<span style='color:red'>MWC</span> Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities
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MWC Barcelona 2025: Fibocom Launches Qualcomm X85/X82 5G Modem-RF-Powered 5G Modules, Enhancing FWA AI Capabilities

　　Barcelona, Spain – March.4th 2025 - Fibocom (Stock code:300638), a global leading provider of AIoT solutions and wireless communication modules, announced the launch of its new 5G modules and solutions based on Qualcomm Technologies, Inc.s latest Qualcomm® X85/X82 5G Modem-RF. These new solutions are set to help industry customers seamlessly transition to next-generation Fixed Wireless Access (FWA) technologies and rapidly accelerate the commercialization of new platforms.　　The latest Qualcomm X85/X82 5G Modem-RF delivers significant performance upgrades over the previous X75/X72 generation, including:　　l Supports 3GPP 5G Advanced standards, enabling key 5G Advanced features.　　l Enhanced NR Sub-6GHz downlink carrier aggregation (CA), upgraded from 5CA to 6CA, with carrier bands exceeding 400 MHz.　　l Support for Intra-band ULCA (uplink carrier aggregation) TDD, boosting uplink data rates and optimizing network efficiency.　　l Advanced software capabilities, supporting OpenWRT version 24.x, with compatibility for RDK-B and prplOS.　　l Major AI advancements, including Modem AI functionality and support for external AI NPUs (Neural Processing Units).　　Powered by a quad-core processor, new software suite, and several industry-leading innovations, Fibocom’s 5G modules deliver remarkable capabilities in network coverage, latency, energy efficiency, and mobility. Harnessing advanced AI capabilities, these modules drive 5G FWA solutions to an unprecedented level of intelligence.　　These 5G modules support six-carrier aggregation in the NR Sub-6GHz downlink, offering bandwidth exceeding 300 MHz for faster transmission speeds and broader signal coverage. In addition, Intra-Band uplink carrier aggregation ensures faster data rates, optimizing overall network performance and addressing bandwidth-intensive applications like video conferencing, online gaming, and virtual collaboration.　　In addition to hardware upgrades, the Qualcomm X85 Modem-RF introduces software innovations. The modules will support OpenWRT 24.x, a popular open-source router operating system known for robust features and scalability. Support for RDK-B and prplOS provides users with the flexibility to select the platform that best suits their needs.　　The Qualcomm® 5G AI Suite and Qualcomm® Networking AI Suite combine to deliver QoS management and intelligently prioritized network traffic. These powerful AI Suite capabilities automatically identify high-priority tasks—such as streaming HD video or online gaming—and allocate necessary bandwidth, significantly enhancing the user experience.　　“We are thrilled to collaborate with Fibocom on the launch of their new 5G modules and solutions, powered by our latest Qualcomm X85/X82 5G Modem-RF. Together, we are proud to set new benchmarks with solutions offering exceptional network coverage, low latency, energy efficiency, and enhanced mobility, ultimately paving the way for a more connected and efficient future,” said Gautam Sheoran, VP & GM, Wireless Broadband & Communications, Qualcomm Technologies, Inc.
