide a comprehensive software and hardware security solution to meet the industrial market's demands for high reliability and security applications. Currently, samples of this series are available, and mass production is scheduled to begin in May.　　Leading hardware and storage resources to enhance the endurance of industrial applications　　The GD32F5 series high-performance MCUs adopt the Arm® Cortex® -M33 core with a maximum operating frequency of 200MHz and a working performance of up to 3.31 CoreMark®/MHz. They are equipped with advanced DSP hardware accelerators and single-precision floating-point units (FPUs), which significantly reduce the burden on the core and enhance processing efficiency.　　The GD32F5 series high-performance MCUs are equipped with up to 7.5MB on-chip Flash and 1MB SRAM. This includes a 2MB configurable zero-wait execution area (Code-Flash) that effectively improves code processing efficiency and real-time performance. They also provide a large Data-Flash space for backup and parameter storage. The SRAM/Flash fully support ECC verification to ensure stable and reliable storage space, effectively adapting to various complex industrial application environments. The GD32F5 series supports a maximum of 2MB for Read-While-Write (RWW) OTA upgrades to ensure seamless code updates without operation interruption, thus guaranteeing both real-time performance and stability. The external memory controller (EXMC) supports access to a variety of external memory devices such as SDRAM, SRAM, ROM, NOR Flash, NAND Flash, and PC Cards. With its large storage capacity, the GD32F5 meets the needs of complex industrial systems for code upgrades and backups.　　Rich peripherals and security features create a highly reliable platform　　The GD32F5 MCU series includes various built-in security features to ensure the protection of device information. This MCU series provides multiple levels of code and data protection areas, as well as an EFUSE area, supporting various mechanisms such as secure OTA, secure boot, secure debugging, and secure downloading. For ease of use, GD32 has introduced the new Security Boot and Update software platform, offering secure booting, secure upgrading, secure communication, and software solutions. Users can conduct secondary development based on their specific requirements. The GD32F5 MCU series also supports system-level IEC61508 SIL2 functional safety standards, providing a complete Safety Package including a Safety Manual, FMEDA, and a self-test library, among other functional safety materials.　　The high-performance GD32F5 MCU series integrates a wealth of general-purpose peripheral resources, including eight U(S)ARTs, six I2C interfaces, six SPI interfaces, two I2S interfaces, and one SDIO interface. It is equipped with a USB2.0 OTG interface that supports both Full Speed and High-Speed modes. Additionally, it integrates two channels of CAN-FD controllers and one Ethernet interface to meet the requirements of industrial control networking and communication applications.　　The high-performance GD32F5 MCU series operates on 1.71V to 3.6V power supply and features two 32-bit general-purpose timers, eight 16-bit general-purpose timers, two 16-bit basic timers, and two PWM advanced timers. It also supports three 12-bit ADCs, two DACs, and other high-precision analog peripherals to meet the requirements of motor frequency conversion, industrial control, and other application scenarios.　　GD32F5 series MCU lineup　　Comprehensive development tools to accelerate application design　　The GD32 development ecosystem is continuously expanding and improving. GigaDevice provides the new high-performance GD32F5 series MCU with free development environment GD32 IDE, debugging and download tool GD-LINK, and the programming tool GD32 All-In-One Programmer. Furthermore, industry-leading embedded tools vendors such as Arm® KEIL, IAR, and SEGGER will also offer comprehensive support for the new GD32F5 products, including development, compilation, and trace debugging tools.　　GigaDevice had strategically partnered with leading embedded development system provider SEGGER in Germany to provide free commercial emWin embedded GUI to all users of GD32 series Arm® Cortex®-M microcontrollers, including the new GD32F5 series. This software effectively reduces development complexity and project timelines, further expediting the implementation of high-performance GUI applications. Additionally, it offers AppWizard to streamline and enhance the development of graphic applications.　　The GD32F5 lineup includes five package types: BGA176, LQFP176/144/100/64, totaling 10 product models. Meanwhile, complementary development boards have also been launched. These include the GD32F527I-EVAL full-featured evaluation board, as well as the GD32F527Z-START, GD32F527V-START, and GD32F527R-START entry-level learning kits. These kits correspond to different packages, making it convenient for users to develop and debug their applications. The above products will be released to all authorized distribution channels. Please contact local GigaDevice sales office or authorized representative for more details.
