ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs
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ROHM Develops New High Power Density SiC Power Modules Compact high heat dissipation design sets a new standard for OBCs

　　ROHM has developed the new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles). The lineup includes six models rated at 750V (BSTxxx1P4K01) and seven products rated at 1200V (BSTxxx2P4K01). All basic circuits required for power conversion in various high-power applications are integrated into a compact module package, reducing the design workload for manufacturers and enabling the miniaturization of power conversion circuits in OBCs and other applications.　　In recent years, the rapid electrification of cars is driving efforts to achieve a decarbonized society. Electric vehicles are seeing higher battery voltages to extend the cruising range and improve charging speed, creating a demand for higher output from OBCs and DC-DC converters. At the same time, there is an increasing need in the market for greater miniaturization and lighter weight for these applications, requiring technological breakthroughs to improve power density - a key factor - while enhancing heat dissipation characteristics that could otherwise hinder progress. ROHM’s HSDIP20 package addresses these technical challenges that were previously becoming difficult to overcome with discrete configurations, contributing to both higher output and the downsizing of electric powertrains.　　The HSDIP20 features an insulating substrate with excellent heat dissipation properties that suppresses the chip temperature rise even during high power operation. When comparing a typical OBC PFC circuit utilizing six discrete SiC MOSFETs with top-side heat dissipation to ROHM’s 6-in-1 module under the same conditions, the HSDIP20 package was verified to be approx. 38°C cooler (at 25W operation). This high heat dissipation performance supports high currents even in a compact package, achieving industry-leading power density more than three times higher than top-side cooled discretes and over 1.4 times that of similar DIP type modules. As a result, in the PFC circuit mentioned above, the HSDIP20 can reduce mounting area by approx. 52% compared to top-side cooled discrete configurations, greatly contributing to the miniaturization of power conversion circuits in applications such as OBCs.　　Going forward, ROHM will continue to advance the development of SiC modules that balance miniaturization with high efficiency while also focusing on the development of automotive SiC IPMs that provide higher reliability in a smaller form factor.　　Product Lineup　　*1: Tc=25°C VGS=18V *2: Combines chips with different ON resistances　　*3: Q1, Q4 pins *4: Q2, Q3, Q5, Q6 pins　　Application Examples　　Power conversion circuits like PFC and LLC converters are commonly used in the primary side circuits of industrial equipment, allowing the HSDIP20 to also contribute to the miniaturization of applications in both the industrial and consumer electronics fields.　　◇ Automotive systems　　Onboard chargers, electric compressors and more.　　◇ Industrial equipment　　EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.　　Sales Information　　Pricing: $100/unit (samples, excluding tax)　　Availability: OEM quantities (April 2025)　　Supporting Information　　ROHM is committed to providing application-level support, including the use of in-house motor testing equipment. A variety of supporting materials are also offered such as simulations and thermal designs that enable quick evaluation and adoption of HSDIP20 products. Two evaluation kits are available as well, one for double-pulse testing and the other for 3-phase full bridge applications, enabling evaluation under close to actual circuit conditions.　　For more information, please contact AMEYA360 or visit the contact page on ROHM’s website.　　EcoSiC™ Brand　　EcoSiC™ is a brand of devices that utilize silicon carbide, which is attracting attention in the power device field for performance that surpasses silicon. ROHM independently develops technologies essential for the advancement of SiC, from wafer fabrication and production processes to packaging, and quality control methods. At the same time, we have established an integrated production system throughout the manufacturing process, solidifying our position as a leading SiC supplier.　　・EcoSIC™ is a trademark or registered trademark of ROHM Co., Ltd.　　Terminology　　Power Factor Correction (PFC)　　A circuit that enhances the power factor by shaping the waveform of input power in the power supply circuit. By using a PFC circuit, the input power is made closer to a sine wave (power factor = 1), improving power conversion efficiency. While PFC circuits typically rely on diode rectification, OBCs often employ active bridge rectification using MOSFETs or bridgeless PFC. This approach is favored because MOSFETs offer lower switching losses, and especially in high power PFCs, using SiC MOSFETs reduces heat generation and power losses.　　LLC Converter　　A type of resonant DC-DC converter known for its high efficiency with low noise power conversion. The name LLC comes from its basic configuration, which combines two inductors (L) and a capacitor (C) in the circuit. By forming a resonant circuit, switching losses are significantly reduced, making it ideal for applications requiring high efficiency, such as OBCs, power supplies for industrial equipment, and server power supplies.
