ROHM Develops a New Compact Thermal Printhead for A4-Sized Mob<span style='color:red'>ile</span> Printers
  ROHM has developed a new thermal printhead - KA2008-B07N70A - compatible with a 2-cell Li-ion battery (7.2V). Designed to deliver high print quality with low power consumption and optimized for A4 size printers (210mm width). Height has been reduced by approximately 16% from the conventional 14mm to a best-in-class* 11.67mm – contributing to a more compact printer design. Moreover, optimizing the heating element structure while improving the driver IC and wiring layout enables the support for 7.2V operation – reducing the applied energy required for printing by approximately 66% compared to conventional 12V drive (at 50 mm/s print speed). Adjustments to the individual wiring of the resistive elements ensure uniform heat generation, stabilizing print quality and enabling sharp and high-resolution 203dpi printing – even at speeds up to 100 mm/s.  In recent years, the thermal printer market has been expanding in response to increasing demand to print qualified invoices and customs labels fueled by the growth of overseas e-commerce, as well as prescriptions and drug information sheets in hospitals and pharmacies. The demand for mobile printers has surged, particularly in the logistics and business sectors, where portability and ease of maintenance are highly valued. Among these trends, the adoption of A4-sized thermal printers has been growing in Asian markets, particularly in China – driving the need for 8-inch thermal printheads.  A4-sized mobile printers face challenges such as high power consumption due to their wider print width, requiring larger battery capacities compared to smaller printers such as receipt printers. Moreover, the need for multiple driver ICs to control the heating elements in A4-sized printers often results in variations in heat generation due to the differences in wiring lengths between elements, which affect print quality, such as color development and uniformity.  The KA2008-B07N70A addresses these challenges through an optimized design that enhances mechanical strength and durability by mitigating the effects of expansion and contraction caused by temperature changes. This meets the stringent durability requirements of A4-sized printers (the primary target market) while supporting both thermal and transfer printing methods – offering versatile printing for a wide range of applications.  While thermal printheads are typically used in combination with connectors and a heat sink, the KA2008-B07N70A can also be supplied as a standalone board, providing greater design flexibility for printer manufacturers. For inquiries regarding the product as part of a set, please contact AMEYA360 or visit the contact page on ROHM’s website.  Going forward, ROHM plans to develop a 300dpi resolution thermal printhead for mobile A4-sized printers by spring 2025. The company also intends to expand its considerable lineup with products that deliver high-speed printing with superior efficiency.  Key Specifications  For more information on printheads for mobile printers, please refer to the following URL on ROHM’s website: https://www.rohm.com/products/printheads/mobile-printers  Sales Information        Pricing: $14.50/unit (excluding tax)  Availability: Now (OEM quantities)  Application Examples        • A4-sized mobile printers  • Industrial control label printers  • Tattoo stencil printers, etc.  Terminology        dpi (dots per inch)  A unit of print resolution and density, indicating the number of dots that can be placed within a one-inch length (2.54 cm).  Thermal Printing Method  A printing technique in which heat is directly applied to thermal paper, causing a reaction that produces color. Primarily used for receipts and labels, this method eliminates the need for ink or toner, ensuring easy maintenance and operation.  Thermal Transfer Printing Method  A printing method in which heat melts ink coated on a ribbon, transferring it onto paper. Ideal for high-precision printing, it is commonly used for documents and labels requiring long-term preservation.
