<span style='color:red'>MWC</span> 2026 | Fibocom Unveils AI ECR Solution, Ushering in a New Era of Smart Retail
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MWC 2026 | Fibocom Unveils AI ECR Solution, Ushering in a New Era of Smart Retail

　　At MWC 2026, Fibocom introduced its next-generation AI Electronic Cash Register (ECR) solution for automated and smart retail scenarios.　　Powered by MediaTek’s high-performance Genio 520/720 IoT platform, the solution offers exceptional scalability and supports on-device large model integration, enabling global retailers to deliver smarter, faster, and more immersive retail experiences.　　Core Hardware Power: High-Performance Edge AI Computing　　Built on an advanced 6nm octa-core processor, the AI ECR provides strong edge AI computing for both traditional and intelligent retail operations.　　Equipped with 2× Cortex-A78 (@2.2GHz) and 6× Cortex-A55 (@2.0GHz) cores plus an NPU 850 delivering up to 10 TOPS, it supports local large language models for voice interaction, inventory forecasting, and visual recognition — minimizing cloud reliance while ensuring faster response and data privacy.　　Immersive Visual & Seamless Connectivity　　The platform supports a 15.6-inch 2K display with 2D/3D acceleration and can drive 4K/5K ultra-HD screens, ideal for digital signage.　　To meet diverse retail needs, it integrates dual-camera input (MIPI CSI + USB) for facial payment and behavior analysis, plus multiple I/O ports (USB-A/C, HDMI, RJ45, RJ12, audio) for peripherals.　　Built-in Wi-Fi 6 (1×1) and Bluetooth 5.3 ensure high-speed, stable wireless connections.　　Powered by Android 15: Secure and Future-Ready　　Among the first to run Android 15, the solution provides an open, secure ecosystem with enhanced multitasking, memory management, and system-level protection—ensuring smooth, long-term performance for industrial and consumer-grade applications.　　“We look forward to continuing our collaboration with Fibocom, leveraging the MediaTek Genio platform to deliver powerful edge AI performance with on-device large model support,” said CK Wang, Vice President and General Manager of MediaTek IoT. “This solution demonstrates our shared commitment to advancing smart retail and helping businesses become more competitive and efficient.”　　Ralph Zhao, General Manager of Mobile Computing Solutions BU at Fibocom, stated:　　“As the retail industry accelerates toward automation and intelligence, edge AI computing has become the key to improving user experience. Fibocom’s new AI ECR solution represents a breakthrough in hardware design and enables large-model applications at the point of sale with 10 TOPS of processing power — empowering partners to build more competitive and intelligent retail solutions.”
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Release time：2026-03-10 16:24 reading：351 Continue reading>>
<span style='color:red'>MWC</span> 2026 | Fibocom and du’s ALL-IN-ONE AI CPE Solution Reinvents Family Data Interaction with AI NAS
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MWC 2026 | Fibocom and du’s ALL-IN-ONE AI CPE Solution Reinvents Family Data Interaction with AI NAS

　　On March 5 at the 2026 Mobile World Congress (MWC), Fibocom and du showcased the upgraded ALL-IN-ONE AI CPE solution featuring an enhanced AI NAS, further integrating 5G, AI and real-life scenarios. The upgrade transforms home storage from passive data retention into active intelligent management, delivering more personalized smart home experiences.　　Fibocom first introduced the ALL-IN-ONE AI CPE at NetworkX in France in October 2025, redefining the traditional 5G CPE form factor. The device integrates intelligent voice interaction, human and environmental sensing, and leverages Fibocom’s proprietary FWA AI SkyEngine to enable multi-scenario applications including smart home network management, home security, and smart home control.　　du positions AI-powered 5G CPE as a key enabler of premium fixed wireless access (FWA) services across residential, SME and enterprise markets in the UAE. By emphasizing intelligent self-optimization, ultra-low latency, high reliability and simplified deployment, du aims to deliver consistent gigabit connectivity while supporting cloud services, gaming and smart digital experiences.　　The latest upgrade significantly enhances home data management. Powered by SkyEngine computing capabilities, the built-in AI NAS allows users to quickly locate photos by entering keywords, eliminating the need to manually search large file libraries. The system can also detect duplicate photos and notify users to free up storage space efficiently.　　Natural voice interaction further simplifies the experience. Users can search content through voice commands, such as requesting “family photos from last summer at the beach,” while the AI NAS automatically categorizes photos by location, time, people and themes to generate personalized digital albums.　　All photo recognition and retrieval are processed locally through edge AI to ensure privacy and data security, supported by a physical privacy switch. The CPE also supports HDMI output, allowing users to display photos on larger screens via voice commands, enhancing shared family experiences.　　By integrating AI NAS, intelligent interaction and network optimization, the ALL-IN-ONE AI CPE continues evolving from traditional communication hardware into a full-scenario intelligent home hub, helping operators accelerate the shift toward platform-based services in the 5G FWA ecosystem.
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Release time：2026-03-10 16:21 reading：391 Continue reading>>
<span style='color:red'>MWC</span> Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities
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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
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Release time：2025-03-20 13:55 reading：1103 Continue reading>>
simcom：<span style='color:red'>MWC</span> Shanghai 2024: A New Avenue for 5G Popularization
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simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization