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Release time：2025-03-20 13:55 reading：464 Continue reading>>
simcom：<span style='color:red'>MWC</span> Shanghai 2024: A New Avenue for 5G Popularization
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simcom：MWC Shanghai 2024: A New Avenue for 5G Popularization

　　Under the theme "Future First," as we all know, 5G-Advanced is the next step in the evolution of cellular technologies, enabling advanced use cases for various verticals such as government and security, transportation, oil and gas, airlines and logistics, and healthcare to realize the full potential of 5G.　　As a hallmark technology of 5G evolution, RedCap has garnered extensive attention from the industry since its inception during MWC Shanghai. 5G RedCap offers advantages such as lowering the complexity, cost, size, and power consumption of 5G products. This not only fills the middle ground of 5G capabilities but also opens a new avenue for 5G to empower various industries.　　At MWC Shanghai, SIMCom aims at 5G ultra-high-speed scenarios and has the 5G module series SIM8270 and SIM8390, providing a maximum speed of over 10Gbps. These modules are suitable for applications that have strict requirements on speed and latency, such as broadband access, video monitoring and industrial control.　　Also, SIMCom has launched the SIM8230 and SIM8230-M2 series RedCap modules based on the Qualcomm platform. The SIM8230 module supports multi-frequency bands for 5G R17 SA, comes with a variety of functional interfaces for external device expansion, and boasts advantages such as lightweight, energy efficiency, compactness, and cost-effectiveness. It can be widely utilized in various domains including 5G CPE, wearable devices, industrial routers, high-definition streaming devices, AR/VR, drones, and remote-controlled robots.　　SIMCom has already fully deployed and accelerated the commercial scale of 5G RedCap. As market recognition of RedCap technology continues to increase, the popularization of 5G will further accelerate. SIMCom is committed to developing more diverse and reliable products based on advanced technology, promoting the large-scale commercialization of technologies like 5G RedCap, and contributing to the digital transformation and development of various industries with 5G technology.
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Release time：2024-08-27 15:56 reading：1019 Continue reading>>
Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at <span style='color:red'>MWC</span> Shanghai 2024
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Fibocom Drives the Rapid Growth in the Economics of IoT Scale with Ultra-compact size Cat 1 bis Module MC610-GL at MWC Shanghai 2024

　　Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announces the new member of its LTE Cat 1 bis module portfolio featuring high reliability, ultra-compact size and cost-effectiveness at MWC Shanghai 2024. The MC610-GL is positioned to foster the economics of IoT scale in vertical markets across asset tracking, E-mobility, AMI (Advanced Metering Infrastructure), etc.　　The Global Cellular IoT Module market shows a 7% year-over-year (YoY) growth in Q1 2024, according to the latest reports by IoT Analytics. Despite ongoing inventory and demand issues in several other regions globally, technologies like 5G and LTE Cat-1 bis have seen a combined market growth of 67% year-over-year, signifying their substantial contribution to the cellular IoT module market's overall growth. “The statistics have verified Cat 1 bis’ driving forces in bringing affordable and reliable wireless connectivity service to a diversified IoT landscape, even though 5G remains strong performance in the data-intensive scenarios, and Cat 1 bis takes the lead in the mainstream low and medium speed market thanks to the worldwide 4G infrastructure,” said Kevin Guan, Director of MTC Product Marketing at Fibocom. “Without a doubt, we are optimistic in expanding the utilization of Cat 1 bis technology in segment areas and providing the value-added reference design service to industry customers. Looking forward, the MC610-GL is expected to address its top performance in the global market and accelerate the large-scale IoT deployment worldwide.”　　Developed from the UNISOC 8910DM platform, the MC610-GL supports major carrier frequency bands worldwide and complies with rich network standards, thus ensuring uninterrupted wireless connection anywhere, anytime, especially catering to asset tracking scenarios. It adopts an ultra-compact LCC+LGA form factor design measured at 24.2 x 26.2 x 2.1mm with dual-mode (4G+2G) supported, providing great convenience for customers to switch from LTE Cat M to Cat 1 bis at the minimum investment. Equipped with rich standard interfaces, the module empowers a wide range of low-to-medium speed IoT industries with up to 10Mbps downlink data transmission rate while conserving significant cost. Leveraging the industry capabilities within Fibocom, customers are catered to the reference design service and support, reducing the lead time to market. In addition, regional versions for EMEA (MC610-EU) and Latin America (MC610-LA) are flexibly adjustable in request to customers’ cost concerns.