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Release time:2025-03-31 15:36 reading:274 Continue reading>>
ROHM’s Compact SOT-223-3 600V MOSFETs Contribute to Smaller, Lower Prof<span style='color:red'>ile</span> Designs for Lighting Power Supplies, Pumps, and Motors
  ROHM has added a lineup of compact 600V Super Junction MOSFETs - the R6004END4 / R6003KND4 / R6006KND4 / R6002JND4 / R6003JND4. These devices are ideal for small lighting power supplies, pumps, and motors.  In recent years, power supplies for lighting and motors for pumps are required to be smaller as devices become more sophisticated - spurring the demand for compact MOSFETs that are essential for switching operation.  Generally, however, it has been difficult to reduce the size of Super Junction MOSFETs while maintaining an optimal balance between high breakdown voltage and low ON resistance. In response, after reviewing the shape of the mounted chip, ROHM was able to develop 5 models in the SOT-223-3 package (6.50mm × 7.00mm × 1.66mm) - providing a smaller, lower profile form factor without compromising the performance of conventional products.  Compared to the conventional TO-252 package (6.60mm × 10.00mm × 2.30mm), ROHM’s new products reduce area and thickness by 31% and 27% - contributing to smaller, lower profile applications. At the same time, the same land pattern (footprint) as the TO-252 package can be used, enabling mounting on existing circuit boards without modification.  Offering distinctive features, three of the models optimized for compact power supplies. The R6004END4, characterized by low noise, is suitable for applications where noise is a concern, while the R6003KND4 and R6006KND4, capable of high-speed switching, are ideal for sets requiring low loss, high efficiency operation. The R6002JND4 and R6003JND4 utilize proprietary PrestoMOS technology to achieve significantly lower switching losses by speeding up reverse recovery time (trr), making them well-suited for motors-equipped devices.  Supporting materials such as application notes, technical documents, and SPICE simulation models for each product are available on ROHM’s website free of charge to enable quick market introduction.  Going forward, ROHM will continue to expand its Super Junction MOSFET lineup in different packages and even lower ON resistances that contribute to solving social issues such as environmental protection by reducing power consumption in variety devices.  Product Lineup  For compact power supplies  Application Examples        • R6004END4 / R6003KND4 / R6006KND4: Lighting, Air conditioners, Refrigerators, etc.  • R6002JND4 / R6003JND4: Motors for pumps, fans, copiers, etc.  Online Sales InformationSales Launch Date: December 2023  Pricing: $3.0/unit (samples, excluding tax)  Online Distributors: DigiKey, Mouser, and Farnell  The products will be offered at other online distributors as they become available.  Online Distributors  For More Information about ROHM’s Super Junction MOSFETVarious resources are available on ROHM's website, including application notes on the SOT-223-3 package and other documents essential for circuit design.  https://www.rohm.com/support/super-junction-mosfet  PrestoMOS“Presto” is an Italian musical term meaning “very fast.”  PrestoMOS is ROHM’s original power MOSFET that maintains the high withstand voltage and low ON resistance of Super Junction MOSFETs while speeding up the reverse recovery time of the built-in diode. Reducing switching losses makes it ideal for a wider range of applications with inverter circuits, such as air conditioners and refrigerators.  TerminologySuper Junction MOSFET (Metal Oxide Semiconductor Field Effect Transistor)  A type of transistor, MOSFETs can be divided by device structure into DMOSFET (Double-diffused MOSFET), planar, and super junction topologies. Super Junction MOSFETs deliver superior breakdown voltage and output current than both DMOSFETs and planar types, featuring lower loss when handling large power.  trr (Reverse Recovery Time)  The time it takes for the built-in diode to switch from the ON state to completely OFF. The lower this value is, the smaller the loss during switching.