　　Under the theme "Future First," as we all know, 5G-Advanced is the next step in the evolution of cellular technologies, enabling advanced use cases for various verticals such as government and security, transportation, oil and gas, airlines and logistics, and healthcare to realize the full potential of 5G.　　As a hallmark technology of 5G evolution, RedCap has garnered extensive attention from the industry since its inception during MWC Shanghai. 5G RedCap offers advantages such as lowering the complexity, cost, size, and power consumption of 5G products. This not only fills the middle ground of 5G capabilities but also opens a new avenue for 5G to empower various industries.　　At MWC Shanghai, SIMCom aims at 5G ultra-high-speed scenarios and has the 5G module series SIM8270 and SIM8390, providing a maximum speed of over 10Gbps. These modules are suitable for applications that have strict requirements on speed and latency, such as broadband access, video monitoring and industrial control.　　Also, SIMCom has launched the SIM8230 and SIM8230-M2 series RedCap modules based on the Qualcomm platform. The SIM8230 module supports multi-frequency bands for 5G R17 SA, comes with a variety of functional interfaces for external device expansion, and boasts advantages such as lightweight, energy efficiency, compactness, and cost-effectiveness. It can be widely utilized in various domains including 5G CPE, wearable devices, industrial routers, high-definition streaming devices, AR/VR, drones, and remote-controlled robots.　　SIMCom has already fully deployed and accelerated the commercial scale of 5G RedCap. As market recognition of RedCap technology continues to increase, the popularization of 5G will further accelerate. SIMCom is committed to developing more diverse and reliable products based on advanced technology, promoting the large-scale commercialization of technologies like 5G RedCap, and contributing to the digital transformation and development of various industries with 5G technology.
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Release time：2024-08-27 15:56 reading：1400 Continue reading>>
Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at <span style='color:red'>MWC</span> Shanghai 2024
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Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.
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Release time：2024-07-03 13:57 reading：1541 Continue reading>>
Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at <span style='color:red'>MWC</span> Shanghai 2023
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Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