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Release time：2024-07-03 13:57 reading：865 Continue reading>>
Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at <span style='color:red'>MWC</span> Shanghai 2023
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Fibocom launches 5G FWA solutions embedded with FG190 and FG180 5G modules at MWC Shanghai 2023

　　During MWC Shanghai 2023, Fibocom introduces the cutting-edge 5G FWA solution embedded with 3GPP Release 17 compliant modules FG190 and FG180, with the advanced and scalable configurations, the solution ensures the smooth escalation of 5G FWA applications towards 10 Gigabits era, especially crucial for CPE and mobile hot-spot use cases.　　a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, introduces the pioneering 5G FWA solution based on the latest generation 5G modules FG190 and FG180 at MWC Shanghai 2023. The solution offers a wide range of flexible configurations and multiple enhancements to CPE and mobile hot-spot customers, significantly reducing the complexity to deploy advanced 5G solutions and accelerate the time to market.　　As 5G technology has improved, mobile broadband service providers are no longer limited to older technologies, mobile data subscriptions associated with mobile phones, dongles or even hot-spot devices are looking for agile and high data throughput network connectivity solutions. The cutting-edge 5G FWA solution specialized in CPE and mobile hot-spot use cases, embedded with Fibocom's latest generation 5G Sub-6GHz and mmWave modules FG190 and FG180. The 5G CPE solution is architected with a set of rich interfaces plus flexible dual-band/tri-band Wi-Fi 7 combinations. For example, an FG190 can simultaneously connect three PCIe and two USXGMII ports, in addition to the Wi-Fi 7 selections, CPE customers can adjust the combinations between QFW7114 and QFW7124 to utilize the band capacity from maximum BE21000 to BE5000. Regarding the wired configurations, either the10GbE+2.5GbE or 2.5GbE+2.5GbE could be the most recommendable and efficient options to unleash the full potential of cable access.　　However, the solution for 5G mobile hot spot offers a range of top-quality wireless performance to mobile scenarios. In the support of a highly integrated WCN7851 chip, the multi-channel options will be utilized efficiently to increase the data rate, depending on the requirements, the dual-band options can be switched to 2.4GHz/5GHz/6GHz to achieve maximum throughput up to BE5800. The seamless Wi-Fi 7 connectivity is also benefiting from the contribution of MLO (Multi-Link Operation) and 4K QAM modulation schemes, offering a highly reliable connectivity service, especially in congested environments like airport terminals, sports venues, and hospitals, etc.　　In software design, Fibocom's cutting-edge 5G FWA solution embedded with FG190 and FG180 is loaded with OpenWRT, which allows maximum customization for CPE and mobile hot-spot customers.　　Powered by the Snapdragon® X75 and X72 5G Modem-RF System, Fibocom FG190 and FG180 is compliant with 3GPP Release 17 and equipped with a quad-core A55 CPU to enable a lightning-fast and ultra-reliable 5G network experience. With Snapdragon®X75, Fibocom FG190 supports 5G Sub-6GHz and mmWave dual-connectivity, thus capable of NR 10CA with up to 1000MHz bandwidth in the mmWave spectrum, and NR5CA with up to 300MHz bandwidth in the Sub-6GHz, significantly elevating the maximum downlink speed to 10Gbps. Followed by the FG180, the module integrated with Snapdragon® X72, offers an agile solution for various 5G FWA customers by supporting up to 400MHz bandwidth of NR 4CA under mmwave bands, and 200MHz bandwidth of NR 3CA under Sub-6GHz. Both FG190 and FG180 are adopting LGA form factors, therefore making both modules the ideal wireless solution for a diversified FWA market.
