SIMCom Powers Smart Terminals with 5G + <span style='color:red'>Wi-Fi</span> 7 for Commercial Applications
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SIMCom Powers Smart Terminals with 5G + Wi-Fi 7 for Commercial Applications

　　As AI-driven smart devices evolve, reliable connectivity remains essential for advanced applications. During MWC25 and EW25, SIMCom introduced its 5G + Wi-Fi 7 wireless communication solution, engineered for smart router applications. This solution delivers solid performance, fast speeds, and dependable wireless communication, and it is already being used in commercial products to help manufacturers optimize both cost and time-to-market.　　5G + Wi-Fi 7: Unlocking the Full Potential of Smart Terminals　　Based on the Qualcomm® Snapdragon™ X62 5G Modem-RF System, a key component of the world's first 3GPP Release 16 modem-RF family. Designed with an upgradable architecture, this technology enables rapid commercialization of 5G Release 16, extending 5G connectivity to various applications, including mobile broadband, fixed wireless, industrial IoT, and private 5G networks. By integrating Wi-Fi 7, this solution enhances the wireless experience for smart devices, providing higher capacity, lower latency, and greater efficiency.　　Showcasing Real-World Applications　　During MWC25 and EW25 , SIMCom partnered with LUXSHARE ICT to demonstrate the real-world capabilities of 5G + Wi-Fi 7. A key highlight was the 5G CPE BE17000 Wi-Fi 7 Mesh Router, featuring SIMCom's SIM8262E-M2 module. By inserting a 5G SIM card, this router utilizes advanced 5G connectivity, allowing users to share ultra-fast networks with multiple Wi-Fi devices. The Wi-Fi 7 Mesh technology further enhances:　　● Network coverage and capacity　　● Ultra-HD streaming without buffering　　● Lightning-fast file downloads　　● Seamless video conferencing and online collaboration　　This deployment underscores SIMCom's commitment to delivering high-speed, uninterrupted connectivity for AI-driven applications, addressing the increasing demand for reliable smart networking solutions.　　( 5G CPE BE17000 WiFi 7 Mesh Router with LUXSHARE ICT )　　Global 5G Adaptability for Diverse Market Needs　　One of the key advantages of SIMCom’s 5G + Wi-Fi 7 solution is its ability to support both NSA and SA network architectures, ensuring robust cellular performance and high data transmission rates. The Snapdragon X62 5G Modem-RF System enables full compatibility with global 5G frequency bands, covering high, mid, and low spectrum ranges. This allows SIMCom to offer customized regional solutions, catering to the specific connectivity requirements of different global markets.　　Driving the Future of Smart Connectivity　　With the integration of 5G and Wi-Fi 7, SIMCom is revolutionizing AI-powered smart terminals, enabling faster, more intelligent, and always-connected experiences. As AI-driven applications continue to expand, high-speed, stable, and adaptive connectivity will play a pivotal role in unlocking new possibilities across industries.　　By leading the way in advanced 5G and Wi-Fi solutions, SIMCom empowers device manufacturers, businesses, and end users to fully embrace the next generation of smart, connected experiences.　　About LUXSHARE ICT:　　Established on May 24, 2004, Luxshare Precision successfully listed on the ChiNext Board of Shenzhen Stock Exchange on September 15, 2010 (stock code: 002475). The Company is committed to providing integrated intelligent solutions, parts, modules and systems for enterprise communication products (high-speed interconnect, optical module, heat dissipation module, base station antenna, base station filter), consumer electronic products (TWS wireless headphones, smart wear, wireless charging module, 5G router, VR headsets, smart speaker), and automobile systems (automobile wiring harness, connector, intelligent cabin, intelligent driving) and central gateway, etc　　About SIMCom:　　SIMCom Wireless Solutions Limited is a global leading IoT wireless modules and solutions supplier. Since established in 2002, SIMCom has been fully committed to providing a variety of wireless modules and terminal level solutions worldwide, such as 5G,4G, LTE-A, LTE-M(CAT-M1), NB-IoT, 3G, 2G, and GPS/GLONASS/BEIDOU satellite positioning technology.　　SIMCom insists on providing high-quality modules and industry solutions. With 23 years of professional technical innovation and service experiences, it continuously meets the needs of customers in all industries of the Internet of Things. While deepening the vertical industry, we continue to define advantageous products and build core competitiveness. With the Group's continuous investment in research and development, technology and production, we will continue to innovate and enrich our technology roadmap, and promote the development of the industry in the next few years.