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Release time：2025-04-24 17:23 reading：214 Continue reading>>
GigaDevice's GD5F1GM9 Series High-Speed QSPI NAND Flash Sets New Benchmark with Breakthrough Read Speeds for Accelerated Application Startup
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GigaDevice's GD5F1GM9 Series High-Speed QSPI NAND Flash Sets New Benchmark with Breakthrough Read Speeds for Accelerated Application Startup

　　GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announces the launch of its GD5F1GM9 high-speed QSPI NAND Flash, which features breakthrough read speeds and innovative Bad Block Management (BBM) functionality.　　The GD5F1GM9 series combines the high-speed read performance of NOR Flash with the large capacity and cost-effectiveness of NAND Flash. These innovations address key industry challenges of slow response times and vulnerability to bad block interference associated with traditional SPI NAND Flash. The GD51GM9 launch will open new growth opportunities for SPI NAND Flash, making it the ideal choice for fast-boot applications in sectors such as security, industrial, and IoT.　　The GD5F1GM9 series high-speed QSPI NAND Flash is built on a 24nm process node. The series supports both 3V and 1.8V operating voltages as well as high-speed read modes including Continuous Read, Cache Read, and Auto Load Next Page. Continuous Read and Auto Load Next Page modes are newer read features added on this series, offering users versatile read options to further accelerate code and data fetch. These read modes utilize the new parallel computation approach for its ECC (Error Correction Code) design, replacing the previous serial computation method. This innovation significantly reduces the calculation time for the built-in ECC.　　The 3V version of the series achieves a continuous read rate of up to 83MB/s in Continuous Read mode, operating at a maximum clock frequency of 166MHz. The 1.8V version has a continuous read rate of up to 66MB/s and supports a maximum clock frequency of 133MHz. The results in GD5F1GM9’s read speeds are up to 3 times faster than traditional SPI NAND products at the same frequency. These design advantages improve data access throughput, reduce system boot time, and lower overall system power consumption.　　As bad blocks from the factory are inherent issues in NAND Flash, the GD5F1GM9 incorporates an on-chip Advanced Bad Block Management (BBM) to ensure comprehensive functionality of Continuous Read mode. Continuous Read allows read access of the full memory array with a single Read command in aid of the executed BBM that link bad block addresses to good block addresses. Read access will then automatically skip the bad block due to the established link access to the remap and linked good physical block address.　　From the factory, the GD5F1GM9 series guarantees the first 256 blocks are good blocks. While there will be bad blocks from the factory and possible new bad blocks may arise during usage that needs to be managed, the BBM feature can create a logical block address to the physical block address link, allowing users to swap and replace bad blocks and the associated access will be on a good block once the BBM link is setup.　　The device can support up to 20 Look Up Table BBM Links to further compliment Continuous Read mode functionality. This not only significantly improves resource utilization but also simplifies system design.　　“Currently, the generally slow read speed of SPI NAND Flash has become a major bottleneck in enhancing boot performance of key applications,” said Ruwei Su, GigaDevice vice president and general manager of Flash BU, "The launch of GD5F1GM9 series high-speed QSPI NAND Flash sets a new performance benchmark in the market. This series effectively addresses the read speed limitations of traditional SPI NAND Flash and offers a new solution for bad block management, making it an ideal alternative for NOR Flash users with growing capacity needs. In the future, GigaDevice will continue to refine its underlying technologies to provide customers with more efficient and reliable storage solutions."　　The GD5F1GM9 series offers 1Gb capacity with 3V/1.8V voltage options and supports WSON8 8x6mm, WSON8 6x5mm, and BGA24 (5×5 ball array) 5x5 ball package options. For detailed information and product pricing, please contact your local sales representative.　　About GigaDevice　　GigaDevice Semiconductor Inc. (SSE Stock Code 603986) is a global leading fabless supplier. The company was founded in April 2005 and headquartered in Beijing, China, with branch offices in many countries and regions worldwide, providing local support at customers' fingertips. Committed to building a complete ecosystem with four major product lines – Flash memory, MCU, sensor and analog – as the core driving force, GigaDevice can provide a wide range of solutions and services in the fields of industrial, automotive, computing, consumer electronics, IoT, mobile, networking and communications. GigaDevice has received the ISO26262:2018 automotive functional safety ASIL D certification, IEC 61508 functional safety product certification, as well as ISO9001, ISO14001, ISO45001, and Duns certifications. In a constant quest to expand our technology offering to customers, GigaDevice has also formed strategic alliances with leading foundries, assembly, and test plants to streamline supply chain management. For more details, please visit: www.gigadevice.com　　*GigaDevice and their logos are trademarks, or registered trademarks of GigaDevice Semiconductor Inc. Other names and brands are the property of their respective owners.