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Release time:2024-01-24 13:40 reading:2088 Continue reading>>
Murata and Mob<span style='color:red'>ile</span>Knowledge partnership brings accurate UWB position detection modules to complete and powerful UWB development kits
  Murata is pleased to announce its partnership with MobileKnowledge, combining market-leading Ultra-wideband (UWB) expertise with a range of comprehensive products and in-depth customer support. MobileKnowledge’s UWB development kits provide the most comprehensive and powerful tools to evaluate and design solutions for accurate position detection in IoT devices, leveraging NXP’s UWB TrimensionTM technology.  MobileKnowledge is an expert UWB engineering consultant and the market leader in UWB development kits offering a wide variety of tools, created to meet the demands and needs of specific segments of the IoT ecosystem. The MK UWB Kit SR150/SR040 is the most comprehensive reference design and development platform for UWB-based IoT solutions. The MK UWB Kit Mobile Edition is the first development kit that allows users to evaluate UWB interoperability with Apple® and AndroidTM mobile devices. The MK UWB Kit RTLS supports the deployment of accurate indoor localization systems using Time Difference of Arrival (TDoA) technique.  Each kit features ready-to-run demonstration apps, reference hardware including Arduino compatible development boards, 3D Angle of Arrival (AoA) support and reference software examples to enable fast prototyping with minimal effort. In this new partnership, MobileKnowledge and Murata will also develop specific IoT reference use cases to accelerate the adoption of UWB technology in the IoT ecosystem.  MobileKnowledge will offer UWB development kits integrating the Murata Type 2BP and Type 2DK NXP based modules. As the world’s smallest UWB module, the Type 2BP features NXP’s TrimensionTM SR150 UWB chipset, providing enhanced and secure ranging with 3D AoA. Designed for deployment in both larger infrastructures, such as indoor positioning anchors, and in consumer products like game consoles, Type 2BP is a perfect match for MobileKnowledge’s versatile solutions.  The Type 2DK is designed with minimal power draw in mind, enabling integration across several portable devices. Leveraging on NXP’s TrimensionTM SR040 UWB chipset and QN9090’s (Bluetooth® LE + MCU chipset) efficient power management, the Type 2DK can run off a single coin-cell battery. The combined UWB and Bluetooth® LE capabilities of Type 2DK make it ideal for location tags, such as personal and asset trackers, supporting the latest market requirements.  The flexibility provided by both modules, combined with Murata’s technical expertise, helps customers meet the evolving requirements of UWB for IoT. Both the Type 2BP and Type 2DK modules control PHY/MAC operation within the IC in accordance with the FiRa™ Consortium specifications, ensuring interoperability with the growing IoT ecosystem.  “Throughout the design process of the UWB modules, “ said Rui Ramalho, , Product Manager, Connectivity Module for Murata, “it was vital that the end products offered easy integration, high levels of reliability and unmatched flexibility. MobileKnowledge’s all-in-one platform is a perfect fit for both the Type 2DK and 2BP, and we are excited to see the future implementations of our modules”.  Pedro Martinez, CEO of MobileKnowledge, stated: “In partnering with Murata for our MK UWB Kits, we can use both their extensive wireless communication portfolio and knowledge as well as their manufacturing dependability and strong IoT market presence to provide the highest quality development solutions and increase our visibility to IoT solution providers. MobileKnowledge UWB development kits have already helped our customers to integrate accurate positioning in numerous IoT applications. Now with Murata’s innovative modules and technical experience, they will have access to the latest hardware, development tools and reference IoT use cases.”
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Release time:2023-09-18 16:11 reading:2333 Continue reading>>
AMEYA360:C&K Switches PTS381 Top-Actuated Tact<span style='color:red'>ile</span> Switches
AMEYA360:Nidec Sankyo Develops a New Automatic Open-Close Unit for To<span style='color:red'>ile</span>t Lids and Seats
Ameya360:Panasonic EVP-BD 6mm 4N Square Tact<span style='color:red'>ile</span> Switch