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Release time：2025-03-20 13:58 reading：242 Continue reading>>
Fibocom Accelerates 5G RedCap FWA Commercialization by Offering <span style='color:red'>Wi-Fi</span>-Ready Solutions
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Fibocom Accelerates 5G RedCap FWA Commercialization by Offering Wi-Fi-Ready Solutions

　　Shenzhen,China – November 25th 2024 – Fibocom (Stock code: 300638), a global leading provider of wireless communication modules and solutions, today debuts the ready-to-market 5G RedCap plus Wi-Fi 5/6 solution developed from the 5G RedCap module FG131, which is positioned to accelerate the commercialization of 5G FWA in the form of CPE, mobile hot-spot, and USB dongle, etc., satisfying the diverse market demands.　　According to a report updated in September 2024, GSA has identified 143 operators in 61 countries and territories worldwide that have been investing in public 5G SA networks through trials, planned or actual deployments. With the implementation of 5G SA network infrastructure, 5G-enabled FWA shipments became mainstream, reaching 10.2 million in 2023. The growth of 5G FWA CPE shipments is expected to accelerate further, accounting for 42% of shipments in 2024 compared with 34% in 2023, according to the CPE Vendor Survey released by GSA in August 2024.The launch of Fibocom’s ready-to-market 5G RedCap plus Wi-Fi 5/6 solution is the ideal 5G lightweight solution accelerating the migration from 4G FWA to 5G FWA, elevating the Quality-of-Service with faster network connection, more-agile network slices services and reliability in 5G SA network environment.　　Key takeaways　　Advanced 5G RedCap plus Wi-Fi 6 (AX3600): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm WCN6856, reaching maximum 3600Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-160MHz@5/6GHz dual-band concurrently and the support of 4K QAM for enhanced data transmission efficiency.　　Medium 5G RedCap plus Wi-Fi 6 (AX1800): The FG131 5G RedCap module integrates with a Wi-Fi 6 module developed from the Qualcomm QCA2064, reaching maximum 1800Mbps data throughput with the support of 2x2-40MHz@2.4GHz and 2x2-80MHz@5/6GHz dual-band concurrently.　　Entry-level 5G RedCap plus Wi-Fi 5: The FG131 5G RedCap module integrates with a Wi-Fi module developed from the Qualcomm QCA6174 through a serial port, delivers maximum 867Mbps speed with the support of dual-band 2.4GHz and 5GHz simultaneously.　　Leveraging 5G SA network coverage, optimized power-saving, and reduced complexity, 5G RedCap is gaining more and more attention within the IoT industry. The Fibocom5G RedCap module FG131 offers a high-performance and ultra-reliable wireless solution for application scenarios that are cost-sensitive and power-enduring. Packaged in LGA form factor at the size of 37mm*39.5mm, Fibocom FG131 is pin-compatible with Fibocom LTE Cat 6 module FG101 and FG621 series that allows smooth migration from 4G to 5G RedCap. Compliant with 3GPP Release 17, it supports 5G SA and reaches peak rates of up to 223Mbps downlink and 123Mbps uplink theoretically. With these key features combined, the Fibocom 5G RedCap module FG131 series delivers a new level of 5G network experience while maintaining high reliability and cost-effectiveness, especially for terminal devices used in mobile scenarios. Apart from the hardware optimization, FG131also supports the OpenCPU and OpenWRT software features and an abundant of rich interfaces to realize the flexible and easy integration of FWA devices.