　　During MWC Shanghai 2023, Fibocom introduces the cutting-edge 5G FWA solution embedded with 3GPP Release 17 compliant modules FG190 and FG180, with the advanced and scalable configurations, the solution ensures the smooth escalation of 5G FWA applications towards 10 Gigabits era, especially crucial for CPE and mobile hot-spot use cases.　　a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.　　As 5G technology has improved, mobile broadband service providers are no longer limited to older technologies, mobile data subscriptions associated with mobile phones, dongles or even hot-spot devices are looking for agile and high data throughput network connectivity solutions. The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180. The 5G CPE solution is architected with a set of rich interfaces plus flexible dual-band/tri-band Wi-Fi 7 combinations. For example, an FG190 can simultaneously connect three PCIe and two USXGMII ports, in addition to the Wi-Fi 7 selections, CPE customers can adjust the combinations between QFW7114 and QFW7124 to utilize the band capacity from maximum BE21000 to BE5000. Regarding the wired configurations, either the10GbE+2.5GbE or 2.5GbE+2.5GbE could be the most recommendable and efficient options to unleash the full potential of cable access.　　However, the solution for 5G mobile hot spot offers a range of top-quality wireless performance to mobile scenarios. In the support of a highly integrated WCN7851 chip, the multi-channel options will be utilized efficiently to increase the data rate, depending on the requirements, the dual-band options can be switched to 2.4GHz/5GHz/6GHz to achieve maximum throughput up to BE5800. The seamless Wi-Fi 7 connectivity is also benefiting from the contribution of MLO (Multi-Link Operation) and 4K QAM modulation schemes, offering a highly reliable connectivity service, especially in congested environments like airport terminals, sports venues, and hospitals, etc.　　In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.　　Powered by the Snapdragon® X75 and X72 5G Modem-RF System, Fibocom FG190 and FG180 is compliant with 3GPP Release 17 and equipped with a quad-core A55 CPU to enable a lightning-fast and ultra-reliable 5G network experience. With Snapdragon®X75, Fibocom FG190 supports 5G Sub-6GHz and mmWave dual-connectivity, thus capable of NR 10CA with up to 1000MHz bandwidth in the mmWave spectrum, and NR5CA with up to 300MHz bandwidth in the Sub-6GHz, significantly elevating the maximum downlink speed to 10Gbps. Followed by the FG180, the module integrated with Snapdragon® X72, offers an agile solution for various 5G FWA customers by supporting up to 400MHz bandwidth of NR 4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz. Both FG190 and FG180 are adopting LGA form factors, therefore making both modules the ideal wireless solution for a diversified FWA market.
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Release time：2023-09-12 10:52 reading：3775 Continue reading>>
Fibocom Scales Up the 5G RedCap Module Series at <span style='color:red'>MWC</span> Shanghai 2023 with New FG131 Series Adding to the Portfolio
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Fibocom Scales Up the 5G RedCap Module Series at MWC Shanghai 2023 with New FG131 Series Adding to the Portfolio

　　Fibocom showcases the new 5G RedCap modules portfolio including the new FG131 series and FG132 series at MWC Shanghai 2023. By addressing multiple key features of 5G RedCap, the FG131 module series allows the smooth and fast transition from 4G to 5G benefiting from the form factor design, and delivering a highly cost-effective solution for CPE, ODU, mobile hot-spot, USB Dongle users.　　Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, demonstrates the 5G RedCap module portfolio at MWC Shanghai 2023. Along with the FG132 module series, the brand new FG131 series is introduced to scale up the 5G NR light deployment for use cases such as CPE, ODU, mobile hot-spot, and USB Dongle, etc.　　Leveraging ubiquitous cellular coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The newly launched Fibocom 5G RedCap module FG131 series offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 226Mbps downlink and 120Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios.　　Additionally, the Fibocom FG132 series has adjusted to three form factor designs and multiple regional versions that align with customers' requirements to accelerate the deployment of 5G RedCap worldwide. It is worth noting that these compact designs are pin-compatible with Fibocom LTE Cat 4 module NL668 and L716 series, and the dimension of FG132 (29mm*32mm in LGA form factor) account for only half the size of standard 5G module (41*44mm), significantly reducing the complexity of hardware design at the early stage of 5G RedCap adoption into terminals that shaped variously, for example, IP cameras, drones, wearable XR, etc. Moreover, the M.2 and miniPCIe form factors are the popular selections among manufacturing customers as both of them allow flexible connectivity ports while maintaining the compact size, thus making it easier for manufacturing customers to upgrade the existing LTE devices quickly without changing the hardware design. For example, industrial gateways, utility meters, etc.　　"5G RedCap offers several advantages that make it particularly appealing for supporting IoT applications, and we are glad to scale up Fibocom's RedCap portfolio with new FG131 series," said Shawn Zhu, VP of Global Marketing, Fibocom. "We are expecting to see RedCap gaining further prominence by providing the highly-integrated and fast-to-deploy RedCap modules across the IoT industry, ensuring IoT customers utilize all possible benefits of high-speed, reliable, power-efficient capabilities enabled by RedCap."
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Release time：2023-09-04 15:19 reading：3412 Continue reading>>
Ameya360:Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at <span style='color:red'>MWC</span> 2023
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Ameya360:Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at MWC 2023