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Release time：2023-09-12 10:52 reading：3471 Continue reading>>
Fibocom Scales Up the 5G RedCap Module Series at <span style='color:red'>MWC</span> Shanghai 2023 with New FG131 Series Adding to the Portfolio
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Fibocom Scales Up the 5G RedCap Module Series at MWC Shanghai 2023 with New FG131 Series Adding to the Portfolio

　　Fibocom showcases the new 5G RedCap modules portfolio including the new FG131 series and FG132 series at MWC Shanghai 2023. By addressing multiple key features of 5G RedCap, the FG131 module series allows the smooth and fast transition from 4G to 5G benefiting from the form factor design, and delivering a highly cost-effective solution for CPE, ODU, mobile hot-spot, USB Dongle users.　　Fibocom, a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, demonstrates the 5G RedCap module portfolio at MWC Shanghai 2023. Along with the FG132 module series, the brand new FG131 series is introduced to scale up the 5G NR light deployment for use cases such as CPE, ODU, mobile hot-spot, and USB Dongle, etc.　　Leveraging ubiquitous cellular coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The newly launched Fibocom 5G RedCap module FG131 series offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 226Mbps downlink and 120Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios.　　Additionally, the Fibocom FG132 series has adjusted to three form factor designs and multiple regional versions that align with customers' requirements to accelerate the deployment of 5G RedCap worldwide. It is worth noting that these compact designs are pin-compatible with Fibocom LTE Cat 4 module NL668 and L716 series, and the dimension of FG132 (29mm*32mm in LGA form factor) account for only half the size of standard 5G module (41*44mm), significantly reducing the complexity of hardware design at the early stage of 5G RedCap adoption into terminals that shaped variously, for example, IP cameras, drones, wearable XR, etc. Moreover, the M.2 and miniPCIe form factors are the popular selections among manufacturing customers as both of them allow flexible connectivity ports while maintaining the compact size, thus making it easier for manufacturing customers to upgrade the existing LTE devices quickly without changing the hardware design. For example, industrial gateways, utility meters, etc.　　"5G RedCap offers several advantages that make it particularly appealing for supporting IoT applications, and we are glad to scale up Fibocom's RedCap portfolio with new FG131 series," said Shawn Zhu, VP of Global Marketing, Fibocom. "We are expecting to see RedCap gaining further prominence by providing the highly-integrated and fast-to-deploy RedCap modules across the IoT industry, ensuring IoT customers utilize all possible benefits of high-speed, reliable, power-efficient capabilities enabled by RedCap."
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Release time：2023-09-04 15:19 reading：3139 Continue reading>>
Ameya360:Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at <span style='color:red'>MWC</span> 2023
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Ameya360:Renesas and AMD to Demo Full RF, Digital Front-End Design for 5G AAS Radios at MWC 2023

　　Renesas Electronics Corp. will showcase a full RF front end solution for 5G Active Antenna Systems (AAS) radios in collaboration with AMD at the Mobile World Congress in Barcelona, February 27–March 2.　　Paired with the field-proven AMD Zynq UltraScale+ RFSoC Digital Front End OpenRAN Radio (O-RU) Reference Design, the RF front end includes RF switches, low-noise amplifiers and pre-drivers. It offers a complete solution to meet the demand of the growing mobile network infrastructure market. The reference platform will be demonstrated at the AMD booth (#2M61 Hall 2).　　The new 5G design platform integrates all the essential RF and digital front-end hardware for base stations operating in the Open Radio Access Network (O-RAN) ecosystem. This includes a high-isolation multi-throw DPD (Digital Pre-Distortion) switch, a high-gain and linearity pre-driver in a compact package, an integrated switch and Low Noise Amplifier (LNA) with input signal coupling functionality. This full RF front end platform is designed to efficiently process and transmit data to wireless networks with optimized power levels. Moreover, it has been integrated with the AMD RFSoC DFE ZCU670 Evaluation Kit for quick prototyping and rapid development of wireless network systems. The platform offers superior RF performance, while minimizing DPD resources for TX channel linearization, improving radio efficiency and ultimately reducing operating costs for wireless network providers.　　The RF front-end solution is the latest 5G solution to be jointly developed by Renesas and AMD. Previously, the two companies collaborated on the high-performance RF timing solution for 5G Next-Gen Radio (5G NR), which incorporates Renesas’ IEEE 1588-enabled System Synchronizer as part of the DFE ZCU670 Evaluation Kit.　　“We are thrilled to be collaborating with AMD once again to demonstrate our latest RF capabilities at the upcoming Mobile World Congress,” said Naveen Yanduru, Vice President of RF Engineering at Renesas’ Infrastructure Business Division. “Using our turnkey hardware solution, developers of 5G RF wireless infrastructure systems can reduce development time and cost. We are confident that this solution will set a new standard in RF performance and efficiency for the wireless communication market.”　　“The RFMC expansion connectors on the ZCU670 evaluation board allow our customers to quickly prototype and evaluate a complete RF line up design for their Radio. To demonstrate, we have collaborated with Renesas again to develop an optimized RF Front End reference design targeting the N78 band,” said Brendan Farley, Corporate Vice President of Wireless Engineering at AMD. “As the market for OpenRAN 5G Radio (O-RU) continues to grow, these reference designs will help accelerate our mutual customers’ time to market with proven solutions.”