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Release time：2024-12-11 13:26 reading：711 Continue reading>>
Panasonic Industrial Devices PAN9019/PAN9019A <span style='color:red'>Wi-Fi</span>® Dual Band Wireless Modules
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Panasonic Industrial Devices PAN9019/PAN9019A Wi-Fi® Dual Band Wireless Modules

　　Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi® 6 Dual Band 2.4GHz to 5GHz and BLUETOOTH® 5.4® Modules are wireless radio modules with integrated Bluetooth BDR/EDR/Low Energy (LE). These modules are designed for highly integrated and cost-effective applications requiring high data rates and low power consumption. The PAN9019/PAN9019A features integrated power management, a dual-core CPU, 802.11i security standard support, and high-speed data interfaces. The modules provide a combination of Wi-Fi, Bluetooth, and 802.15.4 wireless connectivity, allowing for high throughput applications and enhanced flexibility. Panasonic Industrial Devices PAN9019/PAN9019A Series Wi-Fi 6 Dual Band 2.4GHz to 5GHz and Bluetooth 5.4 Modules are available in an M.2 form factor for use with host processors as an evaluation tool using an M.2 Key E socket.FEATURES　　Dual-band 2.4GHz to 5GHz 802.11a/b/g/n/ac/ax Wi-Fi, Bluetooth, and 802.15.41 combo module　　Supports WPA3 security　　Secured boot and firmware　　802.11e quality of service supported for multimedia application　　IEEE 802.11ax, 1x1 spatial stream with up to 600Mbps data rate　　OFDMA (UL/DL) and MU-MIMO (UL/DL)　　Bluetooth 5.4 (LE and long range)　　WCI-2- and 5-wire PTA coexistence interfaces　　SDIO 3.0, high-speed UART, and SPI2 for host processor connection general interfaces　　OS driver support for RTOS, Linux, and Android　　Available in M.2 form for evaluation with host processor using an M.2 Key E socket　　SPECIFICATIONS　　PAN9019　　NXP IW611 WLAN 2.4GHz and 5GHz, Bluetooth single-chip solution inside　　PAN9019A　　NXP IW612 WLAN 2.4GHz and 5GHz, Bluetooth and 802.15.4 single-chip solution inside　　15.3mm x 12mm x 2.5mm SMT package size　　-98dBm Rx sensitivity at IEEE 802.11b　　IEEE 802.11ax 20MHz, 40MHz, 80MHz channel bandwidth　　1.8V to 3.3V power supply range　　-40°C to +85°C operating temperature range　　BLOCK DIAGRAM　　PRODUCT OVERVIEW
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Release time：2024-07-15 14:05 reading：952 Continue reading>>
Murata commercializes low-power <span style='color:red'>Wi-Fi</span>®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment
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Murata commercializes low-power Wi-Fi®/Bluetooth® combo module:Helping proliferate battery-powered IoT equipment

　　Murata Manufacturing Co., Ltd. (hereinafter, “Murata”) has developed and begun mass-producing the low-power compact wireless module “Type 2GF” (hereinafter “this product”) with built-in Infineon Technologies (hereinafter “Infineon”) “CYW43022” Wi-Fi®/Bluetooth®/Bluetooth® Low Energy combo chip.　　With the expansion of applications in the IoT market in recent years, there has been a rise in IoT equipment with wireless communication functions. There has been a diversification in the different specifications wireless communication functions need to have depending on the application. For battery-powered devices, wireless communication functions are also being required to have lower power consumption.　　In response to this demand, Murata has applied proprietary wireless design technology and product processing technology to develop this product with CYW43022 built in to have low power consumption capabilities. Because CYW43022 can maintain connectivity even when a host processor is in sleep mode due to its connectivity processing capability with the chip’s Bluetooth® stack and Wi-Fi® network offloading, the chip helps this product consume less power at the system level. Space was also saved on the module by using often space-occupying noise shields in a smaller size, which allowed us to make this product more compact.　　Specifications
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Release time：2024-06-28 11:31 reading：630 Continue reading>>
GigaDevice Launches Brand New <span style='color:red'>Wi-Fi</span> 6 MCU Series - GD32VW553
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GigaDevice Launches Brand New Wi-Fi 6 MCU Series - GD32VW553