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Release time：2024-04-11 11:22 reading：1659 Continue reading>>
3PEAK Launches Two New TPS32 MCU Product Series for Mass Production
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3PEAK Launches Two New TPS32 MCU Product Series for Mass Production

　　After two years of dedicated effort and craftsmanship, 3PEAK's inaugural launch of its embedded processor products has arrived as scheduled.　　The TPS32 mixed-signal microcontroller leverages 3PEAK's excellent capabilities in mixed-signal processing. It is suited for product development in vertical applications and optimizing product design so customers can differentiate their end products. 3PEAK provides complete development ecosystem support, including easy-to-use embedded software packages, hardware and software development tools, and a third-party cooperative ecosystem. This full-range support throughout the design and development cycle helps shorten design time for customer products and ensures a smooth user experience.The TPS32 mixed-signal microcontroller series adheres strictly to industrial quality standards throughout the design process, making it an ideal choice for broad industrial applications.　　This major launch introduces two series under the TPS32 mixed-signal microcontroller family's Mainstream Line, totaling 26 products now officially in mass production.　　TPS325M5 Series　　• TPS325M51 subseries　　• TPS325M5A subseries　　TPS325M0 Series　　• TPS325M01 subseries　　• TPS325M0A subseries　　Product Features　　General Features　　• Incorporates the STAR-MC1 core based on the Armv8-M architecture, compatible with the ARM®Cortex-M33 instruction set　　• Large on-chip memory: Up to 2-MB flash and 336-KB SRAM　　• Comprehensive communication peripherals: 7 UARTs, 2 I2Cs, 3 SPIs, 1 CAN2.0B, and a QSPI external storage expansion interface supporting XIP　　• High-performance and reliable analog peripherals: Multi-channel 12-bit SAR ADC (ENOB: single-ended 11, differential 11.5) supporting 2.5 Msps, ±2°C internal temperature sensor, 2 high-speed analog comparators, 2 high-bandwidth op-amps, dual-channel output 12-bit DAC　　• Ultra-high IO efficiency, supporting up to 87 IO ports　　• Ultra-low system power consumption: <5 μA in ultra-low power capacitive touch mode, supporting external interrupts, RTC, and TPSensor® wake-up　　• Multiple packages: LQFP100, LQFP80, LQFP64, QFN88　　Application-Specific Features　　TPSensor® Capacitive Touch Technology　　• 17-channel Input　　• Ultra-high Precision up to 10 fF　　• Exceptional Noise Resistance　　• Waterproof and False Touch Prevention　　• Low Power Consumption in Sleep Mode with Quick Wake-up　　HMI Optimization　　• Supports SPI and 8080 Display Interfaces　　• Large Display Cache　　Target Applications　　• Smart Door Locks　　• Industrial HMI　　• Intercoms　　• Smart Home Devices　　• Motor Control　　• Household Appliances　　• Industrial Control　　Functional Diagram
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Release time：2024-01-18 14:03 reading：2888 Continue reading>>
GigaDevice Launches Brand New Wi-Fi 6 MCU Series - GD32VW553
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GigaDevice Launches Brand New Wi-Fi 6 MCU Series - GD32VW553

　　The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity. It features advanced Radio Frequency Integrated Circuits (RFIC), enhanced security mechanisms, generous storage capacity, and a wide range of universal interfaces. Leveraging a mature process platform and cost-effective optimization, it consistently delivers solutions for market applications demanding efficient wireless capabilities. The new product lineup offers eight different models. GigaDevice is now accepting requests for samples and evaluation boards in two compact package options: QFN40 and QFN32. These products are scheduled for mass production and will be available for delivery starting in December 2023.　　With its excellent edge processing and connectivity features, GD32VW553 applies to various wireless application scenarios, including smart home appliances, smart home systems, industrial Internet, and communication gateways. This series of MCUs is also well suited for scenarios with budget constraints, making it an ideal choice for office equipment, payment terminals, and various IoT products.　　Eric Jin, GigaDevice's Product Marketing Director, stated, "The new GD32VW553 series, with its optimized RISC-V open-source instruction set architecture, incorporates the microcontroller with advanced Combo Wireless connection protocols. This addresses the increasing connectivity demands in the thriving home appliances and emerging AIoT market, achieving a balance between processing performance, solution design, and material costs. With an ongoing expansion of GD32 RF development platform, it adeptly addresses wireless design challenges in hi-density and intricate environments, presenting developers with a secure, dependable, energy-efficient, and efficient connectivity experience."　　The GD32VW553 series RISC-V core Combo Wireless MCU　　Leading RF computing performance　　To fulfill the requirements of real-time processing and efficient communication, the GD32VW553 series MCU incorporates a new open-source instruction set architecture with the RISC-V processor core, boasting a maximum clock frequency of 160 MHz. Additionally, it incorporates advanced DSP hardware acceleration, a double-precision floating-point unit (FPU), instruction expansion interfaces, and various other resources. Through excellent microarchitecture design, this combination results in outstanding energy efficiency, while providing flexibility for scalability.　　