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Release time：2023-02-22 15:52 reading：3661 Continue reading>>
Ameya360:Analog Devices to Showcase the Future of Connectivity at <span style='color:red'>MWC</span> 2023
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Ameya360:Analog Devices to Showcase the Future of Connectivity at MWC 2023

　　Analog Devices Inc. will feature interactive demonstrations and expert discussions at the upcoming Mobile World Congress (MWC) 2023. Visitors to its booth (Hall 2, Booth #2B18) will learn how ADI aims to minimize environmental impact, enable and accelerate breakthrough innovations, and enrich customers’ lives through solutions which reduce energy consumption, shorten design cycles, and enable the future of work.　　ADI’s solutions enable customers to deliver innovative, advanced Radio Units (RUs) faster using conformance tested reference design platforms with commercial grade RU IP. ADI’s experts will be on hand to discuss RAN energy saving solutions and demonstrate platform interoperability. Furthermore, ADI’s Consumer team will demonstrate their latest innovations in connectivity with applications such as mixed reality (MR) headsets and audible wearables.　　Radio unit demonstration highlights include:　　• ADI’s next-generation massive MIMO (mMIMO) Reference Design with 40% power savings: This 32Tx/32Rx mMIMO radio unit reference design is based on the latest ADI RadioVerse ADRV904x system on chip (SoC) with fully integrated digital front end and collaborator’s advanced baseband processor. This design solution provides 40% power savings compared to competing solutions, enabling lighter, smaller radios and faster time to market.　　• Creating more sustainable networks with advanced micro-sleep modes: Since the Radio Access Network (RAN) consumes 70% to 80% of total network energy, energy savings modes are critical to reducing the carbon footprint across 5G networks and lowering OPEX spending. ADI RadioVerse solutions provide the path forward to meeting the upcoming 3GPP Rel. 18 network energy saving (NES) modes for 5G RAN. See how these potential energy savings are realized in an interactive model of micro-sleep and hibernation modes across multiple Open Remote Unit (O-RU) configurations.　　• Next-generation 5G mmWave beamforming platform: Upgrade macro, small cell, and indoor 5G deployments across the entire 24 to 47GHz bands. This 8T8R 400MHz solution highlights ADI’s latest O-RAN 7.2 split compliant mmWave reference platform, with a proven 25% efficiency improvement in analog beamforming based entirely on ADI silicon solutions.　　In a world where virtual connections are increasingly part of everyday life, ADI will present several advancements in consumer technology which enrich the sensory experience with realistic human interactions:　　• MR headset: Enabling the future of work with the Metaverse – Integrating emerging virtual worlds into everyday lives take a huge technological effort: Intelligent Edge devices, 5G/6G infrastructure, and the green energy to power it all. ADI advancements are making this possible.　　• Hearable solutions: Life, exactly how it is supposed to sound – Filtering out, amplifying, or enhancing the sounds of life when appropriate helps people experience perfect sound, every day. Context-aware, hearable solutions change how people work, play, and rest from anywhere.　　• USB-C fast charging, battery insights, and protection: Fast charging your life’s work – Improving charging efficiency puts less wear on batteries and extends the lifespan of devices. USB-C fast charging technology keeps phones, headphones, or gaming devices going at the speed of daily life, with the highest efficiency and safety in the smallest footprint.
