T<span style='color:red'>AI</span>YO YUDEN Commercializes LCQPB Series of Power Inductors for Automotive Application
Trade news

TAIYO YUDEN Commercializes LCQPB Series of Power Inductors for Automotive Application

　　TAIYO YUDEN CO., LTD. has commercialized the new LCQPB series of wire-wound ferrite power inductors, which have AEC-Q200 qualification for automotive passive components.　　The LCQPB series power inductors are designed for use as choke coils and noise filters in DC-DC converters in power circuits for automotive body and information systems.　　TAIYO YUDEN previously released the LCEN series and LCCN series of metal power inductors made from metallic magnetic substances for automobile application and the LCXN series and LCXH series of ferrite power inductors. To these, we add the new LCQPB series to give our customers more choice by substance and structure and a high degree of freedom in design.　　The LCQPB series inductors have been manufactured by our overseas subsidiary, TAIYO YUDEN (PHILIPPINES), (Lapulapu City, Cebu) since March 2025. Samples are available for 50 yen per unit.　　Technology Background　　The advancements that we have seen in recent years in electronic controls in vehicles, as typified by ADAS units, have led to a greater number of power supply circuits on vehicles, which in turn has led to growth in the demand for power inductors that are used in these circuits. In order to miniaturize power supply circuits, engineers demand inductors with specific properties that allow high-density mounting with a high degree of freedom in design and noise suppression by frequency.　　Therefore, TAIYO YUDEN has newly commercialized the LCQPB series, which complies with AEC-Q200. The LCQPB series inductors have a frameless structure that results in a small footprint. The new LCQPB series, together with our other series of inductors designed for automotive application, give our customers more choice by substance and structure and a high degree of freedom in design.　　TAIYO YUDEN focuses on the development of products that meet market needs, and will continue to expand its power inductor product lineup.　　■ Application　　The LCQPB series power inductors are applicable as choke coils and noise filters in DC-DC converters in power circuits for automotive body and information systems.
Key word：
Release time：2025-04-10 13:18 reading：244 Continue reading>>
ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and <span style='color:red'>AI</span> Servers
Trade news

ROHM Develops Class-Leading* Low ON-Resistance, High-Power MOSFETs for High-Performance Enterprise and AI Servers