　　Renesas Electronics Corp. will showcase a full RF front end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD at the Mobile World Congress in Barcelona, February 27–March 2.　　Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market. The reference platform will be demonstrated at the AMD booth (#2M61 Hall 2).　　The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem. This includes a high-isolation multi-throw DPD (Digital Pre-Distortion) switch, a high-gain and linearity pre-driver in a compact package, an integrated switch and Low Noise Amplifier (LNA) with input signal coupling functionality. This full RF front end platform is designed to efficiently process and transmit data to wireless networks with optimized power levels. Moreover, it has been integrated with the AMD RFSoC DFE ZCU670 Evaluation Kit for quick prototyping and rapid development of wireless network systems. The platform offers superior RF performance, while minimizing DPD resources for TX channel linearization, improving radio efficiency and ultimately reducing operating costs for wireless network providers.　　The RF front-end solution is the latest 5G solution to be jointly developed by Renesas and AMD. Previously, the two companies collaborated on the high-performance RF timing solution for 5G Next-Gen Radio (5G NR), which incorporates Renesas’ IEEE 1588-enabled System Synchronizer as part of the DFE ZCU670 Evaluation Kit.　　“We are thrilled to be collaborating with AMD once again to demonstrate our latest RF capabilities at the upcoming Mobile World Congress,” said Naveen Yanduru, Vice President of RF Engineering at Renesas’ Infrastructure Business Division. “Using our turnkey hardware solution, developers of 5G RF wireless infrastructure systems can reduce development time and cost. We are confident that this solution will set a new standard in RF performance and efficiency for the wireless communication market.”　　“The RFMC expansion connectors on the ZCU670 evaluation board allow our customers to quickly prototype and evaluate a complete RF line up design for their Radio. To demonstrate, we have collaborated with Renesas again to develop an optimized RF Front End reference design targeting the N78 band,” said Brendan Farley, Corporate Vice President of Wireless Engineering at AMD. “As the market for OpenRAN 5G Radio (O-RU) continues to grow, these reference designs will help accelerate our mutual customers’ time to market with proven solutions.”
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Release time：2023-02-22 15:52 reading：4493 Continue reading>>
Ameya360:Analog Devices to Showcase the Future of Connectivity at <span style='color:red'>MWC</span> 2023
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Ameya360:Analog Devices to Showcase the Future of Connectivity at MWC 2023

　　Analog Devices Inc. will feature interactive demonstrations and expert discussions at the upcoming Mobile World Congress (MWC) 2023. Visitors to its booth (Hall 2, Booth #2B18) will learn how ADI aims to minimize environmental impact, enable and accelerate breakthrough innovations, and enrich customers’ lives through solutions which reduce energy consumption, shorten design cycles, and enable the future of work.　　ADI’s solutions enable customers to deliver innovative, advanced Radio Units (RUs) faster using conformance tested reference design platforms with commercial grade RU IP. ADI’s experts will be on hand to discuss RAN energy saving solutions and demonstrate platform interoperability. Furthermore, ADI’s Consumer team will demonstrate their latest innovations in connectivity with applications such as mixed reality (MR) headsets and audible wearables.　　Radio unit demonstration highlights include:　　• ADI’s next-generation massive MIMO (mMIMO) Reference Design with 40% power savings: This 32Tx/32Rx mMIMO radio unit reference design is based on the latest ADI RadioVerse ADRV904x system on chip (SoC) with fully integrated digital front end and collaborator’s advanced baseband processor. This design solution provides 40% power savings compared to competing solutions, enabling lighter, smaller radios and faster time to market.　　• Creating more sustainable networks with advanced micro-sleep modes: Since the Radio Access Network (RAN) consumes 70% to 80% of total network energy, energy savings modes are critical to reducing the carbon footprint across 5G networks and lowering OPEX spending. ADI RadioVerse solutions provide the path forward to meeting the upcoming 3GPP Rel. 18 network energy saving (NES) modes for 5G RAN. See how these potential energy savings are realized in an interactive model of micro-sleep and hibernation modes across multiple Open Remote Unit (O-RU) configurations.　　• Next-generation 5G mmWave beamforming platform: Upgrade macro, small cell, and indoor 5G deployments across the entire 24 to 47GHz bands. This 8T8R 400MHz solution highlights ADI’s latest O-RAN 7.2 split compliant mmWave reference platform, with a proven 25% efficiency improvement in analog beamforming based entirely on ADI silicon solutions.　　In a world where virtual connections are increasingly part of everyday life, ADI will present several advancements in consumer technology which enrich the sensory experience with realistic human interactions:　　• MR headset: Enabling the future of work with the Metaverse – Integrating emerging virtual worlds into everyday lives take a huge technological effort: Intelligent Edge devices, 5G/6G infrastructure, and the green energy to power it all. ADI advancements are making this possible.　　• Hearable solutions: Life, exactly how it is supposed to sound – Filtering out, amplifying, or enhancing the sounds of life when appropriate helps people experience perfect sound, every day. Context-aware, hearable solutions change how people work, play, and rest from anywhere.　　• USB-C fast charging, battery insights, and protection: Fast charging your life’s work – Improving charging efficiency puts less wear on batteries and extends the lifespan of devices. USB-C fast charging technology keeps phones, headphones, or gaming devices going at the speed of daily life, with the highest efficiency and safety in the smallest footprint.
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Release time：2023-02-21 15:10 reading：2432 Continue reading>>
NB-IoT Raises its Volume at <span style='color:red'>MWC</span>
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NB-IoT Raises its Volume at MWC