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Release time：2023-02-21 15:10 reading：2074 Continue reading>>
NB-IoT Raises its Volume at <span style='color:red'>MWC</span>
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NB-IoT Raises its Volume at MWC

　　SAN JOSE, Calif. — The Narrowband-IoT version of LTE for the Internet of Things took a big leap forward this week at the Mobile World Congress with reports of new chips, software, and service offerings. NB-IoT is predicted to take the lion’s share of cellular IoT connections over the next few years, growing in parallel with LTE M1 and a host of non-cellular, long-range nets led by LoRa.　　Sequans Communications announced its first chip optimized for NB-IoT, leapfrogging Qualcomm. Startup Riot Micro teamed up with a software developer to show a dual-mode (NB-IoT/LTE M1) network, and Qorvo rounded out its portfolio of low-band RF chips for all low-power wide-area networks.　　LPWANs will be the world’s fastest-growing connectivity technology through 2025, supporting 4 billion IoT devices by that date, according to market watcher ABI Research. For its part, Qorvo said that it saw 20% growth in the market for low-band products in 2017.　　China Mobile reported at MWC that it has launched NB-IoT networks in 346 cities using chipsets from five companies — Huawei, Mediatek, Qualcomm, RDA, and ZTE. The carrier has approved for use on its network 15 NB-IoT modules using the chips, according to a report from TechInsights analysts at the event.　　Goodix, a chip vendor in China known for touchscreen controllers and fingerprint sensors, announced that it will sell NB-IoT chips, using IP from its acquisition of Germany’s CommSolid GmbH. It showed a live demo of its technology on the Vodafone network in Barcelona, said TechInsights.　　Separately, Cisco reported on trials with China Unicom of an NB-IoT management system, the Cisco Jasper Control Center for NB-IoT. It helps automate control for a wide range of applications from agriculture and building automation to smart metering, parking, fire control, and street lighting.　　“We expect to have more than 100 million NB-IoT connections on our network by 2020,” said Xiaotian Chen, general manager of China Unicom’s IoT group, speaking in a Cisco press statement.　　China’s other major carrier, China Telecom, gave an update on its aggressive deployments of NB-IoT at a U.S. version of the MWC event last year. The three China carriers are racing to carry out government mandates to deploy cellular IoT.　　For its part, Sequans announced its Monarch N, a single chip optimized for LTE Cat NB1/NB2, compliant with 3GPP release 14/15. The company claims that it significantly reduces size and cost compared to its existing dual-mode chip but gave no details other than that it enables modules smaller than 10 mm2.　　Sequans said that Monarch N targets markets such as industrial sensors and utility meters. The chip got praise from Verizon for possible use in its guard-band deployments.　　“Sequans is a leader in LTE for IoT, and their Monarch technology was instrumental in the launch of our LTE Cat M1 network,” said Chris Schmidt, an executive director at Verizon, side-stepping the question of whether the carrier will use the NB-IoT version.　　Startup Riot Micro debuted in December its NB-IoT-only chip that draws milliamps to microamps of power and could sell for well below the industry’s target of a $5 module. At MWC, it partnered with telecom software vendor Amarisoft to demo a dual-mode network using the Riot RM1000 chip and Amarisoft’s Amari LTE 100 software, presumably running on an x86 server.　　For its part, Qorvo detailed a portfolio of nine low-band RF chips for any type of IoT network.　　The Qorvo parts span bands from 50 to 4,200 MHz. They include transmit linear amplifiers, gain blocks, variable gain amplifiers, attenuators, switches, filters, duplexers, and low-noise amplifiers, optimized for low power and small size.