  Panasonic EVP-BD 6mm Square Tactile Switch offers an operating force of 4N with 0.7mm travel distance and 200,000 cycles of operation. This switch features a metal dome and rubber dome construction for a sharp tactile feeling with silent operation.       The high operating force and long travel distance reduce the chance of unintentional activation. This top-push SMD switch has two J-bent terminals and 6mm x 6mm external dimensions with a 4mm height. Panasonic EVP-BD 6mm Square Tactile Switch ensures operational safety for applications such as audio electronics and automotive equipment. Additional applications include consumer, medical, industrial, and lighting.  FEATURES  SMD mounting type  Snap-action / push-on type SPST  Top push  Middle stroke travel  High click ratio of operating force vs. travel distance offers crisp tactile feel  Rubber dome provides quiet operation  High endurance  High operating force and long travel distance for lower chance of unintentional activation  J-bent terminal  With push plate (actuator)  Reflow applicable soldering  APPLICATIONS  Automotive  Industrial  Consumer  Medical  Audio  Lighting  SPECIFICATIONS  4N operating force  0.7mm travel  6mm x 6mm external dimensions  4mm height  10ms maximum bouncing (ON, OFF)  200,000 cycles operating life  10μA 2VDC to 20mA 15VDC (resistive load) rating  500MΩ maximum contact resistance  100MΩ minimum insulation resistance at 100VDC  250VAC (1 minute) dielectric withstanding voltage  -40°C to +90°C operating temperature range
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Release time:2023-02-27 11:44 reading:1818 Continue reading>>
TE Connectivity Blind Mating Mob<span style='color:red'>ile</span> Charging Connectors
  TE Connectivity's (TE) Blind Mating Mobile Charging Connectors are intended for smaller mobile robots and autonomous vehicles typically used in warehouse environments. Autonomous mobile robots (AMR) are used mostly for material handling (picking, movement, storage, and sorting) in the warehouse automation space.         TE's Blind Mating Mobile Charging Connectors are available in 2- and 3-power contact options with up to eight signal contacts to ease installation and rework cycle times. The series offers a high mating cycle life and serves as a modular solution that will support different configurations, data, and sensing.  FEATURES  Robust design for high-cycle life  Designed for a minimum of 12,000 mating cycles  Low insertion force power contacts  Spring probe signal contacts  Connection flexibility  2 and 3 power contact options  Up to 50A and up to 125V  Up to 40A per line at up to 100V  Terminates to 10AWG or 8AWG stranded copper wire  First make, last break contact for use in grounding, system enabling, or applications that require charging two battery strings independently  Touch safe contacts for extra safety if rework is needed  Blind mate capability  Allows for the misalignment of at least ±15mm for x and ±10 for the y direction  ± Approx. 5° for z direction (mating)  Up to 8x signal contacts  Up to 0.5A per line  Terminates to 30AWG to 22AWG stranded wire  Rear pluggable interface to ease installation and rework cycle times  Spring probe contacts for high cycle life  Utilizes Mini Universal MATE-N-LOKII Connector interface for signal contact mating  APPLICATIONS  Charging for autonomous mobile robots/automated guided vehicles (AMR/AGV)  Blind mate battery charging  Industrial  Hospitality  Retail  Medical
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Release time:2023-01-31 14:38 reading:1542 Continue reading>>
Ameya360:Micron Pushes DRAM Node for Mob<span style='color:red'>ile</span> First
  Micron Technology has been setting the pace for DRAM advancement of late. Its 1-beta DRAM technology continues the trend, but other major vendors are keeping up, even as it looks like DRAM prices will be lower in 2023.  The company said at the beginning of November that it was shipping qualification samples of its 1-beta DRAM to select smartphone customers and that it’s ready for mass production. The advanced DRAM technology node, which will be used first on Micron’s low-power double data rate 5X (LPDDR5X) mobile memory that delivers speeds of 8.5 Gb/s, follows the company’s 1-alpha DRAM that began volume shipment in 2021.  Micron’s 1-Beta LPDDR5X provides 16Gb per die capacity, 35% higher than the prior generation, and a 15% power saving compared to prior generation products. Thy Tran, Micron’s VP of DRAM process integration, said the new node is the result of new processes, materials, and equipment to advance Micron’s memory cell integration so it can shrink the memory cell array, including the application of its second-generation high-K metal gate (HKMG) technology. “We can then aggressively scale both the memory cell array in terms of size and also the rest of the circuitry in the dye to save space.”  