　　The GD32VW553 series MCU supports Wi-Fi 6 and Bluetooth LE 5.2 wireless connectivity. It features advanced Radio Frequency Integrated Circuits (RFIC), enhanced security mechanisms, generous storage capacity, and a wide range of universal interfaces. Leveraging a mature process platform and cost-effective optimization, it consistently delivers solutions for market applications demanding efficient wireless capabilities. The new product lineup offers eight different models. GigaDevice is now accepting requests for samples and evaluation boards in two compact package options: QFN40 and QFN32. These products are scheduled for mass production and will be available for delivery starting in December 2023.　　With its excellent edge processing and connectivity features, GD32VW553 applies to various wireless application scenarios, including smart home appliances, smart home systems, industrial Internet, and communication gateways. This series of MCUs is also well suited for scenarios with budget constraints, making it an ideal choice for office equipment, payment terminals, and various IoT products.　　Eric Jin, GigaDevice's Product Marketing Director, stated, "The new GD32VW553 series, with its optimized RISC-V open-source instruction set architecture, incorporates the microcontroller with advanced Combo Wireless connection protocols. This addresses the increasing connectivity demands in the thriving home appliances and emerging AIoT market, achieving a balance between processing performance, solution design, and material costs. With an ongoing expansion of GD32 RF development platform, it adeptly addresses wireless design challenges in hi-density and intricate environments, presenting developers with a secure, dependable, energy-efficient, and efficient connectivity experience."　　The GD32VW553 series RISC-V core Combo Wireless MCU　　Leading RF computing performance　　To fulfill the requirements of real-time processing and efficient communication, the GD32VW553 series MCU incorporates a new open-source instruction set architecture with the RISC-V processor core, boasting a maximum clock frequency of 160 MHz. Additionally, it incorporates advanced DSP hardware acceleration, a double-precision floating-point unit (FPU), instruction expansion interfaces, and various other resources. Through excellent microarchitecture design, this combination results in outstanding energy efficiency, while providing flexibility for scalability.　　The integrated 2.4 GHz Wi-Fi 6 RF module follows the IEEE 802.11ax standard and is backward compatible with the IEEE 802.11b/g/n standard, ensuring its suitability for different network environments. It supports Orthogonal Frequency Division Multiple Access (OFDMA) enabling multiple devices to share channel resources, resulting in 60% higher data transmission rate compared to Wi-Fi 4. Additionally, it offers support for Multi-User Multiple-Input Multiple-Output (MU-MIMO), enabling multiple devices to work simultaneously without interfering with each other, thus achieving high-efficiency and low-latency communication in multi-device high-density access scenarios.　　The integrated Bluetooth LE 5.2 RF module extends the communication distance, increases throughput, enhances security, and saves power following the latest Bluetooth specifications. It provides 2 Mbps high-speed data mode and multiple rates of 125K/500Kbps to effectively reduce transmission time and improve sensitivity. It facilitates the establishment and configuration of stable and high-speed wireless networks even in the case of multiple devices and complex environments.　　The new Combo Wireless MCU offers advanced baseband and RF performance with a variety of additional features. It supports the wireless coexistence protocol based on the Package Traffic Arbitration (PTA) mechanism, significantly reducing same-frequency interference caused by Wi-Fi and Bluetooth; thereby enhancing the stability of signal reception. Additionally, it is equipped with Automatic Gain Control (AGC) in a high dynamic range to effectively enhance signal quality. Thanks to the Target Wake Time (TWT) of Wi-Fi 6, GD32VW553 can flexibly schedule the sleep and wake-up time, improving energy-saving efficiency and meeting the access requirements of wireless devices with low power consumption and long battery life.　　High integration and security　　The new GD32VW553 series integrates up to 4MB Flash, 320KB SRAM, and 32KB configurable Instruction Cache (I-Cache) to greatly improve CPU processing efficiency. The GD32VW553, delivering excellent wireless performance, is also equipped with rich universal wired interfaces, including three U(S)ART, two I2C, one SPI, one four-wire QSPI, and up to 29 programmable GPIO pins. Its built-in components include two 32-bit general-purpose timers, two 16-bit general-purpose timers, four 16-bit basic timers, one PWM advanced timer, and one 12-bit ADC. The power supply voltage ranges from 1.8 V to 3.6 V and it offers high temperature up to 105℃ to meet the application scenarios such as industrial control interconnection, lighting equipment, and socket panels.　　