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Release time：2025-04-23 17:09 reading：230 Continue reading>>
BIWIN Spec Industrial-Grade Wide-Temperature eMMC Wins the Industrial Core
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BIWIN Spec Industrial-Grade Wide-Temperature eMMC Wins the Industrial Core "New Quality" Award

　　Recently, the results of the 23rd Chinese Automation & Digitalization "New Quality Award" selection, hosted by gongkong®, were officially announced. BIWIN Spec, the industrial and automotive-grade storage brand under BIWIN, clinched the Industrial Core "New Quality" Award for its innovatively developed Industrial-Grade Wide-Temperature eMMC storage solution.　　Backed by BIWIN’s technological expertise and competitive advantages in embedded storage sector, the award-winning TGE208/TGE218 series industrial-grade eMMCs are featured with industrial-grade controllers and NAND Flash, along with proprietary firmware architectures and in-house advanced packaging/testing and manufacturing processes, delivering exceptional performance, ultimate stability, and industrial-grade reliability.　　Furthermore, the products are certified with over 200 rigorous validation tests through BIWIN’s automatic testing system, and also passed the HTOL and ELFR tests under JEDEC standards. Designed for consistent and stable operation in extreme environments, the products are widely applicable across diverse industrial scenarios, including smart security surveillance, data communication, industrial automation, rail transportation, smart power systems, smart healthcare, and IoT terminals.　　In terms of technical specifications, the products strictly follow the eMMC5.1 standards, support the HS400 high speed mode (with data transfer rates up to 400MB/s), and deliver outstanding performance under industrial wide-temperature conditions ranging from -40℃ to +85℃. In addition, the pSLC firmware technical support is also enabled to enhance the capability for data retention, so as to meet the high-frequency read/write needs in industrial scenarios.　　With aims to satisfy the 24/7 uninterrupted operation requirements of industrial equipment, the BIWIN eMMCs are also specifically built with five intelligent management functionalities: the Field Firmware Upgrade (FFU) for remote maintenance, Boot Partition for secure system loading, Replay Protected Memory Block (RPMB) for enhanced data security, idle data acceleration for optimized storage efficiency, and a health monitoring system equipped. Customers can monitor the storage unit’s operational status in real time through a customized interface and dynamically optimize adjustments based on specific application scenarios.　　BIWIN has established stable and close partnerships with supply chain collaborators, providing customers with reliable supply assurances and comprehensive after-sales support throughout the product lifecycle. With years of technical R&D accumulation and an intelligent production and testing system, combined with tiered BOM (Bill of Materials) control and manufacturing process management, the products achieve higher reliability and sustained operational stability.