　　SAN JOSE, Calif. — The Narrowband-IoT version of LTE for the Internet of Things took a big leap forward this week at the Mobile World Congress with reports of new chips, software, and service offerings. NB-IoT is predicted to take the lion’s share of cellular IoT connections over the next few years, growing in parallel with LTE M1 and a host of non-cellular, long-range nets led by LoRa.　　Sequans Communications announced its first chip optimized for NB-IoT, leapfrogging Qualcomm. Startup Riot Micro teamed up with a software developer to show a dual-mode (NB-IoT/LTE M1) network, and Qorvo rounded out its portfolio of low-band RF chips for all low-power wide-area networks.　　LPWANs will be the world’s fastest-growing connectivity technology through 2025, supporting 4 billion IoT devices by that date, according to market watcher ABI Research. For its part, Qorvo said that it saw 20% growth in the market for low-band products in 2017.　　China Mobile reported at MWC that it has launched NB-IoT networks in 346 cities using chipsets from five companies — Huawei, Mediatek, Qualcomm, RDA, and ZTE. The carrier has approved for use on its network 15 NB-IoT modules using the chips, according to a report from TechInsights analysts at the event.　　Goodix, a chip vendor in China known for touchscreen controllers and fingerprint sensors, announced that it will sell NB-IoT chips, using IP from its acquisition of Germany’s CommSolid GmbH. It showed a live demo of its technology on the Vodafone network in Barcelona, said TechInsights.　　Separately, Cisco reported on trials with China Unicom of an NB-IoT management system, the Cisco Jasper Control Center for NB-IoT. It helps automate control for a wide range of applications from agriculture and building automation to smart metering, parking, fire control, and street lighting.　　“We expect to have more than 100 million NB-IoT connections on our network by 2020,” said Xiaotian Chen, general manager of China Unicom’s IoT group, speaking in a Cisco press statement.　　China’s other major carrier, China Telecom, gave an update on its aggressive deployments of NB-IoT at a U.S. version of the MWC event last year. The three China carriers are racing to carry out government mandates to deploy cellular IoT.　　For its part, Sequans announced its Monarch N, a single chip optimized for LTE Cat NB1/NB2, compliant with 3GPP release 14/15. The company claims that it significantly reduces size and cost compared to its existing dual-mode chip but gave no details other than that it enables modules smaller than 10 mm2.　　Sequans said that Monarch N targets markets such as industrial sensors and utility meters. The chip got praise from Verizon for possible use in its guard-band deployments.　　“Sequans is a leader in LTE for IoT, and their Monarch technology was instrumental in the launch of our LTE Cat M1 network,” said Chris Schmidt, an executive director at Verizon, side-stepping the question of whether the carrier will use the NB-IoT version.　　Startup Riot Micro debuted in December its NB-IoT-only chip that draws milliamps to microamps of power and could sell for well below the industry’s target of a $5 module. At MWC, it partnered with telecom software vendor Amarisoft to demo a dual-mode network using the Riot RM1000 chip and Amarisoft’s Amari LTE 100 software, presumably running on an x86 server.　　For its part, Qorvo detailed a portfolio of nine low-band RF chips for any type of IoT network.　　The Qorvo parts span bands from 50 to 4,200 MHz. They include transmit linear amplifiers, gain blocks, variable gain amplifiers, attenuators, switches, filters, duplexers, and low-noise amplifiers, optimized for low power and small size.
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Release time：2018-03-05 00:00 reading：1694 Continue reading>>

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