The GD32VW553 series also provides multiple security features to streamline secure connection and management of high-performance wireless devices. It supports the Wi-Fi Protected Access (WPA) security feature, incorporating new WPA3 encryption technologies for both personal and corporate networks. The hardware encryption and decryption engine support DES, triple DES, AES, and Hash algorithms. It also supports Public Key Cryptographic Acceleration Unit (PKCAU) to ensure confidentiality and data integrity during wireless communication. The True Random Number Generator (TRNG) can provide unpredictable data for key generation across a variety of security protocols, further enhancing the system's security capabilities.　　The GD32VW553 series MCU Lineup　　Enabling wireless innovation with ecosystem　　The RISC-V development ecosystem for GD32 has become increasingly comprehensive, covering the entire development process. It is highly compatible with existing MCU development environments and user habits, enabling users to quickly build competitive market driven solutions. GigaDevice provides the new GD32VW553 series MCU with a range of free development tools, including GD32 IDE, GD-LINK debugging and download tool, and GD32 All-In-One Programmer. In addition, GigaDevice has concurrently released the SDKs that contain the underlying driver, wireless protocol stack, and application routine. Development boards that are compatible with various Real-Time Operating Systems (RTOS) supporting local connection, cloud connection, security, and Over the Air (OTA) upgrade are also available, enabling rapid deployment of connectivity devices. The GD32VW553 series meets the Matter over Wi-Fi application standard developed by the international organization Connectivity Standards Alliance (CSA). This allows GD32VW553 to facilitate seamless interconnections among various Matter devices, improving the overall compatibility and interoperability of smart home systems.　　SEGGER, the industry's leading supplier of embedded development systems from Germany, has formed a strategic partnership with GigaDevice to offer developers free access to the SEGGER Embedded Studio IDE and a complete suite of development tools. IAR from Sweden will also provide comprehensive support for the new GD32VW553 series MCU, including development and compilation tools as well as tracking and debugging tools.　　The GD32VW553 series MCU has achieved official Wi-Fi 6 certification from the Wi-Fi Alliance (WFA), Bluetooth certification from the Bluetooth Special Interest Group (Bluetooth SIG), and RF FCC/CE compliance certification. GigaDevice is actively partnering with multiple module manufacturers and developer platforms to offer "turnkey solutions," encompassing wireless modules, certificate authentication service, and more. These solutions enable the rapid development of Internet of Things (IoT) platforms and product solutions that support various wireless communication technologies such as Wi-Fi and Bluetooth.
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Release time：2024-01-02 16:55 reading：2384 Continue reading>>
A World’s First: Murata Enables Better <span style='color:red'>Wi-Fi</span> 6E and <span style='color:red'>Wi-Fi</span> 7 Antenna Design with Cutting-Edge Parasitic Element Coupling Device
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A World’s First: Murata Enables Better Wi-Fi 6E and Wi-Fi 7 Antenna Design with Cutting-Edge Parasitic Element Coupling Device

　　Murata has announced its new Parasitic Element Coupling Device. This state-of-the-art solution improves antenna efficiency by magnetically coupling the parasitic element with the antenna and is the world's first solution designed for Wi-Fi 6E and Wi-Fi 7 products. For designers of smartphones, tablets, network routers, game consoles, and other compact electronics, it enables them to build more efficient antennas – a key requirement for many modern space-constrained devices.　　To develop products conforming to Wi-Fi 6E and Wi-Fi 7 standards, which utilize high-speed wireless communication, multiple high-performance antennas must be installed in electronic devices to improve communication speed and quality.　　However, as the dimensions of heatsinks and batteries expand, as processors become more advanced, the available space for mounting antennas tends to decrease.　　Consequently, there is a need for smaller antennas. But there is a technical limitation, in that the efficiency of wide-band antennas decreases when they are miniaturized. Therefore, designers need a solution that achieves both miniaturization and high performance.　　Murata’s solution is a parasitic element coupling device, made with its multilayer technology as a four-terminal surface-mount component of just 1.0 x 0.5 x 0.35mm.　　