Aside from the performance improvements that will benefit smartphone functions such as camera launch, night mode and portrait mode and shake-free, high-resolution 8K video recording and in-phone video editing, Micron’s LPDDR5 based on its 1-beta DRAM boasts additional energy efficiency by implementing JEDEC’s new enhanced dynamic voltage and frequency scaling extensions core (eDVFSC) techniques. Adding eDVFSC at a doubled frequency tier of up to 3,200 megabits per second provides improved power savings controls to enable more efficient use of power based on end-user patterns.  These features not only represent a faster smartphone camera but also demonstrate how artificial intelligence and machine learning are transforming smartphones into mobile editing studios, Tran said. “Be it photos, videos, or voice processing, memory is at the heart of everything we do.”  Jim Handy, principal analyst with Objective Analysis, said what’s notable about Micron’s 1-beta is that it demonstrates Micron is strongly oriented toward pushing the technology forward with its HKMG technology to make DRAM as fast as it needs to go. “That makes for a complicated process.” If Micron were just trying to get the bits as cheap as they could be, it wouldn’t touch HKMG, he said.  So far, DDR5 DRAM has mostly found its way into PCs, said Handy, and less so data centers. But Micron would like to see that change sooner than later so it can sell DDR5 before prices collapse, especially given the fact it’s been eight years since DDR4 was introduced. He noted that the company’s focus of late has been being more profitable rather than dominating market share.  Although LPDDR5 will be the first to benefit from the 1-beta DRAM technology, Micron will expand the product portfolio that will be manufactured on this node as 2023 progresses for all segments of the memory market including High Bandwidth Memory (HBM).  Not to be outdone, Samsung Electronics closed out 2022 by announcing the development of its 16-Gb DDR5 DRAM built using what it said is the industry’s first 12-nm-class process technology. Like Micron, Samsung is matching performance gains with power efficiency – its new DRAM consumes up to 23%  less power than its predecessor. Mass production is set to begin in 2023.
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Release time:2023-01-17 11:45 reading:2009 Continue reading>>
CES 2019: AMD announces new mob<span style='color:red'>ile</span> processor line-up
Keysight, OPPO Collaborate to Accelerate 5G Mob<span style='color:red'>ile</span> Device Development and Commercialization
Keysight Technologies announced that OPPO, one of the world’s top five mobile device manufacturers*, has selected Keysight’s 5G New Radio (NR) network emulation solutions for protocol and radio frequency (RF) performance validation in sub-6GHz frequency bands (FR1).The Chinese-based smartphone manufacturer is targeting commercial release of its first 5G mobile device in 2019. Leveraging Keysight’s 5G test solutions, OPPO will accelerate the development of their 5G smartphones and meet their strategic go-to-market goals. On November 29, OPPO used Keysight’s UXM-based 5G NR network emulation solutions to successfully establish a 5G video call, thereby completing one of the world’s first 5G signaling and data connections based on OPPO’s commercially available mobile phone.“We are proud of our 5G R&D progress, as well as the recent 5G public demonstrations, and are delighted to be working with Keysight as the leading 5G test solutions to help fast-track the release our first commercial 5G phone,” said Levin Liu, global vice president and head of the OPPO Research Institute at Shenzhen, China. “Keysight’s close relationships with our 5G chipset and operator partners affords the company valuable 5G insights and expertise, which makes them the ideal partner for OPPO.”Leading chipset manufacturers and their mobile device ecosystems use Keysight’s 5G NR network emulation solutions, compliant to the latest 3GPP 5G NR standards, to speed development and validation of new 5G designs. These solutions support both sub-6GHz and mmWave frequencies for conducted and over-the-air (OTA) testing. Common development tools enable users to share design insights gained across each stage of the device lifecycle. As a result, chipset and device manufacturers can accelerate delivery of new 5G NR products to market.“Keysight is pleased to help OPPO realize their ambitious commercial launch plans”, said Peng Cao, senior director of the Commercial Communications group at Keysight Technologies. “5G device manufacturers, like OPPO, benefit from using the same tools that leading chipset manufacturers use to validate new 5G NR products, leading to faster time to market.”
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Release time:2018-12-20 00:00 reading:1169 Continue reading>>

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