The integrated 2.4 GHz Wi-Fi 6 RF module follows the IEEE 802.11ax standard and is backward compatible with the IEEE 802.11b/g/n standard, ensuring its suitability for different network environments. It supports Orthogonal Frequency Division Multiple Access (OFDMA) enabling multiple devices to share channel resources, resulting in 60% higher data transmission rate compared to Wi-Fi 4. Additionally, it offers support for Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling multiple devices to work simultaneously without interfering with each other, thus achieving high-efficiency and low-latency communication in multi-device high-density access scenarios.　　The integrated Bluetooth LE 5.2 RF module extends the communication distance, increases throughput, enhances security, and saves power following the latest Bluetooth specifications. It provides 2 Mbps high-speed data mode and multiple rates of 125K/500Kbps to effectively reduce transmission time and improve sensitivity. It facilitates the establishment and configuration of stable and high-speed wireless networks even in the case of multiple devices and complex environments.　　The new Combo Wireless MCU offers advanced baseband and RF performance with a variety of additional features. It supports the wireless coexistence protocol based on the Package Traffic Arbitration (PTA) mechanism, significantly reducing same-frequency interference caused by Wi-Fi and Bluetooth; thereby enhancing the stability of signal reception. Additionally, it is equipped with Automatic Gain Control (AGC) in a high dynamic range to effectively enhance signal quality. Thanks to the Target Wake Time (TWT) of Wi-Fi 6, GD32VW553 can flexibly schedule the sleep and wake-up time, improving energy-saving efficiency and meeting the access requirements of wireless devices with low power consumption and long battery life.　　High integration and security　　The new GD32VW553 series integrates up to 4MB Flash, 320KB SRAM, and 32KB configurable Instruction Cache (I-Cache) to greatly improve CPU processing efficiency. The GD32VW553, delivering excellent wireless performance, is also equipped with rich universal wired interfaces, including three U(S)ART, two I2C, one SPI, one four-wire QSPI, and up to 29 programmable GPIO pins. Its built-in components include two 32-bit general-purpose timers, two 16-bit general-purpose timers, four 16-bit basic timers, one PWM advanced timer, and one 12-bit ADC. The power supply voltage ranges from 1.8 V to 3.6 V and it offers high temperature up to 105℃ to meet the application scenarios such as industrial control interconnection, lighting equipment, and socket panels.　　The GD32VW553 series also provides multiple security features to streamline secure connection and management of high-performance wireless devices. It supports the Wi-Fi Protected Access (WPA) security feature, incorporating new WPA3 encryption technologies for both personal and corporate networks. The hardware encryption and decryption engine support DES, triple DES, AES, and Hash algorithms. It also supports Public Key Cryptographic Acceleration Unit (PKCAU) to ensure confidentiality and data integrity during wireless communication. The True Random Number Generator (TRNG) can provide unpredictable data for key generation across a variety of security protocols, further enhancing the system's security capabilities.　　The GD32VW553 series MCU Lineup　　Enabling wireless innovation with ecosystem　　The RISC-V development ecosystem for GD32 has become increasingly comprehensive, covering the entire development process. It is highly compatible with existing MCU development environments and user habits, enabling users to quickly build competitive market driven solutions. GigaDevice provides the new GD32VW553 series MCU with a range of free development tools, including GD32 IDE, GD-LINK debugging and download tool, and GD32 All-In-One Programmer. In addition, GigaDevice has concurrently released the SDKs that contain the underlying driver, wireless protocol stack, and application routine. Development boards that are compatible with various Real-Time Operating Systems (RTOS) supporting local connection, cloud connection, security, and Over the Air (OTA) upgrade are also available, enabling rapid deployment of connectivity devices. The GD32VW553 series meets the Matter over Wi-Fi application standard developed by the international organization Connectivity Standards Alliance (CSA). This allows GD32VW553 to facilitate seamless interconnections among various Matter devices, improving the overall compatibility and interoperability of smart home systems.　　SEGGER, the industry's leading supplier of embedded development systems from Germany, has formed a strategic partnership with GigaDevice to offer developers free access to the SEGGER Embedded Studio IDE and a complete suite of development tools. IAR from Sweden will also provide comprehensive support for the new GD32VW553 series MCU, including development and compilation tools as well as tracking and debugging tools.　　The GD32VW553 series MCU has achieved official Wi-Fi 6 certification from the Wi-Fi Alliance (WFA), Bluetooth certification from the Bluetooth Special Interest Group (Bluetooth SIG), and RF FCC/CE compliance certification. GigaDevice is actively partnering with multiple module manufacturers and developer platforms to offer "turnkey solutions," encompassing wireless modules, certificate authentication service, and more. These solutions enable the rapid development of Internet of Things (IoT) platforms and product solutions that support various wireless communication technologies such as Wi-Fi and Bluetooth.
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Release time：2024-01-02 16:55 reading：2475 Continue reading>>

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