Murata’s parasitic element coupling device connects the feeding antenna* to its parasitic elements more effectively than is possible through free space. It acts as a tiny coupling device whose compact size enables strong coupling performance without the use of magnetic materials, which would be inappropriate at the targeted operating frequencies. One side of the coupling device is connected, at very low insertion loss, between a device’s RF circuitry and its main antenna. The other side is connected between the ground and the parasitic element. The resultant, more direct coupling enables the resonance characteristics of the parasitic element to be added to those of the feeding antenna. As a result, it enables more efficient operation across a broader frequency range or on multiple discrete bands.　　The device helps to combat that when an antenna is made smaller, the coupling between it and the parasitic elements is reduced, while the coupling between the parasitic elements and the ground is increased. By sustaining the coupling between the feeding antenna and parasitic element, parasitic element coupling device enables designers to use miniaturized antenna design methods without impacting the communication band of efficiency.　　The feeding antenna can cause an impedance mismatch when used over a wide band, leading to a degradation in wireless performance. In addition, when an antenna with a mismatched impedance is connected to a communication circuit using a long cable, the long cable can promote the impedance mismatch, causing larger insertion loss than expected and significantly reducing wireless communication performance. By using the device, you can improve antenna matching and reduce performance degradation in wireless communications even when using long cables.
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Release time：2023-12-13 14:15 reading：2232 Continue reading>>
Fibocom Debuts the <span style='color:red'>Wi-Fi</span> 7 Module WN170-GL at Broadband World Forum 2023
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Fibocom Debuts the Wi-Fi 7 Module WN170-GL at Broadband World Forum 2023

　　With the popularity of FWA(Fixed Wireless Access) devices among homes and enterprises, the pursuit of unleashing the potential of unlimited speed performance with 5G and Wi-Fi combination never stops. During Broadband World Forum 2023, Fibocom debuts the Wi-Fi 7 module WN170-GL with key performance in supporting incomparable 5.8Gbps download speed and jitter-free latency, delivering blazing-fast wireless experience for FWA scenarios.　　Paris, France – October 26th 2023 – Fibocom (Stock code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, debuts the groundbreaking Wi-Fi 7 module WN170-GL featuring multiple key advancements in optimized network usage, next-level speed performance, and elevated overall performance. The state-of-the-art Wi-Fi 7 module is set to provide superior wireless connections for smart home devices and enterprise-level terminals.　　Coupled with the Qualcomm® FastConnect™ 7800 WCN7851, the WN170-GL is a highly integrated module ready for 802.11a/b/g/n/ac/ax/be and compliant with Bluetooth 5.3 standard. Packaged in LGA form factor design, the Wi-Fi 7 module adopts multiple innovations and enhancements in the support of MU-MIMO (Multi-user MIMO) and 4K QAM (Quadrature Amplitude Modulation) modulation scheme, with the capacity to pack more data into each signal thus offering striking data throughput and assuring the lag-free wireless connectivity. In terms of channel bandwidth, the WN170-GL supports MLO (Multi-Link Operation), allowing maximum flexibility in DBS (Dual-band Simultaneous) operations such as 2.4GHz + 5GHz and 2.4GHz + 6GHz. Furthermore, WN170-GL is equipped with a closed-loop power detector and low-power PCIe interface to achieve low-power and high-speed data transmission.　　By utilizing the merits of Wi-Fi 7 innovations, the 5G FWA industry will be able to unlock the next-level wireless experience for smart home devices and enterprise-level terminals. Fibocom provides the industry-first 5G + Wi-Fi 7 module solution by integrating the 5G Sub-6GHz module FG190 and Wi-Fi 7 module WN170-GL, helping FWA customers to build up the top-quality wireless devices such as CPE, router, mobile hot-spot etc.　　5G FWA device is transforming as the ‘Hub’ with the pivotal role in enabling the Gigabit wireless access in both indoor and outdoor scenarios, and the introduction of Wi-Fi 7 module WN170-GL is crucial to unleash the next-level wireless experience combined with the Fibocom 5G module solution. Fibocom is confident in offering the industry-leading 5G + Wi-Fi 7 solution and bringing smoother video conferencing, virtual collaboration, and lag-free streaming for a wide range of industry customers worldwide.