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Release time：2018-03-05 00:00 reading：1436 Continue reading>>
Mobile AI Race Unfolds at <span style='color:red'>MWC</span>
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Mobile AI Race Unfolds at MWC

　　BARCELONA — While Apple and Samsung, both armed with home-grown apps processors, have a lock on the premium smartphone market, MediaTek, seeking to rebound in smartphones, is rolling out at the Mobile World Congress its Helio P60 chipset.　　MediaTek’s plan is to re-enter the mid-upper tier smartphone market where it competes with Qualcomm.　　MediaTek is pitching Helio P60 as “the first SoC platform featuring a multi-core AI processing unit (mobile APU) and MediaTek’s NeuroPilot AI technology.”　　MediaTek’s move highlights a sharp shift in focus — in the industry’s smartphone battle — to mobile AI. Various chip vendors are racing to make neural network engines locally available on handsets. The goal is simple. They want to enable the AI experience — voice UIs, face unlock, AR and others– processed on client devices, faster and better, with or without network connection.　　“We only in the last year have seen the first wave of smartphone processors with embedded neural engines, and those were all in flagship processors like the Apple A11, Huawei’s Kirin 970, Qualcomm’s Snapdragon 835 and MediaTek’s Helio X30,” said Mike Demler, senior analyst at the Linley Group.　　Demler said, “We’re not surprised that MediaTek would add a neural engine in the lower tier, but it’s interesting that they’re doing it with a more powerful core than the company’s flagship X30 has.”　　In other words, a community of vibrant mid-tier smartphone vendors — mostly driven by Chinese handset manufacturers, appear impatient. They want to pounce on the mobile AI trend as soon as possible.　　New premium　　MediaTek has defined what it calls “new premium,” as “devices that offer premium performance and features at a mid-range price.” Finbarr Moynihan, general manager, corporate sales at MediaTek, explained to EE Times “new premium” is where all the action is in smartphones today. Mid- to upper-tier players, such as Oppo, Vivo, Lenovo, etc. are eager to close the gap with their top-tier rivals, in hopes of making a big leap in apps, features and AIs.　　MediaTek told us that 48 percent of global smartphone shipments in 2017 were from Chinese OEMs, largely aimed at emerging markets. MediaTek quoted a TrendForce report, pointing out that brands focusing on mid-range consumers saw huge growth in 2017 with Xiaomi reporting a remarkable 76 percent increase in smartphone production, and significant increases from Transsion, OPPO and Vivo.　　Helio P60 features four Arm A73 processors and four Arm A53 processors in an octa-core CPU complex. Based on a big.LITTLE octa-core design, MediaTek claims 70 percent CPU performance enhancement compared to its predecessors, Helio P23 and Hleio P30. By using a new Mali G72 GPU that maxes at 800MHz, the P60 also improves GPU performance by 70 percent.　　MediaTek’s neural network engine　　Helio P60’s claim to fame, however, is a built-in NeuroPilot AI platform that bridges CPU, GPU and onboard AI accelerators. MediaTek’s AI framework is there to manage heterogeneous AI-compute architecture by coordinating computing workload across CPU, GPU and the AI accelerator within the SoC to maximize performance and energy efficiency.　　MediaTek has confirmed that the P60 integrates a Cadence Vision P6 core for its AI accelerator.　　Compared to MediaTek’s flagship Helio X30, which used Cadence Vision P5 at 70 GMAC per second (8-bit), Helio P60 does 280 GMAC per second. Demler said, “So they dropped down a tier as far as the overall processor’s performance, but increased neural-engine performance by 4x at the same time.”　　Asked to compare the performance of Helio P60’s neural network engine, Demler said, “Huawei’s Kirin 970 does ~1TMAC/s (FP16), so it has 4x the neural-network performance of P60 at higher resolution. At 280GMAC/s, the P60 is a close match for the Apple’s A11, which does 300GMAC/s.”　　No AI benchmarks　　Most analysts we consulted, however, agreed that the lack of a benchmark for deep-learning accelerators makes it nearly impossible to make any meaningful comparison. Calling it “a big open issue,” Demler said the mobile-AI quagmire could easily lead us to “a GOPS/TOPS battle of marketing hype.”　　