　　ROHM has developed N-channel power MOSFETs featuring industry-leading* low ON-resistance and wide SOA capability. They are designed for power supplies inside high-performance enterprise and AI servers.　　The advancement of high-level data processing technologies and the acceleration of digital transformation have increased the demand for data center servers. At the same time, the number of servers equipped with advanced computing capabilities for AI processing is on the rise and is expected to continue to grow. These servers operate 24 hours a day, 7 days a week – ensuring continuous operation. As a result, conduction losses caused by the ON-resistance of multiple MOSFETs in the power block have a significant impact on system performance and energy efficiency. This becomes particularly evident in AC-DC conversion circuits, where conduction losses make up a substantial portion of total power loss – driving the need for low ON-resistance MOSFETs.　　Additionally, servers equipped with a standard hot-swap function, which allow for the replacement and maintenance of internal boards and storage devices while powered ON, experience a high inrush current during component exchanges. Therefore, to protect server components and MOSFETs from damage, a wide Safe Operating Area (SOA) tolerance is essential.　　To address these challenges, ROHM has developed its new DFN5060-8S package that supports the packaging of a larger die compared to conventional designs, resulting in a lineup of power MOSFETs that achieve industry-leading* low ON-resistance along with wide SOA capability. These new products significantly contribute to improving efficiency and enhancing reliability in server power circuits.　　The new lineup includes three products. The RS7E200BG (30V) is optimized for both secondary-side AC-DC conversion circuits and hot-swap controller (HSC) circuits in 12V power supplies used in high-performance enterprise servers. The RS7N200BH (80V) and RS7N160BH (80V) are ideal for secondary AC-DC conversion circuits in 48V AI server power supplies.　　All three models feature the newly developed DFN5060-8S package (5.0mm × 6.0mm). The package increases the internal die size area by approximately 65% compared to the conventional HSOP8 package (5.0mm × 6.0mm). As a result, the RS7E200BG (30V) and RS7N200BH (80V) achieve ON-resistances of 0.53mΩ and 1.7mΩ (at VGS = 10V), respectively – both of which rank among the best in the industry in the 5.0mm × 6.0mm class, significantly contributing to higher efficiency in server power circuits.　　Moreover, ROHM has optimized the internal clip design to enhance heat dissipation, further improving SOA tolerance, which contributes to ensuring application reliability. Notably, the RS7E200BG (30V) achieves an SOA tolerance of over 70A at a pulse width of 1ms and VDS = 12V, which is twice that of the conventional HSOP8 package MOSFETs under the same conditions, ensuring industry-leading SOA performance in a 5.0mm × 6.0mm footprint.　　Going forward, ROHM plans to gradually begin mass production of power MOSFETs compatible with hot-swap controller circuits for AI servers in 2025, continuing to expand its lineup that contributes to greater efficiency and reliability across a wide range of applications.　　Product Lineup　　EcoMOS™ Brand　　EcoMOS™ is ROHM's brand of silicon power MOSFETs designed for energy-efficient applications in the power device sector.　　Widely utilized in applications such as home appliances, industrial equipment, and automotive systems, EcoMOS™ provides a diverse lineup that enables product selection based on key parameters such as noise performance and switching characteristics to meet specific requirements.　　EcoMOS™ is a trademark or registered trademark of ROHM Co., Ltd.　　Application Examples　　・AC-DC conversion and HSC circuits for 12V high-performance enterprise server power supplies　　・AC-DC conversion circuits for 48V AI server power supplies　　・48V industrial equipment power supplies (i.e. fan motors)　　Terminology　　Low ON-Resistance (RDS(on))　　The resistance value between the Drain and Source of a MOSFET during operation. A smaller RDS(on) results in lower power loss during operation.　　SOA (Safe Operating Area) Tolerance　　The range of voltage and current within which a device can operate safely without damage. Exceeding this range can lead to thermal runaway or device failure, making SOA tolerance a critical factor, especially in applications prone to inrush current or overcurrent.　　Power MOSFET　　A type of MOSFET used for power conversion and switching applications. N-channel MOSFETs are the mainstream choice, as they become conductive when a positive voltage is applied to the gate relative to the source, offering lower ON-resistance and higher efficiency than P-channel variants. Due to their low loss and high-speed switching capabilities, power MOSFETs are widely used in power circuits, motor drive circuits, and inverters.　　Hot-Swap Controller (HSC)　　A specialized integrated circuit (IC) that enables hot-swap functionality, allowing components to be inserted or removed while the power supply system remains active. It plays a crucial role in managing inrush current that occurs during component insertion, protecting both the system and connected components from damage.　　Inrush Current　　A sudden surge of current that momentarily exceeds the rated value when an electronic device is powered ON. Proper control of this current reduces stress on power circuit components, helping to prevent device failure and stabilize the system.
Key word：
Release time：2025-04-10 13:10 reading：254 Continue reading>>
T<span style='color:red'>AI</span>YO YUDEN Realizes a Metal Power Inductor as Thin as 0.33 mm
Trade news