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Release time：2023-10-31 14:11 reading：2056 Continue reading>>
Murata’s Latest Wireless Module Utilizes <span style='color:red'>Wi-Fi</span> 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations
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Murata’s Latest Wireless Module Utilizes Wi-Fi 6E & Bluetooth 5.3 to Deliver Enhanced Performance for IoT Implementations

　　Murata, an industry leading electronics manufacturer, has further expanded its range of state-of-the-art wireless communication modules. The new LBEE5XV2EA (Type 2EA) module utilises Infineon’s CYW55573 system-on-chip (SoC), providing Bluetooth® 5.3 and triband Wi-FiTM operation – which includes both 2.4GHz and 5GHz bands as well as 6GHz band, Wi-Fi 6E, support.　　With many areas of the RF spectrum becoming increasingly overcrowded, Wi-Fi communication speeds can often suffer. The latest Wi-Fi 6E standard allows the same 9.6Gbps data rate as 5GHz Wi-Fi 6, but overall performance is more consistent thanks to less congestion and interference at 6GHz frequencies. Furthermore, Wi-Fi 6E provides additional (and wider) broadcast radio channels, which helps to increase data throughput in high-traffic areas.　　The module supports Wi-Fi 6’s target wake time (TWT) feature. This ensures that the device spends more time in standby mode, only communicating when necessary to reduce overall energy consumption and optimise network efficiency.　　The Type 2EA is equipped with on-board Bluetooth 5.3 functionality, including Bluetooth LE (low energy) Audio. This standard employs a new audio codec known as low complexity communications codec (LC3), which provides enhanced high-quality audio at a lower power requirement than Bluetooth Classic.　　20/40/80MHz channels are all incorporated into the module, with 1024-QAM modulation and a 2x2 MIMO antenna arrangement, helping to achieve heightened levels of data throughput. The Type 2EA’s wireless specification meets the latest IoT demands, making it ideal for low-latency communication applications such as video streaming, conference systems, virtual reality (VR) and augmented reality (AR) equipment, surveillance camaras, high resolution digital still camara, and alarm systems.　　Compared to other Wi-Fi 6E solutions available on the market, the Type 2EA has a better optimised design, thanks to utilising Murata’s high-performance components and miniaturisation expertise. With its surface mount device (SMD) design and compact size of just 12.5mm x 9.4mm x 1.2mm, the wireless module allows for easy system integration.　　While FCC certification is in preparation, the availability of ISED and MIC certification, along with conductive tests for CE, also helps to simplify any compliance process. This means that fewer engineering resources need to be committed, delivering both time and cost savings.
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Release time：2023-09-12 10:20 reading：2495 Continue reading>>
Renesas:Matter-Ready <span style='color:red'>Wi-Fi</span> Sensor Solution
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Renesas:Matter-Ready Wi-Fi Sensor Solution

　　If you want your smart home solutions to be easily interoperable between devices within the major smart home ecosystems, Matter is the way to go. All sensor data relevant to smart home applications is collected and easily made available via a unified application layer standard for connected things. The battery/solar-powered design and Matter connectivity of this sensor solution allow for independent, stand-alone operation (no wiring!) and a fast/reliable system, as well as user-friendly IoT development.　　System Benefits:　　Ease-of-use due to a compact footprint and interoperable Matter connectivity　　Battery/solar powered, therefore enabling portable/mobile operation　　Multiple sensor solution (light, humidity, air quality, etc.)　　Unified application layer = "de-facto" connectivity standard for connected things within the universe of smart homes
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Release time：2023-05-06 11:42 reading：3570 Continue reading>>
Nordic Launches <span style='color:red'>Wi-Fi</span> 6 Companion IC and Dev Kit
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Nordic Launches Wi-Fi 6 Companion IC and Dev Kit