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Release time：2025-04-07 13:20 reading：321 Continue reading>>
ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory
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ROHM Apollo Yukuhashi Plant received the Japan Greenery Research and Development Center Chairperson's Award at National Award for Greenery Factory

　　ROHM Apollo Co., Ltd. (Headquarters: Fukuoka Prefecture, hereafter ROHM Apollo) Yukuhashi Plant received “the Japan Greenery Research and Development Center Chairperson's Award“ in the 2024 Factory Greening Award Program (commonly called the National Green Factory Award) sponsored by the Ministry of Economy, Trade and Industry, and at the award ceremony held on January 22, Yukuhashi Plant was awarded the certificate of commendation.　　Toshiyuki Hashimoto, General Manager, LSI Engineering Department, ROHM Apollo Yukuhashi Plant(left)　　Masatoshi Kaku, Chairperson, Japan Greenery Research and Development Center(right)　　The Awards Program has been organized annually since 1982, sponsored by the Ministry of Economy, Trade and Industry and operated by the Japan Greenery Research and Development Center, with the aim of further promoting factory greening. The Awards program recognizes factories, organizations, and individuals for their outstanding achievements in promoting factory greening and improving the environment inside and outside their factories.　　Yukuhashi Plant has been focusing on the creation of a “greenery factory” that takes the ecosystem into consideration and was recognized for the maintenance of cherry blossom trees along the road on the plant premises and the completion of a vast green space and a multipurpose ground on the site in 2023. This is the first time that a plant which is based on Yukuhashi City has received this award.　　In ROHM Group, The ROHM Head Office and Plant received the “Japan Greenery Research and Development Center Chairperson's Award” in 2021 and “Kinki Bureau of Economy, Trade and Industry Director General's Award” in 2022.　　ROHM Group formulated “Environmental Vision 2050” in April 2021. Based on its three themes - “Climate change," "Resource recycling," and "Coexistence with nature", we aim to achieve Net Zero greenhouse gas emissions by 2050 and conduct business activities in harmony with the natural cycle to protect biodiversity. Based on our company mission of "contribute to the advancement and progress of culture" and our Environmental Vision, we will continue to work to conserve the environment and biodiversity toward the realization of a sustainable society while promoting sound cooperation with society by contributing to the local environment and appropriately disclosing environmental information.
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Release time：2025-03-24 11:32 reading：291 Continue reading>>
Exploring Infrared Sensors: Types, Applications, and Principle
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Exploring Infrared Sensors: Types, Applications, and Principle

　　In the realm of modern technology, infrared (IR) sensors stand out as versatile and essential components across a wide array of applications. These sensors leverage the infrared part of the electromagnetic spectrum to detect and measure infrared radiation, which can be indicative of heat, motion, and various other parameters. This article delves into the fundamentals of Infrared Sensors, and their diverse applications.　　What is an infrared sensor ?Infrared sensors detect radiation in the infrared spectrum, which ranges from about 750 nanometers (nm) to 1 millimeter (mm). Unlike visible light, infrared radiation is not visible to the human eye but can be felt as heat. IR sensors convert this radiation into an electrical signal that can be processed and interpreted by electronic systems.　　How many types of IR sensors are there?1. Active Infrared Sensors: These sensors emit their own infrared light and detect the reflected light. They are commonly used in proximity sensors and certain types of motion detectors. An example is the IR LED and photodiode pair, which measures changes in the reflected light to determine the presence of objects.　　2. Passive Infrared Sensors (PIR): Unlike active sensors, PIR sensors do not emit any radiation. Instead, they detect the infrared radiation naturally emitted by objects. PIR sensors are widely used in motion detection applications, such as security systems and automatic lighting.　　What is the purpose of the IR sensor?IR sensors serve various purposes across multiple applications. Here are some common uses:　　1. Proximity Detection　　– Used in devices like automatic doors, smartphones, and vehicles to detect nearby objects without physical contact.　　2. Motion Detection　　– Common in security systems and alarms (e.g., PIR sensors) to sense movement in a defined area.　　3. Temperature Measurement　　– Employed in non-contact thermometers to measure the temperature of objects or bodies from a distance.　　4. Remote Controls　　– Found in TVs, air conditioners, and other electronics to facilitate wireless communication with remote controls.　　5. Obstacle Avoidance　　– Used in robotics and drones to navigate and avoid collisions by detecting nearby objects.　　6. Gas Detection　　– Some IR sensors can detect specific gases based on their absorption of infrared light, useful in industrial applications.　　