TAIYO YUDEN Realizes a Metal Power Inductor as Thin as 0.33 mm

　　TAIYO YUDEN CO., LTD. has begun mass production of a new metal power inductor MCOIL™ LSCN series of multilayer metal power inductors, the "LSCND1005CCTR47MH" (1.0 x 0.5 x 0.33 mm; maximum height shown).　　This power inductor is for use as choke coils in the power supply circuits of wearable devices, such as smartphones, AR/VR glasses, TWS devices, and smart watches. The "LSCND1005CCTR47MH" is 40% lower in height than our previous product, the "LSCNB1005EETR47MB" (1.0 x 0.5 x 0.55 mm), and realizes a metal power inductor as thin as 0.33 mm. This will contribute to the miniaturization and thickness reduction of cutting-edge electronic devices.　　Mass production of this products began at our subsidiary, WAKAYAMA TAIYO YUDEN CO., LTD. (Inami-cho, Hidaka-gun, Wakayama Prefecture), in December 2024. Samples are available for 50 yen per unit.　　Technology Background　　As smartphones, AR/VR glasses, and wearable devices are equipped with higher-performance processors, more sensors, multiple cameras, and higher-capacity batteries for sophistication, electronic components used in them need to be smaller and thinner.　　In particular, smartphones are requiring thinner electronic components, due to the trend towards foldable devices that combine large screens and smaller sizes, as well as the adoption of multi-layered circuit boards. On the other hand, wearable devices, such as AR/VR glasses, TWS devices, and smart watches, require smaller, lighter, and thinner components to achieve a thin profile and comfortable fit.　　To address these needs, TAIYO YUDEN has been expanding its lineup in the MCOIL™ LSCN series of multilayer metal power inductors which use metallic magnetic materials with high DC saturation characteristics, and provide superior characteristics for achieving miniaturization and thinness. With our latest upgrade, we have commercialized the "LSCND1005CCTR47MH," which achieves a thickness of 0.33 mm for a metal power inductor by utilizing the strengths of our multilayer process technology.　　This product will be on display at CES 2025, which takes place from January 7, 2025 at the Las Vegas Convention Center in Las Vegas, Nevada, U.S.A.　　In response to market needs, we will continue to expand and improve our product lineup with higher performance and reliability.　　■ Application　　For use as choke coils for power supply circuits in wearable devices such as smartphones, AR/VR glasses, TWS devices, and smart watches.　　* "MCOIL" is a registered trademark or a trademark of TAIYO YUDEN CO., LTD. in Japan and other countries.　　* The names of series noted in the text are excerpted from part numbers that indicate the types and characteristics of the products, and therefore are neither product names nor trademarks.
Key word：
Release time：2025-04-01 14:41 reading：260 Continue reading>>
ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory
Trade news

ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory

　　ROHM Apollo Co., Ltd. (Headquarters: Fukuoka Prefecture, hereafter ROHM Apollo) Yukuhashi Plant received “the Japan Greenery Research and Development Center Chairperson's Award“ in the 2024 Factory Greening Award Program (commonly called the National Green Factory Award) sponsored by the Ministry of Economy, Trade and Industry, and at the award ceremony held on January 22, Yukuhashi Plant was awarded the certificate of commendation.　　Toshiyuki Hashimoto, General Manager, LSI Engineering Department, ROHM Apollo Yukuhashi Plant(left)　　Masatoshi Kaku, Chairperson, Japan Greenery Research and Development Center(right)　　The Awards Program has been organized annually since 1982, sponsored by the Ministry of Economy, Trade and Industry and operated by the Japan Greenery Research and Development Center, with the aim of further promoting factory greening. The Awards program recognizes factories, organizations, and individuals for their outstanding achievements in promoting factory greening and improving the environment inside and outside their factories.　　Yukuhashi Plant has been focusing on the creation of a “greenery factory” that takes the ecosystem into consideration and was recognized for the maintenance of cherry blossom trees along the road on the plant premises and the completion of a vast green space and a multipurpose ground on the site in 2023. This is the first time that a plant which is based on Yukuhashi City has received this award.　　In ROHM Group, The ROHM Head Office and Plant received the “Japan Greenery Research and Development Center Chairperson's Award” in 2021 and “Kinki Bureau of Economy, Trade and Industry Director General's Award” in 2022.　　ROHM Group formulated “Environmental Vision 2050” in April 2021. Based on its three themes - “Climate change," "Resource recycling," and "Coexistence with nature", we aim to achieve Net Zero greenhouse gas emissions by 2050 and conduct business activities in harmony with the natural cycle to protect biodiversity. Based on our company mission of "contribute to the advancement and progress of culture" and our Environmental Vision, we will continue to work to conserve the environment and biodiversity toward the realization of a sustainable society while promoting sound cooperation with society by contributing to the local environment and appropriately disclosing environmental information.
Key word：
Release time：2025-03-24 11:32 reading：290 Continue reading>>
MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA <span style='color:red'>AI</span> Capabilities
Trade news

MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
Key word：
Release time：2025-03-20 13:55 reading：274 Continue reading>>
ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year
Trade news

ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year

　　ROHM Co., Ltd. was included for the second year in a row in the Sustainability Yearbook 2025, published by S&P Global on February 11, 2025, as a Sustainability Yearbook Member, one of the top 15% companies in the Semiconductor & Semiconductor Equipment industry.　　S&P Global annually evaluates the sustainability efforts of the world's leading companies from governance & economic, environmental, and social perspectives based on its proprietary Corporate Sustainability Assessment (CSA) methodology and selects companies with outstanding sustainability efforts in each industry for inclusion in the Sustainability Yearbook.　　This year, more than 7,690 companies worldwide from 60 industries were evaluated, and 780 companies (including 80 Japanese companies) were selected for this year's Yearbook.　　Encouraged by the results of this year's evaluation, ROHM will continue to promote sustainability activities and address social issues to create a sustainable society, aiming to be a company that meets the expectations of our stakeholders.
Key word：
Release time：2025-03-20 10:11 reading：322 Continue reading>>
ROHM selected as a Constituent of the Dow Jones Sustainability Asia Pacific Index for the First Time
Trade news

ROHM selected as a Constituent of the Dow Jones Sustainability Asia Pacific Index for the First Time

　　ROHM has been selected for the first time as a constituent of the Dow Jones Sustainability Asia Pacific Index (DJSI Asia Pacific), one of the Dow Jones Sustainability Indices (DJSI), a leading global ESG (Environment, Social, Governance) investment indices, which is composed of companies in the Asia-Pacific region.　　Jointly developed by U.S.-based company S&P Dow Jones Indices and RobecoSAM AG, a Swiss investment advisory firm, the DJSI is an index that evaluates companies worldwide from three perspectives - Governance & Economic, Environmental and Social. It is designed to select those that excel in terms of sustainability. It is one of the most important indicators for investors who are interested in ESG. In FY2024, 161 companies (78 companies of which are Japanese companies and 3 are in the semiconductor sector) were selected for DJSI Asia Pacific from approximately 610 major companies in the Asia-Pacific region.　　ROHM Group will continue to strive to address social issues through our business activities and meet the expectations of our stakeholders, aiming to realize a sustainable society.
Key word：
Release time：2025-03-17 14:09 reading：305 Continue reading>>
ROHM’s EcoGaN™ has been Adopted for <span style='color:red'>AI</span> Server Power Supplies by Murata Power Solutions
Trade news

ROHM’s EcoGaN™ has been Adopted for AI Server Power Supplies by Murata Power Solutions

　　ROHM has announced that the EcoGaN™ series of 650V GaN HEMTs in the TOLL package has been adopted for AI server power supplies by Murata Power Solutions, a subsidiary of the Murata Manufacturing Group and a leading supplier of electronic components, batteries and power supplies in Japan. Integrating ROHM’s GaN HEMTs, which combine low loss operation with high-speed switching performance, in Murata Power Solutions’ 5.5kW AI server power supply unit achieves greater efficiency and miniaturization. Mass production of this power supply unit is set to begin in 2025.　　Rapid advancements in IoT-related fields such as AI and AR (Augmented Reality) have led to a surge in global data traffic in recent years. Notably, the power consumption for a single AI-generated response is estimated to be several times higher than that of a standard Internet search, highlighting the need for more efficient AI power supplies. Meanwhile, GaN devices, known for low ON resistance and high-speed switching performance, are gaining attention for their ability to enhance power supply efficiency while reducing the size of peripheral components such as inductors used in power circuits.　　Dr. Joe Liu, Technical Fellow, Murata Power Solutions　　“We are pleased to have successfully designed AI server power supply units featuring higher efficiency and power density by incorporating ROHM’s GaN HEMTs. The high-speed switching capability, low parasitic capacitance, and zero reverse recovery characteristics of GaN HEMTs help minimize switching losses. This allows for higher operating frequencies in switching converters, reducing the size of magnetic components. ROHM’s GaN HEMTs deliver competitive performance and exceptional reliability, yielding excellent results in the development of Murata Power Solutions’ 5.5kW AI server power supply units. Going forward, we will continue our collaboration with ROHM, a leader in power semiconductors, to improve the efficiency of power supplies and address the social issue of increasing power demand.”　　Yuhei Yamaguchi, General Manager, Power Stage Product Development Div., LSI Business Unit, ROHM Co., Ltd.　　“We are delighted that ROHM's EcoGaN™ products have been integrated into AI server power supply units from Murata Power Solutions, a global leader in power supplies. The GaN HEMTs used in this application provide industry-leading switching performance in a high heat dissipation TOLL package, enhancing power density and efficiency in Murata Power Solutions’ power supply units. We look forward to strengthening our partnership with Murata Manufacturing, a company that shares the similar vision of contributing to society through electronics - promoting the miniaturization and efficiency of power supplies to enrich people’s lives.”　　Murata Power Solutions’ Power Supply Units for AI Servers　　Murata Power Solutions’ series of “1U Front End” AC-DC power supplies includes the D1U T-W-3200-12-HB4C (12V output) and D1U T-W-3200-54-HB4C (54V output) 3.2kW power supplies in the high power density short version M-CRPS package, as well as the 5.5kW D1U67T-W-5500-50-HB4C designed for AI servers. These front-end power supplies deliver high conversion efficiency that meets the stringent requirements of 80+ Titanium and Open Compute products while supporting N+m redundant operation for system reliability, making them ideal for powering the latest GPU servers. In addition to providing reliable, efficient power for servers, workstations, and storage/communication systems, the low profile 1U design of these units helps to minimize system footprint.　　ROHM's EcoGaN™　　ROHM’s brand name for GaN devices that contribute to energy conservation and miniaturization by maximizing GaN characteristics to achieve lower application power consumption, smaller peripheral components, and simpler designs requiring fewer parts.　　• EcoGaN™ is a trademark or registered trademark of ROHM Co., Ltd.　　Related ROHM Web Pages        • 650V TOLL Package GaN HEMTs (Feb. 2025 News Release)　　https://www.rohm.com/news-detail?news-title=2025-02-27_news_gan&defaultGroupId=false　　• ROHM GaN Power Device Page (EcoGaN™)　　https://www.rohm.com/products/gan-power-devices/　　About Murata Manufacturing　　Murata Manufacturing is a global leader in the development, production, and sales of ceramic-based electronic components. By leveraging proprietary expertise in material development, process innovation, product design, and production technology, supported by software, analysis, and evaluation, Murata Manufacturing creates innovative products that drive the advancement of an electronic society.　　For more information, please visit Murata Manufacturing's website: https://corporate.murata.com/en-global/
Key word：
Release time：2025-03-13 11:46 reading：338 Continue reading>>
Fibocom Fosters Local 5G <span style='color:red'>AI</span>oT Market with Newly Launched 5G Module FG370-KR at <span style='color:red'>AI</span>oT Korea 2024
Trade news