　　Nordic Semiconductor has launched the nRF7002 Wi-Fi 6 companion IC and its associated nRF7002 Development Kit (DK). The nRF7002 is the first in Nordic’s Wi-Fi product family and is a low power Wi-Fi 6 companion IC providing seamless dual band (2.4GHz and 5GHz) connectivity. It can be used together with Nordic’s nRF52 and nRF53 Series multiprotocol Systems-on-Chip (SoCs) and the nRF9160 cellular IoT (LTE-M/NB-IoT) System-in-Package (SiP), but can equally be used in conjunction with non-Nordic host devices. The DK makes it easy for developers to get started on nRF7002-based IoT projects.　　Wi-Fi 6 brings significant benefits to IoT applications—such as smart-home products, industrial sensors, asset trackers, and wearables—including power efficiency gains for battery powered Wi-Fi operation, and management of large IoT networks comprising hundreds of devices.　　“The nRF7002 Wi-Fi 6 companion IC is a testament to Nordic Semiconductor’s leadership in low-power wireless technology,” said Svein-Egil Nielsen, CTO/EVP of R&D and Strategy at Nordic. “This highly integrated and flexible solution will empower developers to create new, innovative Wi-Fi 6-enabled products. Supported with the nRF7002 DK and the award-winning nRF Connect SDK, combined with Nordic’s best in class technical support, I believe it has never been easier to develop great Wi-Fi products.”　　“The nRF7002 is designed to work alongside Nordic’s nRF52 and nRF53 Series making it a perfect fit for Matter, a smart-home standard backed by Amazon, Apple, Google, Nordic, Samsung, and hundreds of other companies,” said Finn Boetius, Product Marketing Engineer with Nordic. “The introduction of the IC and the nRF7002 DK now makes it easy for developers to get started on Matter and any other Wi-Fi based applications.” Matter uses Thread and Wi-Fi for data transport, and Bluetooth LE for commissioning.　　The nRF7002 brings low power and secure Wi-Fi to the IoT. The dual-band IC complies with Station (STA), Soft Access Point (AP), and Wi-Fi Direct operation, and meets the IEEE 802.11b, a, g, n (Wi-Fi 4), ac (Wi-Fi 5), and ax (Wi-Fi 6) Wi-Fi standards. The product also offers excellent coexistence with Bluetooth LE, Thread, and Zigbee. The nRF7002 supports Target Wake Time (TWT) a key Wi-Fi 6 power saving feature. Interfacing with a host processor is done via Serial Peripheral Interface (SPI) or Quad SPI (QSPI). The IC offers a single spatial stream, 20 MHz channel bandwidth, 64 QAM (MCS7), OFDMA, up to 86 Mbps PHY throughput, and BSS coloring.　　In addition to its suitability for general IoT applications and Matter, the nRF7002 is the ideal choice for implementing low power SSID-based Wi-Fi locationing when used together with Nordic’s nRF9160 SiP and the company’s nRF Cloud Location Services. SSID-based Wi-Fi locationing supplements GNSS- or cell-based locationing by providing accurate positioning indoors and in places with a high density of Wi-Fi access points.　　The introduction of the nRF7002 is accompanied by the launch of the nRF7002 DK, a development kit for the Wi-Fi 6 companion IC. The DK includes an nRF7002 IC and features an nRF5340 multiprotocol SoC as a host processor for the nRF7002. The nRF5340 embeds a 128 MHz Arm Cortex-M33 application processor and a 64 MHz high efficiency network processor. The DK supports the development of low-power Wi-Fi applications and enables Wi-Fi 6 features like OFDMA, Beamforming, and TWT. The DK includes: Arduino connectors; two programmable buttons; a Wi-Fi dual-band antenna and a Bluetooth LE antenna, and current measurement pins.　　Together with the DK, developing nRF7002-based designs is made simpler by the support for the IC in the nRF Connect SDK, Nordic’s scalable and unified software development kit for building products based on the company’s wireless devices. With the nRF7002 IC, nRF7002 DK, and nRF Connect SDK, developers can quickly and easily add Wi-Fi connectivity to their products, allowing them to connect to the Internet and communicate with other devices over a Wi-Fi network. Example applications for the nRF7002 DK are included with nRF Connect SDK.
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Release time：2023-02-09 15:39 reading：3008 Continue reading>>

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