7. Night Vision and Thermal Imaging　　– Used in military, security, and surveillance applications to detect heat signatures in low-light conditions.　　8. Data Transmission　　– In certain applications, IR can be used for wireless data transfer over short distances.　　What is an infrared sensor used for?Infrared sensors have a broad range of applications, benefiting various industries from consumer electronics to healthcare. Here are some notable examples:　　1. Consumer Electronics:　　– Remote Controls: IR sensors are integral to remote control devices for televisions, air conditioners, and other home appliances. They receive signals from the remote control unit to perform the desired function.　　– Smartphones and Tablets: Some devices use IR sensors for facial recognition, which helps in unlocking screens and enhancing security.　　2. Healthcare:　　– Thermography: Infrared thermography is used for non-invasive temperature measurement, allowing for early detection of fevers and other medical conditions. It’s particularly valuable in monitoring patients’ health and in diagnosing conditions based on temperature anomalies.　　– Vital Sign Monitoring: IR sensors can be used in wearable devices to monitor vital signs such as heart rate and blood oxygen levels.　　3. Automotive Industry:　　– Collision Avoidance Systems: IR sensors help in detecting obstacles and monitoring the surrounding environment to prevent accidents. They are used in parking assist systems and adaptive cruise control.　　– Night Vision: Some high-end vehicles are equipped with IR sensors to enhance visibility during night driving by detecting pedestrians and animals on the road.　　4. Industrial Automation:　　– Temperature Measurement: In manufacturing processes, IR sensors are employed to monitor the temperature of machinery and products to ensure they remain within safe and optimal limits.　　– Quality Control: These sensors are used to inspect products for defects and irregularities by detecting variations in thermal emission.　　5. Environmental Monitoring:　　– Gas Detection: IR sensors can detect the presence and concentration of specific gases in the atmosphere by measuring their absorption of infrared light. This is crucial for monitoring air quality and ensuring safety in industrial environments.　　What is the principle of IR sensor?The principle of an infrared (IR) sensor is based on the detection and measurement of infrared radiation, which is electromagnetic radiation with wavelengths longer than visible light. The core principle involves capturing the infrared radiation emitted or reflected by objects and converting it into an electrical signal that can be analyzed. Here’s a detailed breakdown of how IR sensors work:　　1. Emission and Detection of Infrared Radiation　　Infrared Radiation Basics:　　– Infrared radiation is part of the electromagnetic spectrum with wavelengths ranging from approximately 750 nanometers (nm) to 1 millimeter (mm), just beyond the visible light spectrum.　　– All objects emit infrared radiation as a function of their temperature. Hotter objects emit more infrared radiation compared to cooler ones.　　Detection Principle:　　– Active IR Sensors: These sensors emit their own infrared light (often using an IR LED) and then measure the amount of this light that is reflected back from objects in their environment. The detected signal changes based on the distance, size, and properties of the object, allowing the sensor to infer its presence, distance, or other characteristics.　　– Passive IR Sensors (PIR): These sensors do not emit any radiation. Instead, they detect the infrared radiation naturally emitted by objects in their field of view. They typically use a sensor element that responds to changes in infrared radiation, such as a pyroelectric detector or a thermopile.　　2. Conversion of Infrared Radiation to Electrical Signal　　Pyroelectric Detectors:　　– Pyroelectric sensors contain materials that generate an electrical charge when exposed to infrared radiation. This charge is proportional to the amount of infrared radiation detected.　　– The sensor detects changes in temperature caused by infrared radiation, converting these changes into an electrical signal.　　Thermopiles:　　– A thermopile consists of multiple thermocouples connected in series or parallel. It measures the temperature difference between the heated element exposed to infrared radiation and a reference element.　　– This temperature difference generates a voltage, which is then measured and converted into an output signal.　　Photodetectors:　　– Some IR sensors use photodetectors (such as photodiodes or phototransistors) sensitive to infrared light. These detectors convert the incident infrared light into an electrical current proportional to the light intensity.　　3. Signal Processing　　Once the infrared radiation is converted into an electrical signal, the output is typically processed and analyzed by the sensor’s electronics. This may involve amplification, filtering, and digitization of the signal. The processed signal can then be used to trigger actions or provide readings depending on the application. For example:　　– In motion detectors, the sensor might trigger an alarm if it detects significant changes in infrared radiation indicating movement.　　