Fibocom Fosters Local 5G AIoT Market with Newly Launched 5G Module FG370-KR at AIoT Korea 2024

　　wireless communication modules, announces the launch of FG370-KR, a regional version of the FG370 series module, which is positioned to accelerate the commercial development of Korean’s 5G AIoT industries such as Fixed Wireless Access (FWA), live streaming, and industrial automation, etc. By adopting the advancements from FG370-KR, the solution allows local customers to benefit from the seamless 5G experience and fast-to-market industry solutions.　　5G subscribers in South Korea reached around 33 million as of the end of March 2024, according to the latest report from Statista. SK Telecom accounted for 15.9 million of the total 5G subscribers, followed by KT with 9.9 million and LG U+ with 7.2 million. At present, the country accelerates the rollout of commercial 5G services to industry-related field and shows strong growing trends. Fibocom's 5G Sub-6GHz module FG370-KR is compatible with Korea's mainstream 5G frequency bands, supports both 5G SA and NSA network architecture, making it an ideal 5G solution for industry customers that require high-transmission speed, large capacity, and ultra-low latency.　　Developed from the MediaTek T830 chipset platform, the FG370-KR is a 3GPP Release 16 compliant module that adopts a 4nm process integrated with an Arm Cortex-A55 quad-core CPU, leading to a 10% improvement in speed performance compared to the previous generation. In terms of data transmission, FG370-KR supports NR 4CA (Carrier Aggregation) with up to 300MHz bandwidth on the downlink, and NR 2CA in FDD and TDD hybrid mode on the uplink, reaches a maximum speed of up to 7.01Gbps DL and 1.25Gbps UL. In addition, it also supports PC2 of HPUE (High Power User Equipment) technology, significantly enhances 5G uplink capability and network coverage. It is worth highlighting that, FG370-KR can greatly reducing the time-to-market of customers’ devices with the support of a wide range of peripheral interfaces, including three PCI-Express, USB 3.2, two USXGMII interfaces along with software features such as Kernel, OpenWRT drivers.　　“The launch of the FG370-KR signifies that Fibocom will provide a Korea-dedicated solution for local customers, boosting the 5G adoption towards a larger-scale of industries with optimal network connectivity and enhanced operational efficiency, said Simon Tao, VP of Product Management Dept., Head of MBB BU at Fibocom. “We have the confidence in helping enterprises to accomplish the 5G commercialization with our industry know-how and expertise accumulated, without doubt, Korea’s 5G deployment will keep experiencing a fast-growing rate and Fibocom will continually invest in cutting-edge 5G module solutions and delivering superior wireless experience.”　　To learn more about 5G Sub-6GHz module and its demos, welcome to visit Fibocom booth #G101 on the 3rd Floor of Hall D in COEX at the AIoT Korea from October 30 to November 1 2024.
Key word：
Release time：2024-12-13 10:55 reading：861 Continue reading>>
simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization
Trade news

simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization

　　Under the theme "Future First," as we all know, 5G-Advanced is the next step in the evolution of cellular technologies, enabling advanced use cases for various verticals such as government and security, transportation, oil and gas, airlines and logistics, and healthcare to realize the full potential of 5G.　　As a hallmark technology of 5G evolution, RedCap has garnered extensive attention from the industry since its inception during MWC Shanghai. 5G RedCap offers advantages such as lowering the complexity, cost, size, and power consumption of 5G products. This not only fills the middle ground of 5G capabilities but also opens a new avenue for 5G to empower various industries.　　At MWC Shanghai, SIMCom aims at 5G ultra-high-speed scenarios and has the 5G module series SIM8270 and SIM8390, providing a maximum speed of over 10Gbps. These modules are suitable for applications that have strict requirements on speed and latency, such as broadband access, video monitoring and industrial control.　　Also, SIMCom has launched the SIM8230 and SIM8230-M2 series RedCap modules based on the Qualcomm platform. The SIM8230 module supports multi-frequency bands for 5G R17 SA, comes with a variety of functional interfaces for external device expansion, and boasts advantages such as lightweight, energy efficiency, compactness, and cost-effectiveness. It can be widely utilized in various domains including 5G CPE, wearable devices, industrial routers, high-definition streaming devices, AR/VR, drones, and remote-controlled robots.　　SIMCom has already fully deployed and accelerated the commercial scale of 5G RedCap. As market recognition of RedCap technology continues to increase, the popularization of 5G will further accelerate. SIMCom is committed to developing more diverse and reliable products based on advanced technology, promoting the large-scale commercialization of technologies like 5G RedCap, and contributing to the digital transformation and development of various industries with 5G technology.
Key word：
Release time：2024-08-27 15:56 reading：856 Continue reading>>

Turn to

/ 32

Popular categories
Semiconductors Circuit Protection Electromechanical Embedded Solutions Connectors, Interconnects Sensors, Transducers Optoelectronics Development Kits Test and Measurement Power Fans, Thermal Management Boxes, Enclosures, Racks Cables, Wires Passive Components Others
  • Week of hot material
  • Material in short supply seckilling
model brand Quote
TL431ACLPR Texas Instruments
CDZVT2R20B ROHM Semiconductor
RB751G-40T2R ROHM Semiconductor
MC33074DR2G onsemi
BD71847AMWV-E2 ROHM Semiconductor
model brand To snap up
ESR03EZPJ151 ROHM Semiconductor
BU33JA2MNVX-CTL ROHM Semiconductor
TPS63050YFFR Texas Instruments
BP3621 ROHM Semiconductor
IPZ40N04S5L4R8ATMA1 Infineon Technologies
STM32F429IGT6 STMicroelectronics
Hot labels
ROHM
IC
Averlogic
Intel
Samsung
IoT
AI
Sensor
Chip
Original authorized brand
More Licensed Brands>>
Information leaderboard
  • Week of ranking
  • Month ranking

About us

Qr code of ameya360 official account

Identify TWO-DIMENSIONAL code, you can pay attention to

AMEYA360 mall (www.ameya360.com) was launched in 2011. Now there are more than 3,500 high-quality suppliers, including 6 million product model data, and more than 1 million component stocks for purchase. Products cover MCU+ memory + power chip +IGBT+MOS tube + op amp + RF Bluetooth + sensor + resistor capacitance inductor + connector and other fields. main business of platform covers spot sales of electronic components, BOM distribution and product supporting materials, providing one-stop purchasing and sales services for our customers.

Please enter the verification code in the image below：

verification code