Jim McGregor, principal analyst at Tirias Research, concurred. “This is a confusing topic because there are few details and no benchmarks,” he said. “MediaTek and others make it sound like these AI solutions can do anything,” but they are not usually true, McGregor added.　　For example, the Cadence Vision P6 core used in MediaTek’s P60 is optimized for computer-vision applications, not general-purpose neural networks, Demler said.　　As McGregor explained, “First, you need to understand what most of these AI processors are.” For example, MediaTek, Apple and Huawei call their solutions "dedicated." That means they use a single IP block for AI acceleration. “In most cases, that means an IP block licensed from someone else” such as Cadence or Ceva. Such an IP block “supports a configurable neural network with some limitations,” said McGregor. But “no one will tell exactly what those limitations are.”　　So, obviously, dropping inside an app processor a neural networks engine isn’t the end of the story. As McGregor pointed out that the development and training of new neural networks still need to take place in data centers where they must depend on much more high-precision, powerful processors for training.　　If app developers and OEMs want to exploit the neural engines inside a smartphone app processor, they need a software framework with hooks to the underlying hardware. “All the leading mobile-processor designers (Qualcomm, MediaTek, Huawei, Apple) now offer neural-network SDKs,” Demler observed. But they all need to support popular training frameworks like Caffe and Torch, he added.　　In MediaTek’s case, the company offers what it calls NeuroPilot AI SDK, a framework that lets app developers and OEMs “look down into hardware, to see how AI apps can run on CPU, GPU and dedicated AI accelerator,” said MediaTek’s Moynihan.　　Meanwhile, apps developers and OEMs also need to be able to “look up, and to see what Android Networks API (Android NNAPI) says,” Moynihan added. Google developed Android NNAPI and runtime engine for Android-based machine learning. “MediaTek’s NeuroPilot SDK is fully compliant with Android NNAPI,” Moynihan added.　　Among methods deployed to enable smartphone processors to run AI apps, Qualcomm appears to have a slightly different approach.　　McGregor said Qualcomm’s solution is different because “they use multiple resources already on their chip, including the Hexagon DSP, Adreno GPU, and Kryo CPU cores.”　　However, he added, “With no benchmarks available, it is impossible to determine which method is better, but the Qualcomm model does offer more flexibility.”　　Battle for AI software　　Regardless of the underlying hardware, it’s after all the software that can truly differentiate the AI experience on any given smartphone.　　McGregor said, “Right now, these applications are being targeted towards common functions on the phone, such as photography and digital assistants. However, it is often left up to third-party software developers to develop and train the model for use on the device.”　　He noted, “In limited cases, some models or libraries are available. Qualcomm developed some libraries around image recognition, Samsung around photography, and I'm sure Apple is developing its own models.”　　In other cases, it is up to the applications developer, which is a significant limitation, McGregor pointed out. “Not many application developers are accustomed to deep learning or have access to large data centers necessary for deep learning," he said.　　The Linley Group’s Demler also sounded a note of caution on AI software development in his recent Microprocessor Report. “The diversity of processor architecture creates a challenge for developers of Android apps, because these apps must work even on devices that lack a dedicated deep learning accelerator.” On the other hand, developers of iOS apps need only support a few Apple designed processors, he noted.　　Similarly, Kevin Krewell, principal analyst at Tirias Research, warned, “The biggest problem I see is that each silicon and IP vendor is doing Machine Learning differently. Arm may have the best opportunity to standardize multiple vendors on one IP.”
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