– In temperature measurement systems, the signal is used to provide accurate temperature readings or to monitor thermal conditions.　　How do I choose an IR sensor?Choosing an infrared (IR) sensor depends on several factors related to your application. Here’s a quick guide to help you make the right choice:　　1. Type of IR Sensor　　– Active IR Sensors: Emit IR light and measure reflections (e.g., proximity sensors).　　– Passive IR Sensors: Detect IR radiation from objects (e.g., PIR sensors for motion detection).　　2. Detection Range　　– Consider the distance over which you need to detect objects. Check the specifications for range and field of view.　　3. Sensitivity　　– Look for specifications on sensitivity, which determines how small a change in IR radiation the sensor can detect.　　4. Environmental Conditions　　– Ensure the sensor can operate in the conditions it will face (temperature, humidity, dust, etc.).　　5. Response Time　　– Consider how quickly the sensor needs to respond. This is crucial for applications like motion detection.　　6. Output Type　　– Decide whether you need digital output (on/off) or analog output (variable signal) based on how you’ll process the sensor data.　　7. Power Consumption　　– Look for power-efficient models if you’re running on batteries or need to minimize energy use.　　8. Size and Form Factor　　– Ensure the physical size and mounting options fit your project requirements.　　9. Cost　　– Determine your budget, as prices can vary widely based on features and capabilities.　　10. Manufacturer Support　　– Choose brands or suppliers that provide good documentation and support.　　How far can IR sensors detect?The detection range of IR sensors can vary significantly based on the type of sensor and its design:　　1. Active IR Sensors　　– Proximity Sensors: Typically have a range of a few centimeters to a few meters (around 0.1 to 5 meters) depending on the sensor’s power and environment.　　– IR Range Finders: Can detect distances up to 10-20 meters or more, depending on the model and application.　　2. Passive IR Sensors (PIR)　　– Commonly used for motion detection in security systems, these sensors usually have a range of about 5 to 12 meters (16 to 40 feet). The actual range can be influenced by factors such as the angle of detection and the presence of obstacles.　　3. IR Cameras and Thermal Sensors　　– These devices can detect heat signatures at much greater distances, often exceeding 100 meters, depending on the resolution and the environment.　　Factors Influencing Range　　– Sensitivity: Higher sensitivity allows for detection at greater distances.　　– Environmental Conditions: Obstructions, temperature, and humidity can affect performance.　　– Field of View: A wider field of view may reduce the effective detection range.　　ConclusionInfrared sensors are indispensable components in modern technology, offering critical functionalities across various fields. From enhancing consumer electronics to advancing healthcare and industrial automation, their applications are both diverse and impactful. As technological advancements continue to push the boundaries of what is possible, IR sensors are poised to become even more integral to our everyday lives, driving innovations and efficiencies across multiple sectors. Understanding their technology and applications provides valuable insights into how these sensors are shaping the future of technology and industry.
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Release time：2025-03-21 13:17 reading：276 Continue reading>>
SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications
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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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Release time：2025-03-20 13:58 reading：247 Continue reading>>
MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities
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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
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Release time：2025-03-20 13:55 reading：277 Continue reading>>
ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year
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ROHM included in S&P Global's Sustainability Yearbook 2025 as Sustainability Yearbook Member for the second consecutive year

　　ROHM Co., Ltd. was included for the second year in a row in the Sustainability Yearbook 2025, published by S&P Global on February 11, 2025, as a Sustainability Yearbook Member, one of the top 15% companies in the Semiconductor & Semiconductor Equipment industry.　　S&P Global annually evaluates the sustainability efforts of the world's leading companies from governance & economic, environmental, and social perspectives based on its proprietary Corporate Sustainability Assessment (CSA) methodology and selects companies with outstanding sustainability efforts in each industry for inclusion in the Sustainability Yearbook.　　This year, more than 7,690 companies worldwide from 60 industries were evaluated, and 780 companies (including 80 Japanese companies) were selected for this year's Yearbook.　　Encouraged by the results of this year's evaluation, ROHM will continue to promote sustainability activities and address social issues to create a sustainable society, aiming to be a company that meets the expectations of our stakeholders.
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Release time：2025-03-20 10:11 reading：324 Continue reading>>
SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules
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SGP.32 remote provisioning firmware being added to all SIMCom LTE Cat 1 bis IoT modules

　　SIMCom, a leading provider ofcellular wireless modules and solutions for IoT and M2M applications, has announced that all its range of Cat 1 bis IoT modules are now being prepared with the firmware necessary to support SGP.32 functionality, facilitating simple remote provisioning of IoT modules. Developed by the GSMA, the SGP.32 standard enables connectivity with IoT devices without the need for physical SIM cards or other user interfaces.　　Comments Mads Fischer, European Sales Director. SIMCom: “ SGP.32 allows IoT devices that have no displays, buttons or SIM cards to be deployed and updated. Cat 1 bis has been rolled out globally, so by implementing SGP.32 firmware in our Cat 1 bis modules, we are enabling IoT network designers to easily and seamlessly operate their systems remotely and securely using an eSIM only.”　　SIMCom's key LTE Cat 1 bis modules that have integrated SGP.32 firmware include the A7672 series, SIM7672 series, and A7683E. These modules offer strong connectivity, global certification compliance, and enhanced power efficiency, making them ideal for various IoT applications.　　Based on the ASR1603 platform, the A7672 series supports LTE-FDD, LTE-TDD, GSM, GPRS, and EDGE communication modes. With a comprehensive certification portfolio—including RoHS, REACH, CE-RED, RCM, FCC, Anatel, and Deutsche Telekom—this series ensures compliance with global regulations, facilitating smooth deployment across international markets.　　Powered by the QCX216 chipset, the SIM7672 series supports LTE-FDD and LTE-TDD communication. It boasts a wide range of certifications, including CE-RED, RoHS, REACH, FCC, TELEC, JATE, GCF, PTCRB, IC, KC, CCC, AT&T, and T-Mobile, ensuring reliability in diverse regions. A key feature of the SIM7672 series is its support for 3GPP Rel-14 Power Saving Mode (PSM), which allows power consumption to drop as low as 3µA in PSM mode, making it an excellent choice for battery-sensitive applications. The A7683E module is designed for LTE-FDD applications and carries certifications such as RoHS, REACH, CE-RED, and Anatel. All three modules offering a 10Mbps(maximum)downlink rate and 5Mbps uplink rate.　　Available in theLCC+LGA form factor,A7672 series and SIM7672 series are compatible with SIMComNB/Cat Mand/or2G modules,enabling a smooth migration to LTE Cat 1 products,enabling end-product scalability and upgradability. Modules alsosupport both multiple built-in network protocols and the drivers for main operation systems (USB driver for Windows, Linux and Android).The inclusion of industrial standard interfaces such as UART, USB, I2C and GPIO suit the modules for IoT applications such as telematics, POS, surveillance devices, industrial routers, and remote diagnostics etc.　　SIMCom's A7672 series, SIM7672 series, and A7683E modules, powered by SGP.32 firmware, provide a cost-effective and scalable solution for large-scale IoT deployments, particularly in metering and tracking, by enabling remote SIM provisioning that eliminates the need for physical SIM insertion—thereby reducing costs and simplifying deployment in remote locations. With global certifications and ultra-low power consumption, these modules deliver reliable, energy-efficient performance and long-term deployment stability, making them the ideal choice for massive IoT applications due to their flexibility and efficiency.
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Release time：2025-03-18 16:38 reading：318 Continue reading>>
ROHM Develops a 1kW Class High Power Infrared Laser Diode
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ROHM Develops a 1kW Class High Power Infrared Laser Diode

　　ROHM has developed a high output laser diode - RLD8BQAB3 - for use in ADAS (Advanced Driver Assistance Systems) equipped with LiDAR for distance measurement and spatial recognition. ROHM will initially start supplying samples targeting consumer and industrial applications such as drones, robot vacuum cleaners, AGVs (Automated Guided Vehicles), and service robots.　　LiDAR is seeing growing adoption in recent years across a variety of applications that require automation such as automotive ADAS, AGVs, drones, and robot vacuums, facilitating precise distance measurement and spatial recognition. To detect information at greater distances with more accuracy, there is a need for laser diodes that serve as light sources to achieve high kW-level output while allowing multiple light sources to emit light at close intervals.　　ROHM has established proprietary patented technology that achieves the narrow emission width of lasers, enhancing the long-distance, high accuracy LiDAR, beginning with the commercialization of the 25W output RLD90QZW5 in 2019 and high-power 120W RLD90QZW8 in 2023. Building on these successes, we have developed a new 125W 8ch (1kW class) array-type product that meets the demand for a high output, high performance laser diode.　　The RLD8BQAB3 is an ultra-compact surface mount high-output 125W × 8ch infrared laser diode for LiDAR applications that utilize 3D ToF systems to carry out distance measurement and spatial recognition. The optimized design features 8 emission areas (each 300µm wide) per element, installed on a submount affixed to a high heat dissipation substrate.　　The package’s emitting surface incorporates a clear glass cap - an industry first for a surface mount laser diode - eliminating the risk of light scattering caused by scratches during dicing that tends to occur with resin-encapsulated products, ensuring high beam quality. Each emission area is wired with a common cathode, enabling the selection of the irradiation method based on application needs - ranging from individual emission that increases the number of light-emitting points to industry-leading* simultaneous emission at ultra-high outputs of 1kW class.　　The new product retains the key features of ROHM’s conventional laser diodes, including uniform emission intensity across the emission width along with a low wavelength temperature dependence of 0.1nm/°C (vs 0.26 to 0.28nm/°C for standard products). On top, the array configuration narrows the regions of reduced emission intensity between channels, while the bandpass filter minimizes the effects of ambient light noise from the sun and other sources, contributing to long-distance detection and high-definition LiDAR.　　Samples are available since August 2024 (please contact a sales representative or visit the contact page on ROHM’s website).　　Application Examples        Automotive: ADAS　　Consumer: Drones, robot vacuums, golf rangefinders, and more　　Industrial: AGVs, service robots, 3D monitoring systems (sensors for human/object detection), etc.　　Terminology        LiDAR　　Short for Light Detection and Ranging, an application that uses the ToF (Time of Flight) system (comprised of a light source and ToF or image sensor) to sense ambient conditions.　　3D ToF System　　An abbreviation for Time of Flight, a spatial measurement system which, as its name implies, measures the flight time of a light source. Refers to a system that uses ToF to perform 3D spatial recognition and distance measurement.　　Submount　　A small, flat mounting plate made from a material with high thermal conductivity.　　Bandpass Filter　　A filter that allows only signals in a specific light wavelength band to pass through. In optical devices, a narrow bandpass filter range allows for efficient extraction of light close to the peak waveform. This minimizes the effects of ambient noise such as sunlight, enabling lower power consumption at the same distance or longer range at the same optical output.　　IATF 16949　　IATF is the short for International Automotive Task Force, a quality management standard for the automotive industry. Based on the international standard ISO 9001 with additional specific requirements, compliance with IATF 16949 enables automakers and suppliers to meet international quality standards.　　AEC-Q102　　AEC stands for Automotive Electronics Council, an organization (comprised of major automotive manufacturers and US electronic component makers) responsible for establishing reliability standards for automotive electronics. Q102 is a standard specifically intended for optical devices.
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Release time：2025-03-17 13:49 reading：285 Continue reading>>

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